Wafer transfer platform

Abstract

The utility model relates to the technical field of wafer processing, and relates to a wafer transfer platform. After the wafer products are loaded on the positioning carrier, the edges of the wafer products on the positioning stations are positioned through the positioning parts, the rotating table drives the wafer products on the positioning carrier to rotate and process, and the wafer grooving machine is matched with a laser device to realize wafer grooving and adapts to wafers of different sizes; and after the rotating table stops rotating and processing the wafer product, the adjusting mechanism rotates and resets the wafer product on the positioning carrier, so that the processing effect of the wafer product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and relates to a wafer transfer platform. Background Art

[0002] With the rapid development of economy and technology and the continuous increase in the market demand for semiconductors, wafers are the basic materials for manufacturing semiconductor chips. The wafer dispensing technology is a crucial technology in the advanced electronic manufacturing industry. It is widely used in chip packaging and integrated circuit equipment. The purpose is to reduce the failure probability of components caused by factors such as thermal expansion and contraction, dropping, and vibration during the use of products, thereby extending the service life of products.

[0003] The existing wafer transfer processing requires pre-positioning the wafer. Generally, it is to detect the reserved marks or notches on the wafer to determine whether the positioning is accurate. Generally, it cannot adjust the pose of the wafer, and its accuracy is often insufficient, and it cannot quickly adjust the position of the wafer according to the detection result, which affects the processing efficiency and accuracy of the wafer. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a wafer transfer platform that adapts to wafers of different sizes and ensures the processing effect of wafer products.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer transfer platform, comprising:

[0007] A base, on which a rotating table is provided, and an installation frame is provided on the rotating end of the rotating table;

[0008] A positioning carrier is arranged on the installation frame, and a positioning station for loading wafer products is arranged on the positioning carrier;

[0009] A positioning mechanism is arranged on the installation frame. The positioning mechanism includes a positioning ring, the positioning ring is arranged opposite to the positioning carrier, and positioning components are arranged on the positioning ring. The positioning components are used to position the edge of the wafer product on the positioning station;

[0010] An adjustment mechanism is arranged below the installation frame. The adjustment mechanism is connected to the installation frame, and the adjustment mechanism is used to rotate and reset the wafer product on the positioning carrier.

[0011] In an embodiment of the utility model, the adjustment mechanism includes an adjustment frame, a slider is slidably arranged on the adjustment frame, the slider is hinged to the installation frame, an installation part is arranged in the middle of the adjustment frame, and a spring is arranged on the installation part. The free end of the spring is connected to the slider.

[0012] In one embodiment of the present utility model, groove-shaped photoelectric switches are arranged on both sides of the adjustment frame, a baffle matching with the groove-shaped photoelectric switch is arranged on the slider, and the baffle is arranged opposite to the groove-shaped photoelectric switch.

[0013] In one embodiment of the present utility model, a slide rail is arranged on the adjustment frame, the slider is slidably arranged on the slide rail, fixing frames are arranged on both sides of the slide rail, a detection sensor is arranged on the fixing frame, and the detection sensor is arranged opposite to the slider.

[0014] In one embodiment of the present utility model, a rotating block is arranged on the slider, a rotating hole is arranged on the rotating block, a rotating stop block is arranged on the mounting frame, a rotating shaft is arranged on the rotating stop block, and the rotating shaft is arranged through the rotating hole.

[0015] In one embodiment of the present utility model, the positioning component includes a plurality of positioning pins, the positioning pins are vertically arranged on the positioning ring, a plurality of positioning holes are arranged on the positioning ring, and the edge of the wafer product is positioned through the positioning holes and the positioning pins.

[0016] In one embodiment of the present utility model, the positioning component includes a plurality of vacuum suction cups, a plurality of air suction holes are arranged on the positioning ring, the vacuum suction cups are arranged on the air suction holes, an air valve is arranged on the edge of the positioning ring, and the air valve is communicated with the air suction holes.

[0017] In one embodiment of the present utility model, the positioning carrier includes a machine table, the machine table is arranged on the mounting frame, a fixing groove is arranged on the machine table, and a porous ceramic plate is arranged on the fixing groove.

[0018] In one embodiment of the present utility model, the positioning ring and the positioning carrier are concentrically arranged, a plurality of groups of connection holes are arranged on the mounting frame, and the positioning ring is connected to the connection holes through screws.

[0019] In one embodiment of the present utility model, a mounting hole is arranged on the fixing frame, the detection sensor is arranged through the mounting hole, a locking bolt is arranged on the fixing frame, the locking bolt is arranged through the mounting hole, and the detection sensor is connected to the fixing frame through the locking bolt.

[0020] Advantages of the present utility model:

[0021] After the positioning carrier of the present utility model loads the wafer product, the edge of the wafer product on the positioning station is positioned by the positioning component, and the rotating table drives the wafer product on the positioning carrier to rotate for processing, cooperating with the laser device to realize wafer grooving and adapting to wafers of different sizes. After the rotating table stops rotating and processing the wafer product, the adjusting mechanism rotates and resets the wafer product on the positioning carrier, thereby improving the processing effect of the wafer product. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of a wafer transfer platform of the present utility model.

[0023] Figure 2 It is a schematic diagram of the adjusting mechanism of the present utility model.

[0024] Explanation of the reference numerals in the drawings: 1. Positioning carrier; 11. Machine table; 12. Porous ceramic plate; 2. Base; 21. Rotating table; 22. Mounting frame; 23. Positioning ring; 24. Positioning pin; 25. Suction hole; 26. Vacuum chuck; 27. Air valve; 3. Adjusting frame; 31. Slide rail; 32. Slide block; 33. Rotating block; 34. Connecting piece; 341. Rotating stop block; 342. Rotating shaft; 343. Rotating hole; 35. Flap; 36. Groove type photoelectric switch; 37. Mounting part; 38. Spring; 4. Fixed frame; 41. Detection sensor; 42. Locking bolt. Detailed Embodiment

[0025] The following further describes the present utility model in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments cited do not limit the present utility model.

[0026] Referring to Figure 1-2 As shown, a wafer transfer platform includes:

[0027] A base 2, on which a rotating table 21 is provided, and a mounting frame 22 is provided at the rotating end of the rotating table 21;

[0028] A positioning carrier 1 is provided on the mounting frame 22, and a positioning station for loading the wafer product is provided on the positioning carrier 1;

[0029] A positioning mechanism is provided on the mounting frame 22. The positioning mechanism includes a positioning ring 23, the positioning ring 23 is disposed opposite to the positioning carrier 1, and a positioning component is provided on the positioning ring 23. The positioning component is used to position the edge of the wafer product on the positioning station;

[0030] An adjusting mechanism is provided below the mounting frame 22. The adjusting mechanism is connected to the mounting frame 22, and the adjusting mechanism is used to rotate and reset the wafer product on the positioning carrier 1.

[0031] After the positioning carrier 1 of the present utility model loads the wafer product, the edge of the wafer product on the positioning station is positioned by the positioning component. The rotating table 21 drives the wafer product on the positioning carrier 1 to rotate for processing, and cooperates with the laser device to realize wafer grooving, adapting to wafers of different sizes. After the rotating table 21 stops rotating and processing the wafer product, the adjusting mechanism rotates and resets the wafer product on the positioning carrier 1, thereby improving the processing effect of the wafer product.

[0032] In an embodiment of the present utility model, the adjusting mechanism includes an adjusting frame 3. A slider 32 is slidably arranged on the adjusting frame 3. The slider 32 is hinged to the mounting frame 22. An installation part 37 is arranged in the middle of the adjusting frame 3. A spring 38 is arranged on the installation part 37. The free end of the spring 38 is connected to the slider 32.

[0033] Specifically, a rotating table 21 is arranged on the base 2, which can drive the wafer product on the positioning carrier 1 to rotate at an angle. The slider 32 is hinged to the mounting frame 22 and rotates under the drive of the rotating table 21 of the mounting frame 22, thereby pushing the slider 32 to move left and right on the slide rail 31 and stretching the spring 38. Since the spring 38 is arranged on the installation part 37 and the free end of the spring 38 is connected to the slider 32, when the rotating table 21 stops rotating the wafer product, the spring 38 contracts to restore the wafer product on the rotating table 21 to its initial state, thereby improving the processing effect of the wafer product.

[0034] In an embodiment of the present utility model, groove-shaped photoelectric switches 36 are arranged on both sides of the adjusting frame 3. A baffle 35 matched with the groove-shaped photoelectric switches 36 is arranged on the slider 32. The baffle 35 is arranged opposite to the groove-shaped photoelectric switches 36.

[0035] Specifically, the baffle 35 is arranged opposite to the groove-shaped photoelectric switches 36. The slider 32 drives the baffle 35 to move left and right on the slide rail 31. The groove-shaped photoelectric switches 36 on both sides can detect the stroke of the slider 32, avoiding the problem of over-limit movement of the slider 32 and ensuring the movement accuracy of the slider 32.

[0036] In an embodiment of the present utility model, a slide rail 31 is arranged on the adjusting frame 3. The slider 32 is slidably arranged on the slide rail 31. Fixed frames 4 are arranged on both sides of the slide rail 31. Detection sensors 41 are arranged on the fixed frames 4. The detection sensors 41 are arranged opposite to the slider 32.

[0037] Specifically, the slider 32 is slidably disposed on the slide rail 31, which can ensure the movement accuracy of the slider 32, making the slider 32 have better movement smoothness, and at the same time ensuring the rotation adjustment accuracy of the mounting bracket 22. The detection sensor 41 is disposed opposite to the slider 32 so that it can monitor the movement distance of the slider 32 in real time and ensure the movement accuracy of the mounting bracket 22.

[0038] In an embodiment of the present invention, a rotating block 33 is disposed on the slider 32, a rotating hole 343 is disposed on the rotating block 33, a connecting member 34 is disposed on the mounting bracket 22, the connecting member 34 includes a rotating stopper 341, and a rotating shaft 342 is disposed on the rotating stopper 341. The rotating shaft 342 is inserted through the rotating hole 343.

[0039] Specifically, a rotating shaft 342 is disposed on the rotating stopper 341, and the rotating shaft 342 is inserted through the rotating hole 343. The rotating hole 343 of the present application can be a strip-shaped hole or the rotating shaft 342 abuts against the rotating block 33, so that the connection relationship between the slider 32 and the mounting bracket 22 can be realized. The two are in a state of relative movement, and the slider 32 can quickly restore the position of the mounting bracket 22 to the initial position, which is convenient to use.

[0040] In an embodiment of the present invention, the positioning member includes a plurality of positioning pins 24, the positioning pins 24 are vertically disposed on the positioning ring 23, and a plurality of positioning holes are disposed on the positioning ring 23. The position of the edge of the wafer product is positioned through the positioning holes and the positioning pins 24.

[0041] Specifically, the wafer product is placed on the positioning station of the positioning carrier 1 and supported by the positioning carrier 1. At the same time, the positioning pins 24 on the positioning ring 23 are inserted through the hole positions of the wafer product, so that the position of the wafer product can be quickly positioned, the efficiency of processing the wafer product is improved, and the wafer processing accuracy is ensured.

[0042] In an embodiment of the present invention, the positioning member includes a plurality of vacuum suction cups 26, a plurality of suction holes 25 are disposed on the positioning ring 23, the vacuum suction cups 26 are disposed on the suction holes 25, and an air valve 27 is disposed on the edge of the positioning ring 23. The air valve 27 is communicated with the suction holes 25.

[0043] Specifically, the air valve 27 is connected to a vacuum generating device through a trachea or the like, so that the vacuum suction cup 26 generates an adsorption force, adsorbs and positions the edge of the wafer product on the positioning carrier 1, cooperates with a laser device to realize wafer grooving, adapts to wafers of different sizes, can quickly adsorb and position the wafer product, and at the same time the vacuum suction cup 26 can also play a certain buffering role on the wafer product to ensure the processing quality of the wafer product.

[0044] In an embodiment of the present utility model, the positioning carrier 1 includes a machine table 11, the machine table 11 is arranged on the mounting frame 22, a fixing groove is arranged on the machine table 11, and a porous ceramic plate 12 is arranged on the fixing groove.

[0045] Specifically, the porous ceramic plate 12 can be connected to a gas supply device through a pipeline. The porous ceramic plate 12 has tiny holes. After being connected to the gas supply device, when positioning the product, it sucks air to generate negative pressure to adsorb and position the product. After the product is completed with detection or processing, it blows air to clean the porous ceramic plate 12, which is convenient for continuous processing of wafer products and improves the processing quality.

[0046] In an embodiment of the present utility model, the positioning ring 23 is concentrically arranged with the positioning carrier 1. A plurality of connecting holes are arranged on the mounting frame 22, and the positioning ring 23 is connected to the connecting holes through screws.

[0047] Specifically, a plurality of connecting holes are arranged on the mounting frame 22. The plurality of connecting holes can be combined to form circles with different diameters, forming a plurality of concentric circle structures, so that it can be installed and adapted to mounting rings of various specifications. The appropriate mounting ring can be selected for adaptation according to different specifications of wafer products, with a wide range of applications, effectively ensuring the positioning effect of wafer products.

[0048] In an embodiment of the present utility model, mounting holes are arranged on the fixing frame 4, the detection sensor 41 is inserted through the mounting holes, a locking bolt 42 is arranged on the fixing frame 4, the locking bolt 42 is inserted through the mounting holes, and the detection sensor 41 is connected to the fixing frame 4 through the locking bolt 42.

[0049] Specifically, the detection sensor 41 is connected to the fixing frame 4 through the locking bolt 42, so that the detection sensor 41 can be replaced according to the actual situation, which is convenient for the maintenance and replacement of the detection sensor 41. At the same time, the relative position between the detection sensor 41 and the slider 32 can be quickly adjusted to ensure the detection accuracy of the slider 32.

[0050] Usage process

[0051] Place the wafer product on the positioning station of the positioning carrier 1, support it through the positioning carrier 1. At the same time, the positioning pins 24 on the positioning ring 23 are inserted into the hole positions of the wafer product. Meanwhile, the air valve 27 is connected to the vacuum generating device through a trachea or other means, so that the vacuum chuck 26 generates an adsorption force to adsorb and position the edge of the wafer product on the positioning carrier 1, cooperate with the laser device to realize wafer grooving, and adapt to wafers of different sizes. At the same time, a rotating table 21 is arranged on the base 2, which can drive the wafer product on the positioning carrier 1 to rotate at an angle. The slider 32 is hinged to the mounting bracket 22 and rotates under the drive of the mounting bracket 22 and the rotating table 21, thereby pushing the slider 32 to move left and right on the slide rail 31 and stretching the spring 38. Since the spring 38 is arranged on the mounting portion 37 and the free end of the spring 38 is connected to the slider 32, when the rotating table 21 stops rotating the wafer product, the spring 38 contracts to restore the wafer product on the rotating table 21 to its initial state.

[0052] The above-described embodiments are merely preferred embodiments given to fully illustrate the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A wafer transfer platform, characterized in that: include: A base, on which a rotating platform is arranged, and a mounting frame is arranged on a rotating end of the rotating platform; A positioning carrier, arranged on the mounting frame, wherein the positioning carrier is provided with a positioning station for loading wafer products; A positioning mechanism is arranged on the mounting frame, the positioning mechanism comprises a positioning ring, the positioning ring is arranged opposite to the positioning carrier, a positioning component is arranged on the positioning ring, and the positioning component is used to position the edge of the wafer product on the positioning station; The adjustment mechanism is arranged below the mounting frame, the adjustment mechanism is connected to the mounting frame, and the adjustment mechanism is used to rotate and reset the wafer product on the positioning carrier.

2. The wafer transfer platform according to claim 1, characterized in that: The adjustment mechanism comprises an adjustment frame, a slider is slidably arranged on the adjustment frame, the slider is hinged to the mounting frame, a mounting portion is arranged in the middle of the adjustment frame, a spring is arranged on the mounting portion, and the free end of the spring is connected to the slider.

3. The wafer transfer platform according to claim 2, characterized in that: Slot-type photoelectric switches are arranged on both sides of the adjustment frame, and baffles matching the slot-type photoelectric switches are arranged on the slider, and the baffles are arranged opposite to the slot-type photoelectric switches.

4. The wafer transfer platform according to claim 2, characterized in that: The adjustment frame is provided with a slide rail, the slider is slidably arranged on the slide rail, fixed frames are arranged on both sides of the slide rail, the fixed frames are provided with detection sensors, and the detection sensors are arranged opposite to the slider.

5. The wafer transfer platform according to claim 2, characterized in that: The sliding block is provided with a rotating block, the rotating block is provided with a rotating hole, the mounting frame is provided with a rotating stopper, the rotating stopper is provided with a rotating shaft, and the rotating shaft is penetrated through the rotating hole.

6. The wafer transfer platform according to claim 1, characterized in that: The positioning component includes a plurality of positioning pins, and the positioning pins are vertically arranged on the positioning ring. The positioning ring is provided with a plurality of positioning holes, and the edge of the wafer product is positioned through the positioning holes and the positioning pins.

7. The wafer transfer platform according to claim 1, characterized in that: The positioning component comprises a plurality of vacuum suction cups, the positioning ring is provided with a plurality of suction holes, the vacuum suction cups are arranged on the suction holes, an air valve is arranged on the edge of the positioning ring, and the air valve is communicated with the suction holes.

8. The wafer transfer platform according to claim 1, characterized in that: The positioning carrier comprises a platform, the platform is arranged on the mounting frame, a fixing groove is arranged on the platform, and a porous ceramic plate is arranged on the fixing groove.

9. The wafer transfer platform according to claim 1, characterized in that: The positioning ring is arranged concentrically with the positioning carrier, and the mounting frame is provided with a plurality of connection holes, and the positioning ring is provided with screws connected to the connection holes.

10. The wafer transfer platform according to claim 4, characterized in that: The fixing frame is provided with a mounting hole, the detection sensor is inserted into the mounting hole, the fixing frame is provided with a locking bolt, the locking bolt is inserted into the mounting hole, and the detection sensor is connected to the fixing frame via the locking bolt.

Images