Integrated circuit package carrier

Abstract

The utility model discloses an integrated circuit package carrier. The integrated circuit package substrate comprises a substrate body and a bearing surface. The bearing surface is arranged on the upper surface of the plate body. The bearing surface comprises a plurality of first parting lines and a plurality of second parting lines. The two adjacent first parting lines and the two adjacent second parting lines define a substrate placing area. And each first segmentation line and the plurality of second segmentation lines are intersected at a plurality of intersection points. And each first parting line is provided with four grooves between two adjacent intersection points. And the four grooves are used for providing a picking space.

Description

Technical Field

[0001] This application relates to the field of semiconductors. Specifically, it relates to an integrated circuit packaging carrier board. Background Art

[0002] After the molding machine finishes processing the integrated circuit substrate, when the operator collects the board, since the cut substrates are stacked in multiple pieces, they are heavy and the board spacing is narrow. Therefore, it is difficult for the operator to directly remove the substrate from the carrier board by hand. The substrate is prone to slide and rub on the carrier board, causing scratches. Summary of the Utility Model

[0003] In view of this, one of the purposes of this application is to provide an integrated circuit packaging carrier board to solve the above problems.

[0004] According to an embodiment of the present application, an integrated circuit packaging carrier board is provided. The integrated circuit packaging carrier board includes a board body and a bearing surface. The bearing surface is disposed on the upper surface of the board body. The bearing surface includes a plurality of first dividing lines and a plurality of second dividing lines. Adjacent two of the first dividing lines and adjacent two of the second dividing lines enclose a substrate placement area. Each of the first dividing lines intersects with the plurality of second dividing lines at a plurality of intersection points. Four grooves are provided between adjacent two of the intersection points on each of the first dividing lines. The four grooves are used to provide a picking space.

[0005] According to an embodiment of the present application, the four grooves penetrate through the board body.

[0006] According to an embodiment of the present application, the aperture of each of the grooves gradually decreases from the bearing surface downward.

[0007] According to an embodiment of the present application, the area of each of the grooves gradually decreases from 2 cm * 1.5 cm downward.

[0008] According to an embodiment of the present application, a smooth curved surface is formed at the bottom of the inner wall of each of the grooves.

[0009] According to an embodiment of the present application, the first dividing lines correspond to the long sides of the substrate placement area, and the second dividing lines correspond to the short sides of the substrate placement area.

[0010] According to an embodiment of the present application, the distance between adjacent two of the grooves is in the range of 1.5 - 2.0 cm.

[0011] According to an embodiment of the present application, the first dividing lines are horizontal dividing lines, and the second dividing lines are vertical dividing lines.

[0012] According to an embodiment of the present application, the bearing surface includes the substrate placement areas arranged in an array.

[0013] The integrated circuit package carrier proposed in this application is provided with a plurality of grooves on the bearing surface, and the positions of four grooves correspond to the long sides of the substrate. Operators can insert four fingers into the grooves to grab the long side of the substrate with one hand. It is easier to apply force, and it can prevent the substrate from sliding on the integrated circuit package carrier, causing scratches on the substrate. Description of the Drawings

[0014] The drawings are used to provide a further understanding of this application, and constitute a part of the specification. Together with the following specific embodiments, they are used to explain this application, but do not constitute a limitation to this application. In the drawings:

[0015] Figure 1 A top view demonstrating an integrated circuit package carrier according to an embodiment of this application.

[0016] Figure 2 An enlarged schematic view demonstrating a groove according to an embodiment of this application.

[0017] Figure 3A Demonstrating from Figure 1 a cross-sectional view observed from A - A' in Figure 3B Demonstrating from Figure 1 a cross-sectional view observed from B - B' in

[0018] Figure 4A A schematic view of the substrate on the bearing surface after the cutting process according to an embodiment of this application.

[0019] Figure 4B and Figure 4C A schematic view demonstrating removing the substrate from the integrated circuit package carrier according to an embodiment of this application. Detailed Description of the Embodiments

[0020] The following disclosure provides various embodiments or illustrations that can be used to implement different features of this disclosure. The specific examples of the components and configurations described below are used to simplify this disclosure. As can be imagined, these descriptions are only illustrative and are not intended to limit this disclosure. For example, in the following description, forming a first feature on or above a second feature may include that in some embodiments, the first and second features are in direct contact with each other; and it may also include that in some embodiments, there are additional components formed between the above-mentioned first and second features, so that the first and second features may not be in direct contact. In addition, this disclosure may reuse component symbols and / or reference numerals in multiple embodiments. Such reuse is for the purpose of simplicity and clarity, and does not itself represent the relationship between different embodiments and / or configurations discussed.

[0021] Furthermore, the use of spatially relative terms herein, such as "below", "beneath", "lower", "above", "upper" and the like, may be for convenience in describing the relationship of one component or feature shown in the drawings to another or other components or features. These spatially relative terms are intended to cover not only the orientation shown in the drawings but also various different orientations in which the device may be used or operated. The device may be placed in other orientations (e.g., rotated 90 degrees or in other orientations), and these spatially relative descriptive terms should be interpreted accordingly.

[0022] Although the numerical ranges and parameters used to define the broader scope of the present application are approximate values, the relevant numerical values in the specific embodiments have been presented as precisely as possible herein. However, any numerical value inherently and inevitably contains standard deviations resulting from individual testing methods. Herein, "about" generally means that the actual value is within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. Alternatively, the term "about" represents that the actual value falls within the acceptable standard error of the average value, depending on the consideration of those of ordinary skill in the art to which the present application pertains. It will be understood that, except for experimental examples or unless otherwise explicitly stated, all ranges, amounts, numerical values and percentages (such as those used to describe material amounts, time lengths, temperatures, operating conditions, quantity ratios and others similar) used herein are modified by "about". Therefore, unless otherwise stated to the contrary, the numerical parameters disclosed in this specification and the appended claims are approximate values and may be varied as required. At least these numerical parameters should be understood as the values indicated by the significant digits and obtained by applying ordinary rounding methods. Herein, a numerical range is expressed as from one endpoint to the other endpoint or between two endpoints; unless otherwise stated, the numerical ranges described herein include the endpoints.

[0023] Figure 1 A top view of an integrated circuit package carrier 1 according to an embodiment of the present application is shown. In some embodiments, the integrated circuit package carrier 1 is configured to carry an integrated circuit substrate to facilitate a cutting or cleaning process on the integrated circuit substrate. In some embodiments, the integrated circuit package carrier 1 includes a board body 10 and a carrying surface S10, wherein the carrying surface S10 is used to place the substrate. In some embodiments, the carrying surface S10 is located on the upper surface of the board body 10.

[0024] In some embodiments, the carrying surface S10 includes a plurality of first dividing lines 21 (such as Figure 1 21_1, 21_2... and 21_8 as shown), and further includes a plurality of second dividing lines 22 (such as Figure 122_1, 22_2 and 22_3 shown). In some embodiments, the first cutting line 21 is a horizontal cutting line, and the second cutting line 22 is a vertical cutting line. In some embodiments, two adjacent first cutting lines 21 and two adjacent second cutting lines 22 enclose a substrate placement area 231. In some embodiments, the first cutting line 21 corresponds to the long side of the substrate placement area 231, and the second cutting line 22 corresponds to the short side of the substrate placement area 231. In some embodiments, a plurality of first cutting lines 21 and a plurality of second cutting lines 22 enclose a plurality of substrate placement areas 231 arranged in an array on the carrying surface S10. After the cutting process is performed, the area and shape of the cut strip substrate conform to the area and shape of the substrate placement area 231.

[0025] It should be noted that Figure 1 The extending directions, numbers and shapes of the first cutting lines 21 and the second cutting lines 22 shown in the embodiment are only examples and are not limitations of the present application.

[0026] In some embodiments, each first cutting line 21 intersects with a plurality of second cutting lines 22 at a plurality of intersections 24 , and each first cutting line 21 is provided with four grooves 25 between two adjacent intersections 24 , wherein the grooves 25 are used to provide a picking space. Figure 2 An enlarged schematic diagram of a groove 25 according to an embodiment of the present application is demonstrated. After the cutting process, the operator can use a picking tool (such as a finger) to go deep into the groove 25. At this time, the finger is lower than the substrate, so the operator can easily remove the substrate with one hand. In some embodiments, the distance D25 between two adjacent grooves 25 is approximately in the range of 1.5-2 cm to meet the finger spacing. The four grooves 25 are located on the long side of the substrate, which is convenient for the operator to put four fingers into the groove 25 to grab the long side of the substrate. In some embodiments, the groove 25 is a through hole that penetrates the board body 10, so as to facilitate the cleaning of the integrated circuit package carrier 1. After the hair and other debris are swept into the groove 25, they can be directly discharged from the hole H25 at the bottom of the groove 25 to avoid accumulation in the integrated circuit package carrier 1.

[0027] refer to Figure 3A and Figure 3B ,in Figure 3A Demo from Figure 1 The cross-sectional view observed from A-A', Figure 3B Demo from Figure 1Cross-sectional view observed along B-B'. In some embodiments, the length L25 of the groove 25 is approximately 2 cm, the width W25 of the groove 25 is approximately 1.5 cm, and the depth Z25 of the groove 25 is approximately 3 cm. In some embodiments, the aperture diameter of the groove 25 gradually decreases downward from the bearing surface S10, and a smooth curved surface is formed at the bottom of the groove 25 to avoid forming corners in the groove 25, so that foreign object hairs can smoothly drain out from the hole H25 along the curved surface, preventing foreign objects from accumulating in the integrated circuit package carrier 1.

[0028] Figure 4A Schematic diagram of the substrate X on the bearing surface S10 after the cutting process according to an embodiment of the present application. Figure 4B and Figure 4C Schematic diagram showing the removal of the substrate X from the integrated circuit package carrier 1 according to an embodiment of the present application. By providing a plurality of grooves 25 on the bearing surface S10 and making the positions of the four grooves 25 correspond to the long sides of the substrate, an operator can insert four fingers into the grooves 25 to grasp the long side of the substrate with one hand, which is easier to apply force and can prevent the substrate from sliding on the integrated circuit package carrier 1, causing scratches on the substrate.

[0029] As used herein, the terms "approximately", "substantially", "essentially" and "about" are used to describe and account for small variations. When used in conjunction with an event or situation, these terms can refer to instances where the event or situation occurs precisely as well as instances where the event or situation occurs very nearly. As used herein with respect to a given value or range, the term "about" generally means within ±10%, ±5%, ±1% or ±0.5% of the given value or range. Ranges may be expressed herein as from one endpoint to another endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein include the endpoints. The term "substantially coplanar" may refer to two surfaces positioned within a few micrometers (μm) along the same plane, e.g., within 10 μm, 5 μm, 1 μm or 0.5 μm along the same plane. When referring to "substantially" the same numerical value or property, the term may refer to a value within ±10%, ±5%, ±1% or ±0.5% of the average value of the said value.

[0030] As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely as well as instances where it occurs very nearly. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation of less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two numerical values is less than or equal to ±10% (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%) of the average of the values, then the two numerical values can be considered to be "substantially" or "about" the same. For example, "substantially" parallel can refer to an angular range of variation of less than or equal to ±10° relative to 0°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1%, or less than or equal to ±0.05°. For example, "substantially" perpendicular can refer to an angular range of variation of less than or equal to ±10° relative to 90°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1%, or less than or equal to ±0.05°.

[0031] For example, if the displacement between two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar. If the displacement between any two points on a surface relative to a plane is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, then the surface can be considered to be planar or substantially planar.

[0032] As used herein, the terms "conductive", "electrically conductive", and "conductivity" refer to the ability to transfer current. Conductive materials generally refer to those materials that exhibit little or no opposition to the flow of current. A measure of conductivity is Siemens per meter (S / m). Generally, a conductive material is a material having a conductivity greater than approximately 104 S / m (e.g., at least 105 S / m or at least 106 S / m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0033] As used herein, unless the context clearly dictates otherwise, the singular terms "a / an" and "the" may include plural referents. In the description of some embodiments, a component provided "on" or "above" another component may cover the case where the former component is directly on the latter component (e.g., in physical contact with the latter component), as well as the case where one or more intermediate components are located between the former component and the latter component.

[0034] As used herein, to facilitate description, spatial relative terms such as "below", "beneath", "lower", "above", "upper", "under", "left", "right", etc. may be used to describe the relationship of one component or feature to another component or feature as illustrated in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein may be interpreted accordingly. It should be understood that when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected or coupled to the other component, or there may be intermediate components.

[0035] The foregoing outlines several embodiments and features of aspects of the present disclosure. The embodiments described in the present disclosure can be readily used as a basis for designing or modifying other processes and for performing the same or similar purposes and / or achieving the same or similar advantages as the embodiments introduced herein. These equivalent structures do not depart from the spirit and scope of the present disclosure and can be made with various changes, substitutions, and alterations without departing from the spirit and scope of the present disclosure.

Claims

1. An integrated circuit package substrate, characterized in that include: plate body; as well as A carrying surface is arranged on the upper surface of the plate body, and the carrying surface includes multiple first dividing lines and multiple second dividing lines, wherein two adjacent first dividing lines and two adjacent second dividing lines form a substrate placement area, each of the first dividing lines intersects with the multiple second dividing lines at multiple intersections, and each of the first dividing lines is provided with four grooves between two adjacent intersections, and the four grooves are used to provide a picking space.

2. The integrated circuit package substrate according to claim 1, characterized in that: The four grooves penetrate through the plate body.

3. The integrated circuit package substrate according to claim 2, characterized in that: The aperture of each groove gradually decreases downward from the bearing surface.

4. The integrated circuit package substrate according to claim 3, characterized in that: The area of ​​each groove gradually decreases from 2 cm*1.5 cm downwards.

5. The integrated circuit package substrate according to claim 3, characterized in that: The bottom of the inner wall of each groove forms a smooth curved surface.

6. The integrated circuit package substrate according to claim 1, characterized in that: The first dividing line corresponds to the long side of the substrate placement area, and the second dividing line corresponds to the short side of the substrate placement area.

7. The integrated circuit package substrate according to claim 1, characterized in that: The distance between two adjacent grooves is in the range of 1.5-2.0 cm.

8. The integrated circuit package substrate according to claim 1, characterized in that: The first dividing line is a horizontal dividing line, and the second dividing line is a vertical dividing line.

9. The integrated circuit package substrate according to claim 1, characterized in that: The carrying surface includes the substrate placement areas arranged in an array.

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