Novel wafer substrate stripping and grabbing device

Abstract

The utility model relates to a novel wafer substrate stripping and grabbing device, which comprises a slide rail mounting plate with a disc-shaped structure, a sucker mounting block below the drive end of the bottom of a sucker cylinder drives the sucker mounting block to move in the vertical direction, and a sucker is mounted at the bottom of the sucker mounting block; the driving end of the bottom of the servo motor is connected with a cam track groove disc located below the sliding rail installation plate, the sliding rail is connected with a sliding block above the sliding rail and moves in the radial direction of the sliding rail installation plate, the inner side of the sliding rail is connected with a cam track groove through a cam bearing follower, and clamping fingers are installed at the bottom of a clamping finger installation block. According to the utility model, the product is coarsely positioned by three-jaw centering while the sucker is adopted for adsorption, so that secondary taking and placing are facilitated, the clamping jaws and the sucker are matched for use, dislocation or falling of the upper and lower substrates in the product transfer process can be prevented, the purpose of double insurance is achieved, and the risk of product damage is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a novel wafer substrate peeling and grasping device. Background Technique

[0002] In the Micro LED display technology, after the RGB chips are usually generated on a source substrate of a specific material, a large number of them need to be transferred to a target substrate or a driving circuit through a high-precision operating device, which is called the mass transfer technology. To meet this actual application requirement, the epitaxial peeling technology with high efficiency and high reliability has become one of the key steps in the Micro LED manufacturing technology. The laser peeling technology (i.e., LLO) is a good choice in automated operations, which brings the problem of efficient peeling of the source substrate or the intermediate substrate (hereinafter collectively referred to as the substrate).

[0003] Currently, the commonly used peeling technologies mainly include mechanical peeling, chemical peeling, laser peeling, etc. For the mass transfer technology, although the principle of mechanical peeling is simple, it requires complex etching technology support and has poor stability and repeatability; although chemical peeling has less damage to the GaN film, the separation efficiency is limited; the laser peeling technology can meet the requirements of industrial automation for high efficiency and high stability. Since the upper and lower two substrates are usually relatively flat and almost in a "tightly attached" state, coupled with the coating of various materials on the chips, it is difficult to separate the two substrates. Modern factories usually manually use a thin blade to pry or a simple pulling method to separate the substrates after the peeling process, which not only has low efficiency but also has the risks of damaging products and scratching personnel.

[0004] In view of the above defects, the designer actively conducts research and innovation to create a novel wafer substrate peeling and grasping device, making it more valuable in industry. Content of the Utility Model

[0005] To solve any of the above technical problems, the purpose of the utility model is to provide a novel wafer substrate peeling and grasping device.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] The novel wafer substrate peeling and grasping device includes a slide rail mounting plate with a disc-shaped structure. Along the circumferential direction of the slide rail mounting plate, a number of cylinder mounting grooves are evenly distributed. In the cylinder mounting grooves, suction cup cylinders are installed through cylinder mounting blocks. The driving end at the bottom of the suction cup cylinder drives the suction cup mounting block below to move in the vertical direction, and suction cups are installed at the bottom of the suction cup mounting block.

[0008] A servo motor is installed at the middle position on the slide rail mounting plate through a motor adapter plate. The driving end at the bottom of the servo motor is connected to a cam track groove disc located below the slide rail mounting plate. A number of cam track grooves with arc-shaped structures are evenly distributed along the circumferential direction on the cam track groove disc. A number of slide rails are evenly distributed along the circumferential direction at the bottom of the slide rail mounting plate. The slide rails are distributed along the radial direction of the slide rail mounting plate. A slider is installed at the bottom of the slide rail mounting plate directly above the slide rail. The slide rail is connected to the upper slider and moves in the radial direction of the slide rail mounting plate. The inner side of the slide rail is connected to the cam track groove through a cam follower. A finger mounting block is installed at the bottom of the slide rail, and a finger is installed at the bottom of the finger mounting block.

[0009] As a further improvement of the present utility model, a slide table connecting plate is provided directly above the slide rail mounting plate. The slide table connecting plate is connected to the lower slide rail mounting plate through a number of connecting columns. A slide table is provided directly above the slide table connecting plate. The slide table is installed on the slide table mounting plate. The driving end at the bottom of the slide table drives the lower slide table connecting plate to move in the vertical direction.

[0010] As a further improvement of the present utility model, a slide table reinforcing plate is also provided on the slide table mounting plate on one side of the slide table.

[0011] As a further improvement of the present utility model, mounting limit plates distributed along the radial direction of the slide rail mounting plate are provided on both sides of the cylinder mounting groove. A number of mounting limit holes are evenly distributed along the radial direction of the slide rail mounting plate on the mounting limit plates. The cylinder mounting block is installed on the mounting limit plates through the mounting limit holes.

[0012] As a further improvement of the present utility model, scale lines are provided along the radial direction of the slide rail mounting plate on the slide rail mounting plate outside the mounting limit plates.

[0013] As a further improvement of the present utility model, a number of finger limit holes are evenly distributed along the radial direction of the slide rail mounting plate at the bottom of the finger mounting block. The top of the finger is installed at the bottom of the finger mounting block through the finger limit holes.

[0014] As a further improvement of the present utility model, a finger groove is provided at the position of the finger near the bottom.

[0015] By means of the above solution, the present utility model has at least the following advantages:

[0016] The present utility model can be compatible with the process of peeling wafers of different sizes from the substrate by changing the positions of the fingers and the suction cup cylinder;

[0017] The utility model uses a suction cup for adsorption and at the same time uses three-jaw centering for rough positioning of the product to facilitate secondary picking and placing. By using the clamping jaws and the suction cup in combination, it can also prevent the misalignment or dropping of the upper and lower substrates during the process of transferring the product, achieving the purpose of double insurance and reducing the risk of product damage;

[0018] The structure of the utility model is compact, facilitating operation and maintenance, realizing automation, improving production efficiency and saving costs;

[0019] The utility model can be integrated and used in an automated machine platform.

[0020] The above description is only an overview of the technical solution of the utility model. In order to be able to understand the technical means of the utility model more clearly and implement it in accordance with the content of the description, the following takes the preferred embodiment of the utility model and combines with the attached drawings to describe in detail as follows. Brief Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the attached drawings required to be used in the embodiments. It should be understood that the following attached drawings only show some embodiments of the utility model, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related attached drawings can also be obtained based on these attached drawings.

[0022] Figure 1 is a schematic structural diagram of a novel wafer substrate peeling and grasping device of the utility model;

[0023] Figure 2 is Figure 1 the installation structural diagram of the suction cup cylinder on the slide rail mounting plate in ;

[0024] Figure 3 is Figure 1 the installation structural diagram of the finger slide rail assembly on the slide rail mounting plate in ;

[0025] Figure 4 is a partial enlarged structural diagram of the fingers and the suction cup when the utility model is working.

[0026] Among them, the meanings of the following reference numerals in the drawings are as follows.

[0027] Slide table mounting plate 1, slide table 2, slide table reinforcement plate 3, slide table connecting plate 4, slide rail mounting plate 5, connecting column 6, slide rail 7, finger mounting block 8, finger 9, cam follower 10, cam track groove disc 11, motor adapter plate 12, suction cup 13, suction cup mounting block 14, suction cup cylinder 15, cylinder mounting block 16, servo motor 17, cylinder mounting groove 18, mounting limit plate 19, scale line 20, slider 21, finger limit hole 22, upper substrate 23, lower substrate 24. Detailed implementation manners

[0028] The following will further describe in detail the specific implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0029] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present utility model.

[0030] As Figures 1 to 4 shown, a new type of wafer substrate peeling and grasping device includes a slide rail mounting plate 5 with a disc-shaped structure. A number of cylinder mounting grooves 18 are evenly distributed along the circumferential direction on the slide rail mounting plate 5. A suction cup cylinder 15 is installed in the cylinder mounting groove 18 through a cylinder mounting block 16. The driving end at the bottom of the suction cup cylinder 15 drives the suction cup mounting block 14 below to move in the vertical direction. A suction cup 13 is installed at the bottom of the suction cup mounting block 14.

[0031] 1. A slide table connecting plate 4 is arranged directly above the slide rail mounting plate 5. The slide table connecting plate 4 is connected to the slide rail mounting plate 5 below through a number of connecting columns 6. A slide table 2 is arranged directly above the slide table connecting plate 4. The slide table 2 is installed on a slide table mounting plate 1. The driving end at the bottom of the slide table 2 drives the slide table connecting plate 4 below to move in the vertical direction. A slide table reinforcing plate 3 is also arranged on the slide table mounting plate 1 on one side of the slide table 2. The slide table 2 with precise force control can also set the required pulling force threshold to prevent damage to the product due to over-pulling.

[0032] 2. A servo motor 17 is installed at the middle position on the slide rail mounting plate 5 through a motor adapter plate 12. The driving end at the bottom of the servo motor 17 is connected to a cam track groove disc 11 located below the slide rail mounting plate 5. A number of cam track grooves with arc-shaped structures are evenly distributed along the circumferential direction on the cam track groove disc 11. A number of slide rails 7 are evenly distributed along the circumferential direction at the bottom of the slide rail mounting plate 5. The slide rails 7 are distributed along the radial direction of the slide rail mounting plate 5. A slider 21 is installed at the bottom of the slide rail mounting plate 5 directly above the slide rail 7. The slide rail 7 is connected to the upper slider 21 and moves in the radial direction of the slide rail mounting plate 5. The inner side of the slide rail 7 is connected to the cam track groove through a cam follower 10. A finger mounting block 8 is installed at the bottom of the slide rail 7, and a finger 9 is installed at the bottom of the finger mounting block 8. A finger groove is provided at a position near the bottom of the finger 9.

[0033] 3. Installation limit plates 19 distributed along the radial direction of the slide rail mounting plate 5 are provided on both sides of the cylinder installation groove 18. A number of installation limit holes are evenly distributed along the radial direction of the slide rail mounting plate 5 on the installation limit plates 19. The cylinder mounting block 16 is installed on the installation limit plates 19 through the installation limit holes. Scale lines 20 are provided along the radial direction of the slide rail mounting plate 5 on the slide rail mounting plate 5 outside the installation limit plates 19.

[0034] 4. A number of finger limit holes 22 are evenly distributed along the radial direction of the slide rail mounting plate 5 at the bottom of the finger mounting block 8. The top of the finger 9 is installed at the bottom of the finger mounting block 8 through the finger limit holes 22.

[0035] The first embodiment of the present utility model:

[0036] The precision force control slide table 2 is installed on the slide table mounting plate 1. The slide table connecting plate 4 is installed at the end of the precision force control slide table 2. The slide table reinforcing plate 3 is respectively connected to the precision force control slide table 2 and the slide table connecting plate 4 to enhance the reliability of the connection.

[0037] Finger slide rail assembly: The finger 9 is installed in the clamping groove (i.e., finger limit hole 22) of the finger mounting block 8. Replacing the finger 9 in different clamping grooves can achieve compatibility with different products. The finger mounting block 8 is fixed to the slide rail 7. The cam follower 10 is installed at one end of the slide rail 7. The slide rail 7 is installed under the slide rail mounting plate 5. There are a total of 3 groups of finger slide rail assemblies.

[0038] Suction cup cylinder assembly: The high-temperature resistant suction cup 13 is installed on the suction cup mounting block 14. The suction cup mounting block 14 is installed at the top rod end of the cylinder 15. The cylinder 15 is fixed on the cylinder mounting block 16. The cylinder mounting block 16 can change its position in the chute of the slide rail mounting plate 5 to cooperate with the finger 9 to achieve compatibility with different products. There are a total of 3 groups of suction cup cylinder assemblies.

[0039] The cam track groove disk 11 is flange-connected to the reduction motor 17. The cam track groove disk 11 restricts the cam follower 10 within its cam follower groove. The precision reduction motor 17 is mounted on the convex platform of the slide rail mounting plate 5 through the motor adapter plate 12.

[0040] The connecting column 6 connects the slide table connecting plate 4 and the slide rail mounting plate 5 together.

[0041] Scenario 1: The product (including the upper and lower substrates, i.e., the upper substrate 23 and the lower substrate 24) is adsorbed on the lower stage (not shown). After the LLO process is completed, the present invention moves above the product. The precision force control slide 3 descends to an appropriate position, the suction cup cylinder 15 extends, and the high-temperature suction cup 13 is gently pressed onto the upper substrate of the product. The vacuum is turned on to adsorb the upper substrate. The precision force control slide 2 rises, and under a certain acting force, the upper and lower substrates are separated. The suction cup cylinder 15 retracts, the servo motor 17 drives the cam track groove disk 11 to rotate a certain angle, and the slide rail 7 is pushed to contract through the cam follower 10. The finger 9 assists in clamping the upper substrate 23 through the three-jaw centering principle. The upper substrate 23 is clamped in the groove of the finger to achieve the grasping function. To release the product, only the jaws need to be opened and the vacuum disconnected.

[0042] Scenario 2: Due to the differences between products, if the upper and lower substrates cannot be separated in Scenario 1 (exceeding the pulling force threshold set by the precision force control slide during the peeling process), the pulling will stop. At this time, the present device can be used to take away the whole product and place it on the secondary process stage for treatment to further reduce the adhesion force between the upper and lower substrates, and then repeat the action mode in Scenario 1 to complete the peeling.

[0043] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0044] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those of ordinary skill in the technical field, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A novel wafer substrate peeling and grabbing device, comprising a slide rail mounting plate (5) of a disc-shaped structure, on which a plurality of cylinder mounting grooves (18) are evenly distributed along the circumferential direction, a suction cup cylinder (15) is installed in the cylinder mounting groove (18) through a cylinder mounting block (16), a driving end at the bottom of the suction cup cylinder (15) drives a suction cup mounting block (14) below to move in a vertical direction, and a suction cup (13) is installed at the bottom of the suction cup mounting block (14); characterized in that: A servo motor (17) is installed at a middle position on the slide rail mounting plate (5) via a motor adapter plate (12); a driving end at the bottom of the servo motor (17) is connected to a cam track groove plate (11) located below the slide rail mounting plate (5); a plurality of cam track grooves with an arc structure are evenly distributed along a circumferential direction on the cam track groove plate (11); a plurality of slide rails (7) are evenly distributed along a circumferential direction at the bottom of the slide rail mounting plate (5); and the slide rails (7) are arranged along the slide rail mounting plate. The slide rail (7) is radially distributed on the plate (5), a slider (21) is installed at the bottom of the slide rail mounting plate (5) directly above the slide rail (7), the slide rail (7) is connected to the slider (21) above and the slide rail (7) moves in the radial direction of the slide rail mounting plate (5), the inner side of the slide rail (7) is connected to the cam track groove through a cam bearing follower (10), a clamping finger mounting block (8) is installed at the bottom of the slide rail (7), and a clamping finger (9) is installed at the bottom of the clamping finger mounting block (8).

2. The novel wafer substrate peeling and grabbing device as claimed in claim 1, characterized in that: A slide connecting plate (4) is arranged directly above the slide rail mounting plate (5), and the slide connecting plate (4) is connected to the slide rail mounting plate (5) below via a plurality of connecting columns (6). A slide (2) is arranged directly above the slide connecting plate (4), and the slide (2) is mounted on the slide mounting plate (1). The driving end at the bottom of the slide (2) drives the slide connecting plate (4) below to move in the vertical direction.

3. The novel wafer substrate peeling and grabbing device as claimed in claim 2, characterized in that: A slide reinforcement plate (3) is also provided on the slide mounting plate (1) on one side of the slide (2).

4. The novel wafer substrate peeling and grabbing device as claimed in claim 1, characterized in that: Mounting limit plates (19) are provided on both sides of the cylinder mounting groove (18) and are distributed radially along the slide rail mounting plate (5). A plurality of mounting limit holes are evenly distributed radially along the slide rail mounting plate (5) on the mounting limit plate (19), and the cylinder mounting block (16) is mounted on the mounting limit plate (19) through the mounting limit holes.

5. The novel wafer substrate peeling and grabbing device as claimed in claim 4, characterized in that: A scale line (20) is provided on the slide rail mounting plate (5) outside the mounting limit plate (19) along the radial direction of the slide rail mounting plate (5).

6. The novel wafer substrate peeling and grabbing device as claimed in claim 1, characterized in that: A plurality of clamping finger limiting holes (22) are evenly distributed along the radial direction of the slide rail mounting plate (5) at the bottom of the clamping finger mounting block (8), and the top of the clamping finger (9) is mounted on the bottom of the clamping finger mounting block (8) through the clamping finger limiting holes (22).

7. The novel wafer substrate peeling and grabbing device as claimed in claim 1, characterized in that: The clamping finger (9) is provided with a clamping finger groove near the bottom.

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