Integrated signal terminal

Abstract

The utility model discloses an integrated signal terminal, which comprises a pin seat electrically connected with an upper copper layer of a copper-clad ceramic substrate; the connecting part is formed above the needle seat and is used for connecting the needle seat and the crimping part; the crimping part is formed above the connecting part, can be arranged in the PCB, and is pressed to generate cold deformation to be electrically connected with the PCB; the guide part is formed above the crimping part and is used for guiding the PCB to penetrate into the integrated signal terminal; wherein the yield strength of the crimping part is smaller than the yield strength of the needle seat, the connecting part and the guide part. According to the utility model, the needle seat, the connecting part, the crimping part and the guide part form an integrally formed structure, so that an additional needle inserting process is not needed, and the needle shrinkage problem is also avoided. According to the utility model, the structure of the crimping part and the coating material design can support crimping and welding between the signal terminal and the PCB at the same time.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, and particularly to an integrated signal terminal for a power module. Background Art

[0002] The current product structure of the power module includes a heat dissipation substrate 1, a copper-clad ceramic substrate 2, a chip 3, a plastic frame 4, a signal terminal 5 (composed of a signal pin 5.1 and a pin socket 5.2), etc., as shown in Figure 1 Combined Figure 2 shown.

[0003] During production, first, the pin socket is welded to the upper copper layer of the copper-clad ceramic substrate, and then the signal pin is inserted into the hole of the pin socket through a pin insertion process to achieve the purpose of monitoring and detecting the core state. The current product structure of the power module has the following problems to be solved:

[0004] 1. The manufacturing process is complex. It is necessary to first connect the pin socket to the upper copper layer of the copper-clad ceramic substrate through a soldering process, and then insert the signal terminal into the pin socket hole through a pin insertion process to achieve electrical connection.

[0005] 2. There will be a situation of pin shrinkage. Since the signal terminal is inserted into the pin socket hole through a pin insertion process, the cross-section of the signal terminal is square, while the cross-section of the pin socket hole is circular. The connection between the two is achieved through hard extrusion and the material deformation of the pin socket. As shown in Figure 3 shown, the black shaded area 6 is the area where the two parts will undergo hard extrusion deformation. This connection method is not reliable because there will be a subsequent PCB crimping process, which will apply a force of 50 - 100 N to each signal terminal, and it is possible that the signal terminal will continue to slide under the action of this pressure, affecting the stability of the electrical connection.

[0006] Chinese Patent CN220526902U discloses a power module signal terminal including a pin and a base; the base has opposite first and second sides, and the first side of the base is used for soldering; wherein, the second side of the base is integrally connected with the pin. The technical solution disclosed in this application can solve the problems of high production cost, easy loosening, and unreliable electrical connection of the existing split signal terminal. This solution is more suitable for the soldering connection between the signal terminal and the PCB, and also lists some examples containing side convex segments, which is not very applicable to the crimping process.

[0007] Chinese Patent CN116130441A discloses an electrical connection component and a power module. The electrical connection component includes a first conductive member and a second conductive member. The lower end of the first conductive member is used to connect to a substrate; the second conductive member is connected to the upper end of the first conductive member in a sleeved manner, and the upper end of the second conductive member is used to abut against an upper die; one of the first conductive member and the second conductive member has a deformation portion, and the other has an abutting portion. The deformation portion can abut against the abutting portion and deform, so that the second conductive member moves downward. In the present invention, the deformable deformation portion is integrated into the first conductive member or the second conductive member, reducing the number of components compared with the related art. Only the first conductive member needs to be fixedly connected to the substrate, and the connection relationship between the second conductive member and the first conductive member is a sleeved connection without the need for fixation. Compared with the related art, the connection between the spring and the spring seat and the connection between the spring seat and the conductive column are omitted, thus simplifying the assembly difficulty. This solution still realizes the connection by means of pins, mainly describing how to achieve deformation through the structures of the pin socket and the signal terminal, so as to ensure the electrical connection between the pin socket and the signal terminal. Summary of the Utility Model

[0008] A series of simplified concepts are introduced in the Summary of the Utility Model part. These simplified concepts are all simplified from the prior art in the field, which will be further described in detail in the Detailed Description part. The Summary of the Utility Model part of the present invention does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.

[0009] The technical problem to be solved by the present invention is to provide an integrated signal terminal that does not require a pin insertion process and realizes assembly through a crimping process or a reflow soldering process.

[0010] To solve the above technical problem, the integrated signal terminal provided by the present invention includes:

[0011] A pin socket 5.2, which is electrically connected to the upper copper layer of the copper-clad ceramic substrate; the pin socket and the upper copper layer of the copper-clad ceramic substrate can be connected by ultrasonic welding or by soldering.

[0012] A connecting portion 5.3, which is formed above the pin socket 5.2 and is used to connect the pin socket 5.2 and the crimping portion 5.4.

[0013] A crimping portion 5.4, which is formed above the connecting portion 5.3 and can be arranged in the PCB 4. It undergoes cold deformation under pressure to form an electrical connection with the PCB 4; it can also form an electrical connection through reflow soldering, or can form an electrical connection through a process combining crimping and reflow soldering.

[0014] A guiding portion 5.5, which is formed above the crimping portion 5.4 and is used to guide the PCB 4 to penetrate into the integrated signal terminal.

[0015] Among them, the yield strength of the crimping part 5.4 is less than that of the needle base 5.2, the connecting part 5.3 and the guiding part 5.5. That is, under the stressed state, the crimping part 5.4 deforms first, and at least the inner needle base 5.2, the connecting part 5.3 and the guiding part 5.5 do not deform under the condition that the stressed state remains unchanged.

[0016] Preferably, further improve the integrated signal terminal. The needle base 5.2 is formed into a disk with a flat bottom and a chamfer at the edge.

[0017] Preferably, further improve the integrated signal terminal. The diameter range of the disk is 1.5 mm to 2.5 mm, and the diameter is preferably 1 mm or 2 mm. The radius range of the rounded corner is 0.02 mm to 0.1 mm, and the radius is preferably 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm or 0.09 mm.

[0018] Preferably, further improve the integrated signal terminal. The cross-section of the connecting part 5.3 is formed into a square.

[0019] Preferably, further improve the integrated signal terminal. The crimping part 5.4 is formed into an annular hollow structure, and the outer radius of the annular hollow structure is greater than the aperture of the PCB 4.

[0020] Preferably, further improve the integrated signal terminal. The cross-section of the hollow part of the annular hollow structure is circular, triangular, trapezoidal or polygonal.

[0021] Preferably, further improve the integrated signal terminal. When the cross-section of the hollow part of the annular hollow structure is circular, it is formed into a semi-annular ring. The outer radius range of the semi-annular ring is 1 mm to 2 mm, and the outer radius is preferably 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm or 1.9 mm. The inner radius range of the semi-annular ring is 0.8 mm to 1.6 mm, and the inner radius of the semi-annular ring is preferably 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or 1.5 mm.

[0022] Preferably, further improve the integrated signal terminal. The top of the guiding part 5.5 is formed with a chamfer.

[0023] Preferably, further improve the integrated signal terminal. It is characterized in that the crimping part 5.4 is formed with a nickel undercoat tin plating layer or a gold layer.

[0024] Preferably, to further improve the above-mentioned integrated signal terminal, it further includes: a circular ring support structure formed between the pin base 5.2 and the connection part 5.3. The function of adding the circular ring support structure is that when feeding the signal terminal, vacuum adsorption is generally used, and the periphery of the added circular ring structure is beneficial for adsorption feeding.

[0025] The utility model can at least achieve the following technical effects;

[0026] 1. The pin base, connection part, crimping part and guiding part of the utility model are formed into an integrally formed structure, without the need for an additional pin insertion process, and the problem of pin shrinkage is also avoided.

[0027] 2. The structure and plating material design of the crimping part of the utility model can support both crimping and soldering between the signal terminal and the PCB.

[0028] 3. The upper copper layer of the pin base of the utility model and the copper-clad ceramic substrate can be ultrasonically welded or welded, and the operation is convenient. Description of the Drawings

[0029] The drawings of the utility model are intended to show the general characteristics of the methods, structures and / or materials used in specific exemplary embodiments of the utility model to supplement the description in the specification. However, the drawings of the utility model are schematic diagrams not drawn to scale, and thus may not be able to accurately reflect the precise structure or performance characteristics of any given embodiment. The drawings of the utility model should not be construed as limiting or restricting the scope of the values or properties covered by the exemplary embodiments of the utility model. The following further describes the utility model in detail in conjunction with the drawings and specific embodiments:

[0030] Figure 1 is a schematic diagram of the structure of an existing power module product Figure 1 .

[0031] Figure 2 is a schematic diagram of the structure of an existing power module product Figure 2 .

[0032] Figure 3 is a schematic diagram of the deformation position of the pin of an existing signal terminal.

[0033] Figure 4 is a schematic diagram of the structure of the first embodiment of the utility model.

[0034] Figure 5 is a cross-sectional view of a feasible embodiment of the crimping part of the utility model.

[0035] Description of the Reference Numerals

[0036] Heat dissipation substrate 1

[0037] Copper-clad ceramic substrate 2

[0038] Chip 3

[0039] Plastic frame 4

[0040] Signal terminal 5

[0041] Signal pin 5.1

[0042] Pin socket 5.2

[0043] Connection part 5.3

[0044] Crimping part 5.4

[0045] Guide part 5.5. Specific implementation mode

[0046] The following illustrates the implementation modes of the present utility model through specific specific examples. Those skilled in the art can fully understand other advantages and technical effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through different specific implementation modes. The details in this specification can also be applied based on different viewpoints, and various modifications or changes can be made without departing from the overall design concept of the utility model. It should be noted that, without conflict, the following examples and the features in the examples can be combined with each other. The following exemplary embodiments of the present utility model can be implemented in many different forms and should not be construed as being limited only to the specific embodiments described herein. It should be understood that these embodiments are provided so that the disclosure of the present utility model is thorough and complete, and the technical solutions of these exemplary specific embodiments are fully conveyed to those skilled in the art. It should be understood that when an element is referred to as being "connected" or "coupled" to another element, the element can be directly connected or coupled to the other element, or there can be an intermediate element. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intermediate element. In all the drawings, the same reference numerals always represent the same elements.

[0047] The first embodiment;

[0048] Refer to Figure 4 As shown, the present utility model provides an integrated signal terminal, including:

[0049] A pin socket 5.2, which is electrically connected to the upper copper layer of the copper-clad ceramic substrate;

[0050] A connection part 5.3, which is formed above the pin socket 5.2 and is used to connect the pin socket 5.2 and the crimping part 5.4;

[0051] A crimping part 5.4, which is formed above the connection part 5.3, can be arranged in the PCB 4, and generates cold deformation under pressure to form an electrical connection with the PCB 4;

[0052] A guiding part 5.5, which is formed above the crimping part 5.4 and is used to guide the PCB 4 to penetrate into the integrated signal terminal;

[0053] Wherein, the yield strength of the crimping part 5.4 is less than the yield strengths of the pin base 5.2, the connecting part 5.3 and the guiding part 5.5. Preferably, the yield strength of the crimping part 5.4 is much less than the yield strengths of the pin base 5.2, the connecting part 5.3 and the guiding part 5.5.

[0054] Optionally, further improving the above first embodiment, the pin base 5.2 is formed as a disk with a flat bottom and a chamfer at the edge. The diameter range of the disk is 1.5 mm to 2.5 mm, and the radius range of the rounded chamfer is 0.02 mm to 0.1 mm.

[0055] Optionally, further improving the above first embodiment, the cross-section of the connecting part 5.3 is formed as a square.

[0056] Optionally, further improving the above first embodiment, the crimping part 5.4 is formed as an annular hollow structure, and the outer radius of the annular hollow structure is greater than the aperture diameter of the PCB 4.

[0057] Optionally, further improving the above first embodiment, a chamfer is formed at the top of the guiding part 5.5.

[0058] Optionally, further improving the above first embodiment, the crimping part 5.4 is formed with a nickel-based tin plating layer or a gold layer.

[0059] Reference Figure 5 As shown, optionally, further improving the above first embodiment, the cross-section of the hollow part of the annular hollow structure is circular, triangular, trapezoidal or polygonal.

[0060] Wherein, when the cross-section of the hollow part of the annular hollow structure is circular, it is formed as a semi-annular ring. The outer radius range of the semi-annular ring is 1 mm to 2 mm, and the inner radius range of the semi-annular ring is 0.8 mm to 1.6 mm.

[0061] The second embodiment;

[0062] The second embodiment of the present utility model is a further improvement based on the above first embodiment. The same parts will not be described in detail. It further includes: a ring support structure, which is formed between the pin base 5.2 and the connecting part 5.3.

[0063] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. It will also be understood that terms such as those defined in a general dictionary shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0064] The above has described this utility model in detail through specific embodiments and examples, but these do not constitute a limitation to this utility model. Without departing from the principle of this utility model, those skilled in the art can also make many modifications and improvements, which should also be regarded as the protection scope of this utility model.

Claims

1. An integrated signal terminal, characterized in that: include: A needle holder (5.2) electrically connected to the upper copper layer of the copper-clad ceramic substrate; A connecting portion (5.3) formed above the needle seat (5.2) and used to connect the needle seat (5.2) and the crimping portion (5.4); A crimping portion (5.4) is formed above the connecting portion (5.3) and can be arranged in the PCB (4). It is pressed to generate cold deformation and form an electrical connection with the PCB (4); A guide portion (5.5) formed above the crimping portion (5.4) and used to guide the PCB (4) to penetrate the integrated signal terminal; The yield strength of the crimping portion (5.4) is smaller than the yield strength of the needle seat (5.2), the connecting portion (5.3) and the guiding portion (5.5).

2. The integrated signal terminal according to claim 1, characterized in that: The needle seat (5.2) is formed as a disk with a flat bottom and chamfered edges.

3. The integrated signal terminal according to claim 2, characterized in that: The disc diameter ranges from 1.5mm to 2.5mm, and the fillet radius ranges from 0.02mm to 0.1mm.

4. The integrated signal terminal according to claim 1, wherein: The connecting portion (5.3) has a square cross section.

5. The integrated signal terminal according to claim 1, characterized in that: The crimping portion (5.4) is formed into an annular hollow structure, and the outer radius of the annular hollow structure is larger than the aperture of the PCB (4).

6. The integrated signal terminal according to claim 5, characterized in that: The cross section of the hollow part of the annular hollow structure is circular, triangular, trapezoidal or polygonal.

7. The integrated signal terminal according to claim 6, characterized in that: When the cross section of the hollow part of the annular hollow structure is circular, it forms a semicircular ring, the outer radius of the semicircular ring is in the range of 1 mm to 2 mm, and the inner radius of the semicircular ring is in the range of 0.8 mm to 1.6 mm.

8. The integrated signal terminal according to claim 1, wherein: Also includes: The top of the guide portion (5.5) is formed with a chamfer.

9. The integrated signal terminal according to any one of claims 1 to 8, characterized in that: The crimping portion (5.4) is formed with a nickel-undercoated tin-plated layer or a gold layer.

10. The integrated signal terminal according to any one of claims 1 to 8, further comprising: A circular ring support structure is formed between the needle seat (5.2) and the connecting part (5.3).

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