Solid state relay

By using a thyristor bracket and ceramic substrate in solid-state relays, the problem of inconvenient maintenance and high processing technology requirements of existing solid-state relays after potting is solved, and the product quality stability and reliability are achieved.

CN223007548UActive Publication Date: 2025-06-20ZHEJIANG LANSHENG ELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202422196229.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-07
Publication Date
2025-06-20
Estimated Expiration
2034-09-07

AI Technical Summary

Technical Problem

Existing solid-state relays are inconvenient for maintenance after potting, high processing technology requirements, and it is difficult to ensure the uniformity and quality of glue filling, resulting in poor product consistency.

Method used

A solid-state relay is designed, and a thyristor is fixed by using a thyristor bracket. The interlocking plate on the thyristor is matched with the interlocking slot of the base to make the thyristor stick tightly to the bottom plate, and a U-shaped elastic part is set on the interlocking plate to increase the downforce; at the same time, a ceramic substrate is set between the thyristor and the bottom plate to improve thermal conductivity and heat dissipation efficiency.

Benefits of technology

Through the design of the thyristor bracket and ceramic substrate, the stable and tight connection between the thyristor and the bottom plate is achieved, the connection density and thermal conductivity are improved, and the product quality stability and reliability are ensured.

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Abstract

The utility model relates to a solid-state relay, which comprises a base, a bottom plate and a silicon controlled rectifier, the bottom plate is arranged at the bottom of the base, the silicon controlled rectifier is arranged on the bottom plate, the solid-state relay further comprises a silicon controlled rectifier support, a silicon controlled rectifier positioning groove matched with the silicon controlled rectifier is formed in the middle of the silicon controlled rectifier support, and two sides of the silicon controlled rectifier support extend outwards to form interlocking plates. According to the utility model, the silicon controlled rectifier is fixed by adopting the silicon controlled rectifier bracket, and the silicon controlled rectifier is tightly attached to the bottom plate through the matching of the interlocking plate on the silicon controlled rectifier and the interlocking clamping groove of the base, so that the stable and tight connection between the silicon controlled rectifier and the bottom plate is ensured.
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Description

Technical Field

[0001] The utility model relates to a relay, in particular to a solid state relay. Background Art

[0002] A solid state relay (SSR for short) is a contactless switch composed of microelectronic circuits, discrete electronic devices, and power electronic power devices. This relay realizes the contactless and sparkless connection and disconnection of the circuit through the switching characteristics of electronic components (such as semiconductor devices like switching triodes and bidirectional thyristors), so it is also called a "contactless switch".

[0003] Solid state relays usually adopt potting technology to pot semiconductor devices such as thyristors in the housing. However, the potted solid state relays are not convenient for maintenance, and the processing technology requirements are high. It is difficult to ensure the uniformity and quality of potting, and the product consistency is poor. Summary of the Invention

[0004] Aiming at the above deficiencies, the utility model provides a solid state relay that is convenient for assembly and has stable and reliable quality.

[0005] To achieve the above purpose, the utility model adopts a solid state relay, including a base, a bottom plate, and a thyristor. The bottom plate is arranged at the bottom of the base, and the thyristor is arranged on the bottom plate. The solid state relay further includes a thyristor support. A thyristor positioning groove adapted to the thyristor is formed in the middle of the thyristor support. The thyristor support extends outward to form two or more interlocking plates. Interlocking card slots are formed on the base, and the outer ends of the interlocking plates are connected in the interlocking card slots on the base.

[0006] The utility model is further arranged such that a U-shaped elastic part is formed on the interlocking plate.

[0007] The utility model is further arranged such that a ceramic substrate is arranged between the thyristor and the bottom plate.

[0008] The beneficial effect of the utility model is that the thyristor is fixed by the thyristor support. Through the cooperation of the interlocking plate on the thyristor and the interlocking card slot on the base, the thyristor is closely attached to the bottom plate, ensuring a stable and tight connection between the thyristor and the bottom plate. At the same time, the U-shaped elastic part arranged on the interlocking plate can increase the downward pressure on the thyristor, further improving the tightness of the connection. The ceramic substrate arranged between the thyristor and the bottom plate improves the heat conduction efficiency between the thyristor and the bottom plate, and thus improves the heat dissipation efficiency of the thyristor. Description of the Drawings

[0009] Figure 1 It is a schematic diagram of a specific embodiment of the utility model.

[0010] Figure 2It is a cross-sectional view of a specific embodiment of the present utility model.

[0011] Figure 3 It is a schematic assembly diagram of the base of a specific embodiment of the present utility model.

[0012] Figure 4 It is Figure 3 an exploded view of Specific embodiments

[0013] As Figures 1 to 4 shown, a specific embodiment of the present utility model is a solid-state relay, which includes a base 1, a middle cover 2, an upper cover 3, a bottom plate 4, a thyristor 5, a circuit board 6, and a terminal block 7. The bottom plate 4 is arranged at the bottom of the base 1, the middle cover 2 is arranged on the base 1, a wiring groove 21 is formed on the middle cover 2, the terminal block 7 is arranged above the base 1, and the terminal block 7 is stuck in the wiring groove 21 of the middle cover 2. The upper cover 3 covers above the middle cover 2. The thyristor 5 is arranged on the bottom plate 4, a ceramic substrate 8 is arranged between the thyristor 5 and the bottom plate 4. The circuit board 6 is arranged above the thyristor 5, and the circuit board 6 is respectively connected to the terminal block 7 and the thyristor 5. The solid-state relay further includes a thyristor bracket 9. A thyristor positioning groove 91 adapted to the thyristor 5 is formed in the middle of the thyristor bracket 9. The two sides of the thyristor bracket 9 extend outwards to form an interlock plate 92. An interlock card slot 11 is formed on the base 1, and the outer end of the interlock plate 92 is connected in the interlock card slot 11 of the base 1. A U-shaped elastic part 93 is formed on the interlock plate 92.

[0014] The interlock plate 92 in the present utility model is not limited to the positions on the front and rear sides of the thyristor bracket 9 shown in the specific embodiment and its attached drawings. The interlock plate 92 can also be arranged at any two opposite positions of the thyristor bracket 9 or at two or more positions arranged at equal angles around it. For example, the interlock plate 92 is arranged on the left and right sides of the thyristor bracket 9, or the interlock plate 92 is arranged in the front, rear, left, and right four directions of the thyristor bracket 9. The above technical solutions are all within the scope of the substantial protection of the claims of the present utility model.

[0015] The directions such as above and below in the present utility model refer to the relative positions determined with the position of the upper cover as the upper and the position of the base as the lower. Other substantially identical transformations are also within the scope of the claims of the present utility model.

Claims

1. A solid-state relay, comprising a base, a bottom plate, and a thyristor, wherein the bottom plate is arranged at the bottom of the base, and the thyristor is arranged on the bottom plate, characterized in that: The solid-state relay also includes a thyristor bracket, a thyristor positioning groove adapted to the thyristor is formed in the middle of the thyristor bracket, the thyristor bracket extends outward to form 2 or more interlocking plates, an interlocking slot is formed on the base, and the outer end of the interlocking plate is connected to the interlocking slot of the base.

2. The solid-state relay according to claim 1, characterized in that: A U-shaped elastic portion is formed on the interlocking plate.

3. The solid-state relay according to claim 1 or 2, characterized in that: A ceramic substrate is arranged between the thyristor and the bottom plate.