Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a frame body; the first support is connected with the frame body, and the first support comprises a hollow area; the camera assembly is arranged on the inner side of the first support, and the camera assembly is connected with the first support; and the heat conduction part is arranged in the hollow area, and the heat conduction part is in contact with the camera assembly.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the continuous increase in consumers' imaging requirements for electronic devices, the thickness of electronic devices has been continuously thickened. In order to reduce the thickness of the whole machine, periscope cameras are widely used in electronic devices.

[0003] In related technologies, with the expansion of the types of cameras, the heat generation areas of different types of cameras are distributed differently, and the layout requirements of the corresponding heat dissipation structures are different. As a result, some cameras cannot dissipate heat through the heat dissipation surface of the frame and need to rely on the outer bracket for heat dissipation.

[0004] However, in order to meet the lightweight design of electronic devices at the same time, the bracket is mostly made of a material with a low density but limited thermal conductivity (magnesium alloy), resulting in technical problems such as poor heat dissipation effect of the camera and high failure rate of the camera in the electronic device. Utility Model Content

[0005] This application aims to provide an electronic device, which at least solves the technical problems of poor heat dissipation effect of the camera and high failure rate of the camera.

[0006] To solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of this application provides an electronic device, which includes: a frame; a first bracket, the first bracket is connected to the frame, and the first bracket includes a hollowed-out area; a camera assembly, the camera assembly is arranged inside the first bracket, and the camera assembly is connected to the first bracket; a heat conduction component, the heat conduction component is arranged in the hollowed-out area, and the heat conduction component is in contact with the camera assembly.

[0008] This application is provided with a hollowed-out area on the first bracket, and the hollowed-out area can directly expose a part of the outer surface of the inner camera assembly.

[0009] On this basis, the electronic device further includes a heat conduction component, which is made of a material with excellent heat conduction performance. After assembly, the heat conduction component is located in the hollowed-out area, and the heat conduction component is in contact with the outer surface of the camera assembly exposed in the hollowed-out area. The heat generated by the camera assembly during operation can be quickly transferred to the heat conduction component through contact, and the heat is dissipated to the environment outside the first bracket through the heat conduction component, so as to achieve efficient heat dissipation of the camera assembly.

[0010] Among them, compared with the first bracket, the heat-conducting component has lower stiffness requirements and lower density requirements. Therefore, the heat-conducting component can be prepared from a non-metallic material with excellent heat-conducting performance. For example, the heat-conducting component can be prepared from heat-conducting silica gel or heat-conducting silicone grease to make up for the deficiency of the first bracket in heat-conducting performance, thereby accelerating the heat dissipation efficiency of the camera module.

[0011] At the same time, there is inevitably a gap between the bracket arranged outside the camera module and the outer surface of the camera module. The gap is filled with air, and the heat-conducting performance of air is poor, which will affect the rate of heat transfer to the outside of the bracket. In this regard, in the present application, by arranging a heat-conducting component in the hollow area that is in direct contact with the camera module, heat can be directly transferred to the outside of the bracket through the heat-conducting component, and heat does not need to be transferred across the air in the gap. For example, when preparing the heat-conducting component from heat-conducting silica gel, the heat-conducting coefficient of the heat-conducting silica gel is 172 times that of air, and heat can be exported from the camera module more quickly.

[0012] It can be seen that in the present application, by arranging a hollow area on the bracket and arranging a heat-conducting component in the hollow area that contacts the camera module, the electronic device takes into account both lightweight design and efficient heat dissipation design, thereby solving the technical problems of poor heat dissipation effect of the camera and high failure rate of the camera in the related art. Furthermore, the technical effects of optimizing the heat dissipation structure of the electronic device, improving the heat dissipation efficiency of the electronic device, and enhancing the safety and reliability of the electronic device are achieved.

[0013] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, where:

[0015] Figure 1 is an exploded view of an electronic device according to an embodiment of the present application;

[0016] Figure 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0017] Figure 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0018] Figure 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0019] Figure 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0020] Figure 6 is Figure 5 A partial enlarged view of the electronic device in the A area in the illustrated embodiment;

[0021] Figure 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0022] Figure 8 is Figure 7 A partial enlarged view of the electronic device in the B area in the illustrated embodiment;

[0023] Figure 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0024] Figure 10 is Figure 9 A partial enlarged view of the electronic device in the C area in the illustrated embodiment;

[0025] Figure 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0026] Figure 12 is Figure 11 A cross-sectional view of the electronic device in the D-D direction in the illustrated embodiment;

[0027] Figure 13 is Figure 12 A partial enlarged view of the electronic device in the E area in the illustrated embodiment.

[0028] Reference numerals:

[0029] 100 Electronic device, 110 Housing, 1102 Installation groove, 120 First bracket, 1202 Hollow area, 122 First bump, 124 Second bump, 126 Adhesive layer, 130 Camera module, 1302 Heat concentration area, 140 Heat conducting component, 150 Circuit board, 1502 Through hole, 160 Conductive component, 170 Electrical connection component, 172 Metal shrapnel, 174 Second bracket, 176 Metal insert. Detailed implementation manners

[0030] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0031] The terms "first" and "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally indicates an "or" relationship between the associated objects before and after.

[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] The following Figures 1 to 13 describes an electronic device according to an embodiment of this application.

[0034] As Figure 1 、 Figure 2 and Figure 3 shown, an electronic device 100 according to some embodiments of this application, the electronic device 100 includes: a housing 110; a first bracket 120, the first bracket 120 is connected to the housing 110, and the first bracket 120 includes a hollowed-out area 1202; a camera assembly 130, the camera assembly 130 is disposed inside the first bracket 120, and the camera assembly 130 is connected to the first bracket 120; a heat-conducting component 140, the heat-conducting component 140 is disposed in the hollowed-out area 1202, and the heat-conducting component 140 is in contact with the camera assembly 130.

[0035] In this technical solution, the electronic device 100 includes a housing 110, a first bracket 120, and a camera assembly 130.

[0036] The housing 110 is the main frame structure of the electronic device 100, and the housing 110 can provide positioning, protection, and support for other structures in the electronic device 100.

[0037] The camera assembly 130 can be used to collect image information, so that the electronic device 100 can implement corresponding functions through the collected image information, such as taking pictures, recording videos, or scanning two-dimensional codes.

[0038] The first bracket 120 connects the housing 110 and the camera assembly 130, and the camera assembly 130 is fixed inside the housing 110 through the first bracket 120 to ensure that the camera assembly 130 can be accurately positioned at a predetermined installation position.

[0039] Specifically, the camera assembly 130 includes a periscope camera. The periscope camera draws on the basic principle of the periscope and reflects light through a built-in reflective lens, so that the lens can achieve a telephoto effect while maintaining a short flange distance. This design makes the periscope camera smaller in size and lighter in weight than a telephoto lens, thereby providing convenient conditions for the miniaturization and lightweight design of the electronic device 100. The heat concentration area of ​​the periscope camera is located on the four sides, and needs to be dissipated by the first brackets 120 on the four sides.

[0040] In addition, in some camera assemblies 130 in which the sensors are concentrated at the top, the heat concentration area may also be concentrated at the top of the camera assembly 130, resulting in the camera assembly 130 also needing to rely on the outer first bracket 120 for heat dissipation.

[0041] The camera assembly 130 generates a large amount of heat during operation. If the heat cannot be discharged from the camera assembly 130 in time, the overheated camera assembly 130 may malfunction, affect the normal use of the electronic device 100, and create a safety hazard.

[0042] In this regard, the present application provides a hollow area 1202 on the first bracket 120 , and the hollow area 1202 can directly expose a portion of the outer surface of the inner camera assembly 130 .

[0043] In one embodiment, the hollow area 1202 can be arranged around the camera assembly 130, and the first bracket 120 can dissipate heat from the camera assembly 130 that generates heat around it, for example, centrally dissipate heat for a periscope camera through the hollow areas 1202 around it.

[0044] In another embodiment, the hollow area 1202 may be arranged on the top of the camera assembly 130, and the first bracket 120 may dissipate the heat of the camera assembly 130 that generates heat on the top.

[0045] On this basis, the electronic device 100 further includes a heat-conducting component 140, which is made of a material with strong thermal conductivity. After assembly, the heat-conducting component 140 is located in the hollow area 1202, and the heat-conducting component 140 is in contact with the outer surface of the camera assembly 130 exposed in the hollow area 1202. The heat generated by the camera assembly 130 during operation can be quickly transferred to the heat-conducting component 140 through contact, and the heat is dissipated to the environment outside the first bracket 120 through the heat-conducting component 140, so as to achieve efficient heat dissipation of the camera assembly 130.

[0046] Among them, compared with the first bracket 120, the stiffness requirement and low-density requirement of the heat-conducting component 140 are lower. Therefore, the heat-conducting component 140 can be prepared from a non-metallic material with excellent heat-conducting performance. For example, the heat-conducting component 140 is prepared from heat-conducting silica gel or heat-conducting silicone grease to make up for the deficiency of the first bracket 120 in heat-conducting performance, thereby accelerating the heat dissipation efficiency of the camera module 130.

[0047] Meanwhile, there is inevitably a gap between the bracket arranged outside the camera module 130 and the outer surface of the camera module 130, and air exists in the gap. The heat-conducting performance of air is poor, which will affect the rate of heat transfer to the outside of the bracket. In response to this, in the present application, by arranging the heat-conducting component 140 in the hollowed-out area 1202 that is in direct contact with the camera module 130, heat can be directly transferred to the outside of the bracket through the heat-conducting component 140, and heat does not need to be transferred across the air in the gap. For example, when the heat-conducting component 140 is prepared from heat-conducting silica gel, the heat-conducting coefficient of the heat-conducting silica gel is 172 times that of air, and heat can be exported from the camera module 130 more quickly.

[0048] It can be seen that in the present application, by arranging the hollowed-out area 1202 on the bracket and arranging the heat-conducting component 140 in the hollowed-out area 1202 that is in contact with the camera module 130, the electronic device 100 takes into account both lightweight design and efficient heat dissipation design, thereby solving the technical problems of poor heat dissipation effect of the camera and high camera failure rate in the related art. Furthermore, the technical effects of optimizing the heat dissipation structure of the electronic device 100, improving the heat dissipation efficiency of the electronic device 100, and improving the safety and reliability of the electronic device 100 are achieved.

[0049] Such as Figure 1 、 Figure 2 and Figure 3 As shown, in some embodiments of the present application, optionally, the camera module 130 includes a periscope camera; the heat-conducting component 140 is in contact with the peripheral side surface of the periscope camera.

[0050] In this technical solution, the camera module 130 includes a periscope camera.

[0051] Among them, the heat generated in the periscope camera will be concentrated in a local area on the peripheral side surface of the periscope camera to form a heat concentration area 1302 on the peripheral side surface of the periscope camera. During the working process, the temperature value of the heat concentration area 1302 is higher than that of other areas, and the heat dissipation requirement of the heat concentration area 1302 is relatively large. The peripheral side surface of the periscope camera is vertically placed compared with the whole machine plane of the electronic device 100. Therefore, the heat concentration area 1302 cannot dissipate heat by means of the heat dissipation surface on the frame 110.

[0052] In this regard, the hollow area 1202 on the bracket is arranged opposite to the heat concentration area 1302. After assembly, the heat-conducting component 140 in the hollow area 1202 is in direct contact with the heat concentration area 1302, so that the heat on the heat concentration area 1302 is quickly conducted to the outside of the bracket through the heat-conducting component 140, thereby reducing the temperature of the heat concentration area 1302, realizing the centralized heat dissipation of the periscope camera, enabling the heat-conducting component 140 to dissipate heat targeted at the relatively hot heat concentration area 1302. Furthermore, the layout of the heat-conducting component 140 is optimized, the heat dissipation efficiency of the camera module 130 is improved, and the technical effect of reducing the operating temperature of the camera module 130 is achieved.

[0053] As Figure 1 , Figure 2 and Figure 3 shown, in some embodiments of the present application, optionally, the first bracket 120 is a magnesium alloy bracket, and the magnesium alloy bracket is bonded to the camera module 130; the heat-conducting component 140 is a heat-conducting silicone layer, and the heat-conducting silicone layer is attached to the outer surface of the camera module 130.

[0054] In this technical solution, the first bracket 120 is a magnesium alloy bracket, that is, the first bracket 120 is prepared by magnesium alloy.

[0055] Magnesium alloy has strong stiffness, which can meet the positioning and support requirements of the camera module 130 to ensure that the camera module 130 can be accurately positioned at a predetermined position. At the same time, compared with metal materials such as aluminum alloy, the density of magnesium alloy is relatively low. Preparing the bracket with magnesium alloy can facilitate the lightweight design of the electronic device 100. In addition, compared with air, the heat-conducting performance of magnesium alloy is better, and the magnesium alloy bracket can also play an auxiliary role in heat dissipation.

[0056] On this basis, the magnesium alloy bracket cannot meet the heat dissipation requirements of the camera module 130 alone, and the gap between the magnesium alloy bracket and the camera module 130 will also affect the heat dissipation efficiency. In this regard, the heat-conducting component 140 is a heat-conducting silicone layer, that is, the heat-conducting component 140 is formed by heat-conducting silicone. The heat-conducting performance of heat-conducting silicone is better than that of magnesium alloy, which can make up for the heat dissipation deficiency of the magnesium alloy bracket, thereby improving the heat dissipation efficiency of the camera module 130. Moreover, the heat-conducting silicone layer is directly attached to the outer surface of the camera module 130, and there is no gap between the two, and heat can be directly transferred through contact, thereby improving the heat dissipation efficiency.

[0057] Specifically, the shape of the heat-conducting silicone layer is adapted to the shape of the hollow area 1202. After assembly, the heat-conducting silicone layer fills the hollow area 1202, thereby increasing the contact area between the heat-conducting silicone layer and the camera module 130, and further improving the heat dissipation efficiency of the camera module 130.

[0058] Specifically, the thermal conductive silicone once covered the entire heat concentration area 1302.

[0059] Specifically, the camera module 130 and the magnesium alloy bracket are bonded through the bonding layer 126.

[0060] As Figure 4 , Figure 7 and Figure 9 shown, in some embodiments of the present application, optionally, the electronic device 100 further includes: a circuit board 150, the circuit board 150 is connected to the housing 110; a conductive component 160, the conductive component 160 is disposed on the first bracket 120; an electrical connection component 170, the electrical connection component 170 is disposed on the circuit board 150, and the electrical connection component 170 contacts the conductive component 160, and the first bracket 120 is grounded through the conductive component 160 and the electrical connection component 170.

[0061] In this technical solution, the electronic device 100 further includes a circuit board 150, the circuit board 150 is fixed inside the housing 110, the camera module 130 is connected to the circuit board 150 through a flexible cable, the circuit board 150 can control the operation of the camera module 130, and the image information collected by the camera module 130 can be transmitted to the circuit board 150.

[0062] Among them, the radio frequency signal of the electronic device 100 will interfere with the camera module 130, resulting in interference stripes when the camera module 130 works. Therefore, a grounding connection needs to be made between the first bracket 120 and the circuit board 150 to eliminate the interference.

[0063] On this basis, when the first bracket 120 has conductivity, a conductive component 160 is provided on the first bracket 120, and an electrical connection component 170 is correspondingly provided on the circuit board 150. After assembly, the electrical connection component 170 contacts the conductive component 160, so that the first bracket 120 can be connected to the ground point on the circuit board 150 through the conductive component 160 and the electrical connection component 170, thereby realizing the grounding connection of the first bracket 120 to eliminate the interference of the radio frequency signal on the camera module 130, and further achieving the technical effect of improving the working stability of the camera module 130.

[0064] Specifically, if the first bracket 120 is directly in contact with the electrical connection component 170, when the electronic device 100 is impacted, the first bracket 120 and the electrical connection component 170 will rub frequently. When the first bracket 120 is made of a metal material such as magnesium alloy, friction will generate an oxide layer on the first bracket 120, and the oxide layer will affect the reliability of the electrical connection and the grounding reliability of the first bracket 120.

[0065] To this end, by providing a conductive component 160 between the first bracket 120 and the electrical connection component 170, the conductive component 160 can replace the first bracket 120 to contact the electrical connection component 170, so as to prevent the first bracket 120 from generating an oxide layer due to friction. And by providing the conductive component 160 independent of the first bracket 120, the conductive component 160 can be made of a non-metallic material different from that of the first bracket 120. This can not only improve the electrical connection stability by selecting a material with excellent corrosion resistance, but also reduce the friction and collision losses by selecting a material with lower stiffness, thereby further enhancing the electrical connection reliability between the first bracket 120 and the circuit board 150.

[0066] As Figure 7 , Figure 8 , Figure 9 and Figure 10 shown, in some embodiments of the present application, optionally, the first bracket 120 includes a first bump 122, the conductive component 160 is provided on the side of the first bump 122 facing the circuit board 150, and the electrical connection component 170 includes: a metal spring piece 172, the metal spring piece 172 is provided on the circuit board 150, and the metal spring piece 172 is in contact with the conductive component 160.

[0067] In this technical solution, the circumferential side of the first bracket 120 includes a first bump 122. After assembly, the first bump 122 is located above the circuit board 150. The conductive component 160 is installed on the side of the first bump 122 facing the circuit board 150, and the ground connection point on the circuit board 150 is opposite to the first bump 122.

[0068] On this basis, the electrical connection component 170 includes a metal spring piece 172. The metal spring piece 172 is installed on the ground connection point of the circuit board 150, and the metal spring piece 172 is electrically connected to the ground connection point. After the assembly of the first bracket 120 and the camera module 130 is completed, the first bump 122 on the first bracket 120 presses on the metal spring piece 172 through the conductive component 160 to achieve electrical connection through contact. The metal spring piece 172 can generate elastic deformation when being pressed, and the metal spring piece 172 with elastic deformation can closely adhere to the conductive component 160 through the elastic force to improve the electrical connection reliability.

[0069] By providing the metal spring piece 172 and the conductive component 160 on the first bump 122, a contact electrical connection between the first bracket 120 and the circuit board 150 is achieved, enabling the first bracket 120 to complete the positioning assembly and the electrical connection assembly synchronously, eliminating the need to provide a rigid electrical connection structure such as screws between the first bracket 120 and the circuit board 150, and enabling the first bracket 120 to adapt to different circuit board 150 structures, thereby solving the problem of poor commonality of the rigid electrical connection structure.

[0070] As Figure 7 ,Figure 8 , Figure 9 and Figure 10 As shown in Figure 8 , Figure 9 , and Figure 10 , in some embodiments of the present application, optionally, the conductive component 160 is a gold-plated sheet; the magnesium alloy bracket is welded to the gold-plated sheet.

[0071] In this technical solution, the first bracket 120 is a magnesium alloy bracket, that is, the first bracket 120 is prepared by magnesium alloy.

[0072] Magnesium alloy has strong stiffness, which can meet the positioning and support requirements of the camera module 130 to ensure that the camera module 130 can be accurately positioned at a predetermined position. At the same time, compared with metal materials such as aluminum alloy, magnesium alloy has a lower density. Preparing the bracket with magnesium alloy can facilitate the lightweight design of the electronic device 100. In addition, compared with air, magnesium alloy has better thermal conductivity, and the magnesium alloy bracket can also play a role in assisting heat dissipation.

[0073] On this basis, the conductive component 160 is a gold-plated sheet, which is prepared by plating gold on the outer surface of the substrate. During the assembly process, the gold-plated sheet is welded to the side of the first bump 122 facing the circuit board 150.

[0074] Among them, compared with magnesium alloy, the gold-plated sheet has stronger conductivity, which can avoid direct contact between the metal elastic sheet 172 and the magnesium alloy bracket, prevent the formation of a new oxide layer due to friction between the magnesium alloy bracket and the metal elastic sheet 172, and eliminate the hidden danger of poor grounding.

[0075] As Figure 11 , Figure 12 and Figure 13 As shown in Figure 11 , Figure 12 , and Figure 13 , in some embodiments of the present application, optionally, the first bracket 120 includes a second bump 124, the conductive component 160 is disposed on the second bump 124, and the electrical connection component 170 includes: a second bracket 174, the second bracket 174 is connected to the circuit board 150, there is a gap between the second bracket 174 and the circuit board 150, and the second bump 124 is located in the gap; a metal insert 176, the metal insert 176 is embedded on the side of the second bracket 174 facing the circuit board 150, and the metal insert 176 is electrically connected to the circuit board 150, and the conductive component 160 is clamped between the metal insert 176 and the second bump 124.

[0076] In this technical solution, the circumferential side of the first bracket 120 includes a second bump 124. After assembly, the second bump 124 is located above the circuit board 150, and the conductive component 160 is installed on the second bump 124.

[0077] On this basis, the electrical connection component 170 includes a second bracket 174 and a metal insert 176. The second bracket 174 is used to position and support other electrical components on the circuit board 150. The second bracket 174 is connected to the circuit board 150. After the assembly of the second bracket 174 is completed, there is a gap between the second bracket 174 and the circuit board. The second bump 124 on the first bracket 120 together with the conductive component 160 is inserted into the gap. The metal insert 176 is embedded on the side of the second bracket 174 facing the circuit board 150, and the metal insert 176 is fixed at the grounding point on the circuit board 150 through structures such as screws. After the assembly is completed, the conductive component 160 is clamped between the metal insert 176 and the second bump 124 to ensure that the first bracket 120 can be grounded through the metal insert 176.

[0078] Among them, the interference signal release path of radio frequency radiation is: the first bracket 120—the conductive component 160—the metal insert 176—the second bracket 174—the grounding point on the main board.

[0079] By setting the second bracket 174, the metal insert 176 and the conductive component 160 on the second bump 124, a contact electrical connection between the first bracket 120 and the circuit board 150 is realized, enabling the first bracket 120 to complete the positioning assembly and the electrical connection assembly synchronously, eliminating the need to set rigid electrical connection structures such as screws between the first bracket 120 and the circuit board 150, and enabling the first bracket 120 to adapt to different circuit board 150 structures, thus solving the problem of poor commonality existing in the rigid electrical connection structure.

[0080] Such as Figure 11 , Figure 12 and Figure 13 As shown, in some embodiments of the present application, optionally, the conductive component 160 is a conductive foam. The conductive foam is provided on the side of the second bump 124 facing away from the circuit board 150, and the metal insert 176 and the second bump 124 clamp the conductive foam.

[0081] In this technical solution, the conductive component 160 is a conductive foam, and the conductive foam is attached to the side of the second bump 124 facing away from the circuit board 150.

[0082] The metal insert 176 is a steel sheet, and the second end of the metal insert 176 extends from the second bracket 174 to the side of the second bump 124 facing away from the circuit board 150. During the assembly process, first, the camera module 130 is fixed on the circuit board 150 through the first bracket 120. Then, the second bracket 174 is assembled onto the circuit board 150. After the second bracket 174 is installed at the predetermined position, the extended metal insert 176 cooperates with the second bump 124 to clamp and position the conductive foam to maintain the contact state between the two, thereby improving the electrical connection stability between the first bracket 120 and the circuit board 150.

[0083] As Figure 5 and Figure 6 shown, in some embodiments of the present application, optionally, the circuit board 150 and the camera module 130 are disposed on the same side of the housing 110. The housing 110 includes a mounting groove 1102, and the circuit board 150 avoids the mounting groove 1102; a part of the camera module 130 is disposed in the mounting groove 1102.

[0084] In this technical solution, the circuit board 150 and the camera module 130 are disposed on the same side of the housing 110, and an installation groove 1102 is formed in the area of the housing 110 facing the camera module 130. The shape and size of the installation groove 1102 are adapted to the shape and size of the camera module 130. During the assembly process, a part of the camera module 130 can be embedded into the installation groove 1102 to achieve the sinking installation of the camera module 130 ( Figure 6 where H is the sinking depth), reducing the dimensions of the camera module 130 and the housing 110 in the height direction, thereby realizing the ultra-thin design of the electronic device 100.

[0085] Specifically, the circuit board 150 avoids the mounting groove 1102 on the housing 110 to ensure that the circuit board 150 does not increase the height of the camera module 130.

[0086] As Figure 5 and Figure 6 shown, in some embodiments of the present application, optionally, the circuit board 150 includes a through hole 1502, and the through hole 1502 is opposite to the mounting groove 1102; the camera module 130 passes through the through hole 1502.

[0087] In this technical solution, a through hole 1502 is provided on the circuit board 150. The shape and size of the through hole 1502 are adapted to the camera module 130. When the circuit board 150 is fixed above the housing 110, the through hole 1502 is opposite to the mounting groove 1102. During the assembly process, the camera module 130 is inserted into the mounting groove 1102 through the through hole 1502, thereby achieving the sinking design of the camera module 130 across the circuit board 150, providing convenient conditions for the ultra-thin design of the electronic device 100.

[0088] The electronic device 100 can be a terminal or other devices other than terminals. Exemplarily, the electronic device 100 can be a mobile phone, a tablet computer, a laptop computer, a handheld computer, an in-vehicle electronic device 100, a Mobile Internet Device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It can also be a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations.

[0089] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0090] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Frame; A first bracket, the first bracket is connected to the frame, and the first bracket includes a hollow area; A camera assembly, wherein the camera assembly is disposed inside the first bracket and connected to the first bracket; A heat-conducting component is disposed in the hollow area and is in contact with the camera assembly.

2. The electronic device according to claim 1, characterized in that: The camera assembly includes a periscope camera; The heat-conducting component is in contact with the peripheral side surface of the periscope camera.

3. The electronic device according to claim 1, characterized in that: The first bracket is a magnesium alloy bracket, and the magnesium alloy bracket is bonded to the camera assembly; The heat-conducting component is a heat-conducting silicone layer, and the heat-conducting silicone layer is bonded to the outer surface of the camera assembly.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises: A circuit board connected to the frame; A conductive component, wherein the conductive component is arranged on the first bracket; An electrical connection component is provided on the circuit board and is in contact with the conductive component, and the first bracket is grounded through the conductive component and the electrical connection component.

5. The electronic device according to claim 4, characterized in that: The first bracket includes a first bump, the conductive component is arranged on a side of the first bump facing the circuit board, and the electrical connection component includes: A metal spring is disposed on the circuit board and keeps in contact with the conductive component.

6. The electronic device according to claim 5, characterized in that: The conductive component is a gold-plated sheet; The magnesium alloy bracket is welded to the gold-plated sheet.

7. The electronic device according to claim 4, characterized in that: The first bracket includes a second bump, the conductive component is arranged on the second bump, and the electrical connection component includes: a second bracket, the second bracket being connected to the circuit board, a gap being provided between the second bracket and the circuit board, and the second protrusion being located in the gap; A metal insert is embedded in a side of the second bracket facing the circuit board, and the metal insert is electrically connected to the circuit board, and the conductive component is clamped between the metal insert and the second bump.

8. The electronic device according to claim 7, characterized in that: The conductive component is conductive foam, which is arranged on a side of the second bump facing away from the circuit board, and the metal insert and the second bump clamp the conductive foam.

9. The electronic device according to any one of claims 4 to 8, characterized in that: The circuit board and the camera assembly are arranged on the same side of the frame, the frame includes a mounting groove, and the circuit board avoids the mounting groove; The camera assembly is partially disposed in the mounting groove.

10. The electronic device according to claim 9, characterized in that: The circuit board comprises a through hole, and the through hole is opposite to the mounting groove; The camera assembly is inserted into the through hole.

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