Sealing structure and electronic equipment

Abstract

The utility model discloses a sealing structure and electronic equipment, and belongs to the field of electronic equipment. A sealing structure is used for sealing an electronic module. The electronic module comprises a circuit board, and an interface module and an acoustic-electric conversion module which are arranged on the circuit board. The sealing structure comprises a first sealing element and a second sealing element, the first sealing element is provided with a slot for inserting the circuit board, and the first sealing element is used for sealing at least part of the interface module; the second sealing piece comprises a supporting part and at least one dustproof piece, the supporting part is connected with the first sealing piece, the supporting part is provided with a first channel, the first channel is used for being communicated with a sound channel of the acoustoelectric conversion module, and the dustproof piece covers at least one of a port, communicated with the sound channel, of the first channel or a port, deviating from the sound channel, of the first channel.

Description

Technical Field

[0001] This application belongs to the field of electronic devices, and particularly relates to a sealing structure and an electronic device. Background Art

[0002] Electronic devices in the related art have requirements for waterproof and dustproof performance. Multiple functional modules are connected to the circuit board in an electronic device. Corresponding seals can be provided for each functional module to isolate at least part of the functional module from the external environment through the seals, thereby improving the waterproof and dustproof capabilities of each functional module. A certain distance needs to be reserved between adjacent functional modules so that corresponding seals can be assembled for each of them respectively. In order to ensure that the seals do not interfere with each other, space also needs to be reserved between adjacent seals, resulting in large space occupied by adjacent seals. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide a sealing structure and an electronic device, which can solve the technical problem of large space occupied by adjacent seals in the related art.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, the embodiments of this application provide a sealing structure for sealing an electronic module. The electronic module includes a circuit board, and an interface module and an acoustic-electric conversion module disposed on the circuit board; the sealing structure includes:

[0006] A first seal having a slot for inserting the circuit board, and the first seal is used to seal at least part of the interface module;

[0007] A second seal including a support portion and at least one dustproof member. The support portion is connected to the first seal, the support portion has a first channel for communicating with the sound channel of the acoustic-electric conversion module, and the dustproof member covers at least one of the port where the first channel communicates with the sound channel or the port of the first channel facing away from the sound channel.

[0008] In a second aspect, the embodiments of this application provide an electronic device, including:

[0009] A housing including a frame and a mounting bracket, and the mounting bracket is disposed within the frame;

[0010] An electronic module disposed within the frame and mounted on the mounting bracket. The electronic module includes a circuit board, and an interface module and an acoustic-electric conversion module disposed on the circuit board;

[0011] The sealing structure as in the first aspect, where the first seal is disposed between the housing and the interface module, and the second seal is located on the side of the circuit board close to the mounting bracket, and the second seal is disposed between the mounting bracket and the circuit board.

[0012] In the embodiments provided in the present application, by connecting the supporting parts of the first seal and the second seal, when the first seal is used to seal the interface module and the second seal is used to seal the acoustic-electric conversion module, the sealing structure can be assembled to the electronic module together, thereby improving the assembly efficiency; compared with separately providing independent seals for the interface module and the acoustic-electric conversion module, providing the sealing structure in the present application can eliminate the need to reserve an interference space between adjacent independent seals, so that compared with two independently provided seals, the sealing structure provided in the present application has a smaller volume, which is beneficial to the miniaturization of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is one of the partial three-dimensional structural diagrams of an electronic device provided by an embodiment of the present application;

[0014] Figure 2 is the partial disassembled structural diagram of an electronic device provided by an embodiment of the present application;

[0015] Figure 3 is one of the three-dimensional structural diagrams of the sealing structure provided by an embodiment of the present application;

[0016] Figure 4 is the partial cross-sectional structural diagram of an electronic device provided by an embodiment of the present application;

[0017] Figure 5 is Figure 4 the enlarged structural diagram of part A shown;

[0018] Figure 6 is one of the partial cross-sectional structural diagrams of the second seal provided by an embodiment of the present application;

[0019] Figure 7 is the partial three-dimensional structural diagram of an electronic device provided by an embodiment of the present application;

[0020] Figure 8 is the three-dimensional structural diagram of the sealing structure provided by an embodiment of the present application;

[0021] Figure 9 is the three-dimensional structural diagram of the sealing structure provided by an embodiment of the present application;

[0022] Figure 10 is the partial cross-sectional structural diagram of the second seal provided by an embodiment of the present application;

[0023] Figure 11 is the cross-sectional structural diagram of the sealing structure provided by an embodiment of the present application;

[0024] Figure 12It is a schematic cross-sectional structure diagram of an unassembled second seal provided by an embodiment of the present application. Description of the Drawings:

[0026] 10. Sealing structure; 1. First seal; 11. Slot; 12. First sealing part; 13. Second sealing part; 14. Third sealing part; 2. Second seal; 21. Support part; 22. Dust-proof part; 23. First channel; 22a. First dust-proof part; 22b. Second dust-proof part; 24. First sealing rib; 211. First installation sub-part; 212. Second installation sub-part; 213. Bending connection part; 25. First adhesive; 26. Second adhesive; 27. Second channel;

[0027] 20. Electronic module; 201. Circuit board; 2011. First surface; 2012. Second surface; 2013. Notch; 2014. Through hole; 202. Interface module; 203. Acoustic-electric conversion module;

[0028] 40. Housing; 401. Frame; 402. Mounting bracket; 403. Socket; 404. Sound output channel. Detailed Embodiments

[0029] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0030] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0031] Next, the sealing structure and electronic device provided by the embodiments of the present application will be described in detail in conjunction with the accompanying drawings, through specific embodiments and their application scenarios.

[0032] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5As shown in the figure, an embodiment of the present application provides a sealing structure 10, which is used to seal an electronic module 20. The electronic module 20 includes a circuit board 201, an interface module 202 and an acoustic-electric conversion module 203 arranged on the circuit board 201. The sealing structure 10 includes a first seal 1 and a second seal 2. The first seal 1 has a slot 11 for inserting the circuit board 201, and the first seal 1 is used to seal at least part of the interface module 202. The second seal 2 includes a support portion 21 and at least one dust-proof member 22. The support portion 21 is connected to the first seal 1. The support portion 21 has a first channel 23, and the first channel 23 is used to communicate with the sound channel of the acoustic-electric conversion module 203. The dust-proof member 22 covers at least one of the port where the first channel 23 communicates with the sound channel or the port of the first channel 23 facing away from the sound channel.

[0033] The circuit board 201, the interface module 202 and the acoustic-electric conversion module 203 can be assembled into an integral body in advance, and then the sealing structure 10 is assembled onto the electronic module 20. Finally, the electronic module 20 with the sealing structure 10 is assembled into the housing 40 of the electronic device together. The sealing structure 10 can surround the opening of the housing 40 to prevent water vapor, dust, etc. outside the housing 40 from contacting all or part of the circuit board 201, the interface module 202 and the acoustic-electric conversion module 203. The interface module 202 can specifically be an external interface module 202 such as a USB Type-C interface module 202, a Lightning interface module 202, a Micro USB interface module 202, etc. The acoustic-electric conversion module 203 can be a microphone, a speaker, etc.

[0034] The first seal 1 has a slot 11. When the sealing structure 10 is assembled onto the electronic module 20, the slot 11 of the first seal 1 is aligned with the part of the circuit board 201 where the interface module 202 is arranged, and the circuit board 201 is inserted into the slot 11, so that the first seal 1 can seal part of the circuit board 201. The first seal 1 can also be arranged around part or all of the interface module 202, so that the first seal 1 can seal part or all of the interface module 202.

[0035] Exemplarily, the interface module 202 is a USB Type-C interface module 202. The circuit board 201 has a first surface 2011 and a second surface 2012 that are oppositely arranged. The circuit board 201 also has a notch 2013 connecting the first surface 2011 and the second surface 2012. The USB Type-C interface module 202 is disposed through the notch 2013, and the USB Type-C interface module 202 is fixed and electrically connected to the circuit board 201. A part of the first seal 1 contacts the first surface 2011, and another part of the first seal 1 contacts the second surface 2012 and covers the part of the USB Type-C interface that protrudes from the second surface 2012 away from the first surface 2011. The first seal 1 can seal a part of the first surface 2011, a part of the second surface 2012, and the part of the USB Type-C interface that protrudes from the second surface 2012 away from the first surface 2011.

[0036] The second seal 2 is used to seal the sound channels of the acoustic-electric conversion module 203. The dust-proof member 22 can be a dust-proof film, a dust-proof net, etc. Sound waves, airflows, etc. can pass through the dust-proof member 22, while water vapor, dust, etc. cannot pass through the dust-proof member 22. When the sealing structure 10 is assembled to the electronic module 20, the first seal 1 and the second seal 2 are installed on the electronic module 20 together. The second seal 2 corresponds to the sound channels of the acoustic-electric conversion module 203, so that the dust-proof member 22 of the second seal 2 can cover the first channel 23 communicating with the sound channels. Sound waves emitted by the acoustic-electric conversion module 203 or sound waves in the external environment can both propagate through the first channel 23 and the sound channels. The second seal 2 can prevent or reduce water vapor, dust, etc. from entering the sound channels through the first channel 23, and can also communicate the sound channels with the external environment through the first channel 23.

[0037] The support portion 21 of the second seal 2 and the first seal 1 can be an integrally formed part to improve the structural strength of the sealing structure 10. The support portion 21 of the second seal 2 and the first seal 1 can be prepared from a material with deformation ability, so that the first seal 1 and the second seal 2 can deform under an external force to adapt to the surface of the contacting structure and improve the sealing performance. The material with deformation ability can be silicone, nitrile rubber, ethylene propylene diene monomer rubber, fluororubber, fluorosilicone rubber, etc.

[0038] In the embodiments provided in the present application, by connecting the support portions 21 of the first seal 1 and the second seal 2, when the first seal 1 is used to seal the interface module 202 and the second seal 2 is used to seal the acoustic-electric conversion module 203, the sealing structure 10 can be assembled to the electronic module 20 together, thereby improving the assembly efficiency; compared with separately providing independent seals for the interface module 202 and the acoustic-electric conversion module 203, providing the sealing structure 10 in the present application can eliminate the need to reserve an interference space between adjacent independent seals, so that compared with two independently provided seals, the sealing structure 10 provided in the present application has a smaller volume, which is beneficial to the miniaturization of the product.

[0039] Please refer to Figure 6 , in some embodiments, at least one dust-proof member 22 includes a first dust-proof member 22a and a second dust-proof member 22b, the first dust-proof member 22a and the second dust-proof member 22b are respectively disposed on opposite sides of the support portion 21, and respectively cover two ports of the first channel 23.

[0040] The first dust-proof member 22a and the second dust-proof member 22b can be prepared from the same or different materials. One port of the first channel 23 can be directly or indirectly communicated with the sound channel, and the first dust-proof member 22a can cover this port. When the sealing structure 10 is installed in the electronic device, the other port of the first channel 23 can be directly or indirectly communicated with the external environment, and the second dust-proof member 22b can cover this port. By providing the first dust-proof member 22a and the second dust-proof member 22b to respectively cover two ports of the first channel 23, the sealing performance of the second seal 2 for the sound channel is improved. By providing the first dust-proof member 22a and the second dust-proof member 22b to respectively cover two ports of the first channel 23, the first dust-proof member 22a and the second dust-proof member 22b are spaced apart, so as to prevent the first dust-proof member 22a and the second dust-proof member 22b from oscillating and touching each other under the action of sound waves, which is beneficial to the propagation of sound waves in the first channel 23.

[0041] In some embodiments, the second seal 2 is used to contact the first surface 2011 of the circuit board 201, the acoustic-electric conversion module 203 is disposed on the first surface 2011, and the first channel 23 of the second seal 2 is directly communicated with the sound channel of the acoustic-electric conversion module 203.

[0042] In other embodiments, the circuit board 201 is provided with a through hole 2014, the through hole 2014 is communicated with the sound channel of the acoustic-electric conversion module 203; the second seal 2 is used to be disposed on one side of the circuit board 201, and the first dust-proof member 22a is used to be disposed between the through hole 2014 and the first channel 23.

[0043] The second seal 2 is used to contact the first surface 2011 of the circuit board 201, and the acoustic-electric conversion module 203 is disposed on the second surface 2012, that is, the second seal 2 and the acoustic-electric conversion module 203 are respectively disposed on opposite sides of the circuit board 201. The sound channel, the through hole 2014 of the acoustic-electric conversion module 203 and the first channel 23 of the second seal 2 are sequentially communicated. The first dust-proof member 22a is used to be disposed between the through hole 2014 and the first channel 23, so that when assembling the sealing structure 10 and the electronic module 20, the second seal 2 carries the first dust-proof member 22a to cover the through hole 2014, and thus the first dust-proof member 22a can be disposed between the through hole 2014 and the first channel 23, improving the assembly efficiency.

[0044] In some embodiments, both opposite sides of the second support portion 21 can be planes. When the second support portion is assembled to the electronic device, the first dust-proof member 22a is in sealing contact with the first surface 2011 of the circuit board 201, and the second dust-proof member 22b is in sealing contact with the housing of the electronic device.

[0045] Please refer to Figure 7 、 Figure 8 、 Figure 9 and Figure 10 In some other embodiments, the second seal 2 further includes a first sealing rib 24, and the first sealing rib 24 is disposed on the surface of the support portion 21 facing away from the first dust-proof member 22a.

[0046] The first sealing rib 24 can be disposed around the second dust-proof member 22b to prevent the second sealing rib from protruding from the support portion 21 and causing the second dust-proof member 22b to be in unstable contact with the support portion 21. The first sealing rib 24 and the support portion 21 can be an integrally formed part, and the first sealing rib 24 has a deformation ability. Under the action of an external force, the first sealing rib 24 deforms, so that the second seal 2 is in close contact with the environmental structure where the electronic module 20 is installed.

[0047] In some embodiments, the support portion 21 includes a first installation sub-portion 211 and a second installation sub-portion 212. The first installation sub-portion 211 has a first channel 23, and the second installation sub-portion 212 has a second channel 27 communicating with the first channel 23. The first installation sub-portion 211, the second dust-proof member 22b and the second installation sub-portion 212 are stacked, and the first sealing rib 24 is disposed on the side of the second installation sub-portion 212 facing away from the first installation sub-portion 211.

[0048] By providing the second installation sub-portion 212 having the second channel 27, the first installation sub-portion 211, the second dust-proof member 22b and the second installation sub-portion 212 can be stacked, and the first sealing rib 24 disposed on the second installation sub-portion 212 does not interfere with the second dust-proof member 22b, improving the structural stability of the second dust-proof member 22b in the second seal 2.

[0049] Exemplarily, the acoustic-electric conversion module 203 is a microphone. The circuit board 201 has a first surface 2011 and a second surface 2012 which are oppositely arranged. The circuit board 201 further has a through hole 2014 connecting the first surface 2011 and the second surface 2012. The microphone is arranged on the second surface 2012. The electronic module 20 is arranged in the housing 40 of the electronic device. One side of the second seal 2 contacts the first surface 2011, and the other side contacts the housing 40. The housing 40 has a sound outlet channel 404 communicating with the first channel 23. The first sealing rib 24 is deformed to be sealed between the housing 40 and the second mounting sub-part 212. The second seal 2 covers between the first channel 23 and the second channel 27.

[0050] Please refer to Figure 11 and Figure 12 In some embodiments, the support part 21 further includes a bent connecting part 213. The bent connecting part 213 connects the first mounting sub-part 211 and the second mounting sub-part 212. At least part of the bent connecting part 213 is bent into an arc shape and arranged around the second dust-proof part 22b.

[0051] The first mounting sub-part 211, the bent connecting part 213 and the second mounting sub-part 212 can be integrally formed. The first dust-proof part and the second dust-proof part are arranged on opposite sides of the first mounting sub-part 211. The bent connecting part 213 is bent so that the first mounting sub-part 211 and the second mounting sub-part 212 are stacked, so that the support part 21 can be prepared by using one mold, reducing the preparation cost.

[0052] In some embodiments, the second seal 2 further includes a first bonding part 25. The first bonding part 25 bonds the second dust-proof part 22b and the second mounting sub-part 212.

[0053] The first bonding part 25 can be an adhesive. The first bonding part 25 bonds the second dust-proof part 22b and the second mounting sub-part 212, so that the second mounting sub-part 212 provided with the first sealing rib 24 can be fixed to the first mounting sub-part 211 through the first adhesive part and the second dust-proof part 22b.

[0054] In some embodiments, the second seal 2 further includes a second bonding part 26. The second bonding part 26 bonds the dust-proof part 22 and the support part 21.

[0055] The first bonding member 25 and the second bonding member 26 can be made of the same or different materials. In the case of having the first dust-proof member 22a and the second dust-proof member 22b, the first dust-proof member 22a can be connected to the support portion 21 through one second bonding member 26, and the second dust-proof member 22b can be connected to the support portion 21 through another second bonding member 26. In the case where the first mounting sub-portion 211 and the second mounting sub-portion 212 are provided, the first dust-proof member 22a, the second bonding member 26, the first mounting sub-portion 211, the second bonding member 26, the second dust-proof member 22b, the first bonding member 25, and the second mounting sub-portion 212 are stacked in sequence.

[0056] Please participate Figures 1 to 12 In a second aspect, the present application further provides an electronic device. The electronic device includes a housing 40, an electronic module 20, and the sealing structure 10 provided as in the first aspect. The housing 40 includes a frame body 401 and a mounting bracket 402. The mounting bracket 402 is disposed inside the frame body 401. The electronic module 20 is disposed inside the frame body 401 and mounted on the mounting bracket 402. The electronic module 20 includes a circuit board 201, and an interface module 202 and an acoustic-electric conversion module 203 disposed on the circuit board 201. The first seal 1 is disposed between the housing 40 and the interface module 202, and the second seal 2 is located on the side of the circuit board 201 close to the mounting bracket 402. The second seal 2 is disposed between the mounting bracket 402 and the circuit board 201.

[0057] The electronic device provided by the present application can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle-mounted device, a Mobile Internet Device (MID), an augmented reality (AR) device, a virtual reality (VR) device, an extended-range (XR) device, a robot, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. It can also be a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations. Hereinafter, the electronic device is taken as an example of a mobile phone for introduction.

[0058] The circuit board 201 is disposed on the mounting bracket 402 along the first direction, and the housing 401 circumferentially surrounds the circuit board 201 and the mounting bracket 402 along a direction perpendicular to the first direction. The first direction may be the thickness direction of the electronic device, or may be the direction from the screen to the back cover in the electronic device. The circuit board 201 may be a secondary board in the electronic device, and a main board is also provided in the electronic device. Both the main board and the secondary board are provided with electronic components to assist the operation of the electronic device.

[0059] On the housing 40, there may be a socket 403 corresponding to the interface module 202, and an external plug can be electrically connected to the interface module 202 through the socket 403. On the housing 40, there may be a sound outlet channel 404, and the sound outlet channel 404 is communicated with the sound channel of the electroacoustic conversion module 203 through the first channel 23, so that the sound wave emitted by the electroacoustic conversion module 203 can be transmitted to the outside, or the external sound wave can be transmitted to the electroacoustic conversion module 203.

[0060] The first seal 1 is disposed between the housing 40 and the interface module 202, so as to prevent external moisture and dust from entering the housing 40 through the socket 403 and the gap between the interface module 202 and the housing 40; the second seal 2 is located on the side of the circuit board 201 close to the mounting bracket 402, and the second seal 2 is disposed between the mounting bracket 402 and the circuit board 201, so as to prevent external moisture and dust from entering the electroacoustic conversion module 203 through the sound outlet channel 404, the first channel 23, etc.

[0061] In some embodiments, the first seal 1 includes a first seal portion 12, a second seal portion 13, and a third seal portion 14 that are sequentially connected. The first seal portion 12, the second seal portion 13, and the third seal portion 14 enclose a slot 11, and the first seal portion 12 and the third seal portion 14 are disposed on opposite sides of the circuit board 201.

[0062] By providing the slot 11, it is convenient to assemble the sealing structure 10 into the electronic module 20; by providing the first seal portion 12 and the third seal portion 14, both opposite sides of the circuit board 201 can be sealed by the first seal 1.

[0063] In some embodiments, the electronic device further includes a first electronic module, and the first electronic module is disposed on the side of the interface module 202 away from the mounting bracket 402. The first seal portion 12 is located on the side of the circuit board 201 away from the mounting bracket 402, and the first seal portion 12 is disposed between the interface module 202 and the first electronic module.

[0064] The first electronic module can be a speaker. The first sealing portion 12 deforms, so that the first sealing portion 12 can block external water vapor, dust, etc. from entering the housing 40 through the gap between the interface module 202 and the first electronic module. Second sealing ribs can also be provided on the surface of the first sealing portion 12 facing away from the circuit board 201 and on the surface close to the circuit board 201, so as to improve the tightness of the contact between the first sealing portion 12 and the first electronic module and the tightness of the contact between the first sealing portion 12 and the circuit board 201.

[0065] In some embodiments, the third sealing portion 14 is disposed around the interface module 202, and the third sealing portion 14 is disposed between the mounting bracket 402 and the interface module 202.

[0066] The mounting bracket 402 can support the circuit board 201. The interface module 202 is disposed at the notch 2013 of the circuit board 201. The interface module 202 protrudes in a direction away from the second surface 2012 relative to the first surface 2011. The third sealing portion 14 can be disposed around this portion to block external water vapor, dust, etc. from entering the housing 40 through the gap between the interface module 202 and the mounting bracket 402. Second sealing ribs can also be provided on the surface of the third sealing portion 14 facing away from the circuit board 201 and on the surface close to the circuit board 201, so as to improve the tightness of the contact between the third sealing portion 14 and the mounting bracket 402 and the tightness of the contact between the third sealing portion 14 and the circuit board 201.

[0067] In some embodiments, the second sealing portion 13 is disposed between the housing 401 and the circuit board 201.

[0068] The second sealing portion 13 is disposed around the side surface of the circuit board 201. The second sealing portion 13 deforms, so that it can block external water vapor, dust, etc. from entering the housing 40 through the gap between the housing 401 and the circuit board 201. Fourth sealing ribs can also be provided on the surface of the second sealing portion 13 facing away from the circuit board 201, so as to improve the tightness between the second sealing portion 13 and the housing 401.

[0069] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. A sealing structure, characterized in that: Used to seal an electronic module, the electronic module includes a circuit board, and an interface module and an acoustic-electric conversion module arranged on the circuit board; the sealing structure includes: A first sealing member, having a slot for inserting the circuit board, and the first sealing member is used to seal at least a portion of the interface module; The second sealing member includes a supporting portion and at least one dustproof member, wherein the supporting portion is connected to the first sealing member, the supporting portion has a first channel, the first channel is used to communicate with the sound channel of the sound-to-electric conversion module, and the dustproof member covers at least one of a port through which the first channel connects to the sound channel or a port through which the first channel deviates from the sound channel.

2. The sealing structure according to claim 1, characterized in that: The at least one dustproof member includes a first dustproof member and a second dustproof member, wherein the first dustproof member and the second dustproof member are disposed on opposite sides of the support portion and respectively cover the two ports of the first channel.

3. The sealing structure according to claim 2, characterized in that: The circuit board is provided with a through hole, and the through hole is connected to the sound channel of the sound-to-electric conversion module; the second sealing member is used to be arranged on one side of the circuit board, and the first dustproof member is used to be arranged between the through hole and the first channel.

4. The sealing structure according to claim 2, characterized in that: The second sealing member further includes a first sealing rib, and the first sealing rib is arranged on a surface of the supporting portion facing away from the first dustproof member.

5. The sealing structure according to claim 4, characterized in that: The supporting portion includes a first mounting sub-portion and a second mounting sub-portion, the first mounting sub-portion having the first channel, the second mounting sub-portion having a second channel connected to the first channel, the first mounting sub-portion, the second dustproof part and the second mounting sub-portion are stacked, and the first sealing rib is arranged on a side of the second mounting sub-portion away from the first mounting sub-portion.

6. The sealing structure according to claim 5, characterized in that: The support portion further includes a bent connection portion, the bent connection portion connecting the first mounting sub-portion and the second mounting sub-portion, and at least a portion of the bent connection portion is bent into an arc shape and disposed around the second dustproof member.

7. The sealing structure according to claim 5, characterized in that: The second sealing member further includes a first adhesive member, and the first adhesive member bonds the second dustproof member and the second mounting sub-portion.

8. The sealing structure according to claim 1, characterized in that: The second sealing member further includes a second adhesive member, and the second adhesive member bonds the dustproof member and the supporting portion.

9. An electronic device, characterized in that: include: The housing comprises a frame and a mounting frame, wherein the mounting frame is arranged in the frame; An electronic module is disposed in the frame and mounted on the mounting frame, wherein the electronic module comprises a circuit board, and an interface module and an acoustic-electric conversion module disposed on the circuit board; According to the sealing structure described in any one of claims 1-8, the first sealing member is arranged between the shell and the interface module, the second sealing member is located on the side of the circuit board close to the mounting frame, and the second sealing member is arranged between the mounting frame and the circuit board.

10. The electronic device according to claim 9, characterized in that: The first sealing member includes a first sealing portion, a second sealing portion and a third sealing portion which are connected in sequence, the first sealing portion, the second sealing portion and the third sealing portion enclose the slot, and the first sealing portion and the third sealing portion are arranged on opposite sides of the circuit board.

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