Heat dissipation structure and electronic equipment
By adopting a combined structure of stacked heat conduction sheets and mesh heat conduction layers in electronic equipment, the problems of difficult processing, high cost and risk of cooling liquid leakage in existing electronic equipment are solved, and efficient and low-cost heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421440235.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-06-21
AI Technical Summary
The existing electronic devices such as smartphones and other electronic devices are difficult to process and costly, and require cooling liquid injection, which poses a risk of liquid leakage.
A heat dissipation structure is adopted, including two layers of heat conducting flakes arranged on the stack and a mesh-shaped thermal conducting layer. Each layer of heat conducting flakes is coated with a heat dissipation coating to one side of the mesh-shaped thermal conducting layer. Through the combination of heat conducting flakes, heat dissipation coatings and mesh-shaped thermal conducting layer, efficient heat conduction and loss of heat is achieved.
It improves heat dissipation performance and efficiency, reduces processing difficulty and cost, avoids the risk of coolant leakage, and allows the heat conductor to thin the design, thereby reducing the weight of the heat dissipation structure.
Smart Images
Figure CN223007765U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and particularly to a heat dissipation structure and an electronic device. Background Art
[0002] With the increasingly widespread use of electronic devices such as laptop computers, tablet computers, and smart phones, the performance requirements of electronic devices have been gradually improved. A variety of electronic components are integrated inside the electronic devices, and a large amount of heat will be generated when the electronic components are in the working state. When these heats accumulate inside the electronic device, the performance of each electronic component will be affected.
[0003] Currently, in smart phones, the heat dissipation is usually carried out by using a VC vapor chamber and a heat dissipation copper tube. The essence of the VC vapor chamber and the heat dissipation copper tube is to quickly transfer heat by evaporating a liquid, which requires injecting the liquid into the sheet material and wrapping it, resulting in high processing difficulty and cost. Utility Model Content
[0004] To solve the above technical problems, the present disclosure provides a heat dissipation structure and an electronic device.
[0005] In a first aspect, the present disclosure provides a heat dissipation structure including a heat dissipation main body and a mesh heat conduction layer. The heat dissipation main body includes two heat conduction sheets arranged in a stacked manner, and the mesh heat conduction layer is sandwiched between the two heat conduction sheets. A heat dissipation coating is provided on one side of each heat conduction sheet facing the mesh heat conduction layer.
[0006] Optionally, the two heat conduction sheets of the heat dissipation main body are formed by bending a single heat conduction sheet.
[0007] Optionally, the two heat conduction sheets include a first heat conduction sheet and a second heat conduction sheet. There are two second heat conduction sheets, and the two second heat conduction sheets are respectively connected to opposite sides of the first heat conduction sheet in its length direction.
[0008] Optionally, the heat dissipation structure includes a plurality of heat dissipation main bodies arranged in a stacked manner, and the mesh heat conduction layer is sandwiched between the two heat conduction sheets of each heat dissipation main body.
[0009] Optionally, a mesh heat conduction layer is provided between two adjacent heat dissipation structures.
[0010] Optionally, the heat conduction sheet is a metal heat conduction sheet, and the thickness of the heat conduction sheet is 0.05 - 0.22 mm;
[0011] And / or, the thickness of the heat dissipation coating is 0 - 0.13 mm.
[0012] Optionally, the thickness of the metal heat dissipation mesh in the thickness direction of the heat conduction sheet is 0.1 - 0.24 mm;
[0013] And / or, the diameter of the metal wires of the metal heat dissipation net is 0 - 0.1 mm;
[0014] Optionally, the heat dissipation coating is any one of a graphene coating, a boron nitride coating, a borophene coating, and a thermal conductive gel.
[0015] In a second aspect, the present disclosure provides an electronic device including the heat dissipation structure provided in the first aspect above.
[0016] The technical solutions provided by the embodiments of the present disclosure have the following advantages compared with the prior art:
[0017] In this heat dissipation structure, a mesh-shaped heat conductive layer is clamped between two heat conductive sheets of the heat dissipation main body, and a heat dissipation coating is coated on one side of each heat conductive sheet facing the other heat conductive sheet. The heat dissipation coating and the heat conductive sheet can accelerate the conduction and dissipation of heat, improve the heat dissipation performance, and the mesh-shaped heat conductive layer can accelerate the heat transfer and increase the heat dissipation area. Therefore, heat can be transferred and dissipated through the heat conductive sheet, the heat dissipation coating, and the mesh-shaped heat conductive layer, improving the heat dissipation efficiency.
[0018] In addition, this heat dissipation structure does not need to be processed to form a closed cavity, which can reduce the processing difficulty and cost. Moreover, since there is no need to inject a coolant, there is no risk of liquid leakage, and the requirement for the thickness of the heat conductive sheet can also be reduced, enabling the heat conductive sheet to be designed with a thinner thickness and reducing the weight of the heat dissipation structure. Description of the Drawings
[0019] The drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure and used together with the specification to explain the principles of the present disclosure.
[0020] To more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.
[0021] Figure 1 It is a schematic structural diagram of the heat dissipation structure according to some embodiments of the present disclosure;
[0022] Figure 2 For Figure 1 a partial enlarged schematic diagram of the heat dissipation structure in
[0023] Figure 3 For Figure 1 a processing schematic diagram of the heat dissipation structure in
[0024] Among them,
[0025] 1. Heat dissipation main body; 11. First-layer heat conducting sheet; 12. Second-layer heat conducting sheet;
[0026] 2. Heat dissipation coating;
[0027] 3. Mesh heat conducting layer;
[0028] 10. Single-layer heat conducting sheet. Detailed implementation manners
[0029] In order to more clearly understand the above-mentioned objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other.
[0030] Many specific details are set forth in the following description in order to fully understand the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.
[0031] An embodiment of the present disclosure provides a heat dissipation structure, which includes a heat dissipation main body 1 and a mesh heat conducting layer 3. Among them, the heat dissipation main body 1 includes two layers of heat conducting sheets arranged in a stacked manner, and a mesh heat conducting layer 3 is sandwiched between the two layers of heat conducting sheets, and a heat dissipation coating 2 is coated on the side of the heat conducting sheet facing the mesh heat conducting layer 3.
[0032] That is to say, a mesh heat conducting layer 3 is sandwiched between the two layers of heat conducting sheets, and a heat dissipation coating 2 is coated on the side of each heat conducting sheet facing the other heat conducting sheet. The heat dissipation coating 2 and the heat conducting sheet can accelerate the conduction and dissipation of heat, improve the heat dissipation performance, and the mesh heat conducting layer 3 can increase the heat dissipation area and accelerate the heat transfer. Therefore, heat can be transferred and dissipated through the heat conducting sheet, the heat dissipation coating 2 and the mesh heat conducting layer 3, and the heat dissipation efficiency can be improved.
[0033] In addition, this heat dissipation structure does not need to be processed to form a closed cavity, which can reduce the processing difficulty and cost. Moreover, since there is no need to inject coolant, there is no risk of liquid leakage, and the requirement for the thickness of the heat conducting sheet can also be reduced, so that the heat conducting sheet can be designed with a thinner thickness, and the weight of the heat dissipation structure can be reduced.
[0034] In some embodiments, referring to Figures 1 to 3 , the two layers of heat conducting sheets of the heat dissipation main body 1 are formed by bending a single-layer heat conducting sheet 10. That is to say, the two layers of heat conducting sheets are integrally formed and are formed by bending the single-layer heat conducting sheet 10.
[0035] It can be understood that the single-layer heat conducting sheet 10 forms two layers of heat conducting sheets by bending, so as to clamp the mesh heat conducting layer 3 and play a role in limiting and fixing the mesh heat conducting layer 3. The heat dissipation main body 1 is formed by bending the single-layer heat conducting sheet 10, and the processing difficulty is small, which can reduce the processing cost.
[0036] Exemplarily, in a specific implementation, the shape of the above-mentioned single-layer heat-conducting sheet 10 is rectangular, which is convenient for bending the single-layer heat-conducting sheet in the length direction of the single-layer heat-conducting sheet 10.
[0037] Exemplarily, in a specific implementation, referring to Figure 1 and Figure 2 , the two-layer heat-conducting sheets of the above-mentioned heat dissipation body 1 include a first-layer heat-conducting sheet 11 and a second-layer heat-conducting sheet 12. There are two second-layer heat-conducting sheets 12, and the two second-layer heat-conducting sheets 12 are respectively connected to opposite sides of the first-layer heat-conducting sheet 11 in its length direction. That is to say, in this case, the single-layer heat-conducting sheet is bent on both its opposite sides. In this way, a first-layer heat-conducting sheet 11 and two second-layer heat-conducting sheets 12 can be formed, which can reduce the degree of warping of the second-layer heat-conducting sheet 12 relative to the first-layer heat-conducting sheet 11, so that the second-layer heat-conducting sheet 12 and the first-layer heat-conducting sheet 11 can better clamp the mesh heat-conducting layer 3. At this time, one end of each second-layer heat-conducting sheet 12 close to the other second-layer heat-conducting sheet 12 can be arranged to be suspended relative to the first-layer heat-conducting sheet 11. That is to say, there is no connection relationship between one end of each second-layer heat-conducting sheet 12 close to the other second-layer heat-conducting sheet 12 and the first-layer heat-conducting sheet 11. One end of each second-layer heat-conducting sheet 12 close to the other second-layer heat-conducting sheet 12 is free, and its relative position with respect to the first-layer heat-conducting sheet 11 is variable.
[0038] Wherein, the two second-layer heat-conducting sheets 12 are abutted against each other in the length direction of the first-layer heat-conducting sheet 11. Or there is a gap between the two second-layer heat-conducting sheets 12 in the length direction of the first-layer heat-conducting sheet 11. It can be understood that the requirement for the bending process is relatively high when the two second-layer heat-conducting sheets 12 are abutted against each other in the length direction of the first-layer heat-conducting sheet 11. When bending, it is necessary to accurately calculate the sum of the lengths of the two formed second-layer heat-conducting sheets 12 in the length direction of the first-layer heat-conducting sheet 11. And when there is a gap between the two second-layer heat-conducting sheets 12 in the length direction of the first-layer heat-conducting sheet 11, it is not necessary to accurately calculate the sum of the lengths of the two formed second-layer heat-conducting sheets 12 in the length direction of the first-layer heat-conducting sheet 11, and the requirement for the bending process is relatively low.
[0039] Furthermore, the above-mentioned heat-conducting sheet is a metal heat-conducting sheet, and the thickness of the heat-conducting sheet is 0.05 - 0.22 mm.
[0040] With such a setting, not only can the heat transfer efficiency be ensured and the heat dissipation effect be improved. Moreover, when the heat dissipation body 1 is formed by bending a single-layer heat-conducting sheet 10, the warping degree of each second-layer heat-conducting sheet 12 relative to the first-layer heat-conducting sheet 11 can be reduced after the single-layer heat-conducting sheet 10 is bent. Thus, the mesh heat-conducting layer 3 can be clamped by the first-layer heat-conducting sheet 11 and the second-layer heat-conducting sheet 12 without adopting an additional connection method.
[0041] Among them, the material of the heat-conducting sheet can be, but is not limited to, copper, copper alloy, aluminum or aluminum alloy. For example, when the material of the heat-conducting sheet is copper, the heat-conducting sheet is a copper foil sheet at this time.
[0042] Optionally, in another specific implementation, the two layers of heat-conducting sheets include a first-layer heat-conducting sheet and a second-layer heat-conducting sheet, and the number of both the first-layer heat-conducting sheet and the second heat-conducting sheet is one. At this time, the heat-conducting sheet can be bent once to form the above-mentioned heat dissipation main body.
[0043] It should be noted that in this case, after the single-layer heat-conducting sheet 10 is bent to form the heat dissipation main body, the free ends of the two layers of heat-conducting sheets are connected, and the connection method can be selected as welding, bonding, etc. Among them, the free end of each layer of heat-conducting sheet refers to the end opposite to the end connected to the other layer of heat-conducting sheet.
[0044] Optionally, in some other embodiments, the two layers of heat-conducting sheets of the heat dissipation main body are separately arranged, that is to say, the two layers of heat-conducting sheets are not formed by bending a single-layer heat-conducting sheet. At this time, the two layers of heat-conducting sheets are connected to clamp the mesh heat-conducting layer, and the connection method of the two layers of heat-conducting sheets can be welding, bonding, etc.
[0045] In some embodiments, the heat dissipation coating 2 can be formed on the heat-conducting sheet by a coating process. Exemplarily, the heat dissipation coating 2 can be, but is not limited to, any one of a graphene coating, a boron nitride coating, and a borophene coating, so as to have a relatively high heat conductivity and emissivity, and can conduct and dissipate heat relatively quickly, improve the heat dissipation performance, and improve the heat dissipation efficiency of the heat dissipation structure. Of course, in other embodiments, the heat dissipation coating 2 can also be a heat-conducting gel.
[0046] Furthermore, the thickness of the above-mentioned heat dissipation coating 2 is preferably 0 - 0.13 mm.
[0047] In some embodiments, the above-mentioned mesh heat-conducting layer 3 is a metal heat dissipation mesh. The material of the metal heat dissipation mesh can be, but is not limited to, copper, copper alloy, aluminum or aluminum alloy, and is preferably copper.
[0048] It should be noted that the above-mentioned metal heat dissipation mesh can be a regular or irregular mesh structure. Among them, the regular mesh structure is, for example, a honeycomb shape, etc., and the irregular mesh structure is not specifically limited.
[0049] In addition, since the mesh heat-conducting layer 3 is selected as a metal heat dissipation mesh, the two layers of heat-conducting sheets clamp the metal heat dissipation mesh. On the one hand, it can play a role in fixing the metal heat dissipation mesh, and on the other hand, it can prevent the metal heat dissipation mesh from damaging the other components of the electronic device.
[0050] Further, the above metal heat dissipation net is woven from metal wires, the diameter of the metal wires is 0 - 0.1 mm, and the thickness of the metal heat dissipation net in the thickness direction of the heat conducting sheet is 0.1 - 0.24 mm, which is beneficial to thinning the overall thickness of the heat dissipation structure, and thus beneficial to the thinning design of the electronic device.
[0051] In some embodiments, the above heat dissipation structure includes a plurality of heat dissipation bodies 1 stacked, and a mesh heat conducting layer 3 is interposed between two layers of heat conducting sheets of each heat dissipation body 1.
[0052] Understandably, when space permits, stacking a plurality of heat dissipation bodies 1 can increase the heat dissipation area and further improve the heat dissipation effect. At this time, the heat conducting sheets of two adjacent heat dissipation bodies 1 are in contact, or the above mesh heat conducting layer 3 is provided between two adjacent heat dissipation bodies 1.
[0053] Exemplarily, referring to Figures 1 to 2 , the heat dissipation structure includes a heat dissipation body 1 and a mesh heat conducting layer 3. Among them, the heat dissipation body 1 includes two layers of heat conducting sheets stacked, a mesh heat conducting layer 3 is interposed between the two layers of heat conducting sheets, and a heat dissipation coating 2 is coated on one side of each layer of heat conducting sheet facing the mesh heat conducting layer 3.
[0054] Among them, the heat dissipation coating 2 is preferably a graphene coating, and the thickness of the graphene coating is 0 - 0.13 mm. The mesh heat conducting layer 3 is preferably a metal heat dissipation net, the material of the metal heat dissipation net is copper, and the metal heat dissipation net is woven from metal wires. Among them, the thickness of the metal heat dissipation net in the thickness direction of the heat conducting sheet is 0.1 - 0.24 mm, and the diameter of the metal wires of the metal heat dissipation net is 0 - 0.1 mm.
[0055] Further, the heat dissipation body 1 is formed by bending a single-layer heat conducting sheet. Specifically, the above two layers of heat conducting sheets include a first-layer heat conducting sheet 11 and a second-layer heat conducting sheet 12, and there are two second-layer heat conducting sheets 12, and the two second-layer heat conducting sheets 12 are respectively connected to opposite sides of the first-layer heat conducting sheet 11 in its length direction. That is to say, a single-layer heat conducting sheet is bent to form a first-layer heat conducting sheet 11 and two second-layer heat conducting sheets 12.
[0056] Among them, the heat conducting sheet is a metal heat conducting sheet, and the material is preferably copper, and the thickness of the heat conducting sheet is preferably 0.05 - 0.22 mm.
[0057] Referring to Figure 2 and Figure 3 , the processing process of this heat dissipation structure will be described in detail below:
[0058] 1. Coating the heat dissipation coating 2 on the single-layer heat conducting sheet 10;
[0059] 2. Placing the mesh heat conducting layer 3 on one side of the single-layer heat conducting sheet 10 coated with the heat dissipation coating 2;
[0060] 3. Bend the single-layer heat-conducting sheet 10 to form a two-layer heat-conducting sheet that clamps the mesh heat-conducting layer 3.
[0061] It should be noted that after applying the heat-dissipating coating on the single-layer heat-conducting sheet 10, the single-layer heat-conducting sheet 10 needs to be cut to the required size, or the single-layer heat-conducting sheet 10 needs to be cut to the required size before applying the heat-dissipating coating 2 on the single-layer heat-conducting sheet 10.
[0062] The embodiment of the present disclosure further provides an electronic device, which includes the above heat-dissipating structure. The electronic device has the technical effects of the heat-dissipating structure in the above embodiment, which will not be elaborated here.
[0063] In some embodiments, the above electronic device is selected as a mobile phone, and the heat-dissipating structure is installed in the mobile phone to dissipate heat from the electronic components of the mobile phone. Of course, in other embodiments, the above electronic device can also be selected as a tablet computer, a wearable device, a computing device, a vehicle-mounted device, a VR device, an AR device, etc., which will not be specifically limited here.
[0064] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the said element.
[0065] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat dissipation structure, characterized in that: The invention comprises a heat dissipation body (1) and a mesh heat-conducting layer (3), wherein the heat dissipation body (1) comprises two layers of heat-conducting sheets which are stacked, the mesh heat-conducting layer (3) is sandwiched between the two layers of heat-conducting sheets, and a heat dissipation coating (2) is provided on the side of each layer of heat-conducting sheets which faces the mesh heat-conducting layer (3).
2. The heat dissipation structure according to claim 1, characterized in that: The two layers of heat conducting plates of the heat dissipation body (1) are formed by bending a single layer of heat conducting plate (10).
3. The heat dissipation structure according to claim 2, characterized in that: The two layers of heat conducting sheets comprise a first layer of heat conducting sheets (11) and a second layer of heat conducting sheets (12), two of the second layer of heat conducting sheets (12) are provided, and the two second layer of heat conducting sheets (12) are respectively connected to two opposite sides of the first layer of heat conducting sheets (11) in the length direction thereof.
4. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure comprises a plurality of heat dissipation bodies (1) arranged in a stacked manner, and the mesh heat conduction layer (3) is sandwiched between two layers of the heat conduction sheets of each heat dissipation body (1).
5. The heat dissipation structure according to claim 4, characterized in that: The mesh heat-conducting layer (3) is arranged between two adjacent heat-dissipating structures.
6. The heat dissipation structure according to claim 1, characterized in that: The heat conducting sheet is a metal heat conducting sheet, and the thickness of the heat conducting sheet is 0.05-0.22 mm; And / or, the heat dissipation coating (2) has a thickness of 0-0.13 mm.
7. The heat dissipation structure according to claim 1, characterized in that: The mesh-shaped heat-conducting layer (3) is a metal heat-dissipating mesh.
8. The heat dissipation structure according to claim 7, characterized in that: The thickness of the metal heat dissipation mesh in the thickness direction of the heat conductive sheet is 0.1-0.24 mm; And / or, the diameter of the metal wires of the metal heat dissipation mesh is 0-0.1 mm.
9. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation coating (2) is any one of a graphene coating, a boron nitride coating, a boronene coating and a thermally conductive gel.
10. An electronic device, characterized in that: It comprises the heat dissipation structure as described in any one of claims 1 to 9.