Automobile intelligent diagnosis positioning box

Abstract

The utility model relates to an automobile intelligent diagnosis positioning box which comprises a first shell, a second shell and a circuit board, and the first shell and the second shell can be mutually buckled or separated; when the first shell and the second shell are buckled with each other, a box body structure is formed, and the circuit board is arranged in the box body structure; the circuit board comprises a substrate, an electronic element and a built-in shielding layer, the electronic element is arranged on the substrate, the substrate is provided with a grounding part, and the grounding part is located on the periphery of the electronic element; the built-in shielding layer defines a shielding separation cavity according to the shape of the electronic component, the electronic component is arranged in the shielding separation cavity, and the built-in shielding layer is electrically connected with the grounding part; the problem that a traditional intelligent diagnosis positioning box is easily interfered by external electromagnetic signals is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle components, and particularly relates to an intelligent vehicle diagnostic and positioning box. Background Art

[0002] An automotive diagnostic and positioning box generally refers to an on-vehicle diagnostic and positioning device of the OBD (On Board Diagnostics) interface type, which combines OBD and GPS positioning functions; the OBD box can view vehicle dynamics in real time, detect vehicle conditions, and even view the driving track and path sharing of the vehicle, analyze driving habits and consumption records, etc. With the rapid development of automotive intelligent technologies, the intelligent vehicle diagnostic and positioning box (abbreviated as the OBD box), as an important device integrating OBD vehicle diagnosis and GPS positioning functions, is gradually becoming an indispensable part of modern vehicle management and maintenance.

[0003] However, the operation of the OBD box faces an important challenge in a complex electromagnetic environment - electromagnetic interference (abbreviated as EMI). The intelligent diagnostic and positioning box usually operates under complex electromagnetic environment conditions. Since the capacitors in the electronic terminal and the main control system connected thereto work, it is easy to be interfered by external environmental electromagnetic signals, and the diagnostic and positioning box itself will also radiate electromagnetic interference signals to the external environment through the connected electronic circuits during operation, affecting the external environment.

[0004] Therefore, in view of this, the inventor proposes an intelligent vehicle diagnostic and positioning box to solve the above technical problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an intelligent vehicle diagnostic and positioning box to solve the problem that the traditional intelligent diagnostic and positioning box is easily interfered by external electromagnetic signals.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] An intelligent vehicle diagnostic and positioning box includes a first housing, a second housing and a circuit board. The first housing can be buckled with or separated from the second housing; when the first housing is buckled with the second housing, a box body structure is formed, and the circuit board is arranged in the box body structure;

[0008] The circuit board includes a substrate, electronic components and an internal shielding layer. The electronic components are arranged on the substrate, and the substrate is provided with a grounding part, and the grounding part is located on the outer periphery of the electronic components;

[0009] The built-in shielding layer defines shielding cavities according to the shape of the electronic components, the electronic components are placed in the shielding cavities, and the built-in shielding layer is electrically connected to the grounding part.

[0010] According to the above technical solution, the built-in shielding layer is specially designed according to the shape of the electronic components. It defines shielding cavities, and places the electronic components in these shielding cavities. This design method is similar to providing an "electromagnetic protection cover" for each electronic component, effectively isolating the interference of external electromagnetic signals. The built-in shielding layer is electrically connected to the grounding part of the circuit board. The built-in shielding layer can conduct the captured electromagnetic interference signals to the ground through the grounding path, thereby further reducing the influence of the interference signals on the electronic components. The grounding part is located on the outer periphery of the electronic components. Such a layout helps to maximize the grounding effect and ensure that the electromagnetic field around the electronic components can be smoothly conducted to the ground. The grounding part of the present invention is not only the potential reference point of the circuit board, but also the main discharge path of electromagnetic interference signals. Through good grounding design, electromagnetic interference signals can be effectively excluded from around the sensitive components.

[0011] Further, a plastic encapsulation body is provided on each of the electronic components. The built-in shielding layer is located outside the plastic encapsulation body and wraps the plastic encapsulation body, and a common grounding part is shared between two adjacent plastic encapsulation bodies.

[0012] According to the above technical solution, the plastic encapsulation body first provides basic physical protection and insulation isolation for the electronic components, preventing dust, moisture, etc. in the external environment from directly contacting the electronic components, and improving the reliability and service life of the electronic components; the built-in shielding layer tightly wraps outside the plastic encapsulation body, forming an electromagnetic shielding "shell layer", which can effectively reflect and absorb external electromagnetic signals, preventing them from penetrating into the internal electronic components, thereby reducing electromagnetic interference; at the same time, the same grounding part is shared between two adjacent plastic encapsulation bodies, which means that multiple electronic components can share a low-impedance grounding path. When the built-in shielding layer captures electromagnetic interference signals, these signals can be quickly conducted to the ground through the shared grounding part, thereby further reducing the influence of electromagnetic interference on the electronic components.

[0013] Further, the built-in shielding layer includes an elastic insulating layer and an electromagnetic shielding layer. When the elastic insulating layer is compressed or stretched, the elastic insulating layer has a tendency to undergo elastic deformation;

[0014] The elastic insulating layer is installed on the side of the electromagnetic shielding layer away from the electronic components.

[0015] According to the above technical solution, when the vehicle is in a vibrating or high-temperature environment, the circuit board may deform due to mechanical stress or thermal stress. At this time, the elastic insulating layer can undergo elastic deformation to absorb and relieve these stresses, thereby protecting the electromagnetic shielding layer from direct impact or extrusion. The elastic insulating layer can play a certain buffering role to prevent the solder joint cracking problem caused by the deformation of the circuit board to the built-in shielding layer (if the electromagnetic shielding layer is made of metal).

[0016] The main function of the electromagnetic shielding layer is to reflect and absorb external electromagnetic signals to prevent them from penetrating to the internal electronic components, thereby protecting the electronic components from electromagnetic interference. Due to the existence of the elastic insulating layer, even if the circuit board undergoes slight deformation, the electromagnetic shielding layer can maintain stable contact with the circuit board and the electronic components, ensuring that the electromagnetic shielding effect is not affected.

[0017] Furthermore, the electromagnetic shielding layer has a shielding portion and an elastic convex portion located outside the electronic components, and the lowest contact point of the elastic convex portion contacts the upper surface of the grounding portion.

[0018] According to the above technical solution, the lowest contact point of the elastic convex portion contacts the upper surface of the grounding portion, forming a reliable grounding channel. This design can ensure that the interference signals on the electromagnetic shielding layer are quickly introduced into the ground through the grounding portion, thereby reducing the impact of electromagnetic interference on the electronic components. Compared with the traditional fixed contact method, the elastic convex portion can adapt to the deformation of the circuit board and maintain the stability of the contact, avoiding the problem of electromagnetic shielding failure caused by poor contact.

[0019] Furthermore, a clamping groove is formed on the top surface of the grounding portion, and the shape of the clamping groove is adapted to the elastic convex portion.

[0020] According to the above technical solution, the contact between the elastic convex portion and the clamping groove actually realizes the electrical connection between the electromagnetic shielding layer and the grounding portion. When the electromagnetic shielding layer captures electromagnetic interference signals, these signals can be quickly introduced into the ground through the elastic convex portion, the clamping groove and the grounding portion, thereby effectively suppressing electromagnetic interference. The matching design of the clamping groove and the elastic convex portion makes the connection between the two more stable and reliable. Even in harsh environments such as vibration or temperature change, it can maintain a stable connection state and is not easy to loosen or fall off. The stable connection ensures good contact between the electromagnetic shielding layer and the grounding portion, thereby improving the electromagnetic shielding effect and helping to better suppress the interference of external electromagnetic signals and protect the normal operation of internal electronic components.

[0021] Furthermore, the cross-section of the elastic convex portion is one or more of a conical shape, a circular shape, a semi-circular shape, and an arc shape. The conical design enables the elastic convex portion to be gradually compressed and locked when snapped into the engaging groove, thereby providing a more stable mechanical connection, helping to resist external vibrations or impacts, and preventing loosening of the connection. The circular, semi-circular, or arc-shaped design provides a smooth contact surface, helping to reduce friction and wear during the engaging process, and ensuring that the elastic convex portion can evenly distribute pressure, further enhancing the stability of the connection.

[0022] Furthermore, fitting grooves are correspondingly provided in both the first housing and the second housing, and an external shielding layer is provided in the fitting grooves.

[0023] According to the above technical solution, the first housing and the second housing are correspondingly and tightly combined with each other through the fitting grooves, forming a closed or semi-closed space for accommodating and protecting internal electronic components. The external shielding layer provided in the fitting grooves is closely attached to the inner wall of the housing, forming an additional electromagnetic shielding layer, which can further block and reflect the interference of external electromagnetic signals. Acting together with the internal shielding layers (such as the elastic insulating layer and the electromagnetic shielding layer), a complete electromagnetic shielding system is formed. This system can effectively isolate the interference of the external electromagnetic environment on the internal electronic components and ensure the normal operation of the electronic components.

[0024] Furthermore, the shielding layer includes a flexible wave-absorbing layer, an electromagnetic shielding coating layer, and two adhesive layers.

[0025] Furthermore, there is a gap a between the inner top surface of the shielding cavity and the upper surface of the electronic component, and the height of a is not less than 0.5 mm.

[0026] According to the above technical solution, when the electronic component generates heat during operation, if it is directly in contact with the inner top surface of the shielding cavity, heat transfer will be restricted, which is not conducive to heat dissipation. By reserving a gap a with a certain height (not less than 0.5 mm), the existence of the gap a increases the radiation heat dissipation area of the electronic component, helping to dissipate heat.

[0027] Furthermore, ball grid array solder joints are provided on the side of the substrate facing away from the electronic component.

[0028] Advantages of the present utility model:

[0029] By using the external shielding layer as an additional electromagnetic protection layer and acting together with the internal shielding layer, the overall electromagnetic shielding effect of the present utility model is significantly enhanced, which helps to better protect the internal electronic components from the interference of external electromagnetic signals and improve the electromagnetic compatibility of the product.

[0030] The design of the fitting groove and the external shielding layer not only enhances the electromagnetic shielding performance of the first housing and the second housing, but also improves the structural strength of the overall structure. This enables the housing to better withstand external impacts and vibrations, protecting the internal electronic components from damage.

[0031] Other advantages, objectives, and features of the present application will to some extent be described in the subsequent specification, and to some extent will be obvious to those skilled in the art based on an examination of the following, or can be taught from the practice of the present application. The objectives and other advantages of the present application can be achieved and obtained through the following specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram of the usage state when the intelligent automotive diagnostic positioning box of the present utility model straddles a concrete guardrail;

[0033] Figure 2 It is a schematic exploded structural diagram of the intelligent automotive diagnostic positioning box of the present utility model in one direction;

[0034] Figure 3 It is a schematic exploded structural diagram of the intelligent automotive diagnostic positioning box of the present utility model in another direction;

[0035] Figure 4 It is a schematic cross-sectional structural diagram of an electronic component on the circuit board in the intelligent automotive diagnostic positioning box of the present utility model;

[0036] Figure 5 It is a schematic cross-sectional structural diagram of the external shielding layer on the circuit board in the intelligent automotive diagnostic positioning box of the present utility model;

[0037] Figure 6 It is a schematic partial cross-sectional diagram of the circuit board in the intelligent automotive diagnostic positioning box of the present utility model.

[0038] Wherein, the first housing 1, the second housing 2, the circuit board 3, the substrate 31, the grounding part 311, the engaging groove 3111, the electronic component 32, the shielding part 321, the elastic convex part 322, the built-in shielding layer 33, the elastic insulating layer 331, the electromagnetic shielding layer 332, the plastic package 34, the shielding cavity 35, the fitting groove 4, the external shielding layer 5, the flexible wave-absorbing layer 51, the electromagnetic shielding coating layer 52, the adhesive layer 53, the ball grid array solder joints 6. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The embodiments of the present utility model will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand the other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be understood that the preferred embodiments are only for explaining the present utility model, rather than limiting the protection scope of the present utility model.

[0040] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0041] This embodiment provides an intelligent diagnostic positioning box for an automobile, as Figures 1 to 6 shown, which includes a first housing 1, a second housing 2, and a circuit board 3. The first housing 1 can be buckled or separated from the second housing 2; when the first housing 1 and the second housing 2 are buckled together, a box body structure is formed, and the circuit board 3 is disposed inside the box body structure;

[0042] As Figure 3 shown, the circuit board 3 includes a substrate 31, electronic components 32, and an internal shielding layer 33. The electronic components 32 are disposed on the substrate 31, and a grounding portion 311 is provided on the substrate 31, and the grounding portion 311 is located on the outer periphery of the electronic components 32;

[0043] In this embodiment, the circuit board 3 is an integrated circuit board 3, that is, the common integrated circuit structure in the prior art, specifically including a substrate 31 and electronic components 32. The substrate 31 can include a PCB board or an FPC circuit board according to the material. The electronic components 32 are disposed on the substrate 31. Among them, this embodiment does not limit that the electronic components 32 are located on one surface of the substrate 31. One surface of the substrate 31 is set according to the use environment adaptability of the circuit board 3. Therefore, in this embodiment, the electronic components 32 are exemplarily disposed on one surface of the substrate 31 for illustration. Of course, it can be understood that electronic components 32 can be disposed on both sides of the substrate 31 of this embodiment to form a structure of double-sided electronic components 32. At the same time, in order to provide current for the components inside the electronic components 32, electrodes and bonding wires (not shown) are also provided on the substrate 31, and the electronic components 32 are connected to the electrodes through the bonding wires to form a current loop.

[0044] The built-in shielding layer 33 defines a shielding cavity 35 according to the shape of the electronic component 32. The shielding cavity 35 is specifically set according to the size, specification and shape of the electronic component 32. The electronic component 32 is placed in the shielding cavity 35, and the built-in shielding layer 33 is electrically connected to the grounding portion 311.

[0045] In this embodiment, the built-in shielding layer 33 is specially designed according to the shape of the electronic component 32. It defines a plurality of shielding cavities 35, and the electronic components 32 are placed in these shielding cavities 35. This design method is similar to providing an "electromagnetic protection cover" for each electronic component 32, effectively isolating the interference of external electromagnetic signals. The built-in shielding layer 33 is electrically connected to the grounding portion 311 of the circuit board 3. The built-in shielding layer 33 can conduct the captured electromagnetic interference signals to the ground through the grounding path, thereby further reducing the influence of the interference signals on the electronic component 32. The grounding portion 311 is located on the outer periphery of the electronic component 32. Such a layout helps to maximize the grounding effect and ensure that the electromagnetic field around the electronic component 32 can be smoothly conducted to the ground. The grounding portion 311 of this embodiment is not only the potential reference point of the circuit board 3, but also the main discharge path of the electromagnetic interference signals. Through good grounding design, the electromagnetic interference signals can be effectively excluded from around the sensitive components.

[0046] As a preferred implementation, a plastic encapsulation body 34 is provided on each electronic component 32. The built-in shielding layer 33 is located outside the plastic encapsulation body 34 and wraps the plastic encapsulation body 34. A common grounding portion 311 is shared between two adjacent plastic encapsulation bodies 34. The plastic encapsulation body 34 first provides basic physical protection and insulation isolation for the electronic component 32, preventing dust, moisture, etc. in the external environment from directly contacting the electronic component 32, and improving the reliability and service life of the electronic component 32; the built-in shielding layer 33 closely wraps outside the plastic encapsulation body 34, forming an electromagnetic shielding "shell layer", which can effectively reflect and absorb external electromagnetic signals, preventing them from penetrating to the internal electronic component 32, thereby reducing electromagnetic interference; at the same time, between two adjacent plastic encapsulation bodies 34, the built-in shielding layer 33 shares the same grounding portion 311, which means that multiple electronic components 32 can share a low-impedance grounding path. When the built-in shielding layer 33 captures electromagnetic interference signals, these signals can be quickly conducted to the ground through the shared grounding portion 311, thereby further reducing the influence of electromagnetic interference on the electronic component 32.

[0047] As a preferred implementation, the built-in shielding layer 33 includes an elastic insulating layer 331 and an electromagnetic shielding layer 332. When the elastic insulating layer 331 is compressed or stretched, the elastic insulating layer 331 has a tendency to undergo elastic deformation;

[0048] The elastic insulating layer 331 is installed on the side of the electromagnetic shielding layer 332 away from the electronic component 32, such as Figure 3As shown, the elastic insulating layer 331 is installed on the outer side of the electromagnetic shielding layer 332, where the electromagnetic shielding layer 332 is made of metal. When the vehicle is in a vibrating or high-temperature environment, the circuit board 3 may deform due to mechanical stress or thermal stress. At this time, the elastic insulating layer 331 can undergo elastic deformation to absorb and relieve these stresses, thereby protecting the electromagnetic shielding layer 332 from direct impact or extrusion. The elastic insulating layer 331 can play a certain buffering role for protection, preventing the problem of solder cracking caused by the deformation of the circuit board 3 in the built-in shielding layer 33.

[0049] The main function of the electromagnetic shielding layer 332 is to reflect and absorb external electromagnetic signals to prevent them from penetrating to the internal electronic components 32, thereby protecting the electronic components 32 from electromagnetic interference. Due to the presence of the elastic insulating layer 331, even if the circuit board 3 undergoes slight deformation, the electromagnetic shielding layer 332 can maintain stable contact with the circuit board 3 and the electronic components 32, ensuring that the electromagnetic shielding effect is not affected.

[0050] Furthermore, the electromagnetic shielding layer 332 has a shielding portion 321 and an elastic convex portion 322 located outside the electronic component 32. The lowest contact point of the elastic convex portion 322 is in contact with the upper surface of the grounding portion 311. The contact between the lowest contact point of the elastic convex portion 322 and the upper surface of the grounding portion 311 forms a reliable grounding channel. This design can ensure that the interference signals on the electromagnetic shielding layer 332 are quickly introduced into the ground through the grounding portion 311, thereby reducing the impact of electromagnetic interference on the electronic component 32. Compared with the traditional fixed contact method, the elastic convex portion 322 can adapt to the deformation of the circuit board 3, maintain the stability of the contact, and avoid the problem of electromagnetic shielding failure caused by poor contact.

[0051] As a preferred implementation, the top surface of the grounding portion 311 is provided with a clamping groove 3111, and the shape of the clamping groove 3111 is adapted to the elastic convex portion 322. The contact between the elastic convex portion 322 and the clamping groove 3111 actually realizes the electrical connection between the electromagnetic shielding layer 332 and the grounding portion 311. When the electromagnetic shielding layer 332 captures electromagnetic interference signals, these signals can be quickly introduced into the ground through the elastic convex portion 322, the clamping groove 3111, and the grounding portion 311, thereby effectively suppressing electromagnetic interference. The adapted design of the clamping groove 3111 and the elastic convex portion 322 makes the connection between the two more stable and reliable. Even in harsh environments such as vibration or temperature change, it can maintain a stable connection state, is not easy to loosen or fall off. The stable connection ensures good contact between the electromagnetic shielding layer 332 and the grounding portion 311, thereby improving the electromagnetic shielding effect, helping to better suppress the interference of external electromagnetic signals, and protecting the normal operation of the internal electronic components 32.

[0052] The cross-section of the elastic protrusion 322 is one or more of a cone, a circle, a semi-circle, and an arc. The conical design enables the elastic protrusion 322 to be gradually compressed and engaged when snapped into the engaging groove 3111, thereby providing a more stable mechanical connection, helping to resist external vibrations or impacts, and preventing connection loosening. The circular, semi-circular, or arc design provides a smooth contact surface, helping to reduce friction and wear during the engagement process, and at the same time ensuring that the elastic protrusion 322 can evenly distribute pressure, further enhancing the stability of the connection

[0053] As a preferred embodiment, as Figure 1 and Figure 2 shown, fitting grooves 4 are provided in both the first housing 1 and the second housing 2 in a corresponding manner, and an external shielding layer 5 is provided in the fitting grooves 4. The first housing 1 and the second housing 2 are correspondingly and tightly combined with each other through the fitting grooves 4 to form a closed space for accommodating and protecting the internal electronic components 32. The external shielding layer 5 provided in the fitting grooves 4 is closely attached to the inner wall of the housing to form an additional electromagnetic shielding layer 332, which can further block and reflect the interference of external electromagnetic signals. Acting together with the built-in shielding layer 33 (such as the elastic insulating layer 331 and the electromagnetic shielding layer 332), a complete electromagnetic shielding system is formed. This system can effectively isolate the interference of the external electromagnetic environment on the internal electronic components 32 and ensure the normal operation of the electronic components 32.

[0054] As a preferred embodiment, as Figure 5 shown, the shielding layer includes a flexible wave-absorbing layer 51, an electromagnetic shielding coating layer 52, and two adhesion layers 53.

[0055] In this embodiment, the flexible wave-absorbing layer 51 is mainly made of flexible materials such as polymer plastics, polyethylene, rubber, and foam, and has good sound absorption, vibration absorption, and wave absorption properties. When electromagnetic waves contact the flexible wave-absorbing layer 51, part of the electromagnetic waves will be reflected back, and the other part will enter the material and be absorbed and converted into other forms of energy (such as heat energy), thereby reducing the transmission and reflection of electromagnetic waves. The electromagnetic shielding coating layer 52 is composed of synthetic resins, conductive fillers (such as metal powders such as gold, silver, copper, and nickel or non-metal powders such as carbon black and graphite), etc. These conductive fillers will form a conductive network to shield electromagnetic waves. When electromagnetic waves contact the coating layer, they will be reflected and absorbed by the conductive network and thus be effectively blocked.

[0056] In this shielding layer structure, the flexible wave-absorbing layer 51 and the electromagnetic shielding coating layer 52 are tightly combined through the adhesion layer 53 and act together. The flexible wave-absorbing layer 51 first absorbs and attenuates part of the electromagnetic waves, while the electromagnetic shielding coating layer 52 further reflects and absorbs the electromagnetic waves. The design of this double-layer structure improves the shielding efficiency and makes the overall shielding effect more significant.

[0057] As a preferred embodiment, as Figure 3 shown, there is a gap a between the inner top surface of the shielding cavity 35 and the upper surface of the electronic component 32, and the height of a is not less than 0.5 mm. When the electronic component 32 generates heat during operation, if it is directly in contact with the inner top surface of the shielding cavity 35, heat transfer will be restricted, which is not conducive to heat dissipation. By retaining a gap a with a certain height (not less than 0.5 mm), the existence of the gap a increases the radiation heat dissipation area of the electronic component 32, which helps to dissipate heat. Further, a ball grid array solder joint 6 is provided on the side of the substrate 31 facing away from the electronic component 32. The ball grid array solder joint 6 is used for implanting metal balls, and the metal balls can be tin balls. The metal balls are used for connecting to other circuit boards 3 or grounding.

[0058] The structure of the utility model is compact and highly practical, solving the problem that the traditional intelligent diagnosis and positioning box is easily interfered by external electromagnetic signals, and has high implementation value.

[0059] The above embodiments are only preferred embodiments given to fully illustrate the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the utility model are within the protection scope of the utility model.

Claims

1. An intelligent automobile diagnosis and positioning box, characterized in that: include: A first shell (1), a second shell (2) and a circuit board (3), wherein the first shell (1) can be engaged with or separated from the second shell (2); when the first shell (1) and the second shell (2) are engaged with each other, a box structure is formed, and the circuit board (3) is arranged in the box structure; The circuit board (3) comprises a substrate (31), an electronic component (32) and a built-in shielding layer (33); the electronic component (32) is arranged on the substrate (31); the substrate (31) is provided with a grounding portion (311); and the grounding portion (311) is located at the periphery of the electronic component (32); The built-in shielding layer (33) defines a shielding compartment (35) according to the shape of the electronic component (32); the electronic component (32) is placed in the shielding compartment (35); and the built-in shielding layer (33) is electrically connected to the grounding portion (311).

2. The intelligent automobile diagnosis and positioning box according to claim 1, characterized in that: A plastic package (34) is provided on each of the electronic components (32); the built-in shielding layer (33) is located outside the plastic package (34) and covers the plastic package (34); and two adjacent plastic packages (34) share a grounding portion (311).

3. The intelligent automobile diagnosis and positioning box according to claim 2 is characterized in that: The built-in shielding layer (33) comprises an elastic insulating layer (331) and an electromagnetic shielding layer (332), and when the elastic insulating layer (331) is compressed or stretched, the elastic insulating layer (331) has a tendency to undergo elastic deformation; The elastic insulating layer (331) is installed on a side of the electromagnetic shielding layer (332) away from the electronic component (32).

4. The intelligent automobile diagnosis and positioning box according to claim 3 is characterized in that: The electromagnetic shielding layer (332) comprises a shielding portion (321) and an elastic protruding portion (322) located outside the electronic component (32), wherein the lowest contact point of the elastic protruding portion (322) contacts the upper surface of the grounding portion (311).

5. The intelligent automobile diagnosis and positioning box according to claim 4 is characterized in that: The top surface of the grounding portion (311) is provided with a snap-fitting groove (3111), and the shape of the snap-fitting groove (3111) is matched with the elastic protrusion (322).

6. The intelligent automobile diagnosis and positioning box according to any one of claims 4 or 5, characterized in that: The cross section of the elastic protrusion (322) is one or more of a conical shape, a circular shape, a semicircular shape, and an arc shape.

7. The intelligent automobile diagnosis and positioning box according to claim 1, characterized in that: The first shell (1) and the second shell (2) are both provided with corresponding fitting grooves (4), and an external shielding layer (5) is provided in the fitting grooves (4).

8. The intelligent automobile diagnosis and positioning box according to claim 7, characterized in that: The external shielding layer (5) comprises a flexible wave absorbing layer (51), an electromagnetic shielding coating layer (52) and an adhesive coating layer (53), and the number of the adhesive coating layers (53) is two.

9. The intelligent automobile diagnosis and positioning box according to claim 7, characterized in that: There is a gap a between the inner top surface of the shielding compartment (35) and the upper surface of the electronic component (32), and the height of a is not less than 0.5 mm.

10. The intelligent automobile diagnosis and positioning box according to claim 1, characterized in that: A ball-planting solder joint (6) is provided on a side of the substrate (31) facing away from the electronic component (32).

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