Spraying device suitable for wafer cleaning equipment

Abstract

The utility model relates to a spraying device suitable for wafer cleaning equipment, which comprises a mounting base, a vertical guide assembly arranged on the mounting base, a plurality of limiting bearing assemblies arranged on the vertical guide assembly, spraying assemblies arranged on the limiting bearing assemblies, spraying guide blocks arranged on the spraying assemblies, spraying cavities arranged in the spraying guide blocks, and a plurality of spraying assemblies arranged on the limiting bearing assemblies. A connecting hole communicated with the spraying cavity is formed in the tail end of the spraying cavity, the spraying cavity is provided with a spraying opening communicated with the spraying cavity, a binding hole is formed in the spraying guide block, and the limiting bearing assembly is connected with the binding hole. Therefore, the vertical guide assembly and the mounting base can be conveniently and stably combined, effective vertical space support can be provided, space occupation is reduced, and layout of other devices in the wafer cleaning equipment is facilitated. The installation number, the installation position and the installation orientation of the spraying assemblies can be conveniently adjusted according to actual requirements, the good adjustability is achieved, and different spraying area coverage requirements can be met.

Description

Technical Field

[0001] The utility model relates to a spraying device, in particular to a spraying device applicable to a wafer cleaning device. Background Art

[0002] For current wafer processing equipment, there is often a cleaning process for wafers. Therefore, wafer cleaning equipment will be equipped. Currently, conventional wafer cleaning equipment is configured with a spraying device to realize the spraying of water and cleaning liquid towards the wafers. However, the existing spraying devices mainly adopt a top-mounted downward spraying method. It cannot adjust the actual coverage area. For the cleaning requirements of switching between 6-inch and 8-inch wafers, when using 8-inch wafers, there are easily cleaning dead corners around.

[0003] At the same time, the existing distribution method can only achieve unilateral top spraying and cannot cover special angles on the side. Moreover, since the spraying height and angle are limited, they cannot be adjusted according to the usage requirements. Therefore, the need for double-sided synchronous spraying cannot be met. If double-sided cleaning is to be carried out, additional turning equipment needs to be added for use, the spraying time is long, the usage cost is increased, and subsequent maintenance is not very convenient. Furthermore, the existing distribution method easily occupies the upper space of the work station and will moderately block the vision inspection equipment participating in the inspection, and manual inspection of the current cleaning status is required later.

[0004] In view of the above defects, the designer actively conducts research and innovation in order to create a spraying device applicable to a wafer cleaning device, making it more valuable in industry. Summary of the Utility Model

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a spraying device applicable to a wafer cleaning device.

[0006] The spraying device applicable to a wafer cleaning device of the utility model includes an installation base, and is characterized in that: a vertical guiding component is arranged on the installation base, a plurality of limiting and bearing components are arranged on the vertical guiding component, a spraying component is arranged on the limiting and bearing component, the spraying component is a spraying guiding block, a spraying cavity is arranged in the spraying guiding block, a connecting hole communicated with the spraying cavity is arranged at the tail end of the spraying cavity, a spraying port communicated with the spraying cavity is arranged on the spraying cavity, a binding hole is arranged on the spraying guiding block, and the limiting and bearing component is connected with the binding hole.

[0007] Furthermore, in the above spraying device applicable to a wafer cleaning device, the installation base includes a base disc, limiting holes are arranged on the base disc, the lower end of the vertical guiding component is connected with the limiting holes, a plurality of installation holes are arranged on the base disc, and installation screws are arranged in the installation holes.

[0008] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the limiting hole is a threaded hole, and the limiting hole is threadedly connected to the lower end of the vertical guiding component; the mounting holes are annularly distributed at equal distances from each other.

[0009] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein a cushion block is arranged below the base disk, and the base disk and the cushion block are connected by mounting screws.

[0010] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the vertical guiding component is a vertical guiding rod, and the cross-section of the vertical guiding rod is oval.

[0011] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein an external thread is arranged at the lower end of the vertical guiding rod; or, an expansion washer is arranged at the lower end of the vertical guiding rod.

[0012] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the limiting and bearing component includes a limiting clamping block, a jack is arranged in the vertical direction of the limiting clamping block, the vertical guiding component is connected to the jack, and a deformation groove extends outwards from the jack; a locking hole is arranged on one side of the limiting clamping block, the locking hole communicates with the deformation groove, and a locking screw is arranged in the locking hole; an adjusting hole is arranged on the other side of the limiting clamping block, an adjusting component is arranged on the limiting clamping block, and one end of the adjusting component passes through the restraint hole of the spraying guiding block and is connected to the limiting clamping block.

[0013] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the adjusting component includes a screw rod, a knob extends at one end of the screw rod, the adjusting hole is a threaded hole, and the other end of the screw rod is connected into the threaded hole.

[0014] Furthermore, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the spraying guiding block is of an L-shaped structure, and an arc chamfer is arranged on the outer edge of the spraying guiding block.

[0015] Still further, for the above-mentioned spraying device applicable to a wafer cleaning device, wherein the connecting hole and the spraying port are both threaded holes.

[0016] By means of the above solution, the utility model has at least the following advantages:

[0017] 1. The vertical guiding component and the mounting base can be combined conveniently and stably, can provide effective vertical space support, reduce the occupation of space, and facilitate the layout of other devices inside the wafer cleaning device.

[0018] 2. The installation quantity, position, and orientation of the spray assembly can be adjusted conveniently according to actual needs, with good adjustability and can adapt to the coverage requirements of different spray areas.

[0019] 3. The spray assembly has a simple appearance and can operate independently or be adapted to the spray head to meet the needs of different cleaning working conditions.

[0020] 4. The overall structure is simple, easy to install and use, can meet the usage requirements of various models of wafer cleaning equipment, and has good versatility.

[0021] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly and implement it according to the content of the specification, the following takes the preferred embodiments of the present invention and combines with the drawings to describe in detail as follows. Description of the Drawings

[0022] Figure 1 is a front structural schematic diagram of a spray device applicable to a wafer cleaning device.

[0023] Figure 2 is a reverse structural schematic diagram of a spray device applicable to a wafer cleaning device.

[0024] Figure 3 is a structural schematic diagram of the spray assembly.

[0025] Figure 4 is a structural schematic diagram of the limit clamping block.

[0026] The meanings of the reference numerals in the drawings are as follows.

[0027] 1 Base disk 2 Vertical guiding assembly

[0028] 3 Spray assembly 4 Connecting hole

[0029] 5 Spray port 6 Binding hole

[0030] 7 Mounting hole 8 Lining pad

[0031] 9 Limit clamping block 10 Jack

[0032] 11 Deformation groove 12 Locking hole

[0033] 13 Adjusting hole 14 Adjusting assembly Detailed Embodiment

[0034] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present invention. The following embodiments are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0035] AsFigures 1 to 4 A spray device applicable to a wafer cleaning device, including an installation base. The distinctive feature lies in that: a vertical guiding component 2 is provided on the installation base, which can realize the adjustment of the installation height of the subsequent spray component 3. At the same time, a number of limit bearing components are provided on the vertical guiding component 2, and a spray component 3 is provided on the limit bearing components. In this way, the spray component 3 can be stably positioned, and the height and orientation of the corresponding spray component 3 can be adjusted as needed, having a better spray coverage area. Specifically, the spray component 3 adopted in the present utility model is a spray guiding block, and a spray cavity (not shown in the figure) is provided inside the spray guiding block for guiding the flow of liquids such as water or cleaning liquid. And, in order to smoothly dock with the liquid supply pipeline, a connection hole 4 communicating with the spray cavity is provided at the tail end of the spray cavity. A spray port 5 communicating with the spray cavity is provided at the front end of the spray cavity for directly participating in spraying or, as needed, installing a spray head. Furthermore, in order to achieve better limitation, a restraint hole 6 is provided on the spray guiding block, and the limit bearing component is connected to the restraint hole 6.

[0036] Combined with a preferred embodiment of the present utility model, the adopted installation base includes a base disk 1. Limit holes are provided on the base disk 1, and the lower end of the vertical guiding component 2 is connected to the limit holes. At the same time, a number of installation holes 7 are provided on the base disk 1, and installation screws are provided in the installation holes 7. In this way, the base disk 1 can be installed in the corresponding working area inside the cleaning device to achieve stable connection at the lower end. During implementation, the adopted limit holes are threaded holes, and the lower end of the vertical guiding component 2 is threadedly connected to the limit holes, facilitating convenient connection. Of course, in order to achieve uniform connection, the installation holes 7 are annularly distributed at equal distances from each other. For certain needs, a cushion block 8 can be provided below the base disk 1, and the base disk 1 and the cushion block 8 are connected by installation screws. In this way, the initial height can be increased, enabling the spray component 3 to have a better spray coverage range.

[0037] Looking further, the vertical guiding component 2 is a vertical guiding rod, and the cross-section of the vertical guiding rod is elliptical. In this way, it has better vertical height guiding and is convenient for the combination of the limit bearing components. Considering the convenience of combination, external threads are provided at the lower end of the vertical guiding rod. Of course, an expansion washer can also be provided at the lower end of the vertical guiding rod. In this way, appropriate interference fit is used for plug-in combination.

[0038] In combination with the actual implementation, the limit bearing assembly adopted by the present utility model includes a limit clamping block 9. A jack 10 is arranged in the vertical direction of the limit clamping block 9. The vertical guide rod belonging to the vertical guide assembly 2 is connected to the jack 10, and a deformation groove 11 extends outward from the jack 10. At the same time, a locking hole 12 is arranged on one side of the limit clamping block 9. The locking hole 12 is communicated with the deformation groove 11, and a locking screw (not shown in the figure) is arranged in the locking hole 12. In this way, a firm combination between the limit clamping block 9 and the vertical guide rod can be achieved. Moreover, an adjustment hole 13 is arranged on the other side of the limit clamping block 9, and an adjustment assembly 14 is arranged on the limit clamping block 9. One end of the adjustment assembly 14 passes through the restraint hole 6 of the spray guide block and is connected to the limit clamping block 9. In this way, the final combination and locking of the spray guide block can be achieved by using the adjustment assembly 14. Specifically, the adopted adjustment assembly 14 includes a screw rod. A knob extends from one end of the screw rod. The adjustment hole 13 is a threaded hole, and the other end of the screw rod is connected into the threaded hole. In this way, stable locking can be achieved by using thread combination.

[0039] Furthermore, the adopted spray guide block has an L-shaped structure, and an arc chamfer is arranged on the outer edge of the spray guide block. In this way, there will be no sharp edges. At the same time, the L-shaped structure can be used to realize the design of upper-end conduction and lower-end fixation. Moreover, both the connection hole 4 and the spray port 5 are threaded holes. In this way, the corresponding liquid supply pipeline can be smoothly docked, and a spray head can also be installed according to needs.

[0040] The working principle of the present utility model is as follows:

[0041] Fix the installation base to the reserved position of the work station in the wafer cleaning equipment. Then, select a vertical guide assembly 2 with an appropriate height and connect it to the installation base.

[0042] After that, combine the limit bearing assembly with the vertical guide assembly 2 and at an appropriate height. Then, combine the spray assembly 3 with the limit bearing assembly. During this period, do not fully tighten the adjustment assembly 14. The elevation angle of the spray assembly 3 can be adjusted so that it can have a better spray coverage area and then be locked.

[0043] Subsequently, dock the liquid supply pipeline with the connection hole 4. And according to the actual needs in the follow-up, choose whether to install a spray head.

[0044] Then, provide test liquid through the liquid supply pipeline first and check whether the current spray coverage area meets the requirements. During this period, the angle, height, etc. of the spray assembly 3 can be conveniently adjusted to meet the smooth use in the follow-up.

[0045] Moreover, during the implementation, multiple spray assemblies 3 can be installed according to needs.

[0046] As can be seen from the above textual description and in combination with the attached drawings, after adopting the present utility model, the following advantages are possessed:

[0047] 1. The vertical guiding component and the mounting base can be combined conveniently and stably, can provide effective vertical space support, reduce the occupation of space, and facilitate the layout of other devices inside the wafer cleaning equipment.

[0048] 2. The installation quantity, position, and orientation of the spraying component can be adjusted conveniently according to actual needs, have good adjustability, and can adapt to different spraying area coverage requirements.

[0049] 3. The spraying component has a simple appearance, can operate independently or be adapted to the spray head to meet the needs of different cleaning working conditions.

[0050] 4. The overall structure is simple, convenient for installation and use, can meet the use requirements of various models of wafer cleaning equipment, and has good versatility.

[0051] In addition, the indicated orientation or positional relationship described in the present utility model is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or structure referred to must have a specific orientation, or be operated in a specific orientation structure. Therefore, it should not be construed as a limitation to the present utility model.

[0052] The above is only the preferred embodiment of the present utility model and is not used to limit the present utility model. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the technical principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A spray device for wafer cleaning equipment, comprising a mounting base, characterized in that: A vertical guide assembly is provided on the mounting base, a plurality of limit bearing assemblies are provided on the vertical guide assembly, a spray assembly is provided on the limit bearing assembly, and the spray assembly is a spray guide block. A spray cavity is provided in the spray guide block, a connecting hole communicated with the spray cavity is provided at the tail end of the spray cavity, a spray port communicated with the spray cavity is provided at the spray cavity, a restraining hole is provided on the spray guide block, and the limit bearing assembly is connected to the restraining hole.

2. The spray device suitable for wafer cleaning equipment according to claim 1, characterized in that: The mounting base includes a base disc, a limiting hole is arranged on the base disc, the lower end of the vertical guide assembly is connected to the limiting hole, a plurality of mounting holes are arranged on the base disc, and mounting screws are arranged in the mounting holes.

3. The spray device suitable for wafer cleaning equipment according to claim 2, characterized in that: The limiting hole is a threaded hole, and the limiting hole is threadedly connected to the lower end of the vertical guide component; the mounting holes are distributed in a ring shape with equal distances from each other.

4. The spray device suitable for wafer cleaning equipment according to claim 2, characterized in that: A cushion block is arranged below the base disc, and the base disc is connected to the cushion block via mounting screws.

5. The spray device suitable for wafer cleaning equipment according to claim 1, characterized in that: The vertical guide component is a vertical guide rod, and the cross section of the vertical guide rod is elliptical.

6. The spray device suitable for wafer cleaning equipment according to claim 5, characterized in that: The lower end of the vertical guide rod is provided with an external thread; or, the lower end of the vertical guide rod is provided with an expansion washer.

7. The spray device suitable for wafer cleaning equipment according to claim 1, characterized in that: The limit bearing assembly includes a limit clamping block, a connector hole is provided in the vertical direction of the limit clamping block, the vertical guide assembly is connected to the connector hole, and the connector hole has a deformation groove extending outward; a locking hole is provided on one side of the limit clamping block, the locking hole is connected to the deformation groove, and a locking screw is provided in the locking hole; an adjustment hole is provided on the other side of the limit clamping block, and the limit clamping block is provided with an adjustment assembly, one end of the adjustment assembly is connected to the limit clamping block after passing through the restraining hole of the spray guide block.

8. The spray device suitable for wafer cleaning equipment according to claim 7, characterized in that: The adjustment component includes a screw rod, one end of which is extended with a knob, the adjustment hole is a threaded hole, and the other end of the screw rod is connected to the threaded hole.

9. The spray device suitable for wafer cleaning equipment according to claim 1, characterized in that: The spray guide block is of L-shaped structure, and the outer edge of the spray guide block is provided with a circular arc chamfer.

10. The spray device suitable for wafer cleaning equipment according to claim 1, characterized in that: The connecting hole and the spray port are both threaded holes.

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