Lamp panel welding auxiliary device

By designing a lamp plate welding auxiliary device including a pressure plate and a connector, the problem of unstable wafer pressure during the welding process of Micro LED display is solved, and the stable compression of the wafer and the improvement of welding quality are achieved.

CN223012117UActive Publication Date: 2025-06-24SHENZHEN ABSEN OPTOELECTRONIC CO LTD +1
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Patent Information

Application Number
CN202422198762.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-06
Publication Date
2025-06-24
Estimated Expiration
2034-09-06

AI Technical Summary

Technical Problem

During the manufacturing process of Micro LED displays, the unstable wafer surface pressure during welding leads to skewed wafer position, affecting the display effect and service life.

Method used

A lamp plate welding auxiliary device is designed, including a press plate and a connecting piece. The crimping surface of the press plate is pressed against the wafer surface. The connecting piece fixes the press plate on the PCB board to ensure that the wafer is subjected to stable pressure during the welding process.

Benefits of technology

By stably pressing the wafer, the position skew is avoided, the welding quality is improved, and the display effect and service life of the display screen are ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a lamp panel welding auxiliary device which comprises a pressing plate and a connecting piece, the pressing plate is provided with a plate hole, and the connecting piece can penetrate through the plate hole in the pressing plate and is connected with a connecting hole in a PCB, so that the pressing face of the pressing plate abuts against the surface of a wafer on the PCB, the wafer is tightly pressed on the PCB through the pressing plate, and therefore when a lamp panel is welded, the wafer is not damaged, and the welding quality of the lamp panel is improved. The pressure borne by the wafer is stable, the problem that the position of the wafer is inclined in the welding process is avoided, and the welding quality of the lamp panel is improved.
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Description

Technical Field

[0001] The utility model relates to the field of display screen production auxiliary equipment, in particular to a light board welding auxiliary device. Background Art

[0002] In the manufacturing process of Micro LED display screens, welding is crucial. However, the instability of the pressure on the surface of the chip during welding has become a potential hidden danger. When welding chips, if the pressure cannot be kept constant, the welding pressure will fluctuate uncontrollably due to performance fluctuations of the welding equipment, inaccurate parameter settings, or interference from external factors. This unstable pressure acts directly on the Micro LED chip, making it impossible to obtain uniform and continuous force during the welding process. As a result, the chip cannot be accurately fixed on the circuit board as expected, but the surface of the chip is skewed. This skew may seem to be just a slight deviation, but it may have a serious impact on the display effect of the entire Micro LED display. It will not only destroy the uniformity and integrity of the picture, causing display abnormalities such as uneven brightness and color deviation, but may also affect the service life and stability of the display. Utility Model Content

[0003] The utility model aims to solve the problem that the chip of the lamp board is easily subjected to unstable pressure when it is welded on the PCB board, resulting in the chip being skewed.

[0004] In order to solve the above technical problems, the utility model provides a lamp board welding auxiliary device, the lamp board includes a PCB board and a chip arranged on the PCB board, the lamp board welding auxiliary device includes a pressing plate and a connecting piece, one side surface of the pressing plate is formed with a crimping surface; the pressing plate is used to be arranged on the side of the chip away from the PCB board, and the crimping surface faces the surface of the chip; the pressing plate is provided with a plate hole, and the plate hole is used to correspond to the connecting hole on the PCB board; the connecting piece is used to be penetrated and fixed in the corresponding plate hole and the connecting hole to fix the pressing plate on the PCB board, so that the crimping surface of the pressing plate is pressed against the surface of the chip, so that the pressing plate presses the chip onto the PCB board.

[0005] In some schemes of the present application, the pressure plate includes a plate body and an elastic member protruding from the plate body, a surface of the elastic member facing away from the plate body constitutes the pressing surface, and the elastic member can be used to elastically abut against the chip; the connecting member is connected to the plate body.

[0006] In some embodiments of the present application, the elastic member includes a pressing block and a spring. The pressing block is disposed on one side of the plate body, and the spring is connected between the pressing block and the plate body. The spring can provide an elastic force to push the pressing block away from the plate body, so that the pressing block abuts against the wafer.

[0007] In some embodiments of the present application, a plurality of pressing blocks are spaced apart, and the plurality of pressing blocks are used to abut against the plurality of wafers in a one-to-one correspondence; or there is one pressing block, and the pressing block is used to abut against all the wafers.

[0008] In some embodiments of the present application, the elastic member is a spring plate. One end of the spring plate is connected to the plate body, and the other end is a free end, and the pressing surface is formed.

[0009] In some embodiments of the present application, the plate hole is disposed on the plate body and is located outside the elastic member.

[0010] In some embodiments of the present application, the connecting member includes a connecting rod and a protruding portion disposed at one end of the connecting rod. The connecting rod passes through the plate hole and is connected to the connecting hole, and the protruding portion abuts against the pressing plate.

[0011] In some embodiments of the present application, the connecting rod is provided with an external thread, and the inner wall of the connecting hole is provided with an internal thread that is threadedly engaged with the external thread.

[0012] In some embodiments of the present application, the lamp board welding auxiliary device further includes positioning posts. The positioning posts are fixed on the pressing plate, and the positioning posts are used to pass through the positioning holes on the PCB board.

[0013] In some embodiments of the present application, the contact area between the pressing plate and the surface of the wafer ranges from 5% to 120%; and / or the thickness of the main body of the pressing plate is 0.1 to 10 times the thickness of the wafer.

[0014] As can be seen from the above technical solutions, the beneficial effects of the present utility model are as follows: The lamp board welding auxiliary device of the present application includes a pressing plate and a connecting member. The pressing plate is provided with a plate hole, and the connecting member can pass through the plate hole on the pressing plate and be connected to the connecting hole on the PCB board, so that the pressing surface of the pressing plate presses against the surface of the wafer on the PCB board, thereby pressing the wafer tightly against the PCB board. When the lamp board is welded, the pressure received by the wafer is stable, avoiding the problem of the wafer being skewed during welding and improving the welding quality of the lamp board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of a lamp board in an embodiment.

[0016] Figure 2It is a schematic diagram of the connection structure between the lamp board and the lamp board welding auxiliary device in an embodiment.

[0017] Figure 3 It is a schematic diagram of the structure of the lamp board welding auxiliary device in an embodiment.

[0018] Figure 4 It is Figure 3 A schematic diagram of the structure after removing the connecting piece.

[0019] Figure 5 It is Figure 3 A schematic enlarged sectional view at A Figure 1 .

[0020] Figure 6 It is Figure 3 A schematic enlarged sectional view at A Figure 2 .

[0021] Figure 7 It is Figure 3 A schematic enlarged partial view at A Figure 3 .

[0022] Figure 8 It is a schematic diagram of the structure of the lamp board welding auxiliary device in another embodiment.

[0023] Explanation of reference numerals is as follows: 1 - lamp board welding auxiliary device; 11 - pressing plate; 111 - plate body; 1111 - plate hole; 112 - elastic member; 1121 - abutting block; 1122 - spring; 1123 - pressing surface; 12 - connecting piece; 121 - connecting rod; 122 - protruding portion; 13 - positioning post; 2 - lamp board; 21 - PCB board; 22 - chip; 23 - solder paste. Detailed implementation manners

[0024] Typical implementation manners reflecting the features and advantages of the present utility model will be described in detail in the following description. It should be understood that the present utility model can have various changes in different implementation manners, all of which do not depart from the scope of the present utility model, and the descriptions and illustrations therein are for illustrative purposes in essence and are not used to limit the present utility model.

[0025] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or position relationship (such as up, down, left, right, front and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0027] The lamp board welding auxiliary device 1 of this application is used to assist in the preparation of the lamp board 2.

[0028] Refer to Figure 1 , the lamp board 2 includes a PCB board 21 and a plurality of wafers 22. The wafers 22 can be LED lamp bead wafers. The plurality of wafers 22 are usually welded to the PCB board 21 by SMT chip mounting technology. That is, first apply solder paste 23 on the pads of the PCB board 21, then attach the wafers 22 to the PCB board 21, and finally pass through a welding device to solidify the solder paste 23 to fix the wafers 22 to the PCB board 21.

[0029] Currently, during the welding process of the lamp board 2, due to performance fluctuations of the welding device, inaccurate parameter settings, or interference from external factors, etc., the wafers 22 on the PCB board 21 are unevenly stressed and there is a problem of positional skew, affecting the overall quality of the lamp board 2.

[0030] Refer to Figure 2 , in response to the above problems, this application provides a lamp board welding auxiliary device 1. The lamp board welding auxiliary device 1 can press the wafers 22 tightly against the PCB board 21. The user can pass the PCB board 21 with the wafers 22 attached through the welding device together with the lamp board welding auxiliary device 1, and perform high-temperature reflow welding in the welding device to achieve the welding of the lamp board 2.

[0031] During the welding process, since the lamp board welding auxiliary device 1 always presses the wafers 22 tightly, it avoids the situations of skew, missed welding, void welding, and false welding of the wafers 22, effectively ensuring the manufacturing accuracy and quality of the lamp board 2.

[0032] Refer to Figure 3 and Figure 4, the lamp board welding auxiliary device 1 includes a pressing plate 11 and a connecting member 12. The pressing plate 11 is disposed on the side of the wafer 22 facing away from the PCB board 21. A pressing surface 1123 for contacting the wafer 22 is formed on one side surface of the pressing plate 11. The connecting member 12 is connected to the pressing plate 11 and the PCB board 21, so that the pressing plate 11 is fixed on the PCB board 21, and the pressing surface 1123 of the pressing plate 11 presses against the surface of the wafer 22, thereby pressing the wafer 22 tightly against the PCB board 21. During the welding process of the wafer 22 and the PCB board 21, the wafer 22 is always in a state of being tightly pressed on the PCB board 21, avoiding the situations of the wafer 22 being skewed, having missed soldering, void soldering, or false soldering.

[0033] The pressing plate 11 is provided with plate holes 1111, and the positions of the plate holes 1111 correspond to the positions of the connection holes on the PCB board 21. The connection holes on the PCB board 21 can be the connection holes for fixedly connecting the PCB board 21 to the display screen housing, or can be the connection holes specifically provided for connecting with the pressing plate 11.

[0034] The connecting member 12 includes a connecting rod 121 and a protrusion 122 provided at one end of the connecting rod 121. The connecting rod 121 passes through the plate hole 1111 and is fixedly connected to the connection hole. The protrusion 122 abuts against the side of the pressing plate 11 facing away from the PCB board 21 to limit the pressing plate 11 from moving away from the PCB board 21, so that the pressing plate 11 maintains the state of pressing the wafer 22 tightly.

[0035] The connecting rod 121 is provided with an external thread, and the inner wall of the connection hole is provided with an internal thread that is screwed and adapted to the external thread. Moreover, the connecting rod 121 is connected to the internal thread of the connection hole through the external thread, so that by adjusting the torque of the connecting rod 121, the pressure of the pressing plate 11 towards the PCB board 21 can be controlled to be consistent, avoiding welding problems such as the wafer 22 being skewed, having missed soldering, void soldering, or false soldering due to inconsistent surface pressure during welding. That is to say, by adjusting the threaded connection position of the connecting rod 121 and the PCB board 21, the pressure applied by the pressing plate 11 on the wafer 22 can be adjusted.

[0036] Among them, the connecting rod 121 is directly connected to the PCB board 21, so that the lamp board welding auxiliary device 1 does not need to be additionally provided with a frame structure that presses against the side of the PCB board 21 away from the pressure plate, thereby making the structure of the lamp board welding auxiliary device 1 simpler and smaller in size. When the PCB board 21 with the chip 22 attached passes through the welding equipment together with the lamp board welding auxiliary device 1, the heat absorbed by the lamp board welding auxiliary device 1 can be reduced, and the heat loss of the welding equipment is prevented from affecting the welding quality between the chip 22 and the PCB board 21 due to excessive heat. Moreover, the lamp board welding auxiliary device 1 is only located on one side of the PCB board 21, and the other side does not have the structure of the lamp board welding auxiliary device 1, so that the solder paste on the PCB board 21 is heated more evenly, and the welding quality between the chip 22 and the PCB board 21 can also be improved.

[0037] In one embodiment, a plurality of plate holes 1111 are arranged at intervals, and the plurality of plate holes 1111 correspond to the positions of the plurality of connection holes one by one. A plurality of connectors 12 are arranged, and the plurality of connectors 12 correspond to the plurality of plate holes 1111 one by one, so that the pressure plate 11 and the PCB board 21 have multiple fixed connection positions, so that the pressure of the pressure plate 11 on the wafer 22 is more balanced.

[0038] In a preferred embodiment, the connectors 12 are arranged on the pressure plate 11 in an N×M matrix, where N and M are both positive integers, such as 2, 3, 4, 5, etc. The values ​​of N and M may be the same or different.

[0039] In one embodiment, the connector 12 includes a screw and a nut, and the screw passes through the plate hole 1111 and the connecting hole and is connected to the nut to achieve a fixed connection between the pressing plate 11 and the PCB board 21. In other embodiments, the connector 12 may also be a clip or a buckle structure.

[0040] See also Figures 5 to 7 In one embodiment, the pressing plate 11 includes a plate body 111 and an elastic member 112. The plate body 111 is provided with a plate hole 1111. The position of the plate hole 1111 corresponds to the position of the connection hole on the PCB board 21. The connection member 12 passes through the plate hole 1111 and the connection hole to achieve the connection between the pressing plate 11 and the PCB board 21. The elastic member 112 is protrudingly arranged on one side of the plate body 111. The surface of the elastic member 112 away from the plate body 111 constitutes a pressing surface 1123. The elastic member 112 can elastically abut against the wafer 22 to press the wafer 22 onto the PCB board 21. In addition, the elastic member 112 can prevent the pressing plate 11 from scratching and damaging the wafer 22 due to uneven pressure. Among them, the plate hole 1111 is located on the outside of the elastic member 112, so that the connection member 12 is located on the outside of the elastic member 112, avoiding the position interference between the connection member 12 and the elastic member 112, and also making the structure simpler.

[0041] See also Figure 5 andFigure 6 , the elastic member 112 includes a abutting block 1121 and a spring 1122. The abutting block 1121 is disposed on one side of the plate body 111, and the spring 1122 is connected between the abutting block 1121 and the plate body 111. The spring 1122 can provide an elastic force to push the abutting block 1121 away from the plate body 111, so that the abutting block 1121 abuts against the wafer 22.

[0042] In Figure 5 In the illustrated embodiment, a guiding hole is provided on the plate body 111, and a guiding post is provided on the abutting block 1121. The guiding post penetrates through the guiding hole and is in sliding fit with the guiding hole, so that the abutting block 1121 can slide relative to the plate body 111. The spring 1122 is sleeved on the guiding post, and both ends thereof abut against the abutting block 1121 and the plate body 111 respectively, so that the elastic force of the spring 1122 pushes the abutting block 1121 to press against the wafer 22.

[0043] In Figure 6 In the illustrated embodiment, a mounting cylinder is fixed on one side surface of the plate body 111. The abutting block 1121 and the spring 1122 are both installed in the mounting cylinder. One end of the abutting block 1121 can extend out of the outside of the mounting cylinder, and the other end abuts against the spring 1122. The other end of the spring 1122 abuts against the bottom of the mounting cylinder, so that the mounting cylinder, the abutting block 1121 and the spring 1122 form a thimble structure. Further, the abutting block 1121 can elastically press against the wafer 22.

[0044] Referring to Figure 7 , in an embodiment, the elastic member 112 is a spring plate. One end of the spring plate is connected to the plate body 111, and the other end is a free end and forms a pressing surface 1123. Therefore, the elastic force of the spring plate itself can be used to elastically abut against the wafer 22, avoiding scratching and damaging the wafer 22 due to uneven pressure of the pressing plate 11.

[0045] In Figure 2 In the illustrated embodiment, a plurality of elastic members 112 are arranged at intervals, and the plurality of elastic members 112 respectively abut against a plurality of wafers 22 correspondingly.

[0046] In Figure 8 In the illustrated embodiment, there is one elastic member 112, and the elastic member 112 abuts against all the wafers 22.

[0047] In another embodiment, the pressing plate 11 is in a flat plate shape, and a plate hole 1111 is formed on the pressing plate 11. The position of the plate hole 1111 corresponds to the position of the connection hole on the PCB board 21, so that the connecting member 12 passes through the plate hole 1111 and the connection hole to realize the connection between the pressing plate 11 and the PCB board 21. One side surface of the pressing plate 11 forms a pressing surface 1123.

[0048] Referring to Figure 3, the lamp board welding auxiliary device 1 further includes positioning posts 13, and the positioning posts 13 are fixed on the pressing plate 11; the positioning posts 13 are used to cooperate with the positioning holes on the PCB board 21, so that the pressure applied by the pressing plate 11 to the wafer 22 is perpendicular to the PCB board 21, avoiding skew of the wafer 22. Among them, the positioning holes on the PCB board 21 can be the holes used for positioning when the PCB board 21 is connected to the display screen housing.

[0049] Specifically, the positioning posts 13 and the elastic members 112 are located on the same side of the plate body 111. The length direction of the positioning posts 13 is perpendicular to the plate body 111. One end of the positioning posts 13 is fixed on the plate body 111 of the pressing plate 11, and the other end is a free end. The free end of the positioning posts 13 can pass through the positioning holes on the PCB board 21, so that the pressing plate 11 can only move along the direction perpendicular to the PCB board 21.

[0050] A plurality of positioning posts 13 are arranged at intervals, and the plurality of positioning posts 13 correspond to the plurality of positioning holes one by one, so that the pressing plate 11 moves more stably relative to the PCB board 21.

[0051] In one embodiment, the positioning posts 13 can be integrally formed with the plate body 111, or the positioning posts 13 are fixed on the plate body 111 by welding or screw hole connection.

[0052] The contact area between the crimping surface 1123 and the surface of the wafer 22 ranges from 5% to 120%, avoiding too small contact area to form point contact and too concentrated pressure to damage the surface of the wafer 22.

[0053] The material of the pressing plate 11 is required to be thin, not easily deformed, and a high-temperature-resistant material with less heat absorption. Preferably, the pressing plate does not deform in the range of 50-300 °C, avoiding deformation of the pressing plate 11 during high-temperature welding, resulting in uneven force on the surface of the wafer 22 and angular and positional offsets; the thickness of the pressing plate 11 is 0.1-10 times the thickness of the wafer 22, avoiding too thick material of the pressing plate 11 absorbing too much heat and too low temperature transmitted to the PCB substrate, which affects the welding quality.

[0054] The method of using the lamp board welding auxiliary device 1 of the present application to assist in welding the lamp board 2 includes the following steps:

[0055] Step S100: Print solder paste 23 on the pads of the PCB board 21.

[0056] Step S200: Mount the wafer 22 on the pads of the PCB board 21. Among them, the electrodes of the wafer 22 are connected to the solder paste 23, so that the wafer 22 is adhered to the PCB board 21 through the solder paste 23.

[0057] Step S300: Fix the lamp board welding auxiliary device 1 on the PCB board 21, and make the pressing surface 1123 of the pressing plate 11 abut against the wafer 22. Specifically, first insert the positioning posts 13 on the pressing plate 11 into the positioning holes on the PCB board 21, then pass the connecting member 12 through the plate hole 1111 and thread it with the connecting hole on the PCB board 21, and by adjusting the connection position between the external thread of the connecting member 12 and the connecting hole, the magnitude of the pressure exerted by the pressing plate 11 on the wafer 22 can be realized, and the pressure exerted by the pressing plate 11 at each wafer 22 can be made the same.

[0058] Step S400: Pass the combined structure of the lamp board 2 and the lamp board welding auxiliary device 1 after Step S300 through the welding equipment. The welding equipment heats and then cools the solder paste 23, causing the solder paste 23 to solidify to achieve the welding and fixation between the wafer 22 and the PCB board 21.

[0059] When the welding connection between the wafer 22 and the PCB board 21 is completed, the lamp board welding auxiliary device 1 can be removed from the PCB board 21, and the lamp board 2 can be tested.

[0060] The lamp board welding auxiliary device 1 of the present application includes a pressing plate 11 and a connecting member 12. The pressing plate 11 is provided with a plate hole 1111. The connecting member 12 can pass through the plate hole 1111 on the pressing plate 11 and connect with the connecting hole on the PCB board 21, so that the pressing surface 1123 of the pressing plate 11 presses against the surface of the wafer 22 on the PCB board 21, thereby pressing the wafer 22 tightly to the PCB board 21. When the lamp board 2 is welded, the pressure received by the wafer 22 is stable, avoiding the problem of the wafer 22 being skewed during welding and improving the welding quality of the lamp board 2.

[0061] Although the present utility model has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present utility model can be embodied in many forms without departing from the spirit or essence of the utility model, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A lamp board welding auxiliary device, the lamp board comprising a PCB board and a chip arranged on the PCB board, characterized in that: The lamp board welding auxiliary device comprises: A pressing plate, one side of which is formed with a pressing surface; the pressing plate is used to be arranged on a side of the wafer away from the PCB board, and the pressing surface faces the surface of the wafer; the pressing plate is provided with a plate hole, and the plate hole is used to correspond to the connection hole on the PCB board; The connecting piece is used to pass through and be fixed in the corresponding plate hole and the connecting hole to fix the pressing plate on the PCB board, so that the pressing surface of the pressing plate presses against the surface of the chip, so that the pressing plate presses the chip onto the PCB board.

2. The lamp board welding auxiliary device according to claim 1, characterized in that: The pressing plate comprises a plate body and an elastic member protruding from the plate body, the surface of the elastic member facing away from the plate body constitutes the pressing surface, and the elastic member can be used to elastically abut against the wafer; The connecting piece is connected to the plate body.

3. The lamp board welding auxiliary device according to claim 2, characterized in that: The elastic member includes a push block and a spring, wherein the push block is arranged on one side of the plate body, and the spring is arranged on the push block and connected to the plate body, and the spring can provide an elastic force to push the push block away from the plate body so that the push block abuts against the wafer.

4. The lamp board welding auxiliary device according to claim 3, characterized in that: A plurality of the abutting blocks are arranged at intervals, and the plurality of the abutting blocks are used to abut against the plurality of wafers in a one-to-one correspondence; or there is only one abutting block, and the abutting block is used to abut against all the wafers.

5. The lamp board welding auxiliary device according to claim 2, characterized in that: The elastic member is a spring sheet, one end of which is connected to the plate body, and the other end of which is a free end and forms the crimping surface.

6. The lamp board welding auxiliary device according to claim 2, characterized in that: The plate hole is arranged on the plate body and is located outside the elastic member.

7. The lamp board welding auxiliary device according to claim 1, characterized in that: The connecting member includes a connecting rod and a protrusion arranged at one end of the connecting rod, the connecting rod passes through the plate hole and is connected to the connecting hole, and the protrusion abuts against the pressure plate.

8. The lamp board welding auxiliary device according to claim 7, characterized in that: The connecting rod is provided with an external thread, and the inner wall of the connecting hole is provided with an internal thread which is threadedly matched with the external thread.

9. The lamp board welding auxiliary device according to claim 1, characterized in that: The lamp board welding auxiliary device also includes a positioning column, which is fixed on the pressure plate and is used to pass through a positioning hole on the PCB board.

10. The lamp board welding auxiliary device according to claim 1, characterized in that: The contact area between the pressure plate and the wafer is in the range of 5% to 120%; and / or The thickness of the pressing plate body is 0.1-10 times the thickness of the wafer.