Wafer thinning device
By designing a wafer thinning device with a motor-driven sliding mechanism and a hydraulic cylinder, the problem of difficult wafer fixation in the prior art is solved, position stability and surface cleaning during the thinning process are achieved, thinning accuracy and uniformity are improved, and the quality and performance of semiconductor devices are improved.
Patent Information
- Application Number
- CN202422094791.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-28
AI Technical Summary
Existing wafer thinning devices are difficult to fix the wafer, resulting in vibration or displacement during the thinning process, affecting the uniformity and accuracy of the thinning.
A wafer thinning device is designed to drive the square plate and arc block to slide through the motor to achieve the fixing of the wafer, and move the fixed cover up and down through the hydraulic cylinder and the motor to combine with the air pump to remove dust to ensure the stability of the wafer position and surface cleaning during the thinning process.
By fixing the wafer, reducing vibration and movement, improving thinning accuracy and uniformity, ensuring consistency in wafer surface thickness, thereby improving the manufacturing quality and performance of semiconductor devices.
Smart Images
Figure CN223012765U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer production, in particular to a wafer thinning device. Background Technique
[0002] Wafer production refers to the process of manufacturing semiconductor wafers through a series of precise technological steps in semiconductor manufacturing. These wafers are ultimately cut into individual chips for the manufacture of electronic devices and integrated circuits. With the development of integrated circuit technology, the thickness requirements for chips are getting smaller and smaller. Therefore, a wafer thinning device is needed to reduce the thickness of the wafers to the required size.
[0003] In the prior art, it is difficult to fix the wafer when using some thinning devices. The wafer thinning process requires very precise control and stable process conditions. If the device is difficult to be fixed in place, it is easy to cause vibration or displacement during the thinning process, which will affect the uniformity and accuracy of thinning. This is particularly crucial for semiconductor products that require extremely high flatness and surface quality. Therefore, in view of the above deficiencies, a wafer thinning device is proposed. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a wafer thinning device is proposed, aiming to improve the problem that some thinning devices in the prior art are difficult to fix the wafer, which will cause vibration or displacement during the thinning process.
[0005] To achieve the above purpose, the utility model provides the following technical solutions:
[0006] A wafer thinning device, including a base, both the left and right sides of the top of the base are fixedly connected with support frames, a circular column is fixedly connected to the adjacent side of the two support frames, a motor one is fixedly connected to the inner wall of the top of the circular column, a rotating rod is fixedly connected to the driving end of the motor one, a square plate is fixedly connected to the outside of the rotating rod, arc-shaped blocks are rotatably connected to the four corners of the outside of the square plate, a plurality of square openings are opened on the inner wall of the bottom of the circular column, a square block is slidably connected to the inner wall of the square opening, a hydraulic cylinder is fixedly connected to the top of the base, a fixed cover is fixedly connected to the driving end of the hydraulic cylinder, a motor two is fixedly connected to the driving end of the fixed cover, a grinding disc is fixedly connected to the driving end of the motor two, connecting pipes are fixedly connected to both the left and right sides inside the fixed cover, and a dust removal component is fixedly connected to the left side of the connecting pipe;
[0007] As a further description of the above technical solution:
[0008] The dust removal assembly includes a collection bucket. On both the front and rear sides of the inner wall of the collection bucket, there are fixedly connected support plates. On the adjacent sides of the two support plates, there is a fixedly connected connecting plate. On the top of the connecting plate, there is a fixedly connected air pump. Outside the air pump, there is a partition plate. On the left side of the collection bucket, there are multiple through holes opened.
[0009] As a further description of the above technical solution:
[0010] The outside of the partition plate is fixedly connected to the inner wall of the collection bucket. A cover door is provided at the rear side of the collection bucket.
[0011] As a further description of the above technical solution:
[0012] The far sides of the multiple arc-shaped blocks are respectively rotatably connected to the adjacent sides of the multiple square blocks.
[0013] As a further description of the above technical solution:
[0014] On the inner wall of the top of the circular column, there is a fixedly connected square frame. Outside the square frame, there are multiple limiting rods fixedly connected.
[0015] As a further description of the above technical solution:
[0016] The bottom of the rotating rod is rotatably connected to the inner wall of the bottom of the circular column. The inside of the square block is slidably connected to the outside of the limiting rod.
[0017] As a further description of the above technical solution:
[0018] At the bottom of the fixed cover, there are multiple sliding columns fixedly connected. At the bottom of the sliding columns, there is a sliding plate fixedly connected.
[0019] As a further description of the above technical solution:
[0020] On the top of the base, there are multiple hollow columns fixedly connected. The outside of the sliding plate is slidably connected to the inner wall of the hollow columns.
[0021] The present utility model has the following beneficial effects:
[0022] 1. In the present utility model, by starting the first motor, the arc-shaped block drives the square block to slide. After the square block contacts the wafer, the wafer is fixed. Subsequently, it can ensure the stable position of the wafer during the thinning process, reduce vibration and movement, thereby improving the thinning accuracy and uniformity, ensuring the consistency of the wafer in terms of the entire surface thickness, and thus enhancing the manufacturing quality and performance of semiconductor devices.
[0023] 2. In the present utility model, by starting the air pump, the dust in the fixed cover enters the air pump through the connecting pipe, realizing the dust removal of the wafer, thereby ensuring that the surface of the wafer is clean and dust-free and reducing the possibility of surface defects. Description of the Drawings
[0024] Figure 1 Is a perspective view of a wafer thinning device proposed by the present utility model;
[0025] Figure 2 Is a schematic internal structure diagram of the circular column of a wafer thinning device proposed by the present utility model;
[0026] Figure 3 Is a schematic internal structure diagram of the collection barrel of a wafer thinning device proposed by the present utility model.
[0027] Legend Explanation:
[0028] 1. Base; 2. Support frame; 3. Circular column; 4. Motor 1; 5. Rotating rod; 6. Square plate; 7. Arc-shaped block; 8. Square frame; 9. Limiting rod; 10. Square opening; 11. Square block; 12. Hydraulic cylinder; 13. Fixed cover; 14. Motor 2; 15. Grinding disc; 16. Connecting pipe; 17. Collection barrel; 18. Support plate; 19. Connecting plate; 20. Air pump; 21. Partition plate; 22. Through hole; 23. Hollow column; 24. Sliding plate; 25. Sliding column. Detailed Embodiment
[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0030] Refer to Figures 1 to 3, an embodiment provided by the present utility model: a wafer thinning device, including a base 1, support frames 2 are fixedly connected to both the left and right sides of the top of the base 1, a circular column 3 is fixedly connected to the adjacent side of the two support frames 2, a motor one 4 is fixedly connected to the inner wall of the top of the circular column 3, a rotating rod 5 is fixedly connected to the driving end of the motor one 4, the motor one 4 drives the rotating rod 5 to rotate, a square plate 6 is fixedly connected to the outside of the rotating rod 5, and the rotating rod 5 drives the square plate 6 to rotate. Arc-shaped blocks 7 are rotatably connected to the four corners of the outside of the square plate 6, and the square plate 6 drives the arc-shaped blocks 7 to move. A plurality of square openings 10 are formed in the inner wall of the bottom of the circular column 3, a square block 11 is slidably connected to the inner wall of the square opening 10, and the arc-shaped block 7 drives the square block 11 to slide. A hydraulic cylinder 12 is fixedly connected to the top of the base 1, a fixed cover 13 is fixedly connected to the driving end of the hydraulic cylinder 12, the hydraulic cylinder 12 drives the fixed cover 13 to move up and down, a motor two 14 is fixedly connected to the driving end of the fixed cover 13, a grinding disc 15 is fixedly connected to the driving end of the motor two 14, and the motor two 14 drives the grinding disc 15 to rotate. Connecting pipes 16 are fixedly connected to both the left and right sides inside the fixed cover 13, and a dust removal component is fixedly connected to the left side of the connecting pipe 16.
[0031] Referring to Figures 1 to 3 , the dust removal component includes a collection bucket 17, support plates 18 are fixedly connected to both the front and rear sides of the inner wall of the collection bucket 17, a connecting plate 19 is fixedly connected to the adjacent side of the two support plates 18, an air pump 20 is fixedly connected to the top of the connecting plate 19, dust inside the fixed cover 13 enters the air pump 20 through the connecting pipe 16, a partition plate 21 is fixedly connected to the outside of the air pump 20, and a plurality of through holes 22 are formed in the left side of the collection bucket 17.
[0032] Referring to Figures 1 to 3 , the outside of the partition plate 21 is fixedly connected to the inner wall of the collection bucket 17, a cover door is arranged at the rear side of the collection bucket 17, the far sides of the plurality of arc-shaped blocks 7 are respectively rotatably connected to the adjacent sides of the plurality of square blocks 11, the arc-shaped block 7 drives the square block 11 to slide, a square frame 8 is fixedly connected to the inner wall of the top of the circular column 3, a plurality of limiting rods 9 are fixedly connected to the outside of the square frame 8, and the square frame 8 improves the stability of the limiting rods 9. The bottom of the rotating rod 5 is rotatably connected to the inner wall of the bottom of the circular column 3, which improves the stability of the rotating rod 5. The inside of the square block 11 is slidably connected to the outside of the limiting rod 9, and the limiting rod 9 improves the stability of the square block 11. A plurality of sliding columns 25 are fixedly connected to the bottom of the fixed cover 13, a sliding plate 24 is fixedly connected to the bottom of the sliding columns 25, a plurality of hollow columns 23 are fixedly connected to the top of the base 1, and the outside of the sliding plate 24 is slidably connected to the inner wall of the hollow column 23, and the sliding plate 24 improves the stability of the hollow column 23.
[0033] Working principle: First, place the wafer at the bottom of the circular column 3. After starting the first motor 4, the first motor 4 drives the rotating rod 5 to rotate. The rotating rod 5 then drives the square plate 6 to rotate. The square plate 6 drives the arc-shaped block 7 to move, causing the arc-shaped block 7 to drive the square block 11 to slide. After the square block 11 contacts the wafer, the wafer is fixed, thereby ensuring the stable position of the wafer during the thinning process and reducing vibration and movement. This can improve the thinning accuracy and uniformity, ensure the consistency of the wafer in terms of the overall surface thickness, and thus improve the manufacturing quality and performance of semiconductor devices. By starting the hydraulic cylinder 12, the hydraulic cylinder 12 drives the fixed cover 13 to move up and down. By starting the second motor 14, the second motor 14 drives the grinding disc 15 to rotate, realizing the grinding of the wafer. By starting the air pump 20, the dust in the fixed cover 13 enters the air pump 20 through the connecting pipe 16, realizing the dust removal of the wafer, and then ensuring that the wafer surface is clean and dust-free, reducing the possibility of surface defects.
[0034] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A wafer thinning device, comprising a base (1), characterized in that: The left and right sides of the top of the base (1) are fixedly connected to support frames (2), the adjacent sides of the two support frames (2) are fixedly connected to circular columns (3), the top inner wall of the circular columns (3) is fixedly connected to a motor (4), the driving end of the motor (4) is fixedly connected to a rotating rod (5), the outside of the rotating rod (5) is fixedly connected to a square plate (6), the four outer corners of the square plate (6) are rotatably connected to arc blocks (7), and the bottom inner wall of the circular columns (3) is provided with a plurality of square openings (10) The inner wall of the square opening (10) is slidably connected with a square block (11), the top of the base (1) is fixedly connected with a hydraulic cylinder (12), the driving end of the hydraulic cylinder (12) is fixedly connected with a fixed cover (13), the driving end of the fixed cover (13) is fixedly connected with a motor 2 (14), the driving end of the motor 2 (14) is fixedly connected with a grinding disc (15), the left and right sides of the interior of the fixed cover (13) are fixedly connected with connecting pipes (16), and the left side of the connecting pipe (16) is fixedly connected with a dust removal component.
2. A wafer thinning device according to claim 1, characterized in that: The dust removal assembly comprises a collection barrel (17), the inner wall of the collection barrel (17) is fixedly connected to support plates (18) on both the front and rear sides, the adjacent sides of the two support plates (18) are fixedly connected to connecting plates (19), the top of the connecting plates (19) is fixedly connected to an air pump (20), the outside of the air pump (20) is fixedly connected to a partition plate (21), and the left side of the collection barrel (17) is provided with a plurality of through holes (22).
3. A wafer thinning device according to claim 2, characterized in that: The exterior of the partition (21) is fixedly connected to the inner wall of the collection barrel (17), and a cover door is provided on the rear side of the collection barrel (17).
4. A wafer thinning device according to claim 1, characterized in that: The far sides of the plurality of arc-shaped blocks (7) are respectively rotatably connected to the near sides of the plurality of square blocks (11).
5. The wafer thinning device according to claim 1, characterized in that: A square frame (8) is fixedly connected to the inner wall of the top of the circular column (3), and a plurality of limiting rods (9) are fixedly connected to the outside of the square frame (8).
6. A wafer thinning device according to claim 5, characterized in that: The bottom of the rotating rod (5) is rotatably connected to the bottom inner wall of the circular column (3), and the inside of the square block (11) is slidably connected to the outside of the limiting rod (9).
7. The wafer thinning device according to claim 1, characterized in that: A plurality of sliding columns (25) are fixedly connected to the bottom of the fixed cover (13), and a sliding plate (24) is fixedly connected to the bottom of the sliding column (25).
8. A wafer thinning device according to claim 7, characterized in that: A plurality of hollow columns (23) are fixedly connected to the top of the base (1), and the outside of the sliding plate (24) is slidably connected to the inner wall of the hollow column (23).