Silicon wafer double-insertion carrier and atomic layer deposition equipment

Abstract

The utility model provides a silicon wafer double-insertion carrier and atomic layer deposition equipment. The silicon wafer double-insertion carrier comprises two vertical plates and at least one group of toothed bars fixed between the vertical plates, each group of toothed bars comprises at least one bottom bar, a plurality of tooth grooves used for supporting two silicon wafers are formed in the axis direction of the bottom bar at uniform intervals, and a protrusion used for separating the two silicon wafers in the tooth groove from the lower portion of the silicon wafer is arranged in each tooth groove; the at least two middle rods are provided with a plurality of clamping teeth for separating the two silicon wafers in the same tooth groove from the middle parts of the two sides of the silicon wafers along the axis direction of the middle rods; the movable limiting piece is used for adjusting the position of the middle rod fixed on the vertical plate, and when the silicon wafer is not loaded, the limiting piece fixes the middle rod at the position far away from the silicon wafer; after the silicon wafers are loaded, the limiting piece fixes the middle rod to the position close to the silicon wafers, so that the clamping teeth are inserted between the two silicon wafers in the tooth grooves. According to the utility model, two silicon wafers in the same tooth groove of the double-insertion carrier can be completely separated, and the coating uniformity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of process equipment for solar cells, in particular to a double-insert carrier for silicon wafers used in process equipment for solar cells. The double-insert carrier for silicon wafers can be used in atomic layer deposition equipment (ALD equipment) in the solar cell industry, especially a coating carrier dedicated to loading battery silicon wafers in ALD equipment. Background Art

[0002] With the continuous development of the photovoltaic industry, the technology of solar cells is updated iteratively, and ALD equipment is increasingly widely used in the production process of solar cell wafers. At the same time, the production capacity requirements of the equipment are also getting higher and higher. Therefore, in order to meet the large production capacity, the carriers on the market have gradually evolved from single-insert to double-insert, but the double-insert carriers often perform worse than single-insert carriers in terms of process effects. Single-insert means that each tooth groove of the carrier inserts one silicon wafer, and the corresponding carrier is called a single-insert carrier. Double-insert means that two silicon wafers are inserted into one tooth groove of the carrier, and the corresponding carrier is called a double-insert carrier.

[0003] Although the existing double-insert carriers have doubled the production capacity compared with single-insert carriers, there are many deficiencies in the process. For example, the two silicon wafers in the same tooth groove of the double-insert carrier are almost in contact with each other. Therefore, in the prior art, the non-contact surfaces of the silicon wafers are usually coated, that is, the outer sides of the two silicon wafers. However, there are often gaps between the two silicon wafers in the same tooth groove due to insufficient contact, resulting in the silicon wafers being coated around to local areas of the contact surface during coating. After coating, the silicon wafers, especially the coated surfaces, will show serious problems such as uneven color difference, which affects the performance of the battery wafers and also causes difficulties in the subsequent processes of the battery wafers.

[0004] Therefore, how to provide a double-insert carrier that can make the two sides of the two silicon wafers in the same tooth groove be coated evenly to avoid the problem of uneven color difference in the coating process of double-insert silicon wafers in the prior art. Summary of the Utility Model

[0005] In order to solve the technical problem of uneven color difference caused by insufficient coating around the double-insert silicon wafers in the double-insert carrier, the utility model provides a double-insert carrier for silicon wafers and an atomic layer deposition equipment that can achieve complete coating (double-sided full coating).

[0006] The double-insert carrier for silicon wafers provided by the utility model includes two opposite vertical plates and at least one group of tooth rods fixed between the vertical plates. Each group of tooth rods includes:

[0007] At least one bottom rod, on which a plurality of tooth grooves for supporting two silicon wafers are evenly spaced along its axial direction, and a protrusion for separating the two silicon wafers in each tooth groove from below the silicon wafers is arranged in each tooth groove;

[0008] At least two middle rods are provided with a plurality of engaging teeth along their axial directions for separating two silicon wafers in the same tooth groove from the middle parts of both sides of the silicon wafer.

[0009] A movable limiting member is used to adjust the position of the middle rod fixed on the vertical plate. When no silicon wafer is loaded, the limiting member fixes the middle rod at a position far from the silicon wafer; when the silicon wafer is loaded, the limiting member fixes the middle rod at a position close to the silicon wafer, so that the engaging teeth are inserted between the two silicon wafers in the tooth groove.

[0010] Furthermore, the vertical plate includes:

[0011] Slotted holes, which are provided in one-to-one correspondence with the ends of the middle rods, and both ends of the middle rods are respectively installed in the slotted holes.

[0012] A clearance layer, which communicates with the corresponding slotted hole, and the limiting member is located in the clearance layer. When the middle rod is located at a position close to or far from the silicon wafer in the slotted hole, the corresponding limiting member in the clearance layer can move into the slotted hole to limit the middle rod.

[0013] Furthermore, a strip-shaped opening perpendicular to the slotted hole is provided on one side of the clearance layer close to the outer side of the vertical plate. The limiting member includes:

[0014] A strip-shaped limiting plate, which is located in the clearance layer;

[0015] An operation protrusion, which can move along the strip-shaped opening and drive the strip-shaped limiting plate to enter or leave the slotted hole.

[0016] Furthermore, two such limiting members are provided in each clearance layer.

[0017] Furthermore, each group of tooth rods further includes: at least two top rods, and a plurality of tooth grooves with evenly spaced intervals are provided along the axial direction of the top rods for accommodating two silicon wafers, and a protrusion for separating two silicon wafers in each tooth groove from the upper parts of both sides of the silicon wafer is provided in each tooth groove.

[0018] Furthermore, when there are multiple groups of tooth rods, tooth grooves and protrusions are provided on both sides of the top rod, so that the top rods of adjacent groups of tooth rods share each other.

[0019] Furthermore, the outer edge of the cross-section of the protrusion parallel to the axis of the top rod or the bottom rod is any one of a trapezoid, an arc or a triangle.

[0020] Further, when multiple groups of the toothed rods are provided, the middle rods on the adjacent sides of the adjacent two groups of toothed rods are respectively referred to as a first middle rod and a second middle rod. The strip-shaped holes corresponding to the first and second middle rods are arranged in a one-to-one correspondence up and down. A smooth surface for abutting against the silicon wafer to be separated by the second middle rod is provided on one side of the first middle rod close to the silicon wafer to be separated by the second middle rod, and a smooth surface for abutting against the silicon wafer to be separated by the first middle rod is provided on one side of the second middle rod close to the silicon wafer to be separated by the first middle rod.

[0021] Further, grooves with openings facing the outside of the vertical plate are formed at the strip-shaped holes corresponding to the first and second middle rods. A sealing plate is fixed at the opening of the groove to form the gap layer between the sealing plate and the bottom surface of the groove. The strip-shaped opening is arranged on the sealing plate, and the strip-shaped hole penetrates through the sealing plate.

[0022] The atomic layer deposition equipment proposed by the present utility model adopts the silicon wafer double-inserting carrier described in the above technical solution.

[0023] The present utility model adjusts the position of the middle rod through the movable middle rod and the limiting member, so that the middle rod can cooperate with the bottom rod or cooperate with the bottom rod and the top rod to completely separate the silicon wafer, which not only retains the production capacity of the double-inserting carrier but also improves the coating uniformity of the double-inserting carrier during silicon wafer coating. Description of the Drawings

[0024] The following will describe the present utility model in detail with reference to the embodiments and the drawings, where:

[0025] Figure 1 is a partial structural schematic diagram of the middle rod and the bottom rod according to an embodiment of the present utility model.

[0026] Figure 2 is a schematic diagram of the positions of the middle rod and the limiting member when inserting wafers according to an embodiment of the present utility model.

[0027] Figure 3 is Figure 2 a schematic cross-sectional view taken along the line G-G of

[0028] Figure 4 is a schematic diagram of the position where the limiting member is lifted according to an embodiment of the present utility model.

[0029] Figure 5 is a schematic diagram of the positions of the middle rod and the limiting member after inserting wafers according to an embodiment of the present utility model.

[0030] Figure 6 is a three-dimensional schematic diagram of a double-inserting carrier according to an embodiment of the present utility model.

[0031] Description of the Reference Numerals:

[0032] 1. Vertical plate; 2. Ejector rod; 3. Middle rod; 4. Bottom rod; 5. Sealing plate; 6. Pull rod; 7. Silicon wafer; 8. Limiting part; 9. Strip-shaped opening; 10. Gap layer; 31. Locking teeth; 81. Strip-shaped limiting plate; 82. Operating projection. Detailed implementation manners

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0034] Therefore, a feature pointed out in this specification will be used to illustrate one of the features of one embodiment of the present utility model, rather than implying that each embodiment of the present utility model must have the illustrated feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to show possible system designs, these features can also be used in other combinations not explicitly described. Therefore, unless otherwise stated, the described combination is not intended to be limiting.

[0035] In a basic embodiment of the silicon wafer double-insert carrier of the present utility model, it includes a vertical plate 1, at least one set of toothed rods and a movable limiting part 8.

[0036] There are two vertical plates 1, and the two vertical plates 1 are arranged at intervals face to face, and at least one set of toothed rods is used to connect the two spaced-apart vertical plates 1.

[0037] In this embodiment, each set of toothed rods includes at least one bottom rod 4 and at least two middle rods 3.

[0038] The bottom rod 4 supports the bottom of the silicon wafer 7, and a plurality of evenly spaced tooth grooves are provided along the axis direction of the bottom rod 4. Each tooth groove can support two silicon wafers 7, and a projection for separating the two silicon wafers 7 in the tooth groove from below the silicon wafer 7 is provided in each tooth groove.

[0039] When there are two middle rods 3, the two middle rods 3 are respectively arranged on both sides of the silicon wafer 7. When there are more than two middle rods 3, multiple middle rods 3 can be arranged in corresponding numbers on both sides of the silicon wafer 7 as needed. A plurality of locking teeth 31 for separating the two silicon wafers 7 in the same tooth groove from the middle parts on both sides of the silicon wafer 7 are provided along the axis direction of the middle rod 3.

[0040] The middle rod 3 of the present utility model can adjust its position and is a movable middle rod 3. Specifically, the middle rod 3 adjusts the position where it is fixed on the vertical plate 1 through a movable limiting member 8. When the silicon wafer 7 is not loaded, the limiting member 8 fixes the middle rod 3 at a position far from the silicon wafer 7. Here, the silicon wafer 7 refers to the silicon wafer 7 to be separated by the middle rod 3. When the silicon wafer 7 is loaded, the limiting member 8 fixes the middle rod 3 at a position close to the silicon wafer 7, so that the engaging teeth 31 are inserted between the two silicon wafers 7 in the tooth grooves.

[0041] The present utility model adjusts the position of the middle rod 3 through the movable limiting member 8 and cooperates with the bottom rod 4, so that the two silicon wafers 7 in the same tooth groove of the double insertion carrier can be separated. In particular, the middle part of the silicon wafer 7 can be completely pushed open and separated by the movable middle rod 3, so as to realize the complete separation of the two silicon wafers 7 and ensure that the back surfaces of the two silicon wafers 7 can be completely and evenly coated with a film. Figure 1 A partial enlarged schematic diagram of the double insertion carrier is shown. It can be seen from the enlarged view that the two silicon wafers 7 are separated by the bottom rod 4 and the middle rod 3.

[0042] In a further embodiment, the vertical plate 1 of the present utility model includes a strip-shaped hole and a gap layer.

[0043] The strip-shaped holes are arranged in one-to-one correspondence with the ends of the middle rod 3. The two ends of one middle rod 3 are respectively installed in a corresponding strip-shaped hole of the two vertical plates 1. For example, the two ends of the middle rod 3 are respectively called the left end and the right end, and the corresponding vertical plates are called the left vertical plate and the right vertical plate. The left end of the middle rod 3 is installed in a strip-shaped hole of the left vertical plate, and the right end of the middle rod 3 is installed in a strip-shaped hole of the right vertical plate, that is, the ends of the middle rod 3 and the strip-shaped holes are in a one-to-one correspondence relationship.

[0044] The gap layer 10 communicates with the corresponding strip-shaped hole, and the limiting member 8 is located in the gap layer 10. When the middle rod 3 is located in the strip-shaped hole close to or far from the silicon wafer 7, the corresponding limiting member 8 in the gap layer 10 can move into the strip-shaped hole to limit the middle rod 3. Here, the silicon wafer 7 also refers to the silicon wafer 7 to be separated by the middle rod 3. For example, when the silicon wafer 7 is not loaded, the middle rod 3 is located in the strip-shaped hole at a position far from the silicon wafer 7 to be separated. At this time, the limiting member 8 can move into the strip-shaped hole to a position close to the silicon wafer 7, so that the middle rod 3 cannot move to a position close to the silicon wafer 7, thereby limiting the position of the middle rod 3. When the silicon wafer 7 is loaded and the middle rod 3 needs to move to a position close to the silicon wafer 7 to push open the two silicon wafers 7 in the same tooth groove, at this time, the limiting member 8 close to the silicon wafer 7 is moved away, the middle rod 3 is moved to a position close to the silicon wafer 7, and then the limiting member 8 is moved to a position in the strip-shaped hole far from the silicon wafer 7 to limit the position of the middle rod 3 again. The limiting member 8 in this example can be one or more, and those skilled in the art can set it according to needs.

[0045] In a further embodiment, a strip-shaped opening 9 is provided on one side of the gap layer 10 close to the outer side of the vertical plate 1, and the strip-shaped opening 9 is perpendicular to the strip-shaped hole. Correspondingly, the limiting member 8 includes a strip-shaped limiting plate 81 and an operation protrusion 82. The strip-shaped limiting plate 81 is located inside the gap layer 10, and the operation protrusion 82 can move along the strip-shaped opening 9. The operation protrusion 82 is directly or indirectly connected to the strip-shaped limiting plate 81, and drives the strip-shaped limiting plate 81 to enter or leave the strip-shaped hole when moving. Through the structural cooperation of the gap layer and the structure of the limiting member 8, the position of the limiting member 8 can be easily adjusted.

[0046] In a specific embodiment, two limiting members 8 are provided in each gap layer. In this way, the limiting member 8 only needs to move up and down along the strip-shaped opening 9, the moving route is simple, and the structure can also be more simplified. Figure 2 、 Figure 3 The implementation structure of a specific embodiment of the gap layer and the limiting member 8 is shown. The gap layer is formed by covering the groove with a sealing plate 5. At this time, the positions of the first and second middle rods 3 of two adjacent groups of tooth rods in the corresponding strip-shaped holes are just opposite. Among the two limiting members 8 corresponding to each middle rod 3, one falls on the middle rod 3 and one is located on the side of the middle rod 3 to limit the position of the middle rod 3. Figure 2 For the state of the middle rod 3 when the carrier inserts the wafer, the upper middle rod 3 is on the left side and the lower middle rod 3 is on the right side. After inserting the silicon wafer 7, the baffle of the middle rod 3 is lifted by a driving mechanism such as manual or air cylinder. As Figure 4 shown, after the baffle of the middle rod 3 is lifted, the middle rod 3 is pushed to the other side by a driving mechanism such as manual or air cylinder. Through this action, the clamping teeth 31 of the middle rod 3 are used to push open two silicon wafers 7, and then the positions of the middle rod 3 and the limiting member 8 are as Figure 5 shown.

[0047] In a preferred embodiment, each group of tooth rods further includes: at least two top rods 2. The top rods 2 are provided with a plurality of tooth grooves for accommodating two silicon wafers 7 at equal intervals along the axial direction thereof, and a protrusion for separating the two silicon wafers 7 in the tooth groove from the upper parts of both sides of the silicon wafer 7 is provided in each tooth groove. Through the cooperation of the top rod 2, the middle rod 3 and the bottom rod 4, the silicon wafers 7 in the same tooth groove can be separated from the lower part, the middle part of the side surface and the upper part of the side surface of the silicon wafer 7, further ensuring that there is no possibility of the silicon wafers 7 being adhered. At the same time, compared with a single-insert carrier, the production capacity and efficiency are also improved.

[0048] In an embodiment, when there are multiple groups of tooth rods, tooth grooves and protrusions are provided on both sides of the top rod 2, so that the top rods 2 of adjacent groups of tooth rods share each other. In this way, the number of rod members of the tooth rods can be reduced, the distance between the two groups of silicon wafers 7 fixed by adjacent groups of tooth rods can be reduced, so that the size of the double-insert carrier is smaller when carrying the same number of silicon wafers 7, or the number of silicon wafers 7 that can be carried is more when the size is the same.

[0049] The present utility model does not limit the specific implementation form of the protrusion. The outer edge of the cross-section of the protrusion of the present utility model parallel to the axis of the ejector rod 2 or the bottom rod 4 can be any one of a trapezoid, an arc, or a triangle, as well as any other shape that is beneficial to separating the two silicon wafers 7.

[0050] In a preferred embodiment, when there are multiple sets of toothed rods, the middle rods 3 on the adjacent sides of the adjacent two sets of toothed rods are respectively referred to as the first middle rod 3 and the second middle rod 3. The strip-shaped holes corresponding to the first and second middle rods 3 are arranged vertically and oppositely one by one. In fact, this is also a way to save space. A smooth surface for abutting against the silicon wafer 7 to be separated by the second middle rod 3 is provided on one side of the first middle rod 3 close to the silicon wafer 7 to be separated by the second middle rod 3. Similarly, a smooth surface for abutting against the silicon wafer 7 to be separated by the first middle rod 3 is provided on one side of the second middle rod 3 close to the silicon wafer 7 to be separated by the first middle rod 3. That is to say, before the first middle rod 3 approaches the silicon wafer 7 to be separated by it, the two sides of the silicon wafer 7 are first supported by the second middle rod 3. However, at this time, the sides of the silicon wafer 7 may be in contact. Similarly, the first middle rod 3 is also supporting the silicon wafer 7 to be separated by the second middle rod 3 at this time. Then, they exchange positions in the direction parallel to the axis of the strip-shaped hole, and then the separation operation can be carried out on the adjacent two sets of silicon wafers 7 at the same time, which not only saves space, improves efficiency, but also solves the stability problem before the separation of the silicon wafers 7.

[0051] In a specific embodiment, grooves with openings facing the outside of the vertical plate 1 are provided at the positions of the strip-shaped holes corresponding to the first and second middle rods 3. Each groove covers the strip-shaped hole where the corresponding first and second middle rods 3 are located, that is, the strip-shaped hole penetrates the bottom surface of the groove. A sealing plate 5 is fixed at the opening of the groove to form the above-mentioned gap layer between the sealing plate 5 and the bottom surface of the groove. The above-mentioned strip-shaped opening 9 is provided on the sealing plate 5, and at the same time, the strip-shaped hole also penetrates the sealing plate 5, so that the end of the middle rod 3 can be exposed outside the vertical plate 1 to observe the position of the middle rod 3 relative to the strip-shaped hole.

[0052] Figure 6 A specific embodiment of the present invention is shown. In this embodiment, multiple sets of toothed rods are provided between the vertical plates 1. The toothed rods include a bottom rod 4, a middle rod 3, and a top rod 2, and the vertical plates 1 are further fixed at both ends of the multiple sets of toothed rods through a pull rod 6.

[0053] The carrier structure of the present utility model can well separate the two silicon wafers 7 in the double-insert carrier tooth grooves, so as to evenly coat the four surfaces of the two silicon wafers 7 in the same tooth groove with a film, effectively solving the problems of deflection and color difference generated by the original double-insert carrier. The present utility model also protects an atomic layer deposition device, and the silicon wafer double-insert carrier adopting the above technical solution is used in this atomic deposition device.

[0054] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A silicon wafer dual-insertion carrier, comprising two oppositely disposed vertical plates, and at least one set of gear rods fixed between the vertical plates, characterized in that: Each gear set includes: At least one bottom rod is provided with a plurality of evenly spaced grooves for supporting two silicon wafers along its axial direction, and each groove is provided with a protrusion for separating the two silicon wafers in the groove from below the silicon wafer; At least two middle rods are provided with a plurality of latching teeth along the axis direction thereof for separating two silicon wafers in the same tooth groove from the middle of both sides of the silicon wafer; The movable limiter is used to adjust the position of the middle rod fixed on the vertical plate. When the silicon wafer is not loaded, the limiter fixes the middle rod at a position away from the silicon wafer; when the silicon wafer is loaded, the limiter fixes the middle rod at a position close to the silicon wafer, so that the latch tooth is inserted between the two silicon wafers in the tooth groove.

2. The silicon wafer dual plug carrier as claimed in claim 1, characterized in that: The vertical plate comprises: Strip holes are arranged in one-to-one correspondence with the ends of the middle rod, and the two ends of the middle rod are respectively installed in the strip holes; A gap layer is connected to the corresponding strip hole, and the limiting member is located in the gap layer. When the middle rod is located in the strip hole close to or far away from the silicon wafer, the corresponding limiting member in the gap layer can be moved into the strip hole to limit the middle rod.

3. The silicon wafer dual plug carrier as claimed in claim 2, characterized in that: A strip opening perpendicular to the strip hole is provided on one side of the gap layer close to the outer side of the vertical plate, and the limiting member includes: A strip-shaped limiting plate, which is located in the gap layer; The operating protrusion can move along the strip-shaped opening and drive the strip-shaped limiting plate to enter or leave the strip-shaped hole.

4. The silicon wafer dual plug carrier as claimed in claim 2, characterized in that: Two limiting members are arranged in each of the gap layers.

5. The silicon wafer dual plug carrier according to any one of claims 1 to 4, characterized in that: Each group of gear rods also includes: at least two top rods, each of which is provided with a plurality of evenly spaced tooth grooves for accommodating two silicon wafers along its axial direction, and each tooth groove is provided with a protrusion for separating the two silicon wafers in the tooth groove from the upper parts of both sides of the silicon wafer.

6. The silicon wafer dual plug carrier as claimed in claim 5, characterized in that: When there are multiple groups of gear rods, the tooth grooves and protrusions are provided on both sides of the push rod, so that the push rods of two adjacent groups of gear rods can be shared.

7. The silicon wafer dual plug carrier as claimed in claim 6, characterized in that: The outer edge of the cross section of the protrusion parallel to the axis of the top rod or the bottom rod is in any one of a trapezoidal shape, an arc shape or a triangle shape.

8. The silicon wafer dual plug carrier as claimed in claim 3, characterized in that: When there are multiple groups of tooth rods, the middle rods of two adjacent groups of tooth rods located on adjacent sides are respectively called the first middle rod and the second middle rod, the strip holes corresponding to the first and second middle rods are arranged one by one up and down, and the first middle rod is provided with a smooth surface for abutting the silicon wafer to be separated by the second middle rod on one side close to the silicon wafer to be separated by the second middle rod, and the second middle rod is provided with a smooth surface for abutting the silicon wafer to be separated by the first middle rod on one side close to the silicon wafer to be separated by the first middle rod.

9. The silicon wafer dual plug carrier as claimed in claim 8, characterized in that: The strip holes corresponding to the first and second middle rods are provided with grooves opening toward the outside of the vertical plate, and a sealing plate is fixed at the opening of the groove to form the gap layer between the sealing plate and the bottom surface of the groove, the strip opening is arranged on the sealing plate, and the strip hole passes through the sealing plate.

10. An atomic layer deposition device, characterized in that: A silicon wafer dual-plug carrier as described in any one of claims 1 to 9 is used.

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