Surface treatment device for laser pumping source chip base machining

Abstract

The utility model discloses a surface treatment device for processing a laser pumping source chip base, which belongs to the technical field of surface treatment of the laser pumping source chip base and is characterized in that the end face of a swash plate is provided with a through groove, the upper end of the swash plate is provided with a wave groove, and the anti-wave operation of liquid in an electroplating bath is realized through the swash plate; a clamping cavity is formed among the multiple swash plates, an electrode plate is installed in the clamping cavity, and electroplating treatment of the laser pumping source chip base in the electroplating bath is achieved through the electrode plate and an assembly of the electrode plate. According to the surface treatment device for machining the laser pumping source chip base, electroplating waves are reduced through the design of the swash plate, and electroplating uniformity is guaranteed. And the electrode plates are fixed by the elastic strips, so that the electroplating stability and precision are improved. The arc-shaped through grooves reduce fluid resistance, the wave grooves enhance the wave-proof effect, and the electroplating efficiency and effect are improved. The integrated design simplifies installation, reduces components, is convenient to maintain, reduces safety risks, and meets the requirements of green production.

Description

Technical Field

[0001] The utility model relates to the technical field of surface treatment of laser pump source chip bases, and particularly relates to a surface treatment device for processing laser pump source chip bases. Background Technique

[0002] The surface treatment of laser pump source chip bases is a key step to improve their performance and reliability. For this reason, we have designed a special surface treatment device, aiming to optimize the surface quality, wear resistance, corrosion resistance of the bases, and extend their service life to meet the strict standards of modern industrial production.

[0003] However, when using the traditional electroplating method for surface treatment, we faced a challenge: the generation of waves on the surface of the electroplating solution. These waves not only interfere with the uniform deposition of the electroplating layer, resulting in uneven thickness and local defects, but also may cause the splashing of the electroplating solution, posing a threat to the safety of operators and equipment. Further, the waves reduce the quality of the electroplating layer, shorten the service life of the laser pump source chip bases, and reduce the production efficiency due to the need for additional time to achieve the ideal electroplating thickness. In addition, in order to overcome the influence of the waves, it is necessary to increase the stirring intensity of the electroplating solution, which undoubtedly increases the energy consumption. At the same time, the splashing of the electroplating solution may also exacerbate environmental pollution.

[0004] Therefore, we recognize that effective measures must be taken to suppress the waves on the surface of the electroplating solution to ensure the high quality, high efficiency and safety of the surface treatment of laser pump source chip bases. Content of the Utility Model

[0005] The main purpose of the utility model is to provide a surface treatment device for processing laser pump source chip bases, which can effectively solve the problems put forward in the background technique.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A surface treatment device for processing laser pump source chip bases includes a bracket, an electroplating tank, a liquid infusion pipeline, a pipeline interface, a liquid infusion pump and an electroplating bath. The electroplating tank is located at the upper end of the bracket, and an electroplating bath for storing liquid is opened at the upper end of the electroplating tank. The liquid infusion pipeline is connected to the electroplating tank through the pipeline interface, and the liquid infusion pump is connected to the liquid infusion pipeline to realize the input of liquid into the electroplating tank.

[0008] A wire hole is opened on the side wall of the electroplating tank. A bottom plate is connected inside the electroplating bath, and a plurality of anti-wave plates are arranged at the upper end of the bottom plate. A through groove is opened on the end face of the anti-wave plate, and a wave groove is opened at the upper end of the anti-wave plate. The anti-wave plates are used to prevent waves in the electroplating bath.

[0009] An interlayer cavity is formed between multiple baffle plates, and an electrode plate is installed in the interlayer cavity. Electroplating treatment of the laser pump source chip base in the electroplating tank is achieved through the electrode plate and its components.

[0010] As a further alternative embodiment of the present application, the bracket is fixed to the electroplating tank by bolts. The upper end of the electroplating tank is connected with a tank cover through a hinge device. The tank cover covers the electroplating tank, and a round hole adapted to the wire hole is opened on the tank cover.

[0011] As a further alternative embodiment of the present application, the two pipeline interfaces are located on both sides of the bottom of the electroplating tank and communicate with the two water tanks of the electroplating tank. The pipeline interfaces are fixed to the infusion pipeline through connecting flanges, nuts and bolts. The infusion pump is connected to the infusion pipeline through connecting flanges, bolts and nuts.

[0012] As a further alternative embodiment of the present application, a partition plate is provided in the electroplating tank. One end of the partition plate is the electroplating tank, and a circulation pump is provided at the lower end of the electroplating tank. The circulation pump communicates with the water tank at the other end of the partition plate.

[0013] As a further alternative embodiment of the present application, there is a gap between the bottom plate and the inner bottom of the electroplating tank. A square strip is provided at the lower end of the bottom plate. The pipeline interface is located between the two square strips of the bottom plate, facilitating the inflow of liquid.

[0014] As a further alternative embodiment of the present application, the baffle plate and the bottom plate are integrally designed, and the baffle plate is perpendicular to the bottom plate. The multiple baffle plates are arranged at equal intervals.

[0015] As a further alternative embodiment of the present application, the orifice of the through groove is designed in an arc shape. The electrode plate passes through the square hole opened on the end face of the baffle plate, and the electrode plate is tightly fixed to the baffle plate through an elastic strip.

[0016] Compared with the prior art, the present utility model has the following beneficial effects:

[0017] In the present utility model, the design of the baffle plate effectively reduces the waves generated during electroplating, avoids interference with the flow and distribution of the electroplating solution caused by the waves, and thus ensures the uniformity of electroplating on the surface of the laser pump source chip base. The integrated design and equidistant arrangement of the baffle plate and the bottom plate, as well as the way of tightly fixing the electrode plate through the elastic strip, improve the stability of the electrode plate during electroplating and ensure the improvement of electroplating accuracy.

[0018] The through groove on the end face of the baffle plate is designed in an arc shape, reducing the fluid resistance, making the electroplating solution flow more smoothly, and improving the electroplating efficiency. The setting of the wave groove further enhances the wave prevention effect, helps to maintain the stable flow of the electroplating solution, and thus optimizes the electroplating effect.

[0019] The integrated design simplifies the installation process, reduces the number of components, and facilitates operation and maintenance. By reducing waves and splashes during the electroplating process, the integrated design of the wave baffle and electrode plate helps reduce safety risks in the workplace and protect the safety of operators. Reducing the splashing of electroplating solution and the emission of harmful gases helps protect the environment and meets the requirements of green production. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0021] Figure 2 It is a display diagram of the overall structure of the present utility model;

[0022] Figure 3 It is a display diagram of the electroplating tank, wave baffle and electrode plate of the present utility model;

[0023] Figure 4 It is a schematic diagram of the wave baffle and electrode plate of the present utility model.

[0024] In the figure: 1, support; 2, electroplating tank; 3, tank cover; 4, infusion pipeline; 5, pipeline interface; 6, infusion pump; 7, circulation pump; 8, electroplating bath; 9, wire hole; 10, bottom plate; 11, wave baffle; 12, through groove; 13, wave groove; 14, electrode plate; 15, clamping cavity. Detailed Implementation Modes

[0025] To make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation modes.

[0026] As Figure 1 - Figure 4 shown, a surface treatment device designed specifically for processing the base of a laser pump source chip, which mainly consists of the following key components: a support 1, an electroplating tank 2, a tank cover 3, an infusion pipeline 4, a pipeline interface 5, an infusion pump 6, a circulation pump 7, an electroplating bath 8, a bottom plate 10, a wave baffle 11, a through groove 12, a wave groove 13, an electrode plate 14, and a clamping cavity 15.

[0027] The support 1 serves as the basic support for the entire device and is firmly connected to the electroplating tank 2 by bolts. The electroplating tank 2 is ingeniously placed at the top of the support 1, and its internal core part is the electroplating bath 8 for storing the liquid required for electroplating. At the top of the electroplating bath 8 and the upper end of the electroplating tank 2, there is an opening for electroplating operations. At the same time, a tank cover 3 is provided at this opening. The tank cover 3 is connected to the electroplating tank 2 through a hinge device, which can not only protect the electroplating bath 8 from external pollution but also facilitate the opening and closing during operation. A round hole corresponding to the wire hole 9 on the side wall of the electroplating tank 2 is also specially opened on the tank cover 3 to ensure the smooth connection of wires or pipelines.

[0028] In order to efficiently input the electroplating solution into the electroplating tank 8, the device adopts an infusion pipeline 4, which is closely connected to the electroplating box 2 through a pipeline interface 5. The pipeline interface 5 is located on both sides of the bottom of the electroplating box 2 and is connected to two water tanks inside the electroplating box 2 to ensure the uniform distribution of the electroplating solution. The infusion pump 6 is closely fitted with the infusion pipeline 4 through a series of connecting parts (such as connecting flanges, nuts, bolts) to achieve the stable input of the electroplating solution.

[0029] The interior design of the electroplating tank 8 is also ingenious. The bottom plate 10 is laid at its bottom, keeping a certain gap from the tank bottom for liquid flow. A plurality of anti-wave plates 11 are installed on the bottom plate 10. These anti-wave plates 11 are not only integrally designed with the bottom plate 10 and perpendicular to each other, but also arranged at equal distances, effectively preventing the influence of the waves generated during the electroplating process on the electroplating effect. Through grooves 12 are opened on the end faces of the anti-wave plates 11, and the orifices of which are designed in an arc shape to reduce fluid resistance. At the same time, wave grooves 13 are provided above them to further enhance the anti-wave effect.

[0030] Inside the clamping cavity 15 formed between multiple anti-wave plates 11, electrode plates 14 are installed. These electrode plates 14 and their components together constitute the core part of the electroplating treatment, and can perform precise electroplating treatment on the laser pump source chip base. The electrode plates 14 pass through the square holes on the end faces of the anti-wave plates 11 and are tightly fixed to the anti-wave plates 11 through elastic strips to ensure their stability and precision during the electroplating process.

[0031] In addition, a partition plate is provided inside the electroplating box 2 to separate the electroplating tank 8 from other water tanks, realizing the independent circulation of the electroplating solution. A circulation pump 7 is installed at the lower end of the electroplating box 2, and this pump is connected to the other water tank of the partition plate, responsible for circulating the electroplating solution back to the electroplating tank 8 to ensure the continuous progress of the electroplating process.

[0032] Through its ingenious design and efficient component cooperation, this surface treatment device for processing the laser pump source chip base provides a stable, reliable and efficient electroplating treatment solution for the processing of the laser pump source chip base.

[0033] Usage process: Ensure that all components (such as the bracket 1, electroplating box 2, box cover 3, infusion pipeline 4, pipeline interface 5, infusion pump 6, circulation pump 7, electroplating tank 8, bottom plate 10, anti-wave plate 11, through groove 12, wave groove 13, electrode plate 14, clamping cavity 15, etc.) are correctly installed and fastened. Check whether the electroplating solution has been prepared as required and stored in an external container.

[0034] Connect one end of the infusion pipeline 4 to an external electroplating solution container, and connect the other end to the corresponding interface at the bottom of the electroplating box 2 through the pipeline interface 5. Start the infusion pump 6 to pump the electroplating solution into the electroplating tank 8 inside the electroplating box 2 through the infusion pipeline 4.

[0035] Place the base of the laser pump source chip to be processed at an appropriate position in the electroplating tank 8, ensuring an appropriate distance and contact state between it and the electrode plate 14. Close the box cover 3 to the electroplating box 2 through the hinge device, ensuring that the opening of the electroplating tank 8 is completely sealed to prevent harmful gases or splashing electroplating solution generated during electroplating from polluting the external environment.

[0036] Connect the power supply of the electroplating device and start the electroplating program. At this time, the electrode plate 14 starts to work, applying an electric current to the base of the laser pump source chip, causing an electrochemical reaction on its surface, thereby achieving electroplating treatment. During electroplating, the circulation pump 7 continuously circulates the electroplating solution in the electroplating tank 8 back to the electroplating tank 8 to ensure the uniform distribution and continuous supply of the electroplating solution.

[0037] During electroplating, the operator needs to closely monitor parameters such as the concentration, temperature, and flow rate of the electroplating solution and make adjustments as needed. At the same time, it is also necessary to observe the electroplating effect of the base of the laser pump source chip to ensure that it meets the predetermined quality standards and requirements.

[0038] When the electroplating process reaches the predetermined time or the expected electroplating effect, turn off the power supply of the electroplating device and the infusion pump 6. Open the box cover 3, take out the electroplated base of the laser pump source chip, and perform necessary cleaning and drying treatments.

[0039] After completing the electroplating task, it is necessary to thoroughly clean and maintain the electroplating device to remove residual electroplating solution and dirt. At the same time, it is also necessary to check the wear and damage of each component, replace damaged parts in a timely manner, and tighten loose connectors. The surface treatment device for the base of the laser pump source chip can efficiently and stably complete the electroplating treatment task of the base of the laser pump source chip.

[0040] It should be noted that in this article, relational terms such as first and second (No. 1, No. 2) are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0041] The foregoing has shown and described the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments. What is described in the above-mentioned embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A surface treatment device for processing a laser pump source chip base, comprising a bracket (1), a plating box (2), an infusion pipeline (4), a pipeline interface (5), an infusion pump (6) and a plating tank (8). The plating box (2) is located at the upper end of the bracket (1). A plating tank (8) for storing liquid is provided at the upper end of the plating box (2). The infusion pipeline (4) is connected to the plating box (2) through the pipeline interface (5), and the infusion pump (6) is connected to the infusion pipeline (4) to realize the input of liquid into the plating box (2). It is characterized in that: A wire hole (9) is provided on the side wall of the electroplating tank (2). A bottom plate (10) is connected inside the electroplating bath (8), and a plurality of anti-wave plates (11) are provided at the upper end of the bottom plate (10). A through groove (12) is provided on the end face of the anti-wave plate (11), and a wave groove (13) is provided at the upper end of the anti-wave plate (11). The anti-wave operation of the liquid in the electroplating bath (8) is realized through the anti-wave plate (11). A clamping cavity (15) is formed between the plurality of anti-wave plates (11), and an electrode plate (14) is installed in the clamping cavity (15). The electroplating treatment of the laser pump source chip base in the electroplating bath (8) is realized through the electrode plate (14) and its components.

2. The surface treatment device for processing the laser pump source chip base according to claim 1, wherein: The bracket (1) is fixed to the electroplating tank (2) by bolts. The upper end of the electroplating tank (2) is connected with a tank cover (3) through a hinge device. The tank cover (3) covers the electroplating bath (8), and a round hole adapted to the wire hole (9) is provided on the tank cover (3).

3. The surface treatment device for processing the laser pump source chip base according to claim 2, characterized in that: Two of the pipe connectors (5) are located on both sides of the bottom of the electroplating tank (2) and are communicated with the two water tanks of the electroplating tank (2). The pipe connector (5) is fixed to the infusion pipe (4) by a connecting flange, nuts and bolts. The infusion pump (6) is connected to the infusion pipe (4) by a connecting flange, bolts and nuts.

4. The surface treatment device for processing the laser pump source chip base according to claim 3, characterized in that: A partition plate is provided inside the electroplating tank (2). One end of the partition plate is the electroplating bath (8). A circulation pump (7) is provided at the lower end of the electroplating tank (2), and the circulation pump (7) is communicated with the water tank at the other end of the partition plate.

5. The surface treatment device for processing a laser pump source chip base according to claim 4, wherein: There is a gap between the bottom plate (10) and the inner bottom of the electroplating bath (8). Square bars are provided at the lower end of the bottom plate (10). The pipe connector (5) is located between the two square bars of the bottom plate (10) to facilitate the inflow of liquid.

6. The surface treatment device for processing a laser pump source chip base according to claim 5, wherein: The anti-wave plate (11) is integrally designed with the bottom plate (10), and the anti-wave plate (11) is perpendicular to the bottom plate (10). The plurality of anti-wave plates (11) are arranged at equal intervals.

7. The surface treatment device for processing the laser pump source chip base according to claim 6, wherein: The orifice of the through groove (12) is designed in an arc shape. The electrode plate (14) passes through a square hole provided on the end face of the anti-wave plate (11), and the electrode plate (14) is tightly fixed to the anti-wave plate (11) by an elastic strip.

Images