Packaging structure detection device and packaging structure

Abstract

The utility model provides a packaging structure detection device and a packaging structure, and relates to the technical field of semiconductor detection. The packaging structure detection device comprises a base and a cover plate. The base is provided with a placing groove, the placing groove is used for placing the packaging structure, the packaging structure comprises a first chip and a second chip, the first chip needs to be subjected to radiographic inspection, and the second chip does not need to be subjected to radiographic inspection. The cover plate is connected with the base and covers the placing groove; a transmission part and a blocking part are arranged on the cover plate, and the blocking part and the second chip are correspondingly arranged; the transmission part can allow rays to pass through, and the blocking part is used for preventing rays from passing through. The welding detection of the first chip can be realized, and the damage of rays to the second chip can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, and more specifically, to a packaging structure detection device and a packaging structure. Background Art

[0002] After research by the inventor, it is found that there are a large number of integrated chips in the 2.5D packaging structure, and X-rays are usually used for chip welding detection. The working principle of using X-rays for detection is that the X-ray tube makes electrons accelerate from the hot cathode to the anode through an electric field. The electrons will become a high-speed moving body under a high voltage of dozens or hundreds of KV, and when hitting the anode, the energy can be converted to release X-rays. For some special material chips such as HBM chips, it is easy to cause the silicon material of the chip to meet the X-rays, and then cause the photoelectric effect to generate charges, resulting in damage to the chip or transistor. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a packaging structure detection device and a packaging structure, which can not only realize the welding detection of the first chip, but also avoid the damage of rays to the second chip.

[0004] The embodiments of the utility model are implemented as follows:

[0005] In a first aspect, the utility model provides a packaging structure detection device, including a base and a cover plate;

[0006] A placement groove is provided on the base, and the placement groove is used for placing a packaging structure, wherein the packaging structure includes a first chip and a second chip, the first chip needs to be detected by rays, and the second chip does not need to be detected by rays;

[0007] The cover plate is connected to the base and covers the placement groove; a transmission part and a blocking part are provided on the cover plate, and the blocking part is correspondingly arranged with the second chip; the transmission part can allow rays to pass through, and the blocking part is used to prevent rays from passing through.

[0008] In an optional embodiment, the projection of the second chip on the base completely falls within the projection of the blocking part on the base.

[0009] In an optional embodiment, the transmission part is made of a non-metallic material, and the blocking part is made of a metallic material.

[0010] In an optional embodiment, the cover plate is made of a metallic material, and the transmission part includes an opening provided on the cover plate, and the opening is correspondingly arranged with the first chip.

[0011] In an alternative embodiment, the cover plate is made of a non-metallic material, and the blocking portion includes a stopper provided on the cover plate, and the stopper and the second chip are correspondingly arranged.

[0012] In an alternative embodiment, the stopper protrudes from the side of the cover plate close to the base.

[0013] In an alternative embodiment, the stopper is made of a metallic material.

[0014] In an alternative embodiment, the material of the stopper includes at least one of lead, gold, silver, and copper.

[0015] In an alternative embodiment, one of the base and the cover plate is provided with a mounting hole, and the other is provided with a mounting post, and the mounting post is disposed in the mounting hole to realize the connection between the base and the cover plate.

[0016] In a second aspect, the present invention provides a packaging structure, including a substrate and a first chip and a second chip disposed on the substrate; the packaging structure is subjected to chip detection by using the packaging structure detection device according to any one of the foregoing embodiments.

[0017] The beneficial effects of the embodiments of the present invention include:

[0018] The packaging structure detection device provided by the embodiments of the present invention has a connected base and a cover plate. The cover plate is provided with a transmission portion through which X-rays can pass and a blocking portion that can block X-rays from passing through. The blocking portion and the second chip are correspondingly arranged. When X-rays are used for detection, the rays penetrate the cover plate and enter the packaging structure in the placement groove, which can not only realize the welding detection of the first chip, but also avoid damage to the second chip by the rays.

[0019] The packaging structure provided by the embodiments of the present invention can be subjected to ray detection by using the above-mentioned packaging structure detection device, and the detection efficiency is high. It can not only realize the welding detection of the first chip, but also avoid damage to the second chip by the rays. Improve the reliability of the packaging structure and the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic diagram of the overall structure of the packaging structure detection device provided by the embodiments of the present invention;

[0022] Figure 2 Schematic diagram of the exploded structure of the encapsulation structure detection device provided by the embodiment of the present utility model;

[0023] Figure 3 Schematic diagram of the structure of the cover plate of the encapsulation structure detection device provided by the embodiment of the present utility model;

[0024] Figure 4 Schematic diagram of the encapsulation structure provided by the embodiment of the present utility model.

[0025] Reference numerals: 100 - encapsulation structure detection device; 110 - base; 111 - placement groove; 113 - mounting hole; 120 - cover plate; 121 - opening; 123 - stop block; 125 - mounting post; 200 - encapsulation structure; 210 - substrate; 220 - first chip; 230 - second chip; 240 - plastic package. Detailed implementation manners

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings below is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0028] It should be noted that: like reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0030] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0031] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] There are a large number of integrated chips in the existing 2.5D packaging structure. Usually, X-rays are used to detect the welding quality of the chips. The working principle of using X-rays for detection is that the X-ray tube causes electrons to accelerate from the hot cathode to the anode through an electric field. The electrons will become a high-speed moving body under a high voltage of dozens or hundreds of KV. When hitting the anode, energy can be converted and X-rays are released. For some special material chips such as HBM chips, it is easy to cause the silicon material of the chip to meet the X-ray, and then cause the photoelectric effect to generate charges, resulting in damage to the chip or transistor.

[0033] In order to overcome at least one defect in the prior art, this embodiment proposes a packaging structure detection device, which can realize the detection of the welding quality of the chips in the packaging structure. And it can avoid the problem that the silicon material of special chips meets the X-ray, and then causes the photoelectric effect to generate charges, resulting in damage to the chip or transistor.

[0034] Please refer to Figures 1 to 4, this embodiment provides a packaging structure detection device 100, which includes a base 110 and a cover plate 120. A placement groove 111 is provided on the base 110, and the placement groove 111 is used to place the packaging structure 200. Among them, the packaging structure 200 includes a first chip 220 and a second chip 230. The first chip 220 needs to be subjected to ray detection, and the second chip 230 does not need to be subjected to ray detection. The cover plate 120 is connected to the base 110 and covers the placement groove 111; a transmission part and a blocking part are provided on the cover plate 120, and the blocking part and the second chip 230 are correspondingly arranged. The transmission part can allow rays to pass through, and the blocking part is used to prevent rays from passing through. It can not only realize the welding detection of the first chip 220, but also avoid the damage of the rays to the second chip 230.

[0035] The projection of the second chip 230 on the base 110 completely falls within the projection of the blocking part on the base 110. Such a setting can better protect the second chip 230 from X-ray damage.

[0036] In this embodiment, the first chip 220 includes but is not limited to SOC chips and logic chips, etc. The second chip 230 includes but is not limited to radio frequency chips and HBM chips, etc.

[0037] Optionally, the transmission part is made of a non-metallic material and can allow X-rays to pass through. The blocking part is made of a metallic material and can prevent X-rays from passing through.

[0038] The base 110 can be made of a non-metallic material, such as ceramic or rubber, etc., and can allow X-rays to pass through, and no specific limitation is made here.

[0039] Optionally, if the cover plate 120 is made of a metallic material, the transmission part includes an opening 121 provided on the cover plate 120, and the opening 121 and the first chip 220 are correspondingly arranged. The metallic cover plate 120 can prevent X-rays from passing through. After an opening 121 is opened at the position corresponding to the first chip 220, the X-rays can penetrate the cover plate 120 from the opening 121 and enter the placement groove 111 of the base 110 to detect the welding quality of the first chip 220. At the same time, the metallic cover plate 120 can prevent X-rays from passing through, thereby realizing the protection of the second chip 230, avoiding the occurrence of the photoelectric effect when the silicon material of the second chip 230 meets the X-rays, and further avoiding the damage of the photoelectric effect to the second chip 230. If the second chip 230 is used for transistors, transistor failure can be avoided.

[0040] Optionally, if the cover plate 120 is made of a non-metallic material, the blocking portion includes a stopper 123 provided on the cover plate 120, and the stopper 123 and the second chip 230 are correspondingly arranged. Since the non-metallic material allows X-rays to pass through, it is possible to perform welding inspection on the first chip 220 without providing an opening 121 on the cover plate 120. Since the stopper 123 and the second chip 230 are correspondingly arranged, the stopper 123 can block the X-rays from meeting the silicon material of the second chip 230, avoiding damage to the second chip 230 caused by the photoelectric effect generated when the X-rays meet the silicon material of the second chip 230.

[0041] Optionally, the stopper 123 protrudes from the side of the cover plate 120 close to the base 110. Of course, in some embodiments, the stopper 123 and the cover plate 120 can be integrally formed. Alternatively, the cover plate 120 and the stopper 123 are detachably connected, including but not limited to snap connection, threaded connection, riveting, bonding, welding or bolt connection, etc., which are not specifically limited here.

[0042] Optionally, the cover plate 120 is provided with an assembly groove or an assembly hole. The stopper 123 is installed in the assembly groove or the assembly hole. The thickness of the stopper 123 is greater than the thickness of the cover plate 120, which is beneficial to further improving the blocking effect of the stopper 123 on X-rays and ensuring that the second chip 230 is not damaged by X-rays.

[0043] Optionally, the stopper 123 is made of a metal material. The material of the stopper 123 includes at least one of lead, gold, silver and copper.

[0044] It should be noted that the metal materials mentioned in this embodiment include but are not limited to at least one of lead, gold, silver and copper. The non-metallic materials mentioned include but are not limited to at least one of ceramics and rubbers.

[0045] Optionally, in one of the base 110 and the cover plate 120, one is provided with a mounting hole 113, and the other is provided with a mounting post 125, and the mounting post 125 is arranged in the mounting hole 113 to realize the connection between the base 110 and the cover plate 120.

[0046] In this embodiment, the base 110 is provided with a mounting hole 113, and the cover plate 120 is provided with a mounting post 125. The number of the mounting posts 125 is equal to the number of the mounting holes 113. The positions of the mounting posts 125 and the mounting holes 113 are arranged in one-to-one correspondence. The sizes and shapes of the mounting posts 125 and the mounting holes 113 are adapted to facilitate the insertion fit between the mounting posts 125 and the mounting holes 113.

[0047] Of course, in some embodiments, the mounting holes 113 can be provided on the cover plate 120, and the mounting posts 125 can be provided on the base 110 to achieve the plug-in fit between the base 110 and the cover plate 120. Alternatively, both the mounting posts 125 and the mounting holes 113 can be provided on the cover plate 120, and the mounting posts 125 and the mounting holes 113 are provided on the base 110. The mounting posts 125 on the base 110 and the mounting holes 113 on the cover plate 120 are correspondingly arranged. The mounting holes 113 on the base 110 and the mounting posts 125 on the cover plate 120 are correspondingly arranged, which can also achieve the plug-in fit between the base 110 and the cover plate 120. No specific limitation is made here.

[0048] An embodiment of the present invention further provides a packaging structure 200, which includes a substrate 210, a first chip 220 and a second chip 230 provided on the substrate 210. The packaging structure 200 uses the aforementioned packaging structure detection device 100 to perform chip detection.

[0049] It can be understood that a first pad is provided on the substrate 210, a second pad is provided on the first chip 220, and a third pad is provided on the second chip 230. The second pad is welded to the first pad, and the third pad is welded to the first pad. After the first chip 220 and the second chip 230 are electrically connected to the substrate 210, or after the plastic package 240 encapsulates the substrate 210, it is necessary to detect the welding position to check whether there are problems such as poor welding, such as virtual welding and voids.

[0050] The whole of the substrate 210, the first chip 220 and the second chip 230 is placed together in the placement groove 111 of the base 110. The first chip 220 includes an SOC chip, a logic chip, etc. The second chip 230 includes, but is not limited to, a radio frequency chip, an HBM chip, etc. The opening 121 on the cover plate 120 corresponds to the first chip 220, and the stopper 123 corresponds to the second chip 230. Using X-rays to detect the welding quality can effectively detect the first chip 220 and effectively protect the second chip 230.

[0051] It is easy to understand that the packaging structure detection device 100 can be applied to perform welding detection on ordinary packaging structures 200, 2.5D packaging structures 200, 3D packaging structures 200, etc.

[0052] In summary, the packaging structure detection device 100 and the packaging structure 200 provided by the embodiments of the present invention have the following beneficial effects, including:

[0053] The encapsulation structure detection device 100 provided by the embodiment of the present utility model has a base 110 and a cover plate 120 connected to each other. The cover plate 120 is provided with a transmission part through which X-rays can pass and a blocking part that can block the passage of X-rays. The blocking part and the second chip 230 are arranged corresponding to each other. When X-rays are used for detection, the rays penetrate the cover plate 120 and enter the encapsulation structure 200 in the placement groove 111, which can not only realize the welding detection of the first chip 220, but also avoid the damage of the rays to the second chip 230.

[0054] The encapsulation structure 200 provided by the embodiment of the present utility model can be subjected to ray detection by using the above-mentioned encapsulation structure detection device 100, and the detection efficiency is high. It can not only realize the welding detection of the first chip 220, but also avoid the damage of the rays to the second chip 230. The reliability of the encapsulation structure 200 and the product quality are improved.

[0055] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A packaging structure detection device, characterized in that: Including base and cover; The base is provided with a placement groove, and the placement groove is used to place the packaging structure, wherein the packaging structure includes a first chip and a second chip, the first chip needs to be subjected to radiation detection, and the second chip does not need to be subjected to radiation detection; The cover plate is connected to the base and covers the placement groove; a transmission part and a blocking part are provided on the cover plate, and the blocking part and the second chip are arranged correspondingly; the transmission part allows radiation to pass through, and the blocking part is used to prevent radiation from passing through.

2. The packaging structure detection device according to claim 1, characterized in that: The projection of the second chip on the base completely falls into the projection of the blocking portion on the base.

3. The packaging structure detection device according to claim 1, characterized in that: The transmission part is made of non-metallic material, and the blocking part is made of metallic material.

4. The packaging structure detection device according to claim 1, characterized in that: The cover plate is made of metal material, the transmission portion includes an opening arranged on the cover plate, and the opening is arranged corresponding to the first chip.

5. The packaging structure detection device according to claim 1, characterized in that: The cover plate is made of non-metallic material, and the blocking portion includes a blocking block arranged on the cover plate, and the blocking block and the second chip are arranged correspondingly.

6. The packaging structure detection device according to claim 5, characterized in that: The stopper is protrudingly arranged on one side of the cover plate close to the base.

7. The packaging structure detection device according to claim 5, characterized in that: The stopper is made of metal material.

8. The packaging structure detection device according to claim 5, characterized in that: The material of the stopper includes at least one of lead, gold, silver and copper.

9. The packaging structure detection device according to any one of claims 1 to 8, characterized in that: One of the base and the cover is provided with a mounting hole, and the other is provided with a mounting column, and the mounting column is arranged in the mounting hole to realize the connection between the base and the cover.

10. A packaging structure, characterized in that: It comprises a substrate and a first chip and a second chip arranged on the substrate; the packaging structure adopts the packaging structure detection device as described in any one of claims 1 to 9 to perform chip detection.

Images