Chip detection device convenient to position
By introducing pressure sensors and buffer components into the chip detection device, real-time monitoring and adjustment of the chip clamping force is achieved, and the problem of ineffective control of clamping force in the prior art is solved, and the production quality and detection efficiency of the chip are improved.
Patent Information
- Application Number
- CN202421854850.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-01
AI Technical Summary
In the existing chip detection device, the positioning structure manually adjusts the rotating handle to clamp the chip, which cannot effectively control the size of the clamping force, resulting in excessive chip clamping force, causing problems such as the middle raised or indentation on both sides, reducing the production quality of the chip.
A chip detection device including a workbench, a placementbench, a fixing mechanism and a pressing mechanism is designed. By providing a first pressure sensor and a cushioning member, the first sliding member and a cushioning member can realize real-time monitoring and adjustment of the chip clamping force to avoid excessive clamping force.
It effectively avoids the problems of rising up the middle of the chip or indentation on both sides caused by excessive clamping force, improves the production quality of the chip, and ensures the stable positioning and efficient detection of the chip.
Smart Images

Figure CN223022188U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip detection, and particularly relates to a chip detection device convenient for positioning. Background Technique
[0002] A chip, also known as a microcircuit, a microchip, and an integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small in size and is often part of a computer or other electronic device. A chip is a general term for semiconductor component products and is the carrier of an integrated circuit. After the chip is produced, in order to ensure the normal use of the chip, the chip is usually detected, and at this time, a chip detection device is used.
[0003] For example, in the Chinese patent document with the publication number CN214409209U and the patent name of a positioning device for chip detection, it is mentioned that "it includes a workbench, a support frame, and a horizontal support rod. A placement groove is opened inside the workbench, and the placement groove is rectangular. The upper end of the workbench is fixedly connected to an internal thread seat by welding. The internal thread seats are distributed around the workbench. A lead screw is connected inside the internal thread seat. The outside of the lead screw is connected to a rotating handle by welding. The inside of the lead screw is connected to a fixing plate by welding. The outside of the fixing plate is connected to a protective cotton by bonding". This structure adjusts the position of the fixing plate through the rotating handle to firmly fix the chip at the central position and avoid instability or shaking during detection. However, in the existing chip device, the positioning structure uses the method of manually adjusting the rotating handle to clamp the chip, which cannot effectively control the size of the clamping force. In order to firmly fix the chip, it is easy to cause the clamping force of the chip to be too large, resulting in the middle of the chip tilting upward or having indentations on both sides, increasing the defective rate of the chip and reducing the production quality of the chip. Content of the Utility Model
[0004] The purpose of the utility model is to provide a chip detection device convenient for positioning, aiming to solve the technical problem that in the existing chip device, the positioning structure uses the method of manually adjusting the rotating handle to clamp the chip, which cannot effectively control the size of the clamping force, and is easy to cause the clamping force of the chip to be too large, resulting in the middle of the chip tilting upward or having indentations on both sides.
[0005] To achieve the above object, an easily positionable chip detection device provided by an embodiment of the present utility model includes a workbench, a placement table, a fixing mechanism, and a pressing mechanism; a fixing plate is provided at the top of the workbench, and a detection mechanism is slidably connected to the fixing plate; the placement table is arranged in the center of the workbench for placing chips; the fixing mechanism includes a first fixing component and a second fixing component; the first fixing component is arranged outside the placement table, and a first pressure sensor is arranged inside the first fixing component; a first sliding component is arranged between the first fixing component and the placement table, and the first sliding component is electrically connected to the first pressure sensor; the first fixing component is slidably connected to the first sliding component; the second fixing component is fixedly arranged inside the placement table; the first fixing component and the second fixing component are used to fix both sides of the chip; two groups of the pressing mechanisms are respectively arranged at the tops of the first fixing component and the second fixing component for pressing the chip onto the placement table; a top rod extending outward is arranged on one side of the placement table close to the second fixing component; a buffer component for buffering the clamping force corresponding to the top rod is arranged inside the second fixing component; the top rod abuts against the buffer component.
[0006] Optionally, the first fixing component includes a first fixing seat; the first fixing seat is arranged on the workbench and is located on one side of the placement table; the first fixing seat is provided with a first vertical plate protruding upward; the pressing mechanism is located at the top of the first vertical plate, and the first pressure sensor is located inside the first vertical plate.
[0007] Optionally, a sliding cavity with an outward opening is arranged on one side of the first fixing seat; the buffer component is arranged in the sliding cavity; the top rod can enter or disengage from the sliding cavity.
[0008] Optionally, the buffer component includes a telescopic rod and a first spring; one end of the telescopic rod is fixedly connected to the inside of the sliding cavity, and the other end is connected with a limiting part; the first spring is sleeved on the telescopic rod and is located between the limiting part and the sliding cavity.
[0009] Optionally, the first vertical plate and the first fixing seat form an "L"-shaped block; first protective layers are arranged on both the first fixing seat and the first vertical plate.
[0010] Optionally, the first sliding component includes a first sliding driving member and a first transmission shaft; the first sliding driving member is arranged at one side of the bottom end of the workbench; the first transmission shaft is arranged inside the workbench and is connected to the output end of the first sliding driving member; the first transmission shaft is connected to the first fixing seat through a first slider.
[0011] Optionally, the second fixing member includes a second fixing base; the second fixing base is disposed on the workbench and is located inside the placement table; the second fixing base is provided with a second vertical plate protruding upward, and second protective layers are provided on both the second fixing base and the second vertical plate; the pressing mechanism is located at the top end of the second vertical plate.
[0012] Optionally, the pressing mechanism includes a pressing driving member, a pressing plate and two sets of pressing rods; the pressing driving members are both disposed at the central top ends of the first fixing member and the second fixing member; the pressing plates are both disposed inside the first fixing member and the second fixing member and are connected to the output ends of the pressing driving members; the two sets of pressing rods are symmetrically distributed at both ends of the pressing plate; a second spring is provided between the pressing rod and the pressing plate.
[0013] Optionally, a second sliding member is provided between the detection mechanism and the fixing plate; the second sliding member includes a second sliding driving member and a second transmission shaft; the second sliding driving member is disposed on one side of the top end of the workbench; the second transmission shaft is disposed inside the workbench and is connected to the output end of the second sliding driving member; the second transmission shaft is connected to the detection mechanism through a first slider.
[0014] Optionally, a second pressure sensor is provided at the center of the placement table; a third protective layer is provided on the surface of the placement table.
[0015] One or more of the above technical solutions in the chip detection device facilitating positioning provided by the embodiments of the present invention at least have the following technical effects: By providing the first pressure sensor and the buffer member, when the chip is positioned and clamped, under the action of the first sliding member, the first fixing member moves towards the placement table, clamps the chip between the first fixing member and the second fixing member, and monitors the clamping force on the first fixing member through the first pressure sensor. If the clamping force is too large, the first pressure sensor sends a feedback signal, then the first sliding member stops moving, avoiding the middle of the chip from tilting upward or having indentations on both sides due to excessive clamping force. At the same time, when clamping, the ejector rod first abuts against the buffer member to buffer the impact force when the first fixing member clamps, reducing the impact force on the side of the chip and avoiding the middle of the chip from tilting due to excessive impact force, improving the production quality of the chip. Description of the Drawings
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0017] Figure 1It is a schematic structural diagram of a chip detection device facilitating positioning provided by an embodiment of the present utility model.
[0018] Figure 2 For Figure 1 an enlarged schematic diagram of A in the figure.
[0019] Figure 3 It is a schematic structural diagram of a pressing mechanism provided by an embodiment of the present utility model.
[0020] Among them, each reference numeral in the figure:
[0021] 10, workbench; 101, fixed plate; 102, detection mechanism; 11, placing table; 111, second pressure sensor; 112, third protective layer; 113, ejector rod; 20, first fixing member; 201, first pressure sensor; 21, first fixing seat; 22, first vertical plate; 23, first protective layer; 31, second fixing seat; 32, second vertical plate; 23, second protective layer; 40, buffer member; 41, telescopic rod; 42, first spring; 43, limiting portion; 50, first sliding member; 51, first sliding driving member; 52, first transmission shaft; 60, pressing mechanism; 61, pressing driving member; 62, pressing plate; 63, pressing rod; 64, second spring; 70, second sliding member; 71, second sliding driving member; 72, second transmission shaft. Detailed implementation manners
[0022] The embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the embodiments of the present utility model and should not be construed as limiting the present utility model.
[0023] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
[0024] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, the meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0025] In the embodiments of the present utility model, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.
[0026] In one embodiment of the present utility model, as Figures 1 to 3 shown, there is provided a chip detection device facilitating positioning, including a workbench 10, a placement table 11, a fixing mechanism, and a pressing mechanism 60. A fixing plate 101 is provided at the top of the workbench 10, and a detection mechanism 102, which is a detector, is slidably connected to the fixing plate 101. The placement table 11 is disposed in the center of the workbench 10 for placing the chip. The fixing mechanism includes a first fixing member 20 and a second fixing member. The first fixing member 20 is disposed outside the placement table 11, and a first pressure sensor 201 is provided inside the first fixing member 20. A first sliding member 50 is provided between the first fixing member 20 and the placement table 11, and the first sliding member 50 is electrically connected to the first pressure sensor 201. The first fixing member 20 is slidably connected to the first sliding member 50. The second fixing member is fixedly disposed inside the placement table 11. The first fixing member 20 and the second fixing member are used to fix both sides of the chip. Two groups of pressing mechanisms 60 are respectively disposed at the tops of the first fixing member 20 and the second fixing member for pressing the chip onto the placement table 11. A top rod 113 extending outward is provided on one side of the placement table 11 close to the second fixing member. A buffer member 40 for buffering the clamping force is provided inside the second fixing member. The top rod 113 abuts against the buffer member 40.
[0027] By setting the first pressure sensor 201 and the buffer component 40, when the chip is positioned and clamped, the first fixed component 20 moves toward the placement table 11 under the action of the first sliding component 50, clamps the chip between the first fixed component 20 and the second fixed component, and monitors the clamping force on the first fixed component 20 through the first pressure sensor 201. If the clamping force is too large, the first pressure sensor 201 sends a feedback signal, and the first sliding component 50 stops moving to avoid the middle of the chip from tilting upward or indentations on both sides due to excessive clamping force. At the same time, when clamping, the push rod 113 first contacts the buffer component 40 to buffer the impact force when the first fixed component 20 is clamped, reduce the impact force on the side of the chip, avoid the chip tilting in the middle due to excessive impact force, and improve the production quality of the chip.
[0028] Furthermore, the first fixing component 20 includes a first fixing seat 21. The first fixing seat 21 is arranged on the workbench 10 and is located on one side of the placement platform 11. The first fixing seat 21 is provided with a first vertical plate 22 protruding upward. The clamping mechanism 60 is located at the top of the first vertical plate 22, and the first pressure sensor 201 is located in the first vertical plate 22. When the chip is clamped, the first fixing component 20 is moved toward the placement platform 11 under the action of the first sliding component 50, and moves until the first vertical plate 22 is completely in contact with the side wall of the chip, then the chip is clamped between the first fixing component 20 and the second fixing component, and the clamping force on the first vertical plate 22 is monitored by the first pressure sensor 201. If the clamping force is too large, the first pressure sensor 201 sends a feedback signal, and the first sliding component 50 stops moving to avoid the middle of the chip from warping up or indentations on both sides due to excessive clamping force.
[0029] Furthermore, a sliding cavity opening outward is provided on one side of the first fixing seat 21. The buffer component 40 is provided in the sliding cavity. The ejector rod 113 can enter or leave the sliding cavity. When clamping, the ejector rod 113 enters the sliding cavity and contacts the buffer component 40, so as to buffer the impact force when the first fixing component 20 is clamped, reduce the impact force on the side of the chip, avoid the chip from warping in the middle due to excessive impact force, and improve the production quality of the chip.
[0030] Furthermore, the buffer component 40 includes a telescopic rod 41 and a first spring 42. One end of the telescopic rod 41 is fixedly connected to the sliding cavity, and the other end is connected to the limiting portion 43. The first spring 42 is sleeved on the telescopic rod 41 and is located between the limiting portion 43 and the sliding cavity. When clamping, the ejector rod 113 enters the sliding cavity and conflicts with the limiting portion 43 of the buffer component 40. Under the action of the first spring 42, the impact force of the first fixed component 20 when clamping is buffered, reducing the impact force on the side of the chip, preventing the chip from warping in the middle due to excessive impact force, and improving the production quality of the chip.
[0031] Furthermore, the first vertical plate 22 and the first fixing base 21 form an "L"-shaped block. First protective layers 23 are provided on both the first fixing base 21 and the first vertical plate 22. By providing the first protective layers 23, the surface of the chip is protected to avoid damage to the chip surface during positioning and clamping, thereby improving the production quality of the chip.
[0032] Furthermore, the first sliding member 50 includes a first sliding driving member 51 and a first transmission shaft 52. The first sliding driving member 51 is a motor, and the first sliding driving member 51 is provided on one side of the bottom end of the workbench 10. The first transmission shaft 52 is provided in the workbench 10 and is connected to the output end of the first sliding driving member 51. The first transmission shaft 52 is connected to the first fixing base 21 through a first slider. During clamping, the first sliding driving member 51 is started, the first sliding driving member 51 drives the first transmission shaft 52 to rotate, the first transmission shaft 52 drives the first fixing member 20 to approach the placement table 11, and after the chip is clamped according to the clamping force monitoring feedback of the first pressure sensor 201, the first driving member stops operating, thereby realizing automatic clamping of the chip and improving the clamping efficiency of the chip.
[0033] Further, the second fixing member includes a second fixing base 31. The second fixing base 31 is provided on the workbench 10 and is located inside the placement table 11. The second fixing base 31 is provided with an upwardly protruding second vertical plate 32. Second protective layers 23 are provided on both the second fixing base 31 and the second vertical plate 32. The pressing mechanism 60 is located at the top end of the second vertical plate 32. During clamping, one end of the chip is placed on the second fixing base 31 and abuts against the side wall of the second vertical plate 32. Under the action of the first sliding member 50, the first vertical plate 22 of the first fixing member 20 and the second vertical plate 32 press both ends of the chip, thereby realizing positioning and clamping of both sides of the chip.
[0034] Further, the pressing mechanism 60 includes a pressing driving member 61, a pressing plate 62, and two groups of pressing rods 63. The pressure driving member is a motor, and the pressing driving member 61 is provided at the center of the top ends of the first fixing member 20 and the second fixing member. The pressing plates 62 are provided inside the first fixing member 20 and the second fixing member and are connected to the output ends of the pressing driving member 61. The two groups of pressing rods 63 are symmetrically distributed at both ends of the pressing plate 62. A second spring 64 is provided between the pressing rod 63 and the pressing plate 62. After the chip is clamped by the first fixing member 20 and the second fixing member, the pressing driving member 61 is started, the pressing driving member 61 drives the pressing plate 62 to move downward, the pressing plate 62 drives the pressing rods 63 at both ends thereof to move downward, and the top surface of the chip is pressed. At the same time, the impact force generated during pressing by the second spring 64 is also reduced, the damage to the chip during pressing is reduced, and the production quality of the chip is improved.
[0035] Further, a second sliding member 70 is provided between the detection mechanism 102 and the fixing plate 101. The second sliding member 70 includes a second sliding driving member 71 and a second transmission shaft 72. The second sliding driving member 71 is disposed on one side of the top end of the workbench 10. The second transmission shaft 72 is disposed in the workbench 10 and is connected to the output end of the second sliding driving member 71. The second transmission shaft 72 is connected to the detection mechanism 102 through a second slider. Before detection, the second sliding driving member 71 is started. The second sliding driving member 71 drives the second transmission shaft to rotate. The second transmission shaft 72 drives the detection mechanism 102 to move left or right to adjust the position of the detection mechanism 102 to adapt to the detection scenarios of different types of chips and improve the versatility of the detection device.
[0036] Further, a second pressure sensor 111 is provided at the center of the placement table 11. A third protective layer 112 is provided on the surface of the placement table 11. By providing the second pressure sensor 111, it is convenient for the staff to timely know whether a chip is placed on the placement table 11 without going to the detection device to observe. At the same time, through the third protective layer 112, the chip is protected to avoid damage to the surface of the chip during detection.
[0037] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A chip detection device that is easy to locate, characterized in that: include: A workbench, wherein a fixed plate is provided on the top of the workbench, and a detection mechanism is slidably connected to the fixed plate; A placement table, which is located in the center of the workbench and is used for placing chips; A fixing mechanism, the fixing mechanism comprising a first fixing component and a second fixing component; the first fixing component is arranged outside the placement table, and a first pressure sensor is arranged inside the first fixing component; a first sliding component is arranged between the first fixing component and the placement table, and the first sliding component is electrically connected to the first pressure sensor; the first fixing component is slidably connected to the first sliding component; the second fixing component is fixedly arranged inside the placement table; the first fixing component and the second fixing component are used to fix both sides of the chip; A clamping mechanism, wherein two sets of the clamping mechanisms are respectively arranged at the top of the first fixing component and the top of the second fixing component, and are used to press the chip onto the placement table; Wherein, a push rod extending outward is provided on one side of the placement platform close to the second fixing component; a buffer component for buffering clamping force is provided inside the second fixing component; and the push rod is in conflict with the buffer component.
2. The chip detection device for facilitating positioning according to claim 1, characterized in that: The first fixing component includes a first fixing seat; the first fixing seat is arranged on the workbench and is located on one side of the placement table; the first fixing seat is provided with a first vertical plate protruding upward; the clamping mechanism is located at the top of the first vertical plate, and the first pressure sensor is located inside the first vertical plate.
3. The chip detection device for facilitating positioning according to claim 2, characterized in that: A sliding cavity opening outward is provided on one side of the first fixing seat; the buffer component is arranged in the sliding cavity; and the ejector rod can enter or leave the sliding cavity.
4. The chip detection device for facilitating positioning according to claim 3, characterized in that: The buffer component includes a telescopic rod and a first spring; one end of the telescopic rod is fixedly connected to the sliding cavity, and the other end is connected to a limiting portion; the first spring is sleeved on the telescopic rod and located between the limiting portion and the sliding cavity.
5. The chip detection device for facilitating positioning according to claim 4, characterized in that: The first vertical plate and the first fixing seat form an "L"-shaped block; the first fixing seat and the first vertical plate are both provided with a first protective layer.
6. The chip detection device for facilitating positioning according to claim 2, characterized in that: The first sliding component includes a first sliding drive and a first transmission shaft; the first sliding drive is arranged at one side of the bottom end of the workbench; the first transmission shaft is arranged in the workbench and connected to the output end of the first sliding drive; the first transmission shaft is connected to the first fixed seat through a first sliding block.
7. The chip detection device for facilitating positioning according to claim 1, characterized in that: The second fixing component includes a second fixing seat; the second fixing seat is arranged on the workbench and is located on the inner side of the placement table; the second fixing seat is provided with a second vertical plate protruding upward, and the second fixing seat and the second vertical plate are both provided with a second protective layer; the clamping mechanism is located at the top of the second vertical plate.
8. The chip detection device for facilitating positioning according to claim 1, characterized in that: The clamping mechanism includes a clamping drive, a pressure plate and two groups of pressure rods; the clamping drive is arranged at the center of the top of the first fixed component and the second fixed component; the pressure plates are arranged in the first fixed component and the second fixed component, and are connected to the output end of the clamping drive; the two groups of pressure rods are symmetrically distributed at both ends of the pressure plate; a second spring is arranged between the pressure rod and the pressure plate.
9. The chip detection device for facilitating positioning according to claim 1, characterized in that: A second sliding component is provided between the detection mechanism and the fixed plate; the second sliding component includes a second sliding drive member and a second transmission shaft; the second sliding drive member is provided on one side of the top end of the workbench; the second transmission shaft is provided in the workbench and connected to the output end of the second sliding drive member; the second transmission shaft is connected to the detection mechanism through a first slider.
10. The chip detection device for facilitating positioning according to claim 1, characterized in that: A second pressure sensor is arranged in the center of the placing platform; and a third protective layer is arranged on the surface of the placing platform.
Citation Information
Patent Citations
Positioning device for chip detection
CN214409209U