Replacement mechanism for wafer placement plate of photoetching machine and photoetching machine

Abstract

The utility model discloses a photoetching machine wafer placing plate replacing mechanism and a photoetching machine, which belong to the technical field of photoetching machines, the photoetching machine wafer placing plate replacing mechanism comprises a hollow carrying table and a placing plate, the top surface of the carrying table is provided with a placing groove for placing the placing plate, and the middle part of the bottom surface of the placing groove is provided with a through hole in a penetrating manner; a bottom plate is arranged in the portion, below the through hole, of the carrying table in an up-down sliding mode, and the middle of the top face of the bottom plate is fixedly connected with a top block sliding in the through hole in an up-down mode. According to the photoetching machine wafer placement plate replacement mechanism and the photoetching machine, the bottom plate drives the connecting rods to move downwards, so that the upper ends of the four positioning rods on the two sides synchronously rotate towards the placement plate, the placement plate is positioned by the positioning rods, the bottom plate is matched with the springs to drive the connecting rods to move upwards, the placement plate is unlocked by the positioning rods, and then the wafer placement plate is replaced. The containing plate is jacked up through the jacking block on the bottom plate, and replacement is convenient. Compared with an existing device, the situation that an additional auxiliary positioning mechanism is needed for positioning is avoided, and the construction cost and the maintenance cost are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of lithography machines, and particularly relates to a wafer placement plate replacement mechanism for a lithography machine and a lithography machine applying the replacement mechanism. Background Technique

[0002] A lithography machine includes a machine table and a receiving groove provided on the machine table. The receiving groove is used to receive a wafer placement plate. In the past, the outer shape of the receiving groove was consistent with the shape of the wafer placement plate, and the wafer was placed on the wafer placement plate for processing.

[0003] Among them, the wafer placement plate needs to be frequently replaced during use. However, since the shape of the receiving groove is consistent with the shape of the wafer placement plate, it is very difficult to take out the wafer placement plate after it is placed in the receiving groove.

[0004] For some existing wafer placement plates of lithography machines, in order to facilitate replacement, the placement plate is no longer tightly embedded and fixed in the receiving groove. Instead, an additional positioning mechanism is used for auxiliary positioning. The construction cost and subsequent maintenance cost are relatively high. As shown in the authorized disclosure number CN214252874U, a wafer placement plate replacement mechanism for a lithography machine includes a machine table, a push plate and a driving mechanism; a receiving groove for receiving a wafer placement plate is provided on the machine table, and a through hole is provided in the middle of the bottom surface of the receiving groove. The above patent fixes the placement plate in the receiving groove by negative pressure. Since an external negative pressure device needs to be provided to pump vacuum to create negative pressure, the construction cost and maintenance cost of the equipment are relatively high.

[0005] Therefore, we propose a wafer placement plate replacement mechanism for a lithography machine and a lithography machine to solve the above problems. Summary of the Utility Model

[0006] The purpose of the utility model is to solve the problems of relatively high construction cost and subsequent maintenance cost in the prior art, and to propose a wafer placement plate replacement mechanism for a lithography machine and a lithography machine.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0008] On the one hand, an embodiment of the present utility model provides a wafer placement plate replacement mechanism for a lithography machine, including a hollow carrier and a placement plate. A placement groove for placing the placement plate is opened on the top surface of the carrier. A through hole is vertically penetrated through the middle of the bottom surface of the placement groove. A bottom plate is slidably arranged up and down inside the carrier below the through hole. A top block that slides up and down in the through hole is fixedly connected to the middle of the top surface of the bottom plate. A plurality of positioning columns are arranged on the top of the top block. Positioning holes for cooperating with the positioning columns are provided on the bottom surface of the placement plate;

[0009] Both ends on both sides of the placement groove are provided with arc-shaped installation grooves. A C-shaped positioning rod is hinged at the lower end of the installation groove. The upper end of the positioning rod extends to the upper end of the installation groove and faces the placement plate, and the lower end of the positioning rod extends into the interior of the platform and is fixedly connected to a spring. The other end of the spring is fixedly connected to the inner top wall of the platform. A connecting rod is fixedly connected between the lower ends of the two positioning rods on the same side. When the bottom plate moves downward, it drives the two connecting rods to move downward synchronously.

[0010] Preferably, an anti-slip block is fixedly provided at the end of the positioning rod facing the placement plate.

[0011] Preferably, a buffer block for buffering the positioning rod is fixedly provided above the installation groove.

[0012] Preferably, the curvature of the positioning rod above the hinge point is greater than that below, and the length of the positioning rod above the hinge point is less than that below.

[0013] Preferably, an auxiliary rod is fixedly connected between the lower ends of the two positioning rods on the same side and above the connecting rod.

[0014] Preferably, a plurality of sliding rods are fixedly connected to the inner top wall of the platform, and a plurality of sliding holes for the sliding rods to pass through are penetrated through the bottom plate.

[0015] Preferably, a limit block is fixedly connected to the bottom end of the sliding rod.

[0016] On the other hand, an embodiment of the present invention further provides a lithography machine, which may include the lithography machine wafer placement plate replacement mechanism described in any one of the above.

[0017] In summary, the technical effects and advantages of the present invention: The lithography machine wafer placement plate replacement mechanism and the lithography machine drive the connecting rod to move downward through the bottom plate, and then realize the synchronous rotation of the upper ends of the four positioning rods on both sides towards the placement plate, so as to realize the positioning of the placement plate by the positioning rod. After the bottom plate cooperates with the spring to drive the connecting rod to move upward and unlock the placement plate by the positioning rod, the top block on the bottom plate jacks up the placement plate, which is convenient for replacement. Compared with the existing device, it avoids the need for an additional auxiliary positioning mechanism for positioning, and reduces the construction cost and maintenance cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the present invention;

[0019] Figure 2 is a schematic cross-sectional structural diagram of the present invention;

[0020] Figure 3 is a schematic side view of the cross-section at the positioning column of the present invention;

[0021] Figure 4 is a schematic side view of the cross-section at the installation groove of the present invention;

[0022] Figure 5 For Figure 4 The enlarged view of part A in the figure.

[0023] In the figure: 1, stage; 2, placement plate; 3, placement groove; 4, through hole; 5, bottom plate; 6, top block; 7, positioning post; 8, positioning hole; 9, installation groove; 10, positioning rod; 11, spring; 12, connecting rod; 13, anti-slip block; 14, buffer block; 15, auxiliary rod; 16, slide bar; 17, slide hole; 18, limit block. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Referring to Figures 1-3 , a replacement mechanism for a wafer placement plate of a lithography machine, a hollow stage 1 and a placement plate 2, a placement groove 3 for placing the placement plate 2 is provided on the top surface of the stage 1, a through hole 4 is vertically penetrated through the middle of the bottom surface of the placement groove 3, a bottom plate 5 is slidably arranged up and down inside the stage 1 below the through hole 4, a top block 6 that slides up and down in the through hole 4 is fixedly connected to the middle of the top surface of the bottom plate 5, a plurality of positioning posts 7 are provided on the top of the top block 6, and positioning holes 8 for cooperating with the positioning posts 7 are provided on the bottom surface of the placement plate 2.

[0026] Referring to Figure 2 , Figure 4 , Figure 5 , arc-shaped installation grooves 9 are provided at both ends on both sides of the placement groove 3, a C-shaped positioning rod 10 is hinged at the lower end of the installation groove 9, the upper end of the positioning rod 10 extends to the upper end of the installation groove 9 and faces the placement plate 2, the lower end of the positioning rod 10 extends into the stage 1 and is fixedly connected to a spring 11, the other end of the spring 11 is fixedly connected to the inner top wall of the stage 1, a connecting rod 12 is fixedly connected between the lower ends of the two positioning rods 10 on the same side, and when the bottom plate 5 moves downward, the two connecting rods 12 are driven to move downward synchronously.

[0027] It should be noted that a driving component for driving the bottom plate 5 to move up and down should be provided on the inner bottom wall of the stage 1. The driving component is a prior art and can be a cylinder, an oil cylinder, etc., and will not be elaborated here.

[0028] When the wafer placement plate replacement mechanism of the lithography machine is in use, first align the positioning holes 8 on the placement plate 2 with the positioning posts 7, and place the placement plate 2 on the top block 6. At this time, drive the bottom plate 5 to move downward through the drive assembly until the bottom surface of the placement plate 2 contacts the bottom wall of the placement groove 3. The bottom plate 5 continues to move downward and drives the two connecting rods 12 to press down simultaneously. At this time, the connecting rod 12 drives the positioning rod 10 to rotate, and the upper ends of the four positioning rods 10 move toward the side wall of the placement plate 2 and fit and fix. That is, the positioning of the placement plate 2 is realized.

[0029] When the placement plate 2 needs to be replaced, only need to move the bottom plate 5 upward. At this time, the spring 11 drives the positioning rod 10 to rotate, and the upper end of the positioning rod 10 separates from the side wall of the placement plate 2. The positioning of the placement plate 2 is released, and the bottom plate 5 continues to move upward and jacks up the placement plate 2. Facilitate subsequent replacement.

[0030] An anti-slip block 13 is fixedly provided at one end of the positioning rod 10 facing the placement plate 2. The anti-slip block 13 is used to prevent the placement plate 2 from moving horizontally and improve the positioning stability. In addition, the soft anti-slip block 13 can also provide buffering for the positioning rod 10 during use, avoiding the direct contact between the positioning rod 10 and the placement plate 2, and improving the operation stability and service life of the device.

[0031] In order to prevent the spring 11 from causing the positioning rod 10 to rotate too fast, resulting in a collision between the positioning rod 10 and the installation groove 9, a buffer block 14 for buffering the positioning rod 10 is fixedly provided on the upper side of the installation groove 9.

[0032] The C-shaped positioning rod 10 exerts an obliquely downward force on the side wall of the placement plate 2 during positioning, thereby improving the positioning stability of the placement plate 2. The curvature of the positioning rod 10 above the hinge point is greater than that below, and the length of the positioning rod 10 above the hinge point is less than that below. Since the shape of the positioning rod 10 is C-shaped and the stroke requirement of the upper end of the positioning rod 10 is small, the positioning rod 10 can form a labor-saving lever, so as to realize more precise control of the upper end of the positioning rod 10.

[0033] In order to improve the connection strength of the positioning rods 10 on the same side, an auxiliary rod 15 located above the connecting rod 12 is fixedly connected between the lower ends of the two positioning rods 10 on the same side. Thereby improving the stability and service life of the device.

[0034] A plurality of sliding rods 16 are fixedly connected to the inner top wall of the stage 1, and a plurality of sliding holes 17 for the sliding rods 16 to pass through are formed through the bottom plate 5. By sliding the sliding rods 16 in the sliding holes 17, the horizontal angle of the bottom plate 5 is limited, ensuring the synchronous force application of the bottom plate 5 to the two connecting rods 12 on both sides

[0035] A limit block 18 is fixedly connected to the bottom end of the sliding rod 16, so as to limit the vertical movement stroke of the bottom plate 5 and prevent the bottom plate 5 from moving too much and causing damage to the positioning rod 10.

[0036] The above are only a specific and preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, making equivalent substitutions or changes should be covered within the protection scope of the present utility model.

Claims

1. A wafer placement plate replacement mechanism for a photolithography machine, comprising a hollow carrier (1) and a placement plate (2), characterized in that: The top surface of the carrier (1) is provided with a placement groove (3) for placing the placement plate (2), the middle part of the bottom surface of the placement groove (3) is penetrated by a through hole (4), a bottom plate (5) is provided inside the carrier (1) below the through hole (4) for sliding up and down, the middle part of the top surface of the bottom plate (5) is fixedly connected with a top block (6) for sliding up and down in the through hole (4), a plurality of positioning columns (7) are provided on the top of the top block (6), and a positioning hole (8) for matching the positioning column (7) is provided on the bottom surface of the placement plate (2); Both ends of the placement groove (3) are provided with arc-shaped installation grooves (9), and the lower end of the installation groove (9) is hinged with a C-shaped positioning rod (10). The upper end of the positioning rod (10) extends to the upper end of the installation groove (9) and faces the placement plate (2), and the lower end of the positioning rod (10) extends to the inside of the carrier (1) and is fixedly connected with a spring (11). The other end of the spring (11) is fixedly connected to the inner top wall of the carrier (1). A connecting rod (12) is fixedly connected between the lower ends of the two positioning rods (10) on the same side. When the bottom plate (5) moves downward, the two connecting rods (12) are driven to move downward synchronously.

2. A lithography machine wafer placement plate replacement mechanism according to claim 1, characterized in that: An anti-sliding block (13) is fixedly provided on one end of the positioning rod (10) facing the placement plate (2).

3. A lithography machine wafer placement plate replacement mechanism according to claim 2, characterized in that: A buffer block (14) for buffering the positioning rod (10) is fixedly provided on the upper side of the installation groove (9).

4. A lithography machine wafer placement plate replacement mechanism according to claim 3, characterized in that: The curvature of the positioning rod (10) above the hinge point is greater than the curvature below the hinge point, and the length of the positioning rod (10) above the hinge point is less than the length below the hinge point.

5. A lithography machine wafer placement plate replacement mechanism according to claim 4, characterized in that: An auxiliary rod (15) located above the connecting rod (12) is fixedly connected between the lower ends of the two positioning rods (10) on the same side.

6. A lithography machine wafer placement plate replacement mechanism according to claim 1, characterized in that: A plurality of sliding rods (16) are fixedly connected to the inner top wall of the carrier (1), and a plurality of sliding holes (17) for the sliding rods (16) to pass through are formed through the bottom plate (5).

7. A photolithography machine wafer placement plate replacement mechanism according to claim 6, characterized in that: The bottom end of the sliding rod (16) is fixedly connected to a limiting block (18).

8. A photolithography machine, characterized in that: It comprises the photolithography machine wafer placement plate replacement mechanism described in any one of claims 1 to 7.

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