Pore plate temperature control module based on heat pipe heat transfer

Abstract

The utility model provides a pore plate temperature control module based on heat pipe heat transfer, which comprises a pore plate seat, a temperature equalizing heat pipe, a semiconductor chilling plate, a lower heat conducting plate, radiating fins and a heat conducting heat pipe, the temperature equalizing heat pipe is horizontally embedded in a mounting groove on the bottom surface of the pore plate seat, and the evaporation end of the heat conducting heat pipe is embedded in a groove body on the bottom surface of the lower heat conducting plate. And the condensation end is connected with the heat dissipation fins. By means of the efficient heat conduction capacity of the heat pipe, the heat conduction efficiency between local high-temperature and low-temperature areas of the pore plate seat is improved through the temperature equalizing heat pipe, and the temperature uniformity of the whole pore plate seat is improved; the heat of the lower heat conduction plate can be quickly transferred to the heat dissipation fins through the heat conduction heat pipe to be dissipated, the heat dissipation efficiency is improved, the structure is compact, and the miniaturization development requirement of biological detection instruments is met.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to an orifice plate temperature control module based on heat pipe heat transfer. Background Technique

[0002] In biological experiments, sample solutions and reagents are usually placed in a multi-well plate for reaction. To ensure the accuracy of experimental results, it is generally necessary for each well position to reach a uniform, stable and consistent temperature. At present, the well plate holder is usually a metal block. Although the metal block has good heat conduction performance, due to the heat generated by the heating device, there are still local high and low temperature phenomena. Therefore, it is necessary to further propose a more reliable solution to the temperature uniformity problem. In addition, for the heat dissipation of the heating device, air cooling is generally used, and some use water cooling to improve the heat dissipation efficiency. However, the circulating cooling water mechanism occupies a large space and cannot well meet the miniaturization development needs of biological detection instruments. Content of the Utility Model

[0003] In order to overcome the deficiencies of the above-mentioned prior art, the purpose of the utility model is to provide an orifice plate temperature control module based on heat pipe heat transfer.

[0004] To achieve the above purpose, the technical solution adopted by the utility model to solve its technical problems is: an orifice plate temperature control module based on heat pipe heat transfer, including:

[0005] A well plate holder, on the surface of which there are a plurality of hole grooves adapted to the multi-well plate;

[0006] A heat pipe for temperature equalization, which is horizontally embedded in the installation groove at the bottom surface of the well plate holder;

[0007] A semiconductor refrigeration sheet, which is attached to the bottom surface of the well plate holder;

[0008] A lower heat conduction plate, which is arranged in contact with the lower surface of the semiconductor refrigeration sheet;

[0009] Heat dissipation fins, which are installed below the lower heat conduction plate;

[0010] A heat conduction heat pipe, the evaporation end of which is embedded in the groove at the bottom surface of the lower heat conduction plate, and the condensation end of the heat conduction heat pipe is connected to the heat dissipation fins.

[0011] Adopting the technical solution of the utility model, by virtue of the high-efficiency heat conduction ability of the heat pipe, the heat conduction efficiency between the local high and low temperature regions of the well plate holder is improved through the heat pipe for temperature equalization, and the temperature uniformity of the entire well plate holder is improved; through the heat conduction heat pipe, the heat of the lower heat conduction plate can be quickly transferred to the heat dissipation fins for dissipation, the heat dissipation efficiency is improved, and the structure is compact, meeting the miniaturization development needs of biological detection instruments.

[0012] Furthermore, the gap between the heat pipe for temperature equalization and the installation groove of the well plate holder is filled with heat-conducting glue.

[0013] Adopt the above preferred solution to improve the heat conduction efficiency between the heat pipe and the orifice plate seat.

[0014] Furthermore, the heat pipe is arranged at the position between adjacent orifice grooves of the orifice plate seat.

[0015] Furthermore, the upper and lower surfaces of the heat pipe are flat.

[0016] Furthermore, the upper surface of the heat pipe and the inner bottom surface of the installation groove of the orifice plate seat are integrally connected by brazing.

[0017] Adopt the above preferred solution to ensure full contact between the heat pipe and the orifice plate seat and improve the heat transfer efficiency.

[0018] Furthermore, a cooling fan is laterally installed on the cooling fin.

[0019] Adopt the above preferred solution to accelerate heat dissipation. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0022] Figure 2 It is a schematic diagram of the back of the orifice plate seat of the present invention.

[0023] Figure 3 It is a sectional view of the orifice plate seat of the present invention.

[0024] The names of the corresponding components represented by the numbers and letters in the figure:

[0025] 10 - Orifice plate seat; 11 - Orifice groove; 12 - Heat pipe; 20 - Semiconductor refrigeration chip; 30 - Lower heat conduction plate; 40 - Cooling fin; 50 - Heat conduction heat pipe; 60 - Cooling fan. Detailed Embodiment

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0027] As Figures 1 - 3 shown, a orifice plate temperature control module based on heat pipe heat transfer includes:

[0028] An orifice plate seat 10, on the surface of which there are provided a plurality of orifice grooves 11 adapted to the porous plate;

[0029] A heat pipe for temperature equalization 12, which is horizontally embedded in the installation groove at the bottom surface of the orifice plate seat 10;

[0030] A semiconductor refrigeration sheet 20, which is attached to the bottom surface of the orifice plate seat 10;

[0031] A lower heat conducting plate 30, which is arranged in contact with the lower surface of the semiconductor refrigeration sheet 20;

[0032] Heat dissipation fins 40, which are installed below the lower heat conducting plate 30;

[0033] A heat conducting heat pipe 50, the evaporation end of which is embedded in the groove body at the bottom surface of the lower heat conducting plate 30, and the condensation end of the heat conducting heat pipe 50 is connected to the heat dissipation fins 40.

[0034] The beneficial effects of adopting the above technical solutions are as follows: By virtue of the high-efficiency heat conduction ability of the heat pipe, the heat conduction efficiency between the local high and low temperature regions of the orifice plate seat is improved through the heat pipe for temperature equalization, and the temperature uniformity of the entire orifice plate seat is improved; Through the heat conducting heat pipe, the heat of the lower heat conducting plate can be quickly transferred to the heat dissipation fins to be dissipated, the heat dissipation efficiency is improved, and the structure is compact, meeting the miniaturization development requirements of biological detection instruments.

[0035] In the present invention, both the heat pipe for temperature equalization 12 and the heat conducting heat pipe 50 are based on heat pipe technology, and the heat pipe structure itself belongs to the prior art. A heat pipe is a heat transfer element, which consists of a tube shell, a wick, and end caps, and the inside is evacuated to a negative pressure state and filled with an appropriate low-boiling liquid. This liquid evaporates rapidly when heated at one end of the heat pipe, the vapor flows to the other end under a small pressure difference, releases heat and then condenses back into a liquid, and the liquid then flows back to the evaporation section along the porous material by the action of capillary force, so on and so forth, realizing the rapid transfer of heat.

[0036] As Figure 3 shown, in some other embodiments of the present invention, a heat conducting adhesive is filled in the gap between the heat pipe for temperature equalization 12 and the installation groove of the orifice plate seat 10. The beneficial effects of adopting the above technical solutions are as follows: The heat conduction efficiency between the heat pipe for temperature equalization and the orifice plate seat is improved.

[0037] As Figure 3 shown, in some other embodiments of the present utility model, the isothermal heat pipe 12 is disposed at the position between adjacent hole slots 11 of the orifice plate seat. The upper and lower surfaces of the isothermal heat pipe 12 are flat. The upper surface of the isothermal heat pipe 12 and the inner bottom surface of the installation groove of the orifice plate seat are integrally connected by brazing. The beneficial effect of adopting the above technical solution is: to ensure full contact between the isothermal heat pipe and the orifice plate seat and improve the heat transfer efficiency.

[0038] As Figure 1 shown, in some other embodiments of the present utility model, a cooling fan 60 is laterally installed on the cooling fins 40. The beneficial effect of adopting the above technical solution is: to accelerate heat dissipation.

[0039] The above embodiments are only for illustrating the technical concept and features of the present utility model, and the purpose is to enable those of ordinary skill in the art to understand the content of the present utility model and implement it. However, the protection scope of the present utility model cannot be limited thereby. Any equivalent changes or modifications made according to the spirit and essence of the present utility model should be covered within the protection scope of the present utility model.

Claims

1. A orifice plate temperature control module based on heat pipe heat transfer, characterized in that: include: A perforated plate seat, the surface of which is provided with a plurality of holes and grooves adapted to the perforated plate; A temperature-averaging heat pipe, which is horizontally embedded in a mounting groove on the bottom surface of the orifice plate seat; A semiconductor cooling sheet is attached to the bottom surface of the orifice plate seat; A lower heat conducting plate, which is disposed in contact with the lower surface of the semiconductor refrigeration sheet; A heat dissipation fin installed below the lower heat conducting plate; The evaporation end of the heat-conducting heat pipe is embedded in the groove body on the bottom surface of the lower heat-conducting plate, and the condensation end of the heat-conducting heat pipe is connected to the heat dissipation fins.

2. The orifice plate temperature control module based on heat pipe heat transfer according to claim 1, characterized in that: The gap between the temperature-averaging heat pipe and the mounting groove of the orifice plate seat is filled with thermally conductive glue.

3. The orifice plate temperature control module based on heat pipe heat transfer according to claim 1, characterized in that: The temperature-averaging heat pipe is arranged between adjacent hole slots of the orifice plate seat.

4. The orifice plate temperature control module based on heat pipe heat transfer according to claim 1, characterized in that: The upper and lower surfaces of the temperature-averaging heat pipe are flat.

5. The orifice plate temperature control module based on heat pipe heat transfer according to claim 4, characterized in that: The upper surface of the temperature-averaging heat pipe and the inner bottom surface of the mounting groove of the orifice plate seat are connected as a whole through brazing.

6. The orifice plate temperature control module based on heat pipe heat transfer according to claim 1, characterized in that: A cooling fan is installed laterally of the cooling fins.

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