Heat dissipation device and computer

Abstract

The utility model relates to a heat dissipation device and a computer. The heat dissipation device comprises a temperature control module with a temperature sensor; a containing cavity is formed in the heat dissipation base shell; performing heat dissipation aluminum extrusion; the heat dissipation aluminum extrusion is fixedly installed on the heat dissipation base shell and abuts against at least part of the temperature control module so that the temperature control module can be clamped in the containing cavity. The fan bracket is arranged on the heat dissipation aluminum extrusion; a double-pin fan; the double-pin fan is assembled on the fan bracket, and the double-pin fan can guide hot air flow to the heat dissipation aluminum extrusion; the temperature sensor is used for measuring the temperature parameter of the hot air flow guided to the heat dissipation aluminum extrusion; the double-pin fan is communicated with the temperature control module so that the temperature control module can adjust the rotating speed of the double-pin fan according to the temperature parameters. The heat dissipation aluminum extrusion is added, and the double-pin fan is arranged on the heat dissipation aluminum extrusion, so that hot airflow generated by the board card is guided to the heat dissipation aluminum extrusion, and the heat dissipation device can solve the heat dissipation problem caused by high power consumption in a limited board card space.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and a computer. Background Art

[0002] At present, the temperature-controlled fans used for board card heat dissipation in the market can be divided into two types according to the number of pins (pins or leads), namely 4-pin and 2-pin; generally speaking, a temperature-controlled fan consists of a motor and a fan blade (or called a vane).

[0003] A 4-pin temperature-controlled fan is a common electronic device, mainly used for heat dissipation and temperature reduction; the 4-pin temperature-controlled fan can be connected to the power interface or motherboard interface of a computer to realize the control of the motor speed; among them, the four pins of the 4-pin fan represent different functions, including input, ground, pulse width modulation (or called speed control) and speed sensor.

[0004] The 2-pin temperature-controlled fan has only two pins, namely input and ground; therefore, a single 2-pin temperature-controlled fan does not have the function of speed regulation. Once the power is turned on, the 2-pin fan will rotate at a constant speed.

[0005] For board card heat dissipation, using a 4-pin temperature-controlled fan not only has too high a cost, but also does not require all the functions of the 4-pin temperature-controlled fan, which will lead to over-function and thus waste of resources; while using a 2-pin temperature-controlled fan, the problem of constant speed cannot be solved.

[0006] In the process of dissipating heat from the board card, the traditional heat dissipation device still has some defects:

[0007] (1) It cannot achieve controllable speed of the temperature-controlled fan while ensuring a relatively low cost.

[0008] (2) It cannot solve the heat dissipation problem caused by high power consumption within the limited space of the board card. Summary of the Utility Model

[0009] The heat dissipation device and computer provided by the utility model aim to solve at least some of the defects of the existing heat dissipation devices applicable to computer boards.

[0010] In a first aspect, an embodiment of the utility model provides a heat dissipation device. The heat dissipation device includes:

[0011] A temperature control module with a temperature sensor;

[0012] A heat dissipation base shell; a receiving cavity is formed inside the heat dissipation base shell;

[0013] Heat dissipation aluminum extrusion; the heat dissipation aluminum extrusion is fixedly installed on the heat dissipation base shell and abuts against at least a part of the temperature control module, so that the temperature control module is clamped in the accommodation cavity;

[0014] Fan bracket; the fan bracket is installed on the heat dissipation aluminum extrusion;

[0015] Dual-pin fan; the dual-pin fan is assembled on the fan bracket, and the dual-pin fan can guide the hot air flow to the heat dissipation aluminum extrusion;

[0016] Wherein, the temperature sensor is used to measure the temperature parameter of the hot air flow guided to the heat dissipation aluminum extrusion; the dual-pin fan is connected to the temperature control module, so that the temperature control module can adjust the rotation speed of the dual-pin fan according to the temperature parameter.

[0017] In some embodiments, the heat dissipation device further includes:

[0018] External thermal conductive gasket; the external thermal conductive gasket is pasted on the surface of the heat dissipation base shell and is located outside the accommodation cavity.

[0019] In some embodiments, the temperature module includes:

[0020] PCB board, thermal conductive component and several functional components;

[0021] The temperature sensor is arranged on the surface of the PCB board and is close to the heat dissipation aluminum extrusion;

[0022] Several of the functional components are respectively arranged on two surfaces of the PCB board that are opposite to each other in the thickness direction;

[0023] At least a part of the thermal conductive component is pasted on several of the functional components, and another part is arranged on the temperature sensor.

[0024] In some embodiments, the thermal conductive component includes:

[0025] Thermal conductive layer and several internal thermal conductive gaskets;

[0026] The thermal conductive layer is coated on the surface of the temperature sensor and can be used to fill the gap between the heat dissipation aluminum extrusion and the temperature sensor;

[0027] Several internal thermal conductive gaskets are pasted on several of the functional components and can be used to fill the gap between a part of several of the functional components and the heat dissipation aluminum extrusion, and to fill the gap between another part of several of the functional components and the heat dissipation base shell.

[0028] In some embodiments, the heat dissipation base shell includes:

[0029] A bottom plate and a pair of side plates; the pair of side plates protrude from the bottom plate and are respectively arranged on two opposite sides of the bottom plate;

[0030] A plurality of mounting portions are provided on each of the side plates, and the plurality of mounting portions protrude from an end of the side plate away from the bottom plate;

[0031] Wherein, the heat dissipation aluminum extrusion has fastening portions adapted to the mounting portions, and the heat dissipation aluminum extrusion can be fixed on the pair of side plates through the mutual cooperation between the fastening portions and the mounting portions.

[0032] In some embodiments, the heat dissipation aluminum extrusion includes:

[0033] A heat dissipation substrate and a plurality of heat dissipation fins; the heat dissipation substrate has opposite first and second surfaces;

[0034] The heat dissipation fins protrude from the first surface, and the second surface can be in contact with at least a part of the heat conduction layer and the plurality of internal heat conduction gaskets;

[0035] A groove extending from the first surface towards the second surface is formed on the heat dissipation substrate, and the fan bracket is installed in the groove.

[0036] In some embodiments, the fan bracket includes:

[0037] A bracket body, a motor sleeve and a plurality of mounting ears; the mounting ears are arranged on the circumferential edge of the bracket body, and the motor sleeve extends from the surface of the bracket body towards the outside of the groove;

[0038] Wherein, the groove includes: a fastening groove and a support groove; the fastening groove has a size and shape adapted to the mounting ears, and the support groove has a size and shape adapted to the bracket body;

[0039] The bracket body is received in the support groove, and the mounting ears are fixed in the fastening groove.

[0040] In some embodiments, the double-pin fan includes:

[0041] A fan body having a motor and a plurality of fan blades;

[0042] The motor can be inserted into the motor sleeve so that the fan body is fixed on the bracket body; the motor is used to drive the fan blades to rotate at a preset target speed;

[0043] A cable; one end of the cable is connected to the motor, and the other end has a VCC pin and a GND pin;

[0044] Wherein, the VCC pin is used for inputting data and can serve as the positive pole of the motor; the GND pin is used for grounding and can serve as the negative pole of the motor.

[0045] In some embodiments, the heat dissipation device further includes:

[0046] A connection terminal; the connection terminal is arranged on the PCB board;

[0047] Both the VCC pin and the GND pin are connected to the connection terminal, so that the temperature control module is communicated with the motor;

[0048] Wherein, the temperature parameter is processed by several function modules to form a corresponding output voltage; the output voltage can be transmitted to the motor through the connection terminal and the cable to drive the fan blade to rotate at the target speed.

[0049] In a second aspect, an embodiment of the present invention provides a computer. The computer includes:

[0050] A computer main body and a board; the board is arranged on the computer main body;

[0051] The above heat dissipation device is assembled on the computer main body, and the fan blade main body of the double-pin fan of the heat dissipation device corresponds to the board, so that the hot air flow generated by the board is guided to the heat dissipation aluminum extrusion of the heat dissipation device.

[0052] At least one beneficial effect of the heat dissipation device and the computer provided by the embodiment of the present invention is: a novel heat dissipation device applicable to a computer board is proposed. By using a double-pin fan to replace the traditional four-pin fan and adding a temperature control module with a temperature sensor, the heat dissipation device can achieve controllable rotation speed of the double-pin fan while ensuring low cost. By adding the structure of the heat dissipation aluminum extrusion and arranging the double-pin fan on the heat dissipation aluminum extrusion, the hot air flow generated by the board is guided to the heat dissipation aluminum extrusion by the double-pin fan, so that the heat dissipation device can solve the heat dissipation problem brought by high power consumption within the limited board space. Description of the Drawings

[0053] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the figures do not constitute a proportional limitation.

[0054] Figure 1Structural schematic diagram of the heat dissipation device provided by the embodiment of the present utility model;

[0055] Figure 2 Exploded schematic diagram of the heat dissipation device provided by the embodiment of the present utility model;

[0056] Figure 3 Connection schematic diagram of the connection terminal and the cable with two pins provided by the embodiment of the present utility model;

[0057] Figure 4 Connection schematic diagram of the multi-pin terminal and the multi-pin cable with four pins provided by the embodiment of the present utility model;

[0058] Figure 5 Exploded schematic diagram of the fan main body and the fan bracket provided by the embodiment of the present utility model.

[0059] Reference numerals:

[0060] 100, heat dissipation device; 1, temperature control module; 11, temperature sensor; 12, PCB board; 13, heat conduction component; 14, functional component; 131, heat conduction layer; 132, internal heat conduction gasket; 2, heat dissipation base shell; 21, bottom plate; 22, side plate; 221, installation part; 3, heat dissipation aluminum extrusion; 31, heat dissipation substrate; 32, heat dissipation fins; 301, fastening part; 311, groove; 3111, fastening groove; 3112, support groove; 4, fan bracket; 41, bracket main body; 42, motor sleeve; 43, installation ear; 5, two-pin fan; 51, fan main body; 52, cable; 511, motor; 512, fan blade; 6, external heat conduction gasket; 7, connection terminal;

[0061] 200, multi-pin cable; 300, multi-pin terminal. Detailed implementation manners

[0062] For the convenience of understanding the present utility model, the present utility model will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "upper", "lower", "inner", "outer", "bottom", etc. used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0063] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0064] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0065] Figure 1 It is a schematic structural diagram of the heat dissipation device provided by the embodiment of the present utility model. Figure 2 It is an exploded schematic diagram of the heat dissipation device provided by the embodiment of the present utility model. Figure 3 It is a connection schematic diagram of the connection terminal and the cable with two pins provided by the embodiment of the present utility model. Figure 4 It is a connection schematic diagram of the multi-pin terminal and the multi-pin cable with four pins provided by the embodiment of the present utility model.

[0066] Please refer to Figure 1 and Figure 2 , the heat dissipation device 100 includes: a temperature control module 1 having a temperature sensor 11, a heat dissipation base case 2, a heat dissipation aluminum extrusion 3, a fan bracket 4, and a two-pin fan 5.

[0067] As shown in Figure 2 and Figure 3As shown, the above-mentioned dual-pin fan 5 only has a VCC (positive or power input; VCC represents the positive pole of the power supply, which can be used to provide power) pin and a GND (ground or negative pole; GND represents the negative pole or ground wire of the power supply, which can be used for grounding and forms a loop in cooperation with VCC). Compared with a 4-pin fan, the dual-pin fan 5 has a lower cost. However, the dual-pin fan 5 adopted in this heat dissipation device 100 does not have a fan speed regulation function under normal circumstances, that is, once powered on, the dual-pin fan 5 will rotate at a constant speed.

[0068] Combined with Figure 2 and Figure 4 It can be seen that one end of the multi-pin cable 200 of the 4-pin fan has four pins, and these four pins can be connected to the multi-pin terminal 300. Among them, the four pins of the above-mentioned multi-pin cable 200 are respectively: VCC pin, GND pin, PWM pin (pulse width modulation; PWM represents pulse width modulation technology, which can control the speed of the motor by changing the duty cycle of the signal to achieve the regulation of the fan speed), and TACH pin (rotation speed sensor; TACH can be used to read the rotation speed information of the fan to monitor the real-time rotation speed of the fan).

[0069] In addition, the duty cycle refers to the proportion of the time when the pulse signal is at a high level (or effective level) within a cycle time (that is, duty cycle = (pulse width / cycle time) × 100%); generally speaking, the duty cycle determines the average power or amplitude of the output signal (that is, the higher the duty cycle, the relatively longer the high-level time of the pulse, and the relatively larger the average power or amplitude of the output signal; conversely, the lower the duty cycle, the relatively smaller the average power or amplitude of the output signal). In summary, by changing the duty cycle of the PWM signal, the average voltage and current of the motor can be controlled, thereby regulating the rotation speed and output power of the motor.

[0070] It can be understood that a receiving cavity is formed inside the heat dissipation base shell 2; the heat dissipation aluminum extrusion 3 is fixedly installed on the heat dissipation base shell 2 and abuts against at least part of the temperature control module, so that the temperature control module is clamped inside the receiving cavity.

[0071] It should be noted that the fan bracket 4 is installed on the heat dissipation aluminum extrusion 3; the dual-pin fan 5 is assembled on the fan bracket 4, and the dual-pin fan 5 can guide the hot air flow to the heat dissipation aluminum extrusion 3.

[0072] Specifically, the temperature sensor 11 is used to measure the temperature parameter of the hot air flow guided to the heat dissipation aluminum extrusion 3 (it can monitor the temperature of the entire heat dissipation device 100 in real time); the dual-pin fan 5 is connected to the temperature control module 1, so that the temperature control module 1 can adjust the rotation speed of the dual-pin fan 5 according to the above-mentioned temperature parameter.

[0073] Among them, the above temperature sensor 11 can be a thermistor, a thermocouple, an infrared sensor, etc., which can form temperature parameters by measuring the ambient temperature and feedback the real-time temperature parameters to the temperature control module 1.

[0074] Further described, a thermistor is a sensor resistor whose resistance value changes with temperature; moreover, thermistors can be classified into positive temperature coefficient thermistors (Positive Temperature Coefficient, abbreviated as PTC) and negative temperature coefficient thermistors (Negative Temperature Coefficient, abbreviated as NTC) according to different temperature coefficients; specifically, the resistance value of a positive temperature coefficient thermistor will increase with the increase of temperature, while the resistance value of a negative temperature coefficient thermistor will decrease with the increase of temperature.

[0075] In addition, after receiving the temperature parameters fed back by the temperature sensor, the above temperature control module will make a temperature judgment (this temperature judgment can be briefly described as: the user first preset a target temperature range, and this target temperature range has a maximum set value and a minimum set value; when the temperature sensor 11 monitors that the ambient temperature exceeds the maximum set value, the two-pin fan 5 will start to work to adjust the ambient temperature to within the target temperature range).

[0076] In addition, in order to adjust the rotation speed of the two-pin fan 5, it is necessary to burn a preset control program on the temperature control module 1 first (this control program can be described as: the user first presets a target equation of temperature parameter and fan rotation speed (that is, forms a target control curve); then, substitute the real-time temperature parameters monitored by the temperature sensor 11 into the above target equation, so as to output a corresponding rotation speed, so that the temperature control module adjusts the rotation speed of the two-pin fan 5 according to the preset control program; usually, the higher the ambient temperature, the faster the rotation speed of the two-pin fan 5 should be to increase the heat dissipation effect of the two-pin fan 5; and in the case of a lower ambient temperature, the rotation speed of the two-pin fan 5 will be correspondingly reduced to reduce energy consumption and noise).

[0077] In the embodiment of the present application, the data relationship among the ambient temperature, the NPU temperature (NPU is Neural Processing Unit, a neural network processor, which can be integrated into various computer boards and can be connected to processors such as CPU and GPU; the NPU temperature can also be understood as the above temperature parameter) and the fan rotation speed can be:

[0078] When the ambient temperature is 25° and the temperature parameter is 50°, the fan rotation speed is 8102 r / min;

[0079] When the ambient temperature is 30° and the temperature parameter is 55°, the fan speed is 8246 r / min;

[0080] When the ambient temperature is 35° and the temperature parameter is 60°, the fan speed is 8186 r / min;

[0081] When the ambient temperature is 35° and the temperature parameter is 65°, the fan speed is 8792 r / min;

[0082] When the ambient temperature is 35° and the temperature parameter is 70°, the fan speed is 10889 r / min;

[0083] When the ambient temperature is 35° and the temperature parameter is 72°, the fan speed is 12410 r / min;

[0084] In summary, when the ambient temperature is constant, the larger the temperature parameter, the greater the fan speed required.

[0085] Specifically, the temperature control module 1 can not only adjust the speed of the dual-pin fan 5, but also adjust the working mode according to the change of the temperature parameter (for example, when the temperature is high, the dual-pin fan 5 can choose to rotate automatically or be set to a specific operation mode to provide a greater air volume and heat dissipation effect, while reducing energy consumption and noise).

[0086] In the embodiment of the present application, the heat dissipation device 100 adopts a heat dissipation method combining the dual-pin fan 5 and the heat dissipation aluminum extrusion 3. First, the hot air flow generated by the board is blown by the dual-pin fan 5 towards the heat dissipation aluminum extrusion 3, and then the heat dissipation aluminum extrusion 3 conducts away the heat of the hot air flow, so that the heat dissipation device 100 can solve the heat dissipation problem caused by high power consumption within the limited board space.

[0087] In some embodiments, referring to Figures 1-2 it can be seen that the heat dissipation device 100 further includes: an external thermal conductive gasket 6.

[0088] Further explanation, the external thermal conductive gasket 6 is attached to the surface of the heat dissipation base shell 2 and is located outside the accommodation cavity, and can be used to transfer the heat on the heat dissipation base shell to outside the accommodation cavity to prevent the heat generated during the operation of the temperature control module 1 from damaging itself.

[0089] In some embodiments, please refer to Figure 2 , the temperature control module 1 includes: a PCB board 12, a heat conduction component 13, and several functional components 14.

[0090] In the embodiment of the present application, the temperature sensor 11 is arranged on the surface of the PCB board 12 and is close to the heat dissipation aluminum extrusion 3.

[0091] Among them, several functional components 14 are respectively arranged on two surfaces of the PCB board 12 that are opposite to each other in the thickness direction.

[0092] In addition, at least a part of the heat-conducting component 13 is attached to several functional components 14, and the other part is arranged on the temperature sensor 11.

[0093] In some embodiments, please continue to refer to Figure 2 , the heat-conducting component 13 includes: a heat-conducting layer 131 and several internal heat-conducting gaskets 132.

[0094] It can be understood that the heat-conducting layer 131 is coated on the surface of the temperature sensor and can be used to fill the gap between the heat-dissipating aluminum extrusion 3 and the temperature sensor; among them, the heat-conducting layer can be heat-conducting paste.

[0095] It should be noted that several internal heat-conducting gaskets 132 are attached to several functional components 14, and can be used to fill the gap between a part of several functional components 14 and the heat-dissipating aluminum extrusion 3, and to fill the gap between another part of several functional components 14 and the heat-dissipating base shell 2, so that the heat generated on the temperature control module can be conducted to the heat-dissipating base shell 2 and the heat-dissipating aluminum extrusion 3, further avoiding the heat generated during the operation of the temperature control module 1 from damaging itself.

[0096] In some embodiments, as Figure 2 shown, the heat-dissipating base shell 2 includes: a bottom plate 21 and a pair of side plates 22.

[0097] Among them, a pair of side plates 22 protrude from the bottom plate 21 and are respectively arranged on two opposite sides of the bottom plate 21.

[0098] In addition, several mounting parts 221 are arranged on each side plate 22, and several mounting parts 221 all protrude from one end of the side plate 22 far from the bottom plate 21.

[0099] In addition, the heat-dissipating aluminum extrusion 3 has a fastening part 301 adapted to the mounting part 221, and the heat-dissipating aluminum extrusion 3 can be fixed on a pair of side plates 22 through the mutual cooperation between the fastening part 301 and the mounting part 221.

[0100] In some embodiments, please continue to refer to Figure 2 , the heat-dissipating aluminum extrusion 3 includes: a heat-dissipating base plate 31 and several heat-dissipating fins 32.

[0101] Specifically, the heat-dissipating base plate 31 has a relative first surface and a second surface.

[0102] Specifically, the heat-dissipating fins 32 protrude from the first surface, and the second surface can be in contact with at least a part of the heat-conducting layer 131 and several internal heat-conducting gaskets 132.

[0103] In an embodiment of the present application, a groove 311 extending from the first surface towards the second surface is formed on the heat dissipation substrate 31, and the fan bracket 4 is installed in the groove 311.

[0104] Figure 5 It is an exploded schematic view of the fan body and the fan bracket provided by an embodiment of the present utility model.

[0105] In some embodiments, according to Figure 2 and Figure 5 it can be known that the fan bracket 4 includes: a bracket main body 41, a motor sleeve 42, and a plurality of mounting ears 43.

[0106] Further, the mounting ears 43 are arranged on the circumferential edge of the bracket main body 41, and the motor sleeve 42 extends from the surface of the bracket main body 41 towards the outside of the groove 311.

[0107] It should be noted that the groove 311 includes: a fastening groove 3111 and a support groove 3112; the fastening groove 3111 has a size and shape adapted to the mounting ears 43, and the support groove 3112 has a size and shape adapted to the bracket main body 41.

[0108] It can be understood that the bracket main body 41 is received in the support groove 3112, and the mounting ears 43 are fixed in the fastening groove 3111.

[0109] In some embodiments, from Figure 2 , Figure 3 and Figure 5 it can be known that the dual-pin fan 5 includes: a fan body 51 having a motor 511 and a plurality of fan blades 512, and a cable 52.

[0110] Among them, the motor 511 can be inserted into the motor sleeve 42 so that the fan body 51 is fixed on the bracket main body 41; the motor 511 is used to drive the fan blades 512 to rotate at a preset target speed.

[0111] In addition, one end of the cable 52 is connected to the motor 511, and the other end has a VCC pin and a GND pin.

[0112] Furthermore, the VCC pin is used to input data and can be used as the positive electrode of the motor 511; the GND pin is used for grounding and can be used as the negative electrode of the motor 511.

[0113] In some embodiments, as Figures 1-3 shown, the heat dissipation device 100 further includes: a connection terminal 7.

[0114] Specifically, the connection terminal 7 is arranged on the PCB board 12.

[0115] Specifically, both the VCC pin and the GND pin are connected to the connection terminal 7, so that the temperature control module is connected to the motor 511.

[0116] Furthermore, the temperature parameter is processed by several functional modules to form a corresponding output voltage; the output voltage can be transmitted to the motor 511 through the connection terminal 7 and the cable 52 to drive the fan blade 512 to rotate at a target speed.

[0117] Please refer to Figures 1-5 , the computer (not shown in the figure) includes: a computer main body (not shown in the figure) and a board (not shown in the figure).

[0118] It can be understood that the board is provided on the computer main body.

[0119] It should be noted that the above-mentioned heat dissipation device 100 is assembled on the computer main body, and the fan blade 512 body of the dual-pin fan 5 of the heat dissipation device 100 corresponds to the board, so that the hot air flow generated by the board is guided to the heat dissipation aluminum extrusion 3 of the heat dissipation device 100.

[0120] In summary, the heat dissipation device and the computer provided by the embodiments of the present invention use a dual-pin fan to replace the traditional four-pin fan and add a temperature control module with a temperature sensor, so that the heat dissipation device can achieve controllable rotation speed of the dual-pin fan on the premise of ensuring low cost. By adding the structure of the heat dissipation aluminum extrusion and arranging the dual-pin fan on the heat dissipation aluminum extrusion, the hot air flow generated by the board is guided to the heat dissipation aluminum extrusion by the dual-pin fan, so that the heat dissipation device can solve the heat dissipation problem brought by high power consumption within the limited board space. Therefore, the heat dissipation device applicable to the computer board provided by the embodiments of the present invention has a certain novelty compared with the traditional heat dissipation device applicable to the computer board.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A temperature control module having a temperature sensor; A heat dissipation base shell; a containing cavity is formed inside the heat dissipation base shell; Heat dissipation aluminum extrusion; the heat dissipation aluminum extrusion is fixedly mounted on the heat dissipation base shell and abuts against at least a part of the temperature control module so that the temperature control module is clamped in the accommodating cavity; Fan bracket; the fan bracket is installed on the heat dissipation aluminum extrusion; A double-pin fan; the double-pin fan is mounted on the fan bracket, and the double-pin fan can guide the hot air flow to the heat dissipation aluminum extrusion; Wherein, the temperature sensor is used to measure the temperature parameters of the hot air flow guided to the heat dissipating aluminum extrusion; the two-pin fan is connected to the temperature control module so that the temperature control module can adjust the speed of the two-pin fan according to the temperature parameters.

2. The heat dissipation device according to claim 1, characterized in that: Also includes: External thermal pad; The external thermal conductive pad is attached to the surface of the heat dissipation base shell and is located outside the accommodating cavity.

3. The heat dissipation device according to claim 1, characterized in that: The temperature module comprises: PCB board, heat-conducting components and several functional components; The temperature sensor is arranged on the surface of the PCB board and is close to the heat dissipation aluminum extrusion; The plurality of functional components are respectively arranged on two surfaces of the PCB board which are away from each other in the thickness direction; At least a part of the heat-conducting component is attached to a plurality of the functional components, and another part is arranged on the temperature sensor.

4. The heat dissipation device according to claim 3, characterized in that: The heat conducting component comprises: A thermally conductive layer and several internal thermally conductive pads; The heat conductive layer is coated on the surface of the temperature sensor and can be used to fill the gap between the heat dissipating aluminum extrusion and the temperature sensor; A plurality of internal thermally conductive pads are attached to a plurality of the functional components, and can be used to fill the gap between a portion of the functional components and the heat dissipation aluminum extrusion, and to fill the gap between another portion of the functional components and the heat dissipation base shell.

5. The heat dissipation device according to claim 1, characterized in that: The heat dissipation base shell comprises: A bottom plate and a pair of side plates; the pair of side plates protrude from the bottom plate and are respectively arranged on two sides of the bottom plate away from each other; Each of the side panels is provided with a plurality of mounting portions, and the plurality of mounting portions protrude from an end of the side panel away from the bottom panel; Wherein, the heat dissipating aluminum extrusion has a fastening portion adapted to the mounting portion, and the heat dissipating aluminum extrusion can be fixed on a pair of the side plates through the mutual cooperation between the fastening portion and the mounting portion.

6. The heat dissipation device according to claim 4, characterized in that: The heat dissipation aluminum extrusion comprises: A heat dissipation substrate and a plurality of heat dissipation fins; the heat dissipation substrate has a first surface and a second surface opposite to each other; The heat dissipation fins protrude from the first surface, and the second surface can abut against at least a portion of the heat conductive layer and a plurality of the internal heat conductive pads; The heat dissipation substrate is provided with a groove extending from the first surface toward the second surface, and the fan bracket is installed in the groove.

7. The heat dissipation device according to claim 6, characterized in that: The fan bracket comprises: A bracket body, a motor sleeve and a plurality of mounting ears; the mounting ears are arranged on the circumferential edge of the bracket body, and the motor sleeve extends from the surface of the bracket body toward the outside of the groove; Wherein, the groove includes: a fastening groove and a supporting groove; the fastening groove has a size and shape that matches the mounting ear, and the supporting groove has a size and shape that matches the bracket body; The bracket body is accommodated in the supporting groove, and the mounting ear is fixed in the fastening groove.

8. The heat dissipation device according to claim 7, characterized in that: The two-pin fan comprises: A fan body having a motor and a plurality of fan blades; The motor can be inserted into the motor sleeve so that the fan body is fixed on the bracket body; the motor is used to drive the fan blades to rotate at a preset target speed; A cable; one end of the cable is connected to the motor, and the other end of the cable has a VCC pin and a GND pin; The VCC pin is used for data input and can be used as the positive pole of the motor; the GND pin is used for grounding and can be used as the negative pole of the motor.

9. The heat dissipation device according to claim 8, characterized in that: Also includes: Connecting terminal; the connecting terminal is arranged on the PCB board; The VCC pin and the GND pin are both connected to the connection terminal so that the temperature control module is connected to the motor; The temperature parameters are processed by a number of functional modules to form a corresponding output voltage; the output voltage can be transmitted to the motor through the connecting terminal and the cable to drive the fan blades to rotate at the target speed.

10. A computer, characterized in that: include: Computer body and motherboard; The board is arranged on the computer body; The heat dissipation device as described in any one of claims 1 to 9 is assembled on the computer body, and the fan blade body of the double-pin fan of the heat dissipation device corresponds to the board, so that the hot air flow generated by the board is guided to the heat dissipation aluminum extrusion of the heat dissipation device.

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