Display device

Abstract

A display device is provided. The display device comprises a display panel and a circuit board. The display panel includes a display area and a bonding area. A plurality of pixels are arranged in the display area. The bonding region is spaced apart from the display region in the first direction. A plurality of pad electrodes are arranged in the bonding region. The circuit board is disposed on the display panel. The circuit board includes a first portion overlapping the display panel between the display area and the bonding area in a plan view. Accordingly, a dead zone of the display device may be reduced, and an area in which a battery or the like is arranged in the display device may be secured by reducing an area in which a circuit board is arranged after the display panel is bent.

Description

[0001] This application is a divisional application of a Chinese patent application with the application number 202420086192.1 and the utility model name "display device", which was filed on January 15, 2024. Technical Field

[0002] The embodiment relates to a display device including a circuit board. Background Art

[0003] A display device may include a display panel and a printed circuit board. The display panel may include light-emitting diodes and pixel circuits. The printed circuit board may include connectors, components, etc. The connector may receive external signals, and the components may perform various operations, such as processing drive signals, etc.

[0004] The printed circuit board may be electrically connected to the pad portion of the display panel. In other words, the printed circuit board may include a first portion overlapping with the pad portion of the display panel and a second portion not overlapping with the pad portion of the display panel. Summary of the Utility Model

[0005] The embodiment provides a display device.

[0006] A display device according to an embodiment of the present disclosure may include: a display panel including a display area in which a plurality of pixels are arranged, and a bonding area spaced apart from the display area in a first direction and in which a plurality of pad electrodes are arranged; and a circuit board disposed on the display panel and including a first portion overlapping the display panel between the display area and the bonding area in a plan view.

[0007] In an embodiment, the circuit board may further include a second portion, and the second portion may extend from the first portion in the first direction and may overlap the bonding area of the display panel in a plan view.

[0008] In an embodiment, the circuit board may further include a third portion. The third portion may extend from the second portion in the first direction and may be spaced apart from the display panel. The third portion of the circuit board may be a space in which wires are arranged.

[0009] In an embodiment, in a plan view, the first portion of the circuit board may have a first area, and the third portion of the circuit board may have a second area smaller than the first area.

[0010] In an embodiment, the display device may further include a driving chip. The driving chip may be disposed on the display panel between the display area and the bonding area. A first hole may be defined in the circuit board at a position overlapping the driving chip in a plan view.

[0011] In an embodiment, in a plan view, the area of the first hole may be larger than the area of the driving chip.

[0012] In an embodiment, the second hole may be further defined in a circuit board at a position adjacent to the bonding area of the display panel.

[0013] In an embodiment, the width of the second hole may be larger than the width of the bonding area. The width of the second hole and the width of the bonding area may both be widths in a second direction intersecting the first direction.

[0014] In an embodiment, the first hole and the second hole may be integrally formed with each other.

[0015] In an embodiment, the display panel may further include a bending area between the display area and the bonding area, and the display panel may be bent in the bending area.

[0016] In an embodiment, a first portion of the circuit board may be arranged to overlap the display panel in a plan view between the bending area and the bonding area.

[0017] In an embodiment, the display device may further include a battery. In a plan view, the circuit board may overlap an upper surface of the display panel on which a plurality of pixels are arranged, and the battery may overlap a lower surface of the display panel that is farthest from the upper surface of the display panel.

[0018] A display device according to another embodiment of the present disclosure may include a display panel, a driving chip, and a circuit board. The display panel may include a display area and a bonding area. The bonding area may be spaced apart from the display area in a first direction. A plurality of pixels may be arranged in the display area. A plurality of pad electrodes may be arranged in the bonding area. The driving chip may be arranged on the display panel between the display area and the bonding area. The circuit board may include a first portion, a second portion, and a third portion. The first portion of the circuit board may be spaced apart from a first side of the driving chip. The first side of the driving chip may be arranged to be farthest from the display area in the first direction. The second portion of the circuit board may be spaced apart from a second side of the driving chip in a second direction. The second side may intersect the first side. The second direction may intersect the first direction. The third portion of the circuit board may be spaced apart from a third side of the driving chip in a direction opposite to the second direction. The third side and the second side may face each other in directions opposite to the second direction.

[0019] In an embodiment, in the second direction, the vertical distance between an end of the display area and an end of the driving chip may be less than the vertical distance between an end of the display area and an end of the first portion of the circuit board.

[0020] In an embodiment, in the second direction, the vertical distance between an end of the display area and an end of the driving chip may be greater than the vertical distance between an end of the display area and an end of the third portion of the circuit board.

[0021] In an embodiment, the display panel may further include a bending region between the display region and the bonding region, and the display panel may be bent in the bending region.

[0022] In an embodiment, the circuit board may be arranged to overlap with the display panel in a plan view between the bending region and the bonding region.

[0023] In an embodiment, the width of the driving chip may be smaller than the width of the first portion of the circuit board, and each of the width of the driving chip and the width of the first portion of the circuit board may be a width in a second direction.

[0024] In an embodiment, the circuit board may further include an alpha region extending in a first direction in a plan view from a portion of the circuit board overlapping with the bonding region, and the alpha region may be a space in which wires are arranged.

[0025] In an embodiment, the display device may further include a battery. In a plan view, the driving chip and the circuit board may overlap with an upper surface of the display panel on which a plurality of pixels are arranged, and in a plan view, the battery may overlap with a lower surface of the display panel that is farthest from the upper surface of the display panel.

[0026] A display device according to an embodiment of the present disclosure may include a display panel and a circuit board. The display panel may include a display region and a bonding region. A plurality of pixels may be arranged in the display region. The bonding region may be spaced apart from the display region in a first direction. A plurality of pad electrodes may be arranged in the bonding region. The circuit board may be arranged on the display panel. The circuit board may include a first portion overlapping with the display panel in a plan view between the display region and the bonding region. Accordingly, a space in which a battery or the like is arranged may be secured by reducing a dead zone of the display device or by reducing an area in which the circuit board is arranged after the display panel is bent.

[0027] In the display device, interference between the driving chip and the circuit board may be avoided by defining a first hole in the circuit board at a position overlapping with the driving chip in a plan view.

[0028] In the display device, a step between the bonding region and another region may be overcome by further defining a second hole in the circuit board adjacent to the bonding region of the display panel.

[0029] A display device according to an embodiment of the present disclosure may include: a display panel including a display area in which a plurality of pixels are arranged, and a bonding area spaced apart from the display area in a first direction and in which a plurality of pad electrodes are arranged; a driving chip disposed on the display panel between the display area and the bonding area; and a circuit board. The circuit board may include: a first portion spaced apart from a first side of the driving chip, the first side of the driving chip being arranged to be farthest from the display area in the first direction; a second portion spaced apart from a second side of the driving chip, the second side of the driving chip intersecting the first side of the driving chip in a second direction intersecting the first direction; and a third portion spaced apart from a third side of the driving chip, the third side of the driving chip facing the second side of the driving chip in a direction opposite to the second direction. Accordingly, space in which a battery or the like is arranged can be ensured by reducing the dead zone of the display device or by reducing the area in which the circuit board is arranged after the display panel is bent. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure.

[0031] Figure 2 is included in Figure 1 a circuit board in the display device.

[0032] Figure 3 and Figure 4 are schematic cross-sectional views illustrating a first hole of a circuit board included in Figure 1 the display device.

[0033] Figure 5 , Figure 6 , Figure 7 and Figure 8 are views illustrating Figure 1 the effect of the display device.

[0034] Figure 9 is a plan view of a display device according to an embodiment of the present disclosure.

[0035] Figure 10 , Figure 11 and Figure 12 are views illustrating a circuit board included in Figure 9 the display device.

[0036] Figure 13 is a plan view of a display device according to an embodiment of the present disclosure.

[0037] Figure 14 is Figure 13 a plan view of the circuit board.

[0038] Figure 15 is a schematic cross-sectional view taken along line II-II' of Figure 13 .

[0039] Figure 16 is a schematic cross-sectional view taken along line III-III' of Figure 13 .

[0040] Figure 17 is a view showing the effect of the display device of Figure 13 . DETAILED DESCRIPTION

[0041] Hereinafter, embodiments will be described in more detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same components, and redundant descriptions of the same components will be omitted.

[0042] When an element such as a layer is referred to as being "on", "connected to", or "coupled to" another element or layer, the element can be directly on, directly connected to, or directly coupled to the other element or layer, or there can be intervening elements or layers. However, when an element or layer is referred to as being "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers. For this reason, the term "connected" can refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. Further, when an element is referred to as being "in direct contact" or "contacting" another element, etc., the element can be "electrically contacting" or "physically contacting" the other element; or "indirectly contacting" or "directly contacting" the other element.

[0043] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, the terms "comprise", "comprising", "include", and / or "including" as used in this specification specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It is also noted that, as used herein, the terms "substantially", "about", and other similar terms are used as approximate terms and not as terms of degree, and are thus used to account for the inherent deviations in the measurements, calculations, and / or provided values that would be recognized by a person of ordinary skill in the art.

[0044] Although terms such as "first" and "second" may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0045] Spatial relative terms, such as "beneath", "below", "under", "lower", "above", "upper", "over", "higher", "side" (e.g., as in "side wall"), etc., may be used herein for descriptive purposes and, thus, to describe the relationship of one element to another element as illustrated in the figures. Spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as "beneath" or "below" another element or feature would then be oriented "above" the other element or feature. Thus, the exemplary term "below" can encompass both an orientation of above and below. Additionally, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and thus, the spatial relative descriptors used herein are to be interpreted accordingly.

[0046] As used herein, the term "dead zone" may be understood as a space dedicated to accommodating one or more components that perform an intended function, either individually or in plurality.

[0047] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined in the specification.

[0048] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure. Figure 2 is included in Figure 1 a plan view of a circuit board in the display device of Figure 3 and Figure 4 are schematic cross-sectional views illustrating a first hole of a circuit board included in the display device of Figure 1

[0049] For example, Figure 3 is a schematic cross-sectional view of a display device according to a comparative embodiment. Figure 4 is along Figure 1 ​Schematic cross-sectional view taken along line I-I'.

[0050] Reference Figure 1 、 Figure 2 Figure 4 According to embodiments of the present disclosure, the display device 100 may include a display panel PA, a driving chip IC, a circuit board CB1, and a battery (e.g., Figure 8 the battery BA).

[0051] The display panel PA may include a display area AA and a bonding area BOA.

[0052] A plurality of pixels PX may be arranged in the display area AA.

[0053] The bonding area BOA may be spaced apart from the display area AA in a first direction DR1. A plurality of pad electrodes may be arranged in the bonding area BOA.

[0054] In an embodiment, the display panel PA may further include a bending area BEA between the display area AA and the bonding area BOA. The display panel PA may be bent in the bending area BEA, and the display panel PA may include a flexible substrate. For example, the flexible substrate may include polyimide ("PI").

[0055] In another embodiment, the bending area BEA may be omitted in the display panel PA, and the display panel PA may include a rigid substrate. For example, the rigid substrate may include glass.

[0056] The driving chip IC may be arranged on the display panel PA. For example, the driving chip IC may be arranged between the display area AA and the bonding area BOA.

[0057] The driving chip IC may drive the display panel PA. For example, a timing controller may be embedded in the driving chip IC. The driving chip IC may perform various operations for driving the display panel PA (such as timing control) or converting analog signals into digital signals.

[0058] The circuit board CB1 may be arranged on the display panel PA. The circuit board CB1 may be arranged to overlap the display panel PA between the display area AA and the bonding area BOA in a plan view. For example, the circuit board CB1 may be arranged to overlap the display panel PA between the bending area BEA and the bonding area BOA in a plan view. For example, the circuit board CB1 may have a pickup portion spaced apart from the bending area BEA arranged between the display area AA and the bonding area BOA by about 2 millimeters (mm). In the case where the device bends the display panel PA, the device may pick up the pickup portion.

[0059] However, the present disclosure is not limited thereto. The circuit board CB1 may be arranged adjacent to the bending area BEA. In the case where the display device 100 includes a rigid substrate, the circuit board CB1 may be arranged adjacent to the display area AA. For example, the circuit board CB1 may be a flexible printed circuit board (“FPCB”).

[0060] The circuit board CB1 may include a first portion PA1, a second portion PA2, and a third portion PA3.

[0061] In a plan view, the first portion PA1 may overlap with the display panel PA between the display area AA and the bonding area BOA.

[0062] The second portion PA2 may extend from the first portion PA1 in the first direction DR1 and overlap with the bonding area BOA of the display panel PA in a plan view. For example, the second portion PA2 may be the portion of the display panel PA where pressure is applied.

[0063] The third portion PA3 may extend from the second portion PA2 in the first direction DR1 and be offset from the display panel PA in a plan view. In other words, in a plan view, the third portion PA3 may not overlap with the display panel PA.

[0064] In an embodiment, the third portion PA3 of the circuit board CB1 may be a space where wires are arranged. For example, the wire may be a wire of the circuit board CB1. A part of the circuit board CB1 may be connected to the signal input device, and another part of the circuit board CB1 may be connected to the display panel PA. The wire of the circuit board CB1 may be a wire connecting this part and the other part of the circuit board CB1.

[0065] For example, the circuit board CB1 may overlap with the bonding area BOA of the display panel PA at a position spaced apart from this part of the circuit board CB1.

[0066] For example, a first hole HO1 may be defined in the circuit board CB1. The first hole HO1 may be defined at a position that overlaps with the driving chip IC in a plan view. Details of the first hole HO1 defined in the circuit board CB1 will be described below with reference to Figure 3 and Figure 4 a detailed description of the first hole HO1 defined in the circuit board CB1 will be described.

[0067] In an embodiment, in a plan view, the first portion PA1 of the circuit board CB1 may have a first area, and the third portion PA3 of the circuit board CB1 may have a second area. The second area may be smaller than the first area. Details of the first area and the second area will be described below with reference to Figure 5 、 Figure 6 、 Figure 7 and Figure 8 a detailed description of the first area and the second area will be described.

[0068] The battery may be arranged on the display panel PA. In another embodiment, the battery may be omitted, and the display device 100 may include a power supply device. For example, the power supply device may include an adapter or the like. Details of the battery will be described below with reference to Figure 8 a detailed description of the battery.

[0069] The display device 100 may have a COP-FOP (Chip On Panel - Flexible Printed Circuit Board on Panel) structure.

[0070] The driving chip IC may be arranged on the display panel PA. For example, the driving chip IC may be arranged on the display panel PA between the display area AA and the bonding area BOA.

[0071] The circuit board CB1 may be arranged on the display panel PA. For example, the display panel PA and the circuit board CB1 may be compressed at the bonding area BOA of the display panel PA.

[0072] For example, in the case where the display device 100 has a COP-FOP structure, the driving chip IC may be arranged on the display panel PA, the circuit board CB1 may be arranged on the driving chip IC, and interference may occur at the portion where the driving chip IC and the circuit board CB1 overlap in the plan view.

[0073] As Figure 3 shown, the first hole HO1 may not be defined in the circuit board CB' included in the display device 100' according to the comparative embodiment. In the case where the first hole HO1 is not defined in the circuit board CB1, the portion of the circuit board CB1 overlapping with the driving chip IC may be deformed to bulge outward. The outwardly bulged portion may adversely affect the assembly characteristics between the display device 100' and other electronic devices.

[0074] On the other hand, as Figure 4 shown, the display device 100 according to the embodiment may include a circuit board CB1 having a defined first hole HO1. The first hole HO1 may be defined at a position overlapping with the driving chip IC in the plan view. Therefore, interference at the portion where the driving chip IC and the circuit board CB1 overlap can be prevented.

[0075] In the plan view, the area of the first hole HO1 may be larger than the area of the driving chip IC. Therefore, the flatness at the portion where the circuit board CB1 and the driving chip IC overlap can be maintained.

[0076] Figure 5 、 Figure 6 、 Figure 7 and Figure 8 are views illustrating Figure 1 the effects of the display device.

[0077] For example, Figure 5 and Figure 6 are a schematic plan view and a cross-sectional view of a display device according to a comparative example. Figure 7 and Figure 8 are a schematic plan view and a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0078] Referring to Figure 5 and Figure 6 , in the display device 100” according to the comparative example, the circuit board CB” can be pressed at the end of the display panel PA, and the area of the dead zone DS” that does not include the display area AA of the display panel PA can be large. The dead zone DS” can correspond to the non-display area.

[0079] The setting space SS” can be small. For example, the setting space SS” can be a space in which components such as a battery are arranged. In another example, the setting space SS” can be a space in which the display panel PA can be curled in the case of a slidable display device.

[0080] On the other hand, referring to Figure 7 and Figure 8 , in the display device 100 according to an embodiment of the present disclosure, the circuit board CB1 can be pressed from the inside of the display panel PA rather than from that end of the display panel PA.

[0081] In the embodiment, the first part PA1 of the circuit board CB1 can be arranged to overlap the display panel PA in a plan view between the bending area BEA and the bonding area BOA of the display panel PA. The second part PA2 can extend from the first part PA1 in the first direction DR1 and overlap the bonding area BOA of the display panel PA in a plan view. The third part PA3 can extend from the second part PA2 in the first direction DR1 and be offset from the display panel PA in a plan view.

[0082] The circuit board CB” included in the display device 100” according to the comparative example can overlap the display panel PA only in the bonding area BOA. On the other hand, the circuit board CB1 included in the display device 100 according to an embodiment of the present disclosure can include the first part PA1 and the second part PA2. In a plan view, the second part PA2 can overlap the bonding area BOA, and the first part PA1 can overlap a part located inside the bonding area BOA of the display panel PA.

[0083] Therefore, the dead zone DS of the display device 100 according to the embodiment can be smaller than the dead zone DS” of the display device 100” according to the comparative example. For example, the display device 100 according to an embodiment of the present disclosure can be smaller or thinner than the display device 100” according to the comparative example.

[0084] The installation space SS of the display device 100 according to an embodiment of the present disclosure may be larger than the installation space SS' of the display device 100" according to a comparative embodiment. Accordingly, the display device 100 according to an embodiment of the present disclosure may include a large-capacity battery BA.

[0085] In an embodiment, the battery BA may be disposed on the display panel PA. For example, the battery BA may be disposed on the lower surface BS of the display panel PA. In a plan view, the upper surface of the display panel PA on which pixels are disposed may overlap with the circuit board CB1, and the lower surface of the display panel PA that is farthest from the upper surface of the display panel PA may overlap with the battery BA.

[0086] For example, the display device 100 according to an embodiment of the present disclosure may secure a space in which a large-capacity battery may be disposed, or may additionally secure a space in which the display panel PA may be curled for a slidable display device.

[0087] In an embodiment, in a plan view, a first portion PA1 of the circuit board CB1 may have a first area, and a third portion PA3 of the circuit board CB1 may have a second area. The first area may be larger than the second area. In another embodiment, the first area may be equal to the second area.

[0088] In a plan view, as the first portion PA1 of the display device 100 increases, the size of the non-display area excluding the display area AA may decrease. Accordingly, according to an embodiment of the present disclosure, the size and thickness of the display device 100 may be reduced.

[0089] In a cross-sectional view, as the first portion PA1 of the display device 100 increases, the protruding length of the circuit board CB1 from the display panel PA may decrease. Accordingly, the installation space SS of the display device 100 according to an embodiment of the present disclosure may be increased.

[0090] Figure 9 is a plan view of a display device according to an embodiment of the present disclosure. Figure 10 、 Figure 11 and Figure 12 are views illustrating a circuit board included in the Figure 9 display device.

[0091] For example, Figure 10 is a plan view of a Figure 9 circuit board according to an embodiment. Figure 11 is a plan view illustrating a Figure 9 circuit board according to an embodiment. Figure 12 is a schematic cross-sectional view illustrating a third hole defined in the Figure 11 circuit board. Hereinafter, with reference to the above Figures 1 to 8Descriptions of overlapping descriptions of the described display device 100 will be omitted or simplified.

[0092] Reference Figure 9 、 Figure 10 、 Figure 11 and Figure 12 According to an embodiment of the present disclosure, the display device 200 may include a display panel PA, a driving chip IC, and a circuit board CB2.

[0093] The display panel PA may include a display area AA and a bonding area BOA.

[0094] Pixels (e.g., Figure 1 pixels PX) may be arranged in the display area AA.

[0095] The bonding area BOA may be spaced apart from the display area AA in a first direction DR1. Pad electrodes may be arranged in the bonding area BOA.

[0096] In an embodiment, the display panel PA may further include a bending area BEA between the display area AA and the bonding area BOA. The display panel PA may be bent in the bending area BEA. In another embodiment, the bending area BEA may be omitted in the display panel PA.

[0097] The driving chip IC may be arranged on the display panel PA. For example, the driving chip IC may be arranged between the display area AA and the bonding area BOA.

[0098] The circuit board CB2 may be arranged on the display panel PA. The circuit board CB2 may include a first portion PA1, a second portion PA2, and a third portion PA3.

[0099] In a plan view, the first portion PA1 may overlap the display panel PA between the display area AA and the bonding area BOA.

[0100] The second portion PA2 may extend from the first portion PA1 in the first direction DR1 and overlap the bonding area BOA of the display panel PA in a plan view. For example, the second portion PA2 may be a portion of the display panel PA to which pressure is applied.

[0101] The third portion PA3 may extend from the second portion PA2 in the first direction DR1 and be spaced apart from the display panel PA. In an embodiment, the third portion PA3 of the circuit board CB2 may be a space in which wires are arranged. For example, the wire may be a wire of the circuit board CB2. For example, the circuit board CB2 may overlap the bonding area BOA of the display panel PA at a position spaced apart from an end of the circuit board CB2.

[0102] In an embodiment, in a plan view, a first portion PA1 of the circuit board CB2 may have a first area, and a third portion PA3 of the circuit board CB2 may have a second area. The second area may be smaller than the first area. In another embodiment, the first area and the second area may be equal.

[0103] In a plan view, as the first portion PA1 of the display device 200 increases, the size of the non-display area excluding the display area AA may decrease. Accordingly, the size and thickness of the display device 200 according to an embodiment of the present disclosure may be reduced.

[0104] In a cross-sectional view, as the first portion PA1 of the display device 200 increases, the protruding length of the circuit board CB2 from the display panel PA may decrease. Accordingly, the installation space (e.g., Figure 8 the installation space SS) of the display device 200 according to an embodiment of the present disclosure may be increased.

[0105] In an embodiment, the display device 200 may have a COP-FOP (Chip On Panel - "FPCB" On Panel) structure. In the case where the display device 200 has a COP-FOP structure, the driving chip IC may be disposed on the display panel PA, the circuit board CB2 may be disposed on the driving chip IC, and interference may occur at a portion where the driving chip IC and the circuit board CB2 overlap in a plan view.

[0106] In an embodiment, in a plan view, the area of the first hole HO1 may be larger than the area of the driving chip IC. Accordingly, the flatness at a portion where the circuit board CB2 and the driving chip IC overlap may be maintained.

[0107] In an embodiment, the circuit board CB2 may be pressed against the display panel PA at the bonding area BOA of the display panel PA, and the display device 200 may include the circuit board CB2 having a defined second hole HO2.

[0108] In an embodiment, the second hole HO2 may be defined in the circuit board CB2 at a position adjacent to the bonding area BOA. For example, the second hole HO2 may be defined in the first portion PA1 of the circuit board CB2. For example, the second hole HO2 may be aligned with a first side SD of the bonding area BOA.

[0109] In an embodiment, the width L1 of the second hole HO2 may be larger than the width L2 of the bonding area BOA. Each of the width L1 of the second hole HO2 and the width L2 of the bonding area BOA may be a width in a second direction DR2. The second direction DR2 may intersect the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other.

[0110] In an embodiment, the first hole HO1 and the second hole HO2 may be integrally formed with each other (e.g., Figure 11 the third hole HO3). The third hole HO3 may be defined at a position overlapping with the driving chip IC in a plan view. The third hole HO3 may be aligned with the first side SD of the bonding area BOA.

[0111] The second hole HO2 defined in the circuit board CB2 may relieve the stress applied to the compression part (e.g., the bonding area BOA).

[0112] The display panel PA and the circuit board CB2 may be thermally compressed at a position overlapping with the bonding area BOA in a plan view. Thus, the display panel PA and the circuit board CB2 may be electrically connected.

[0113] A level difference may occur between the compression part and the part other than the compression part. In other words, the level of the upper surface of the circuit board CB3 may not be constant in the bonding area BOA and other areas. For example, the level of the upper surface of the circuit board CB3 in the bonding area BOA may be lower than the level of the upper surface of the circuit board CB3 in the area other than the bonding area BOA. Thus, the circuit board CB3 may receive stress to return to the position before being compressed. To prevent stress, the step difference at the end of the compression part may be removed by forming the second hole HO2 in the circuit board CB2.

[0114] As described above, the first hole HO1 and the second hole HO2 may be formed integrally with each other in the circuit board CB3 (e.g., Figure 11 the third hole HO3), and the third hole HO3 may be defined at a position overlapping with the driving chip IC to avoid interference with the driving chip IC. The third hole HO3 may be defined to be aligned with the first side SD of the bonding area BOA to eliminate the level difference.

[0115] Figure 13 is a plan view of a display device according to an embodiment of the present disclosure. Figure 14 is Figure 13 a plan view of the circuit board. Figure 15 is a schematic cross-sectional view taken along line II-II' of Figure 13 . Figure 16 is a schematic cross-sectional view taken along line III-III' of Figure 13 . Hereinafter, descriptions overlapping with the descriptions of the display devices 100, 100', 100” or 200 described above with reference to Figures 1 to 12 will be omitted or simplified.

[0116] Refer to Figure 13 , Figure 14 , Figure 15 and Figure 16, a display device 400 according to an embodiment of the present disclosure may include a display panel PA, a driving chip IC, and a circuit board CB4.

[0117] The display panel PA may include a display area AA and a bonding area BOA.

[0118] Pixels (e.g., Figure 1 the pixels PX) may be arranged in the display area AA.

[0119] The bonding area BOA may be spaced apart from the display area AA in a first direction DR1. Pad electrodes may be arranged in the bonding area BOA.

[0120] In an embodiment, the display panel PA may further include a bending area BEA between the display area AA and the bonding area BOA. The display panel PA may be bent in the bending area BEA. In another embodiment, the bending area BEA may be omitted in the display panel PA.

[0121] The driving chip IC may be arranged on the display panel PA. For example, the driving chip IC may be arranged between the display area AA and the bonding area BOA.

[0122] The circuit board CB4 may be arranged on the display panel PA. The circuit board CB4 may be arranged to overlap the display panel PA between the display area AA and the bonding area BOA in a plan view. For example, the circuit board CB4 may be arranged to overlap the display panel PA between the bending area BEA and the bonding area BOA in a plan view. However, the present disclosure is not limited thereto. In the case where the display device 400 includes a rigid substrate, the circuit board CB4 may be arranged adjacent to the display area AA.

[0123] In an embodiment, the display device 400 may have a COP-FOP (chip on panel - "FPCB" on panel) structure. In the case where the display device 400 has a COP-FOP structure, the driving chip IC may be arranged on the display panel PA, the circuit board CB4 may be arranged on the driving chip IC, and interference may occur at a portion where the driving chip IC and the circuit board CB4 overlap each other in a plan view.

[0124] As described above, in the case where the driving chip IC is arranged on the display panel PA and the circuit board CB4 is arranged on the driving chip IC, a portion of the circuit board CB4 that overlaps the driving chip IC may be deformed to bulge outward. The outwardly bulging deformed portion may adversely affect the assembly characteristics between the display device 400 according to the embodiment and other electronic devices.

[0125] A display device 400 according to an embodiment of the present disclosure may include a circuit board CB4, and the circuit board CB4 includes a first portion PA1', a second portion PA2', and a third portion PA3'.

[0126] In an embodiment, the first portion PA1' of the circuit board CB4 may be spaced apart from the first side S1 of the driving chip IC. The first side S1 of the driving chip IC may be the side that is farthest from the display area AA in the first direction DR1.

[0127] The second portion PA2' may be spaced apart from the second side S2 of the driving chip IC in the second direction DR2. The second direction DR2 may be a direction intersecting the first direction DR1. For example, the first direction DR1 and the second direction DR2 may be perpendicular to each other. The second side S2 may intersect the first side S1 in the second direction DR2. For example, the first side S1 and the second side S2 may be perpendicular to each other.

[0128] The third portion PA3' may be spaced apart from the third side S3 of the driving chip IC in a direction opposite to the second direction DR2. The third side S3 may face the second side S2 in the second direction DR2.

[0129] In an embodiment, the width D4 of the driving chip IC may be smaller than the width D5 of the first portion PA1' of the circuit board CB4. Each of the width D4 of the driving chip IC and the width D5 of the first portion PA1' of the circuit board CB4 may be the width in the second direction DR2. Therefore, the flatness at the overlapping portion of the circuit board CB4 and the driving chip IC in the plan view may be maintained.

[0130] In an embodiment, in the plan view, in the first direction DR1, the vertical distance D1 between the end of the display area AA and the end of the driving chip IC may be smaller than the vertical distance D2 between the end of the display area AA and the end of the first portion PA1'. In the plan view, in the first direction DR1, the vertical distance D1 between the end of the display area AA and the end of the driving chip IC may be greater than the vertical distance D3 between the end of the display area AA and the end of the third portion PA3'.

[0131] In an embodiment, the circuit board CB4 may have a partially open shape. For example, the circuit board CB4 may have a "U" shape. Therefore, the driving chip IC may be disposed between the display area AA and the first portion PA1'. For example, in the plan view, the "U"-shaped circuit board CB4 may overlap with the display panel PA and may not overlap with the driving chip IC. However, the present disclosure is not limited thereto, and the shape of the circuit board CB4 is not limited as long as the circuit board CB4 overlaps with the display panel PA and does not overlap with the driving chip IC in the plan view.

[0132] In an embodiment, the circuit board CB4 may further include an alpha region APA extending in a first direction DR1 from a portion overlapping with the bonding region BOA. In a plan view, the alpha region APA may not overlap with the display panel PA.

[0133] In an embodiment, the alpha region APA of the circuit board CB4 may be a space in which wires are arranged. For example, the wire may be a wire within the circuit board CB4. A portion of the circuit board CB4 may be connected to a signal input device, and another portion of the circuit board CB4 may be connected to the display panel PA. The wire in the circuit board CB4 may be a wire connecting this portion and the other portion of the circuit board CB4.

[0134] For example, in a plan view, the circuit board CB4 may overlap with the bonding region BOA of the display panel PA at a position spaced apart from this portion of the circuit board CB4.

[0135] Figure 17 is a view Figure 13 of the effect of the illustrated

[0136] Referring to Figure 13 and Figure 17 , the circuit board CB4 can be pressed from inside the display panel PA rather than from the end of the display panel PA.

[0137] In an embodiment, the display device 400 may further include a battery BA. In a cross-sectional view, the lower surface BS of the display panel PA may overlap with the battery BA, and in a plan view, the upper surface US of the display panel PA may overlap with the driving chip IC and the circuit board CB4. The lower surface BS of the display panel PA may be the farthest from the upper surface US of the display panel PA.

[0138] As the overlapping area of the display panel PA and the circuit board CB4 increases, the size and thickness of the display device 400 can be reduced, and the setting space (e.g., Figure 8 the setting space SS) can be increased.

[0139] Embodiments of the present disclosure can be applied to various electronic devices that may include a display device. For example, the present disclosure can be applied to high-resolution smartphones, mobile phones, smart tablets, smart watches, tablet personal computers, vehicle navigation systems, televisions, computer monitors, laptop computers, etc.

[0140] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure pertains will be able to make various modifications and changes. Therefore, the embodiments of the present disclosure described above can be implemented individually or in combination with each other.

[0141] Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical spirit of this disclosure, but are intended to describe the technical spirit of this disclosure, and the scope of the technical spirit of this disclosure is not limited by these embodiments. The protection scope of this disclosure should be interpreted by the appended claims and should be interpreted as including all technical spirits within the equivalent scope in the scope of this disclosure.

Claims

1. A display device, characterized in that: include: A display panel, the display panel comprising: a display area in which a plurality of pixels are arranged, and a non-display area, the non-display area being adjacent to the display area; a driving chip, wherein the driving chip is arranged on the non-display area; and A circuit board includes a portion closer to the display area than the driving chip, has a shape that does not overlap with the driving chip, and is arranged on the display panel.

2. The display device according to claim 1, characterized in that The non-display area includes a bonding area in which the display panel and the circuit board are bonded, and Wherein, the circuit board comprises: a first portion, the first portion being spaced apart from a first side of the driving chip, the first side of the driving chip being arranged to be farthest from the display area in a first direction; a second portion, the second portion being spaced apart from a second side of the driving chip, the second side of the driving chip intersecting the first side of the driving chip in a second direction intersecting the first direction; and a third portion, the third portion being spaced apart from a third side of the driving chip, the third side of the driving chip facing the second side of the driving chip in a direction opposite to the second direction, Wherein, the first portion overlaps with the display panel between the display area and the combining area, The second portion extends from the first portion and overlaps the bonding area of ​​the display panel, and The third portion extends from the second portion and is spaced apart from the display panel.

3. The display device according to claim 2, characterized in that In the second direction, a vertical distance between an end of the display area and an end of the driving chip is smaller than a vertical distance between the end of the display area and an end of the first portion of the circuit board.

4. The display device according to claim 2, characterized in that: In the second direction, a vertical distance between an end of the display area and an end of the driving chip is greater than a vertical distance between the end of the display area and an end of the third portion of the circuit board.

5. The display device according to claim 2, characterized in that: The display panel further includes a bending area between the display area and the combining area, and The display panel is bent in the bending area.

6. The display device according to claim 5, characterized in that: In a plan view, the circuit board is arranged to overlap the display panel between the bending area and the bonding area.

7. The display device according to claim 2, characterized in that: The width of the driving chip is smaller than the width of the first portion of the circuit board, and Each of the width of the driving chip and the width of the first portion of the circuit board is a width in the second direction.

8. The display device according to claim 2, characterized in that: The circuit board further includes an alpha region extending in the first direction from a portion of the circuit board overlapping the bonding region in a plan view, and The Alpha zone is a space where wires are arranged.

9. The display device according to claim 2, characterized in that: Also includes: Battery, Wherein, in the cross-sectional view, a lower surface of the display panel farthest from an upper surface on which the plurality of pixels are arranged overlaps with the driving chip, the circuit board and the battery.

10. The display device according to claim 2, characterized in that: A second hole is defined in the circuit board at a position adjacent to the bonding area of ​​the display panel.

11. The display device according to claim 10, characterized in that: In the plan view, The width of the second hole is greater than the width of the bonding area, and Wherein, each of the width of the second hole and the width of the bonding area is a width in the second direction intersecting with the first direction.

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