Automatic degumming machine for resistor disc

By designing an automatic glue degluing machine for resistor sheets, the linear guide rails and moving seats are used to achieve automatic processing of resistor sheets, which solves the problem of difficult removal of the guide glue strips and flash burrs in resistor sheets, and improves the glue removal efficiency and effect.

CN223022989UActive Publication Date: 2025-06-24SUZHOU QUANTAI INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202421639139.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-11
Publication Date
2025-06-24
Estimated Expiration
2034-07-11

AI Technical Summary

Technical Problem

After the production of the existing resistor sheets, there are two relatively thicker flow guide strips in the middle and there are many flash burrs on the resistor sheets, and these burrs and flow guide strips are inconvenient to remove.

Method used

An automatic resistive sheet removal machine is designed, including a feed box, a removal device box, a flip box and a stamping device. Through the cooperation of linear guide rails and moving seats, the resistor sheet is automatically loaded, flipped and stamped to remove burrs and diversion strips.

Benefits of technology

The machine can easily remove thicker ribs and flash burrs inside the resistor sheet, improving the efficiency and effect of the resistor sheet to remove glue.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an automatic degumming machine for a resistor disc, relates to the technical field of automatic degumming machine structures, and aims to solve the problems that two thicker flow guide adhesive tapes are arranged in the middle of the conventional resistor disc after the production is finished, a plurality of flash burrs are arranged on the resistor disc, and the burrs and the flow guide adhesive tapes are inconvenient to remove. A mounting plate is mounted in the feeding box, a first linear guide rail is mounted on one side of the mounting plate, a first moving seat is mounted on one side of the first linear guide rail, a feeding device frame is mounted on one side of the first moving seat, and a limiting prevention groove is formed in the upper end of the feeding device frame. The first removing device box is installed on one side of the feeding box, the overturning box is installed on one side of the first removing device box, the second removing device box is installed on one side of the overturning box, the stamping device is installed above the second removing device box, and the discharging box is installed on one side of the second removing device box.
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Description

Technical Field

[0001] The utility model relates to the technical field of automatic deburring machine structures, specifically an automatic resistor sheet deburring machine. Background Technique

[0002] A resistor sheet is an electronic component mainly used to convert the strain change on a mechanical component into a resistance change. It is made by winding constantan wire or nichrome wire into a grid shape and clamping it between two layers of insulating thin sheets. Currently, there are many resistor sheets on the initially made resistor sheets, with two relatively thick guiding rubber strips in the middle and many burrs on the resistor sheets. Since the product is relatively delicate and not convenient for automatic removal, an automatic deburring machine needs to be used for processing.

[0003] After retrieval, the authorized announcement number CN216749814U discloses an automatic deburring and peeling machine, including a frame; a wafer cassette placing stage; a spray deburring and peeling device installed on the frame for spraying deburring liquid on the upper and lower surfaces of the wafer; an immersion deburring and peeling device installed on the frame for immersing the wafer in the peeling liquid for deburring; a cleaning device installed on the frame for cleaning the upper and lower surfaces of the wafer; and a wafer transfer arm installed on the frame for transplanting the wafer. The wafer cassette placing stage, the spray deburring and peeling device, the immersion deburring and peeling device, and the cleaning device are respectively located outside the wafer transfer arm. This automatic deburring and peeling machine can achieve the immersion deburring, spray deburring, and cleaning of the wafer, thereby improving the deburring efficiency and deburring effect.

[0004] However, after the existing resistor sheets are produced, there are two relatively thick guiding rubber strips in the middle and many burrs on the resistor sheets, and it is not convenient to remove the burrs and the guiding rubber strips. Therefore, there is an urgent need for an automatic resistor sheet deburring machine in the market to solve these problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide an automatic resistor sheet deburring machine to solve the problems in the above background technique that after the existing resistor sheets are produced, there are two relatively thick guiding rubber strips in the middle and many burrs on the resistor sheets, and it is not convenient to remove the burrs and the guiding rubber strips.

[0006] To achieve the above purpose, the utility model provides the following technical solution: an automatic resistor sheet deburring machine, including a feeding box, an installation plate is installed inside the feeding box, a linear guide rail I is installed on one side of the installation plate, a moving seat I is installed on one side of the linear guide rail I, a loading device frame is installed on one side of the moving seat I, a limiting and preventing groove is arranged inside the upper end of the loading device frame, a deburring device box I is installed on one side of the feeding box, a turning box is installed on one side of the deburring device box I, a deburring device box II is installed on one side of the turning box, a stamping device is installed above the deburring device box II, and a blanking box is installed on one side of the deburring device box II.

[0007] Preferably, a second linear guide rail is installed on one side of the inner wall of the feeding box. One end of the second linear guide rail is provided with a second moving seat. One side of the second moving seat is installed with a first mounting frame. Below one end of the first mounting frame is installed a first adsorption device seat.

[0008] Preferably, a base is installed above the first removing device box. The upper end of the base is installed with a support rod. Above the support rod is installed a horizontal mounting seat. Above the horizontal mounting seat is installed a stamping cylinder. Below the stamping cylinder is installed a limiting sliding seat. The lower end of the limiting sliding seat is provided with a stamping seat.

[0009] Preferably, a third linear guide rail is installed on one side of the inner wall of the flipping box. One end of the third linear guide rail is provided with a third moving seat. One side of the third moving seat is installed with a fixing frame. One side of the fixing frame is installed with a sliding device. One side of the sliding device is installed with a sliding seat. Below the sliding seat is installed a second mounting frame. Below one end of the second mounting frame is installed a second adsorption device seat.

[0010] Preferably, a fourth linear guide rail is installed below the inside of the flipping box. The upper end of the fourth linear guide rail is provided with a fourth moving seat. Above the fourth moving seat is installed a supporting device. Above the supporting device is installed an adsorption placing seat.

[0011] Preferably, a fifth linear guide rail is installed on one side of the fourth linear guide rail. The upper end of the fifth linear guide rail is provided with a fifth moving seat. Above the fifth moving seat is installed a supporting frame. One side of the supporting frame is installed with a motor. One side of the motor is installed a third adsorption device seat.

[0012] Preferably, a sixth linear guide rail is installed on one side of the third linear guide rail. One end of the sixth linear guide rail is provided with a sixth moving seat. One side of the sixth moving seat is installed with a connecting frame. One side of the connecting frame is installed with a first sliding device. One side of the first sliding device is installed with a third mounting frame. Below one end of the third mounting frame is installed a fourth adsorption device seat.

[0013] Preferably, a seventh linear guide rail is installed on one side of the inner wall of the blanking box. One side of the seventh linear guide rail is installed with a fourth mounting frame. Below one end of the fourth mounting frame is installed a fifth adsorption device seat. Inside the blanking box is installed a blanking device frame.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The automatic deburring machine for this kind of resistor chip pushes the stamping seat to move by opening the stamping cylinder. The stamping seat can punch and remove the thicker ribs inside the resistor chip. The stamping device punches the resistor chip to remove burrs and flash. In this way, it is convenient to remove burrs and the thicker ribs inside the resistor chip.

[0016] 2. The automatic deburring machine for this kind of resistor chip can move the sliding seat through the installed sliding device. In this way, the resistor chip can be placed above the adsorption placement seat. The moving seat five drives the support frame to move through the linear guide five, so that the adsorption device seat three is located at the upper end of the adsorption placement seat. Then, control the adsorption device seat three to descend, and the adsorption device seat three adsorbs the resistor chip. Then, by turning on the motor, the adsorption device seat three rotates 180°. Thus, the resistor chip can be flipped. After flipping, control the linear guide five to move the adsorption device seat three below the adsorption device seat four. Then, control the adsorption device seat four to descend, and the adsorption device seat four adsorbs the resistor chip. With this setting, it is convenient to flip the resistor chip, thereby improving the deburring efficiency of the resistor chip.

[0017] 3. The automatic deburring machine for this kind of resistor chip places the resistor chip above the feeding device frame. The feeding device frame moves through the linear guide one. Through the installed discharging device frame, it can control the discharging device frame to move, so that it is convenient to discharge the resistor chip. In this way, it is convenient to load and unload the resistor chip, thereby improving the processing efficiency. Description of the Drawings

[0018] Figure 1 It is the overall rear view of the present utility model;

[0019] Figure 2 It is the schematic diagram of the overall internal structure of the present utility model;

[0020] Figure 3 It is of the present utility model Figure 2 Partial enlarged view of area A;

[0021] Figure 4 It is of the present utility model Figure 2 Partial enlarged view of area B;

[0022] Figure 5 It is of the present utility model Figure 2 Partial enlarged view of area C.

[0023] In the figure: 1. Feeding box; 2. Mounting plate; 3. Linear guide rail 1; 4. Moving seat 1; 5. Loading device frame; 501. Limit prevention groove; 6. Linear guide rail 2; 601. Moving seat 2; 7. Mounting frame 1; 8. Adsorption device seat 1; 9. Removal device box 1; 10. Base; 11. Support rod; 12. Horizontal mounting seat; 13. Stamping cylinder; 14. Limit sliding seat; 15. Stamping seat; 16. Flipping box; 17. Linear guide rail 3; 18. Moving seat 3; 19. Fixed frame; 20. Sliding device; 21. Sliding seat; 22. Mounting frame 2; 23. Adsorption device seat 2; 24. Linear guide rail 4; 2401. Moving seat 4; 25. Support device; 2501. Adsorption placement seat; 26. Linear guide rail 5; 2601. Moving seat 5; 27. Support frame; 28. Motor; 29. Adsorption device seat 3; 30. Linear guide rail 6; 3001. Moving seat 6; 31. Connecting frame; 32. Mounting frame 3; 33. Adsorption device seat 4; 34. Removal device box 2; 35. Stamping device; 36. Unloading box; 37. Linear guide rail 7; 38. Mounting frame 4; 39. Adsorption device seat 5; 40. Unloading device frame; 41. Sliding device 1. Detailed implementation manners

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0025] Please refer to Figures 1-5 , an embodiment provided by the present invention: an automatic glue removal machine for resistor chips, including a feeding box 1, a mounting plate 2 is installed inside the feeding box 1, a linear guide rail 1 3 is installed on one side of the mounting plate 2, a moving seat 1 4 is installed on one side of the linear guide rail 1 3, a loading device frame 5 is installed on one side of the moving seat 1 4, a limit prevention groove 501 is arranged inside the upper end of the loading device frame 5, a removal device box 1 9 is installed on one side of the feeding box 1, a flipping box 16 is installed on one side of the removal device box 1 9, a removal device box 2 34 is installed on one side of the flipping box 16, a stamping device 35 is installed above the removal device box 2 34, and an unloading box 36 is installed on one side of the removal device box 2 34. It should be noted that, in order to save space and highlight the innovative elements of this patent, such as the specific control principle and working process of the device, they will not be elaborated in this patent.

[0026] During use, the resistor chips can be automatically loaded through the feeding box 1 so that the resistor chips can enter the upper end of the base 10. Then, by opening the stamping cylinder 13, the limit sliding seat 14 is pushed to drive the stamping seat 15 to move. Through the stamping seat 15, the thicker ribs inside the resistor chips can be stamped and removed. Then, the resistor chips with the ribs removed can be conveniently adsorbed and taken out by the adsorption device seat two 23, and the resistor chips enter the inside of the turnover box 16. The resistor chips are turned over by the devices inside the turnover box 16, and then the turned-over resistor chips are placed into the stamping device 35. The stamping device 35 stamps the resistor chips to remove the flash and burrs. Finally, the adsorption device seat five 39 moves into the stamping device 35 to adsorb the resistor chips with the flash and burrs removed, and then moves and places them above the blanking device frame 40. Then, by controlling the movement of the blanking device frame 40, the resistor chips can be conveniently blanked.

[0027] Please refer to Figure 2 and Figure 3 As shown in FIGS.

[0028] Please refer to Figure 2 As shown in FIGS.

[0029] Please refer to Figure 2 and Figure 4, on one side of the inner wall of the turnover box 16, a linear guide rail three 17 is installed. One end of the linear guide rail three 17 is provided with a moving seat three 18. On one side of the moving seat three 18, a fixing frame 19 is installed. On one side of the fixing frame 19, a sliding device 20 is installed. On one side of the sliding device 20, a sliding seat 21 is installed. Below the sliding seat 21, an installation frame two 22 is installed. Below one end of the installation frame two 22, an adsorption device seat two 23 is installed. Through the linear guide rail three 17, the moving seat three 18 can drive the adsorption device seat two 23 to move, so that the adsorption device seat two 23 can conveniently adsorb and take out the resistor chip with the cut-off ribs. Through the installed sliding device 20, the sliding seat 21 can move, so that the resistor chip can be placed above the adsorption placement seat 2501.

[0030] Please refer to Figure 2 and Figure 4 , below the inside of the turnover box 16, a linear guide rail four 24 is installed. At the upper end of the linear guide rail four 24, a moving seat four 2401 is provided. Above the moving seat four 2401, a support device 25 is installed. Above the support device 25, an adsorption placement seat 2501 is installed. Through the linear guide rail four 24, the moving seat four 2401 can drive the support device 25 to move, so that the placed resistor chip can be moved.

[0031] Please refer to Figure 2 and Figure 4 , on one side of the linear guide rail four 24, a linear guide rail five 26 is installed. At the upper end of the linear guide rail five 26, a moving seat five 2601 is provided. Above the moving seat five 2601, a support frame 27 is installed. On one side of the support frame 27, a motor 28 is installed. On one side of the motor 28, an adsorption device seat three 29 is installed. Through the linear guide rail five 26, the moving seat five 2601 drives the support frame 27 to move, so that the adsorption device seat three 29 is located above the adsorption placement seat 2501. Then, control the adsorption device seat three 29 to descend, adsorb the resistor chip through the adsorption device seat three 29, and then rotate the adsorption device seat three 29 by 180° by turning on the motor 28, so that the resistor chip can be flipped.

[0032] Please refer to Figure 2 and Figure 4, on one side of the linear guide rail three 17, a linear guide rail six 30 is installed. At one end of the linear guide rail six 30, a moving seat six 3001 is provided. On one side of the moving seat six 3001, a connecting frame 31 is installed. On one side of the connecting frame 31, a sliding device one 41 is installed. On one side of the sliding device one 41, a mounting frame three 32 is installed. Below one end of the mounting frame three 32, an adsorption device seat four 33 is installed. After flipping, by controlling the linear guide rail five 26, the adsorption device seat three 29 is moved to the lower part of the adsorption device seat four 33. Then, by controlling the adsorption device seat four 33 to descend, the resistor chip is adsorbed by the adsorption device seat four 33. Then, through the linear guide rail six 30, the moving seat six 3001 drives the adsorption device seat four 33 to move, so that the adsorption device seat four 33 places the resistor chip inside the stamping device 35. Then, the stamping device 35 stamps the resistor chip to remove the flash burrs.

[0033] Please refer to Figure 2 and Figure 5 , on one side of the inner wall of the blanking box 36, a linear guide rail seven 37 is installed. On one side of the linear guide rail seven 37, a mounting frame four 38 is installed. Below one end of the mounting frame four 38, an adsorption device seat five 39 is installed. Inside the blanking box 36, a blanking device frame 40 is installed. By the linear guide rail seven 37, the adsorption device seat five 39 is moved to the inside of the stamping device 35 to adsorb the resistor chip with the flash burrs removed. Then, it is moved and placed above the blanking device frame 40. Then, by controlling the movement of the blanking device frame 40, the resistor chip can be conveniently blanked.

[0034] Working principle: When in use, place the resistor chip above the loading device frame 5, move the loading device frame 5 through the first linear guide rail 3, then adsorb the resistor chip by the first adsorption device seat 8, and then move the second moving seat 601 to drive the first adsorption device seat 8 through the second linear guide rail 6, so that the resistor chip is placed inside the first removing device box 9. Then, by opening the stamping cylinder 13, the limiting sliding seat 14 is used to push the stamping seat 15 to move, and the thicker ribs inside the resistor chip can be stamped and removed by the stamping seat 15. The third moving seat 18 can drive the second adsorption device seat 23 to move through the third linear guide rail 17, so that the second adsorption device seat 23 can conveniently adsorb and take out the resistor chip with the ribs removed. The installed sliding device 20 can be used to move the sliding seat 21, so that the resistor chip can be placed above the adsorption and placement seat 2501. The fifth moving seat 2601 drives the support frame 27 to move through the fifth linear guide rail 26, so that the third adsorption device seat 29 is located above the adsorption and placement seat 2501. Then, control the third adsorption device seat 29 to descend, and adsorb the resistor chip by the third adsorption device seat 29. Then, by opening the motor 28, the third adsorption device seat 29 is rotated by 180°, so that the resistor chip can be flipped. After flipping, control the fifth linear guide rail 26 to move the third adsorption device seat 29 to the lower part of the fourth adsorption device seat 33. Then, control the fourth adsorption device seat 33 to descend, and adsorb the resistor chip by the fourth adsorption device seat 33. Then, the sixth moving seat 3001 drives the fourth adsorption device seat 33 to move through the sixth linear guide rail 30, so that the fourth adsorption device seat 33 places the resistor chip inside the stamping device 35. Then, the stamping device 35 is used to stamp and remove the burrs of the resistor chip. The fifth adsorption device seat 39 is moved to the inside of the stamping device 35 through the seventh linear guide rail 37 to adsorb the resistor chip with the burrs removed, and then moved and placed above the unloading device frame 40. Then, by controlling the movement of the unloading device frame 40, the resistor chip can be conveniently unloaded.

[0035] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A resistor stripping machine, comprising a feed box (1), characterized in that: The feed box (1) is provided with a mounting plate (2) installed inside, a linear guide rail (3) is installed on one side of the mounting plate (2), a movable seat (4) is installed on one side of the linear guide rail (3), a loading device frame (5) is installed on one side of the movable seat (4), a limit prevention groove (501) is provided inside the upper end of the loading device frame (5), a removal device box (9) is installed on one side of the feed box (1), a flip box (16) is installed on one side of the removal device box (9), a removal device box (34) is installed on one side of the flip box (16), a stamping device (35) is installed above the removal device box (34), and a discharge box (36) is installed on one side of the removal device box (34).

2. The resistor stripping machine according to claim 1, characterized in that: A linear guide rail 2 (6) is installed on one side of the inner wall of the feed box (1), a movable seat 2 (601) is provided at one end of the linear guide rail 2 (6), a mounting frame 1 (7) is installed on one side of the movable seat 2 (601), and an adsorption device seat 1 (8) is installed below one end of the mounting frame 1 (7).

3. The automatic resistor stripping machine according to claim 2, characterized in that: A base (10) is installed above the removal device box (9), a support rod (11) is installed at the upper end of the base (10), a transverse mounting seat (12) is installed above the support rod (11), a stamping cylinder (13) is installed above the transverse mounting seat (12), a limiting slide (14) is installed below the stamping cylinder (13), and a stamping seat (15) is provided at the lower end of the limiting slide (14).

4. The automatic resistor stripping machine according to claim 3, characterized in that: A linear guide rail three (17) is installed on one side of the inner wall of the flip box (16), a movable seat three (18) is arranged at one end of the linear guide rail three (17), a fixed frame (19) is installed on one side of the movable seat three (18), a sliding device (20) is installed on one side of the fixed frame (19), a sliding seat (21) is installed on one side of the sliding device (20), a mounting frame two (22) is installed below the sliding seat (21), and an adsorption device seat two (23) is installed below one end of the mounting frame two (22).

5. The automatic resistor stripping machine according to claim 4, characterized in that: A linear guide rail four (24) is installed at the lower part of the inside of the flip box (16), a movable seat four (2401) is arranged at the upper end of the linear guide rail four (24), a supporting device (25) is installed above the movable seat four (2401), and an adsorption placement seat (2501) is installed above the supporting device (25).

6. The automatic resistor stripping machine according to claim 5, characterized in that: A linear guide rail five (26) is installed on one side of the linear guide rail four (24), a movable seat five (2601) is arranged at the upper end of the linear guide rail five (26), a support frame (27) is installed above the movable seat five (2601), a motor (28) is installed on one side of the support frame (27), and an adsorption device seat three (29) is installed on one side of the motor (28).

7. The automatic resistor stripping machine according to claim 6, characterized in that: A linear guide rail six (30) is installed on one side of the linear guide rail three (17), a movable seat six (3001) is provided at one end of the linear guide rail six (30), a connecting frame (31) is installed on one side of the movable seat six (3001), a sliding device one (41) is installed on one side of the connecting frame (31), a mounting frame three (32) is installed on one side of the sliding device one (41), and an adsorption device seat four (33) is installed below one end of the mounting frame three (32).

8. The automatic resistor stripping machine according to claim 7, characterized in that: A linear guide rail seven (37) is installed on one side of the inner wall of the material unloading box (36), a mounting frame four (38) is installed on one side of the linear guide rail seven (37), an adsorption device seat five (39) is installed below one end of the mounting frame four (38), and a material unloading device frame (40) is installed inside the material unloading box (36).