Wafer surface cleaning box

Abstract

The utility model relates to the technical field of wafer cleaning equipment, in particular to a wafer surface cleaning box. Comprising a main box body, a pipeline assembly, a temperature control assembly, an auxiliary box body and a lifting assembly; the main box body comprises a box body, a supporting body and a material loading piece, the box body is provided with a first inner cavity, the supporting body is arranged in the first inner cavity, the supporting body is provided with a second inner cavity, the second inner cavity is communicated with the first inner cavity, the material loading piece is located in the second inner cavity, and the auxiliary box body and the main box body define a third inner cavity; the lifting assembly drives the material loading piece to move; the temperature control assembly comprises a heating body, a cooling body and a temperature control piece; by arranging the main box body composed of the body, the supporting body and the material carrying piece, the body, the supporting body, the material carrying piece and the auxiliary box body are connected to form the first inner cavity, the second inner cavity and the third inner cavity, the pipeline assembly supplies different agents to be mixed in the first inner cavity to form chemical agents, the lifting assembly drives the material carrying piece to ascend and descend, the cleaning efficiency of wafers is improved, and the cleaning efficiency of the wafers is improved. The production efficiency is improved and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning equipment, in particular to a wafer surface cleaning box. Background Art

[0002] During the production process, wafers need to be immersed in chemical reagent liquid for surface cleaning. Before cleaning, several wafers are usually neatly placed in a material frame, and then the material frame is immersed in the liquid medicine to complete the surface cleaning process of the wafers. The traditional processing method has the problem of slow cleaning efficiency, resulting in low production efficiency and high cost, which cannot meet the production requirements, so it needs to be improved. Summary of the Invention

[0003] In order to overcome the disadvantages of slow cleaning efficiency and high production cost in the prior art, the purpose of the utility model is to provide a wafer surface cleaning box to achieve the purpose of rapid cleaning and reduce production cost.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] A wafer surface cleaning box includes a main box body, a pipeline assembly, a temperature control assembly, a sub-box body and a lifting assembly;

[0006] The main box body includes a box body, a support body and a material loading member. The box body is provided with a first inner cavity. The support body is arranged in the first inner cavity. The support body is provided with a second inner cavity, and the second inner cavity is communicated with the first inner cavity. The material loading member is located in the second inner cavity. The sub-box body and the main box body enclose a third inner cavity;

[0007] The lifting assembly is arranged on the box body and drives the material loading member to move;

[0008] The temperature control assembly includes a heating body, a cooling body and a temperature control device. The heating body is located outside the box body and is communicated with the first inner cavity. The cooling body is arranged on the support body and is far away from the material loading member. The temperature control device is arranged inside the box body.

[0009] Further, the support body includes an upper fixing member, a lower fixing member and a plurality of rod bodies. The two ends of each rod body are respectively connected with the upper fixing member and the lower fixing member, and the adjacent two rod bodies are arranged at intervals.

[0010] Further, each rod body is provided with a plurality of first notches. The plurality of first notches are arranged along the length direction of the rod body, and the adjacent two first notches are arranged at intervals. The first notches face the box body, and the cooling body is embedded in the first notches.

[0011] Further, the lifting assembly includes a mounting plate, a first driving source, a rotating shaft, a lifting member and a connecting rod;

[0012] The mounting plate is arranged on the main box body. The first driving source is arranged on the mounting plate and drives the rotating shaft to rotate. The rotating shaft is provided with an inclined surface, and the inclined surface is arranged on the end face of the rotating shaft. One end of the lifting member abuts against the inclined surface, and the other end of the lifting member is connected to the connecting rod. The mounting plate is provided with a limiting hole, and the connecting rod passes through the limiting hole and is connected to the material loading member.

[0013] Further, the lifting member includes a body, a through hole and a roller. The roller is rotatably connected to the body and abuts against the inclined surface. The connecting rod is fixed to the through hole.

[0014] Further, the box body is provided with a second notch, and the second notch is arranged on the top surface of the box body.

[0015] Further, the wafer surface cleaning box further includes a cover plate assembly. The cover plate assembly includes a second driving source and a plate body, and the plate body is used to cover the main box body.

[0016] The beneficial effects of the present utility model are as follows: By providing a main box body composed of a body, a support body and a material loading member, a first inner cavity, a second inner cavity and a third inner cavity are formed after the body, the support body, the material loading member and the auxiliary box body are connected. The pipeline assembly supplies different medicaments to complete mixing in the first inner cavity to form chemical medicaments. The lifting assembly drives the material loading member to lift, accelerating the cleaning efficiency of the wafer, improving the production efficiency and reducing the production cost. Description of the Drawings

[0017] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0018] Figure 2 is a three-dimensional sectional structural schematic diagram of the present utility model;

[0019] Figure 3 is a split structural schematic diagram of the main box body and the auxiliary box body of the present utility model;

[0020] Figure 4 is a split structural schematic diagram of the body and the support body of the present utility model;

[0021] Figure 5 is a structural schematic diagram of the lifting assembly of the present utility model;

[0022] Figure 6 is a split structural schematic diagram of the rotating shaft, the lifting member and the connecting rod of the lifting assembly of the present utility model;

[0023] Figure 7 is a structural schematic diagram of the cover plate assembly of the present utility model;

[0024] Figure 8 is a planar structural schematic diagram of the present utility model.

[0025] The reference numerals include:

[0026] 1 - Main housing body 11 - Housing body 111 - Second notch

[0027] 12 - Support body 121 - Upper fixing part 122 - Lower fixing part

[0028] 123 - Rod body 1231 - First notch 13 - Material loading part

[0029] 101 - First inner cavity 102 - Second inner cavity 103 - Third inner cavity

[0030] 2 - Pipeline assembly 31 - Heating element 32 - Cooling element

[0031] 33 - Temperature control component 4 - Sub - housing body 5 - Lifting assembly

[0032] 51 - Mounting plate 511 - Limiting hole 52 - First driving source

[0033] 53 - Rotating shaft 531 - Inclined plane 54 - Lifting part

[0034] 541 - Body 542 - Through hole 543 - Roller

[0035] 55 - Connecting rod 6 - Cover plate assembly 61 - Second driving source

[0036] 62 - Plate body 100 - Material box Specific embodiments

[0037] For the convenience of understanding by those skilled in the art, the present utility model will be further described below in conjunction with embodiments and the accompanying drawings. The content mentioned in the embodiments does not limit the present utility model.

[0038] Please refer to Figures 1 to 8 , a wafer surface cleaning box of the present utility model, characterized in that it includes a main housing body 1, a pipeline assembly 2, a temperature control assembly, a sub - housing body 4 and a lifting assembly 5;

[0039] The main housing body 1 includes a housing body 11, a support body 12 and a material loading part 13. The housing body 11 is provided with a first inner cavity 101. The support body 12 is arranged in the first inner cavity 101. The support body 12 is provided with a second inner cavity 102. The second inner cavity 102 communicates with the first inner cavity 101. The material loading part 13 is located in the second inner cavity 102. The sub - housing body 4 and the main housing body 1 enclose a third inner cavity 103;

[0040] The lifting assembly 5 is arranged on the housing body 11 and drives the material loading part 13 to move;

[0041] The temperature control assembly includes a heating body 31, a cooling body 32 and a temperature control device 33. The heating body 31 is located outside the box body 11 and communicates with the first inner cavity 101. The cooling body 32 is arranged on the support body 12 and away from the material carrier 13. The temperature control device 33 is arranged inside the box body 11.

[0042] Specifically, in this embodiment, the main box body 1 is used to clean wafers from the outside. First, several wafers from the outside are neatly placed in the external material frame 100. The main box body 1 includes a box body 11, a support body 12 and a material carrier 13. The box body 11 is a box with one end open. The box body 11 is surrounded by a bottom plate and side plates to form a first inner cavity 101. The support body 12 is in the shape of a cylinder with both ends open to form a second inner cavity 102. The support body 12 is placed inside the first inner cavity 101. The support body 12 is in a hollow shape so that the first inner cavity 101 and the second inner cavity 102 communicate. The material carrier 13 is movably connected inside the support body 12. The lifting assembly 5 enables the material carrier 13 to move up and down. The auxiliary box body 4 is fixedly connected to the main box body 1. The side wall of the auxiliary box body 4 is spaced from the side wall of the main box body 1 to form a third inner cavity 103. The pipeline assembly 2 is fixedly connected to the inner surface of the side wall of the box body 11. The pipeline assembly 2 includes multiple fluororesin tubes. One end of the fluororesin tube is equipped with a corrosion-resistant PP joint for communicating with an external liquid supply tank. The other end of the fluororesin tube extends deep into the first inner cavity 101. Some of the fluororesin tubes are used to transport concentrated sulfuric acid, and some of the fluororesin tubes are used to transport hydrogen peroxide, so as to realize the separate supply of concentrated sulfuric acid and hydrogen peroxide and mix them to form a chemical agent. The temperature control assembly includes a heating body 31, a cooling body 32 and a temperature control device 33. The heating body 31 includes a first pipe body, a pump body, a second pipe body, a heating box and a third pipe body that are connected in sequence. The first pipe body communicates with the third inner cavity 103. The third pipe body communicates with the first inner cavity 101 to form a circulation channel. The chemical agent in the third inner cavity 103 is pumped out by the pump body through the first pipe body, heated by the heating box to a preset temperature, and then enters the first inner cavity 101 through the third pipe body, so as to make the working temperature of the chemical agent in the first inner cavity 101 in a high-temperature state. The cooling body 32 is a soft corrosion-resistant rubber tube. The cooling body 32 is wound around the outer surface of the side wall of the support body 12. The cooling medium is introduced into the cooling body 32 to cool the chemical agent, so that the temperature of the chemical agent is in a relatively stable state. The temperature control device 33 is arranged on the inner wall of the box body 11 and is used to monitor the temperature of the chemical agent and timely adjust the control of the heating body 31 and the cooling body 32 to improve the cleaning efficiency of the chemical agent. The external material frame 100 is placed inside the material carrier 13, and the cleaning purpose is completed in the chemical agent of concentrated sulfuric acid and hydrogen peroxide in the main box body 1. Under the action of the lifting assembly 5, the material frame 100 and the material carrier 13 are lifted and lowered synchronously to accelerate the cleaning efficiency.

[0043] By setting up the main box body 1 composed of the main body 11, the support body 12 and the material carrier 13, after the main body 11, the support body 12, the material carrier 13 and the auxiliary box body 4 are connected, the first inner cavity 101, the second inner cavity 102 and the third inner cavity 103 are formed. The pipeline assembly 2 supplies different medicaments to complete mixing in the first inner cavity 101 to form chemical medicaments. The lifting assembly 5 drives the material carrier 13 to lift, accelerating the cleaning efficiency of the wafer, improving the production efficiency and reducing the production cost.

[0044] The support body 12 includes an upper fixing part 121, a lower fixing part 122 and a plurality of rod bodies 123. The two ends of each rod body 123 are respectively connected to the upper fixing part 121 and the lower fixing part 122. The adjacent two rod bodies 123 are arranged at intervals. The upper fixing part 121 is in a closed ring shape, and the lower fixing part 122 is in a closed ring shape. The plurality of rod bodies 123 are arranged at intervals and connect the upper fixing part 121 and the lower fixing part 122. The setting of the support body 12 has a limiting effect on the material carrier 13 and protects the material carrier 13 at the same time, that is, protects the wafer to be cleaned and processed, improves the production safety and ensures the processing quality.

[0045] Each rod body 123 is provided with a plurality of first notches 1231. The plurality of first notches 1231 are arranged along the length direction of the rod body 123. The adjacent two first notches 1231 are arranged at intervals. The first notches 1231 face the box body 11. The cooling body 32 is embedded in the first notches 1231. The setting of the first notches 1231 aims to fix the cooling body 32 and cool the coolant per unit volume to achieve the purpose of uniform cooling.

[0046] The lifting assembly 5 includes a mounting plate 51, a first driving source 52, a rotating shaft 53, a lifting member 54 and a connecting rod 55;

[0047] The mounting plate 51 is arranged on the main box body 1. The first driving source 52 is arranged on the mounting plate 51 and drives the rotating shaft 53 to rotate. The rotating shaft 53 is provided with an inclined surface 531. The inclined surface 531 is arranged on the end surface of the rotating shaft 53. One end of the lifting member 54 abuts against the inclined surface 531. The other end of the lifting member 54 is connected to the connecting rod 55. The mounting plate 51 is provided with a limiting hole 511. The connecting rod 55 passes through the limiting hole 511 and is connected to the material carrier 13. During the rotation of the rotating shaft 53, the inclined surface 531 rotates synchronously during the rotation of the rotating shaft 53. The inclined surface 531 is equivalent to the effect of a cam to achieve the purpose of driving the connecting rod 55 and the material carrier 13 to lift.

[0048] The lifting member 54 includes a body 541, a through hole 542, and a roller 543. The roller 543 is rotatably connected to the body 541 and abuts against the inclined surface 531. The connecting rod 55 is fixed to the through hole 542. The arrangement of the roller 543 enables the lifting member 54 to be in line contact with the inclined surface 531, reducing the frictional resistance, reducing the energy consumption, and reducing the production cost. The through hole 542 penetrates the body 541 along the thickness direction of the body 541, and the connecting rod 55 is fixed in the through hole 542, having a positioning function.

[0049] The box body 11 is provided with a second notch 111. The second notch 111 is provided on the top surface of the box body 11. The arrangement of the second notch 111 enables the chemical agent in the first inner cavity 101 to overflow through the second notch 111 and flow into the third inner cavity 103.

[0050] The wafer surface cleaning box further includes a cover plate assembly 6. The cover plate assembly 6 includes a second driving source 61 and a plate body 62. The plate body 62 is used to cover the main box body 1. The number of the cover plate assemblies 6 is two groups, and the two groups of cover plate assemblies 6 are symmetrically arranged. The second driving source 61 is a gas support structure. The second driving source 61 drives the plate body 62 to rotate to achieve the opening or closing function, preventing the chemical agent from splashing out of the main box body 1 and improving the safety of the working environment.

[0051] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A wafer surface cleaning box, characterized in that: It comprises a main box (1), a pipeline assembly (2), a temperature control assembly, a sub-box (4) and a lifting assembly (5); The main box body (1) comprises a box body (11), a support body (12) and a material carrier (13); the box body (11) is provided with a first inner cavity (101); the support body (12) is arranged in the first inner cavity (101); the support body (12) is provided with a second inner cavity (102); the second inner cavity (102) is communicated with the first inner cavity (101); the material carrier (13) is located in the second inner cavity (102); the auxiliary box body (4) and the main box body (1) are arranged to form a third inner cavity (103); The lifting assembly (5) is arranged on the box body (11) and drives the material carrier (13) to move; The temperature control component comprises a heating body (31), a cooling body (32) and a temperature control part (33); the heating body (31) is located outside the box body (11) and communicates with the first inner cavity (101); the cooling body (32) is arranged on the support body (12) and away from the material carrier (13); and the temperature control part (33) is arranged inside the box body (11).

2. The wafer surface cleaning box according to claim 1, characterized in that: The support body (12) comprises an upper fixing member (121), a lower fixing member (122) and a plurality of rod bodies (123), the two ends of each rod body (123) are respectively connected to the upper fixing member (121) and the lower fixing member (122), and two adjacent rod bodies (123) are arranged at a distance.

3. The wafer surface cleaning box according to claim 2, characterized in that: Each rod body (123) is provided with a plurality of first notches (1231), the plurality of first notches (1231) are arranged along the length direction of the rod body (123), two adjacent first notches (1231) are arranged at a distance, the first notches (1231) are arranged toward the box body (11), and the cooling body (32) is embedded in the first notches (1231).

4. The wafer surface cleaning box according to claim 1, characterized in that: The lifting assembly (5) comprises a mounting plate (51), a first driving source (52), a rotating shaft (53), a lifting member (54) and a connecting rod (55); The mounting plate (51) is arranged on the main box body (1), the first driving source (52) is arranged on the mounting plate (51) and drives the rotating shaft (53) to rotate, the rotating shaft (53) is provided with an inclined surface (531), and the inclined surface (531) is arranged on the end surface of the rotating shaft (53), one end of the lifting member (54) is in contact with the inclined surface (531), and the other end of the lifting member (54) is connected to the connecting rod (55), the mounting plate (51) is provided with a limiting hole (511), and the connecting rod (55) passes through the limiting hole (511) and is connected to the carrier (13).

5. The wafer surface cleaning box according to claim 4, characterized in that: The lifting member (54) comprises a body (541), a through hole (542) and a roller (543); the roller (543) is rotatably connected to the body (541) and contacts the inclined surface (531); and the connecting rod (55) is fixed to the through hole (542).

6. The wafer surface cleaning box according to claim 1, characterized in that: The box body (11) is provided with a second notch (111), and the second notch (111) is arranged on the top surface of the box body (11).

7. The wafer surface cleaning box according to claim 1, characterized in that: The wafer surface cleaning box also includes a cover plate assembly (6), wherein the cover plate assembly (6) includes a second driving source (61) and a plate body (62), and the plate body (62) is used to cover the main box body (1).

Images