Wafer processing equipment

Abstract

The utility model relates to wafer processing equipment. The wafer processing equipment comprises a wafer inlet and outlet device used for outputting or receiving wafers; the grinding and thinning device and the wafer inlet and outlet device are arranged at intervals in the first horizontal direction; the polishing device is arranged between the wafer inlet and outlet device and the grinding and thinning device; the transferring device comprises a transferring mechanical arm, and the transferring mechanical arm can be controlled to move in the first horizontal direction so as to transfer the wafer among the wafer inlet and outlet device, the grinding and thinning device and the polishing device; wherein the grinding and thinning device comprises a carrying manipulator, a cleaning mechanism and a grinding and thinning mechanism, the cleaning mechanism is used for cleaning the back surface of the wafer, the grinding and thinning mechanism is used for grinding and thinning the back surface of the wafer, and the carrying manipulator is used for picking up the wafer transferred by the transfer device; and the pick-up mechanism is used for picking up the wafers, transferring the picked-up wafers between the cleaning mechanism and the grinding and thinning mechanism, and transferring the ground and cleaned wafers to the transfer device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer processing equipment. Background Art

[0002] The manufacturing process of integrated circuits is usually divided into: silicon wafer manufacturing, front-end process and back-end process. The main purpose of the back-end process is to fabricate an entire wafer with circuit devices into individual finished chips. The processes of the back-end process can be roughly divided into 8 main steps: back grinding, wafer dicing, wafer mounting, wire bonding, plastic encapsulation, laser printing, trim and form, and final test. Back grinding of the wafer refers to precisely grinding various materials such as silicon wafers or compound semiconductors before encapsulation to reduce their thickness to a suitable ultra-thin form.

[0003] In wafer processing equipment, it is necessary to integrate many functional components such as grinding and thinning, chemical mechanical polishing (CMP), wafer cleaning, and wafer transfer, resulting in a relatively large volume of the equipment and a large amount of space required. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a wafer processing equipment that can improve the above-mentioned defects in view of the problem that the existing wafer processing equipment has a relatively large volume and requires a large amount of space.

[0005] A wafer processing equipment, comprising:

[0006] A wafer input / output device for outputting or receiving wafers;

[0007] A grinding and thinning device arranged at an interval from the wafer input / output device in a first horizontal direction;

[0008] A polishing device arranged between the wafer input / output device and the grinding and thinning device; and

[0009] A transfer device including a transfer manipulator, the transfer manipulator being controllably movable in the first horizontal direction to transfer wafers between the wafer input / output device, the grinding and thinning device, and the polishing device;

[0010] Wherein, the grinding and thinning device includes a handling manipulator, a cleaning mechanism, and a grinding and thinning mechanism. The cleaning mechanism is used to clean the back surface of the wafer, the grinding and thinning mechanism is used to grind and thin the back surface of the wafer, and the handling manipulator is used to transfer the wafer between the transfer device, the cleaning mechanism, and the grinding and thinning mechanism.

[0011] In one embodiment, the transfer device further includes a first buffer mechanism and a centering mechanism arranged at intervals along the first horizontal direction. The first buffer mechanism is arranged at the wafer loading and unloading device and is used for temporarily storing wafers provided by the wafer loading and unloading device. The centering mechanism is arranged at the grinding and thinning device. The transfer manipulator is arranged between the first buffer mechanism and the centering mechanism to transfer the wafers on the first buffer mechanism to the centering mechanism. The centering mechanism is used for centering and positioning the wafers transferred by the transfer manipulator. The handling manipulator is used for transferring the wafers on the centering mechanism to the cleaning mechanism.

[0012] In one embodiment, the transfer device further includes a second buffer mechanism, which is used for temporarily storing the wafers transferred by the handling manipulator. The transfer manipulator is also used for transferring the wafers on the second buffer mechanism to the polishing device.

[0013] In one embodiment, the second buffer mechanism and the centering mechanism are arranged vertically.

[0014] In one embodiment, the transfer manipulator is also used for flipping the wafers on the second buffer mechanism during the process of transferring the wafers to the polishing device, so that the back sides of the wafers transferred to the polishing device face down.

[0015] In one embodiment, the polishing device includes a rotating frame, a polishing head group, a polishing disc and a carrier cup group. The polishing head group is installed on the rotating frame. The rotating frame can be controlled to drive the polishing head group through the loading / unloading station and the polishing station. The carrier cup group is arranged at the loading / unloading station, and the polishing disc is arranged at the polishing station. The polishing head group includes two polishing heads, and the carrier cup group includes two carrier cups. The transfer manipulator is also used for transferring the wafers transferred by the handling manipulator to the two carrier cups of the carrier cup group.

[0016] When the rotating frame drives the polishing head group to rotate to the loading / unloading station, the two polishing heads of the polishing head group can respectively pick up the wafers on the two carrier cups of the carrier cup group, or the two polishing heads of the polishing head group can respectively release the wafers picked up by themselves to the two carrier cups of the carrier cup group. When the rotating frame drives the polishing head group to rotate to the polishing station, the polishing disc can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

[0017] In one embodiment, two polishing stations are provided, and a polishing disc is arranged at each polishing station. The polishing head group is provided with three.

[0018] When the rotating rack drives any one of the polishing head groups to reach the pick-and-place station, the other two polishing head groups are respectively located at the two polishing stations.

[0019] In one embodiment, the wafer processing equipment further includes two cleaning devices. When the transfer manipulator moves along the first horizontal direction, it can pass through the two cleaning devices, so that the transfer manipulator can transfer the wafers on the two carrier cups of the carrier cup group to the two cleaning devices respectively. The cleaning device is used for cleaning and drying the wafers, and the wafer loading and unloading device is used for receiving the wafers in the cleaning device.

[0020] In one embodiment, one of the cleaning devices is arranged between the wafer loading and unloading device and the polishing device, and the other cleaning device is arranged on the side of the wafer loading and unloading device away from the polishing device.

[0021] In one embodiment, the wafer loading and unloading device includes a wafer cassette and a loading and unloading manipulator. The transfer device further includes a first buffer mechanism arranged on one side of the loading and unloading manipulator in the second horizontal direction. The wafer cassette is used for loading wafers. The loading and unloading manipulator can be controlled to move along the second horizontal direction to transfer the wafers in the wafer cassette to the first buffer mechanism, or transfer the wafers in the two cleaning mechanisms to the wafer cassette.

[0022] The transfer manipulator can move along the first horizontal direction to the first buffer mechanism and pick up the wafers on the first buffer mechanism.

[0023] In the actual use process of the above-mentioned wafer processing equipment, first, the transfer manipulator picks up the wafers provided by the wafer loading and unloading device and moves along the first horizontal direction to the grinding and thinning device; then, the handling manipulator transfers the wafers transferred by the transfer manipulator to the cleaning mechanism, and the cleaning mechanism cleans the back surface of the wafer. After the back surface of the wafer is cleaned, the handling manipulator transfers the wafer on the cleaning mechanism to the grinding and thinning mechanism, and the grinding and thinning mechanism grinds and processes the back surface of the wafer, so as to realize the thinning of the wafer. After the grinding and processing is completed, the handling manipulator transfers the wafer on the grinding and thinning mechanism to the cleaning mechanism, and the cleaning mechanism cleans the back surface of the wafer again. After the back surface of the wafer is cleaned, the handling manipulator transfers the wafer to the transfer device again. Then, the transfer manipulator transfers the wafers transferred by the handling manipulator to the polishing device again, and the polishing device performs chemical mechanical polishing on the wafers. After the chemical mechanical polishing is completed, the transfer manipulator transfers the wafers to the wafer loading and unloading device again, and the wafer loading and unloading device receives the processed wafers.

[0024] Thus, the wafer processing equipment in this application integrates relevant mechanisms such as wafer transfer, pre-grinding cleaning of the wafer, post-grinding cleaning of the wafer, wafer grinding and thinning, and wafer polishing. Moreover, the wafer is transferred from the wafer loading and unloading device to the grinding and thinning device and back from the grinding and thinning device to the wafer loading and unloading device along the first horizontal direction by the transfer manipulator, which optimizes the wafer transfer path, simplifies the equipment structure, is conducive to improving the space utilization rate, makes the structure more compact, and thus reduces the equipment volume and the space required. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of the wafer processing equipment in an embodiment of the present utility model. Detailed Embodiments

[0026] In order to make the above objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0027] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0029] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral one; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0031] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0032] Please refer to Figure 1 , an embodiment of the present utility model provides a wafer processing device, including a wafer loading and unloading device 10, a grinding and thinning device 20, a polishing device 30 and a transfer device 40.

[0033] The wafer loading and unloading device 10 is used to provide wafers to be processed and receive the processed wafers. The grinding and thinning device 20 and the wafer loading and unloading device 10 are arranged at intervals along the first horizontal direction X1. The polishing device 30 is arranged between the wafer loading and unloading device 10 and the grinding and thinning device 20. That is to say, the wafer loading and unloading device 10, the polishing device 30, and the grinding and thinning device 20 are arranged in sequence along the first horizontal direction X1. The transfer device 40 includes a transfer manipulator 41, which can be controlled to move along the first horizontal direction X1 to transfer the wafer between the wafer loading and unloading device 10, the grinding and thinning device 20, and the polishing device 30. Among them, the grinding and thinning device 20 includes a handling manipulator 21, a cleaning mechanism 22, and a grinding and thinning mechanism 23. The cleaning mechanism 22 is used to clean the back surface of the wafer, and the grinding and thinning mechanism 23 is used to grind and thin the back surface of the wafer. The handling manipulator 21 is used to pick up the wafer transferred by the transfer device 40, transfer the picked-up wafer between the cleaning mechanism 22 and the grinding and thinning mechanism 23, and transfer the wafer that has completed grinding and cleaning to the transfer device 40.

[0034] In the actual use process of the above wafer processing equipment, first, the transfer manipulator 41 picks up the wafer provided by the wafer loading and unloading device 10 and moves along the first horizontal direction X1 to the grinding and thinning device 20; then, the handling manipulator 21 transports the wafer transferred by the transfer manipulator 41 to the cleaning mechanism 22, and the cleaning mechanism 22 cleans the back surface of the wafer. After the back surface of the wafer is cleaned, the handling manipulator 21 transfers the wafer on the cleaning mechanism 22 to the grinding and thinning mechanism 23, and the grinding and thinning mechanism 23 grinds and processes the back surface of the wafer, thereby realizing the thinning of the wafer. After the grinding process is completed, the handling manipulator 21 transfers the wafer on the grinding and thinning mechanism 23 to the cleaning mechanism 22, and the cleaning mechanism 22 cleans the back surface of the wafer again. After the back surface of the wafer is cleaned, the handling manipulator 21 transfers the wafer to the transfer device 40 again. Then, the transfer manipulator 41 transfers the wafer transferred by the handling manipulator 21 to the polishing device 30 again, and the polishing device 30 performs chemical mechanical polishing on the wafer. After the chemical mechanical polishing is completed, the transfer manipulator 41 transfers the wafer to the wafer loading and unloading device 10 again, and the wafer loading and unloading device 10 receives the processed wafer.

[0035] In this way, the wafer processing equipment in the present application integrates relevant mechanisms such as wafer transfer, pre-grinding cleaning of the wafer, post-grinding cleaning of the wafer, wafer grinding and thinning, and wafer polishing. Moreover, the wafer is transferred from the wafer loading and unloading device 10 to the grinding and thinning device 20 and returned from the grinding and thinning device 20 to the wafer loading and unloading device 10 along the first horizontal direction X1 by the transfer manipulator 41, optimizing the wafer transfer path, simplifying the equipment structure, being beneficial to improving the space utilization rate, making the structure more compact, and further reducing the equipment volume and the occupied space.

[0036] Specifically in the embodiment, the transfer manipulator 41 is arranged on one side of the polishing device 30 in the second horizontal direction X2, and the second horizontal direction X2 is perpendicular to the first horizontal direction X1. In this way, the space on one side of the polishing device 30 in the second horizontal direction X2 is fully utilized to arrange the transfer manipulator 41, further improving the space utilization rate, which is beneficial to reducing the volume of the equipment and the occupied space.

[0037] In the embodiment of the present application, the transfer device 40 further includes a first buffer mechanism 42 and a centering mechanism 43 arranged at intervals along the first horizontal direction X1. The first buffer mechanism 42 is arranged at the wafer loading and unloading device 10 for temporarily storing the wafers provided by the wafer loading and unloading device 10. The centering mechanism 43 is arranged at the grinding and thinning device 20 for centering and positioning the wafers, and also serves to temporarily store the wafers. The transfer manipulator 41 is arranged between the first buffer mechanism 42 and the centering mechanism 43, so that the transfer manipulator 41 can transfer the wafers between the first buffer mechanism 42 and the centering mechanism 43. The handling manipulator 21 is used to transfer the wafers on the centering mechanism 43 between the cleaning mechanism 22 and the grinding and thinning mechanism 23.

[0038] In this way, in actual use, first, the wafers provided by the wafer loading and unloading device 10 are temporarily stored on the first buffer mechanism 42; then, the transfer manipulator 41 moves along the first horizontal direction X1 towards the first buffer mechanism 42 until the transfer manipulator 41 picks up the wafers on the first buffer mechanism 42; then, the transfer manipulator 41 moves along the first horizontal direction X1 towards the centering mechanism 43 until the transfer manipulator 41 releases the wafers onto the centering mechanism 43, and the centering mechanism 43 performs centering and positioning on the wafers thereon; then, the handling manipulator 21 transfers the wafers on the centering mechanism 43 to the cleaning mechanism 22, the grinding and thinning mechanism 23, and the cleaning mechanism 22 in sequence, so as to complete backside cleaning, grinding processing, and backside cleaning again on the wafers in sequence.

[0039] Furthermore, the transfer device 40 further includes a second buffer mechanism 44, which is used to temporarily store the wafers transferred by the handling manipulator 21. The transfer manipulator 41 is also used to transfer the wafers on the second buffer mechanism 44 onto the polishing device 30. In this way, after the wafers are subjected to grinding processing by the grinding and thinning mechanism 23, the handling manipulator 21 transfers the wafers to the cleaning mechanism 22 again for backside cleaning; after the backside cleaning is completed, the handling manipulator 21 transfers the wafers on the cleaning mechanism 22 to the second buffer mechanism 44; then, the transfer manipulator 41 moves along the first horizontal direction X1 to the second buffer mechanism 44 and transfers the wafers on the second buffer mechanism 44 onto the polishing device 30 for chemical mechanical polishing.

[0040] Optionally, the second buffer mechanism 44 and the centering mechanism 43 are arranged in the vertical direction, so that the second buffer mechanism 44 does not additionally occupy the space in the first horizontal direction X1 and the second horizontal direction X2, further improving the space utilization rate and being beneficial to reducing the volume of the device and the occupied space. Specifically, in Figure 1 the illustrated embodiment, the vertical direction is the direction perpendicular to the paper surface.

[0041] Specifically, in the embodiment, the transfer robot 41 is further configured to flip the wafer on the second buffer mechanism 44 during the process of transferring the wafer on the second buffer mechanism 44 to the polishing device 30, so that the back surface of the wafer transferred to the polishing device 30 faces downward. In this way, when on the grinding and thinning mechanism 23, the back surface of the wafer needs to face upward to ensure that the grinding and thinning mechanism 23 grinds the back surface of the wafer. By flipping the wafer by the transfer robot 41, the back surface of the wafer transferred to the polishing device 30 faces downward, ensuring that the polishing device 30 performs chemical mechanical polishing on the back surface of the wafer.

[0042] In the embodiment of the present application, the polishing device 30 includes a rotating frame (not shown in the figure), a polishing head group (not shown in the figure), a polishing platen 32 and a carrier cup group 31. The polishing head group is mounted on the rotating frame, and the rotating frame can controllably drive the polishing head group to pass through the loading / unloading station a1 and the polishing station a2. The carrier cup group 31 is arranged at the loading / unloading station a1, and the polishing platen 32 is arranged at the polishing station a2. The polishing head group includes two polishing heads, and the carrier cup group 31 includes two carrier cups 311. The transfer robot 41 is further configured to transfer the wafers on the second buffer mechanism 44 to the two carrier cups 311 of the carrier cup group 31 one by one.

[0043] When the rotating frame drives the polishing head group to rotate to the loading / unloading station a1, the two polishing heads of the polishing head group can respectively pick up the wafers on the two carrier cups 311 of the carrier cup group 31, or the two polishing heads of the polishing head group can respectively release the wafers picked up by them to the two carrier cups 311 of the carrier cup group 31. When the rotating frame drives the polishing head group to rotate to the polishing station a2, the polishing platen 32 can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

[0044] Thus, first, the transfer manipulator 41 transfers the wafers on the second buffer mechanism 44 to the two carrier cups 311 of the carrier cup group 31 one by one; then, the rotary rack drives the polishing head group to rotate to the loading / unloading station a1, and the two polishing heads of the polishing head group pick up the wafers on the two carrier cups 311 respectively; then, the rotary rack drives the polishing head group to rotate to the polishing station a2, so that the polishing plate 32 at the polishing station a2 performs chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group; after the chemical mechanical polishing is completed, the rotary rack drives the polishing head group to rotate to the loading / unloading station a1, and the two polishing heads of the polishing head group release the wafers they pick up to the two carrier cups 311 of the carrier cup group 31 respectively.

[0045] Furthermore, there are two polishing stations a2, and each polishing station a2 is provided with a polishing plate 32, and the polishing head group is provided with three. When the rotary rack drives any one of the polishing head groups to reach the loading / unloading station a1, the other two polishing head groups are respectively located at the two polishing stations a2. In this way, on the one hand, each wafer undergoes two chemical mechanical polishings (for example, rough polishing first and then fine polishing) to ensure that the polishing effect of the wafer meets the process requirements; on the other hand, the operations at each station are carried out simultaneously, greatly improving the production efficiency.

[0046] Specifically in the embodiment, the wafer processing equipment further includes two cleaning devices 50. When the transfer manipulator 41 moves along the first horizontal direction X1, it can pass by the two cleaning devices 50, so that the transfer manipulator 41 can transfer the wafers on the two carrier cups 311 of the carrier cup group 31 to the two cleaning devices 50 respectively. Each cleaning device 50 is used to clean and dry the wafers. The wafer loading / unloading device 10 is used to receive the wafers in the two cleaning devices 50. In this way, the wafers after polishing are released by the two polishing heads of the polishing head group onto the two carrier cups 311; then, the transfer manipulator 41 transfers the wafers on the two carrier cups 311 to the two cleaning devices 50 respectively, and the two cleaning devices 50 clean the two wafers respectively; then, the wafer loading / unloading device 10 receives the wafers in the two cleaning devices 50.

[0047] Furthermore, one of the cleaning devices 50 is arranged between the wafer loading / unloading device 10 and the polishing device 30, and the other cleaning device 50 is arranged on the side of the wafer loading / unloading device 10 away from the polishing device 30. That is to say, the two cleaning devices 50 are respectively arranged on the opposite sides of the wafer loading / unloading device 10 in the first horizontal direction X1, so as to ensure that when the transfer manipulator 41 moves along the first horizontal direction X1, it can pass by the two cleaning devices 50 to transfer the wafers on the two carrier cups 311 to the two cleaning devices 50 respectively, and at the same time ensure that the wafer loading / unloading device 10 can pick up the wafers in the two cleaning devices 50.

[0048] It should be noted that the two cleaning devices 50 can also be arranged at other positions. For example, the two cleaning devices 50 are arranged within the range of the wafer loading and unloading device 10 or within the range of the transfer device 40, etc. As long as the movement of the loading and unloading manipulator 12 and the transfer manipulator 41 can be avoided, it is not limited here.

[0049] Specifically in the embodiment, the wafer loading and unloading device 10 includes a wafer cassette 11 and a loading and unloading manipulator 12. The wafer cassette 11 is used to load wafers. The loading and unloading manipulator 12 can be controlled to move along the second horizontal direction X2 to transfer the wafers in the wafer cassette 11 to the first buffer mechanism 42, or transfer the wafers in the two cleaning mechanisms 22 to the wafer cassette 11. The transfer manipulator 41 can move to the first buffer mechanism 42 along the first horizontal direction X1 and pick up the wafers on the first buffer mechanism 42. In this way, the loading and unloading manipulator 12 transfers the wafers provided by the wafer cassette 11 to the first buffer mechanism 42, so that the transfer manipulator 41 can transfer the wafers on the first buffer mechanism 42 to the centering mechanism 43. The loading and unloading manipulator 12 transfers the wafers in the two cleaning devices 50 to the wafer cassette 11 for storage.

[0050] It should be noted that the number of wafer cassettes 11 can be multiple (for example, two), and each wafer cassette 11 is arranged along the second horizontal direction X2, so that the loading and unloading manipulator 12 can pick up the wafers in each wafer cassette 11 or release the wafers into each wafer cassette 11. It can be understood that some of the wafer cassettes 11 are used to store wafers to be processed, and some are used to store processed wafers.

[0051] The following will describe Figure 1 the operation process of the wafer processing equipment of the present application:

[0052] First, the loading and unloading manipulator 12 moves along the second horizontal direction X2 to the wafer cassette 11 and picks up the wafers in the wafer cassette 11. Then, the loading and unloading manipulator 12 moves along the second horizontal direction X2 to the first buffer mechanism 42 and releases the picked-up wafers onto the first buffer mechanism 42. Then, the transfer manipulator 41 moves along the first horizontal direction X1 to the first buffer mechanism 42 and picks up the wafers on the first buffer mechanism 42. Then, the transfer manipulator 41 moves along the first horizontal direction X1 to the centering mechanism 43 and releases the picked-up wafers onto the centering mechanism 43. Then, the centering mechanism 43 centers and positions the wafers thereon. Then, the handling manipulator 21 transfers the wafers on the centering mechanism 43 to the cleaning mechanism 22, and the cleaning mechanism 22 cleans the back side of the wafers (at this time, the back side of the wafers faces up). Then, the handling manipulator 21 transfers the wafers on the cleaning mechanism 22 to the grinding and thinning mechanism 23, and the grinding and thinning mechanism 23 grinds the back side of the wafers thereon. After the grinding process is completed, the handling manipulator 21 transfers the wafers on the grinding and thinning mechanism 23 to the cleaning mechanism 22, and the cleaning mechanism 22 cleans the back side of the wafers again. After the cleaning is completed, the handling manipulator 21 transfers the wafers on the cleaning mechanism 22 to the second buffer mechanism 44. Then, the transfer manipulator 41 picks up the wafers on the second buffer mechanism 44 and flips the picked-up wafers so that the back sides of the wafers face down. Then, the transfer manipulator 41 moves along the first horizontal direction X1 to the carrier cup group 31 and releases the picked-up wafers onto the carrier cups 311 of the carrier cup group 31.

[0053] After wafers are loaded on both carrier cups 311 of the carrier cup group 31, the rotary frame drives the polishing head group to rotate above the two carrier cups 311 of the carrier cup group 31 (i.e., the loading and unloading station a1). Then, the two polishing heads of the polishing head group respectively pick up the wafers on the two carrier cups 311. Then, the rotary frame drives the polishing head group to rotate to the first polishing station a2, and the polishing pads 32 at the first polishing station a2 are used to perform the first chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group. Then, the rotary frame drives the polishing head group to rotate to the second polishing station a2, and the polishing pads 32 at the second polishing station a2 are used to perform the second chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group. Then, the rotary frame drives the polishing head group to rotate to the loading and unloading station a1, and the two polishing heads of the polishing head group respectively release the wafers onto the two carrier cups 311. Then, the transfer manipulator 41 transfers the wafers on the two carrier cups 311 to the two cleaning devices 50 one by one, and the two cleaning devices 50 respectively clean and dry the two wafers. Then, the loading and unloading manipulator 12 transfers the wafers in the two cleaning devices 50 to the wafer cassette 11 one by one by moving along the second horizontal direction X2.

[0054] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0055] The above-described embodiments only express several implementation manners of the present utility model, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. A wafer processing equipment, characterized in that: include: A wafer loading and unloading device (10) for outputting or receiving wafers; A grinding and thinning device (20) is arranged at intervals from the wafer entry and exit device (10) along a first horizontal direction (X1); A polishing device (30) is arranged between the wafer entry and exit device (10) and the grinding and thinning device (20); and A transfer device (40), comprising a transfer robot (41), wherein the transfer robot (41) can be controlled to move along the first horizontal direction (X1) to transfer the wafer between the wafer entry and exit device (10), the grinding and thinning device (20) and the polishing device (30); The grinding and thinning device (20) comprises a handling robot (21), a cleaning mechanism (22) and a grinding and thinning mechanism (23); the cleaning mechanism (22) is used to clean the back side of the wafer; the grinding and thinning mechanism (23) is used to grind and thin the back side of the wafer; and the handling robot (21) is used to transfer the wafer between the transfer device (40), the cleaning mechanism (22) and the grinding and thinning mechanism (23).

2. The wafer processing equipment according to claim 1, characterized in that: The transfer device (40) further comprises a first buffer mechanism (42) and a centering mechanism (43) arranged at intervals along the first horizontal direction (X1); the first buffer mechanism (42) is arranged at the wafer entry and exit device (10) for temporarily storing wafers provided by the wafer entry and exit device (10); the centering mechanism (43) is arranged at the grinding and thinning device (20); the transfer robot (41) is arranged between the first buffer mechanism (42) and the centering mechanism (43) to transfer the wafers on the first buffer mechanism (42) to the centering mechanism (43); the centering mechanism (43) is used to center and position the wafers transferred by the transfer robot (41); and the handling robot (21) can transfer the wafers on the centering mechanism (43) to the cleaning mechanism (22).

3. The wafer processing equipment according to claim 2, characterized in that: The transfer device (40) further comprises a second cache mechanism (44), wherein the second cache mechanism (44) is used to temporarily store wafers transferred by the transport robot (21), and the transfer robot (41) is also used to transfer the wafers on the second cache mechanism (44) to the polishing device (30).

4. The wafer processing equipment according to claim 3, characterized in that: The second buffer mechanism (44) and the centering mechanism (43) are arranged in a vertical direction.

5. The wafer processing equipment according to claim 3, characterized in that: The transfer robot (41) is also used to flip the wafer during the process of transferring the wafer on the second buffer mechanism (44) to the polishing device (30), so that the back side of the wafer transferred to the polishing device (30) faces downward.

6. The wafer processing equipment according to claim 1, characterized in that: The polishing device (30) comprises a rotating frame, a polishing head group, a polishing disc (32) and a carrying cup group (31); the polishing head group is mounted on the rotating frame; the rotating frame can controllably drive the polishing head group to pass through a material loading and unloading station (a1) and a polishing station (a2); the carrying cup group (31) is arranged at the material loading and unloading station (a1); the polishing disc (32) is arranged at the polishing station (a2); the polishing head group comprises two polishing heads; the carrying cup group (31) comprises two carrying cups (311); the transfer robot (41) is also used to transfer the wafer transferred by the transport robot (21) to the two carrying cups (311) of the carrying cup group (31); When the rotating frame drives the polishing head group to rotate to the loading and unloading station (a1), the two polishing heads of the polishing head group can respectively pick up the wafers on the two carrying cups (311) of the carrying cup group (31), or the two polishing heads of the polishing head group can respectively release the wafers picked up to the two carrying cups (311) of the carrying cup group (31); when the rotating frame drives the polishing head group to rotate to the polishing station (a2), the polishing disk (32) can perform chemical mechanical polishing on the wafers on the two polishing heads of the polishing head group.

7. The wafer processing equipment according to claim 6, characterized in that: The number of the polishing stations (a2) is two, each of the polishing stations (a2) is provided with the polishing disc (32), and the number of the polishing head groups is three; When the rotating frame drives any one of the polishing head groups to arrive at the material loading and unloading station (a1), the other two polishing head groups are respectively located at the two polishing stations (a2).

8. The wafer processing equipment according to claim 6, characterized in that: The wafer processing equipment also includes two cleaning devices (50). When the transfer robot (41) moves along the first horizontal direction (X1), it can pass through the two cleaning devices (50), so that the transfer robot (41) can transfer the wafers on the two carrying cups (311) of the carrying cup group (31) to the two cleaning devices (50) respectively. The cleaning devices (50) are used to clean and dry the wafers, and the wafer in and out device (10) is used to receive the wafers in the cleaning devices (50).

9. The wafer processing equipment according to claim 8, characterized in that: One of the cleaning devices (50) is arranged between the wafer entry and exit device (10) and the polishing device (30), and the other cleaning device (50) is arranged on a side of the wafer entry and exit device (10) away from the polishing device (30).

10. The wafer processing equipment according to claim 8, characterized in that: The wafer loading and unloading device (10) comprises a wafer box (11) and a loading and unloading robot (12); the transfer device (40) further comprises a first buffer mechanism (42) arranged on one side of the loading and unloading robot (12) in a second horizontal direction (X2), wherein the second horizontal direction (X2) is perpendicular to the first horizontal direction (X1); the wafer box (11) is used for loading wafers, and the loading and unloading robot (12) can be controlled to move along the second horizontal direction (X2) to transfer the wafers in the wafer box (11) to the first buffer mechanism (42), or to transfer the wafers in the two cleaning mechanisms (22) to the wafer box (11); The transfer robot (41) is capable of moving along the first horizontal direction (X1) to the first cache mechanism (42) and picking up the wafer on the first cache mechanism (42).

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