Silicon wafer material box
By designing a silicon wafer material box with a box base plate with multiple bevels and a removable box baffle, the problem of single box size and silicon wafer alignment in the prior art is solved, and efficient and safe material collection for silicon wafers of different sizes is achieved.
Patent Information
- Application Number
- CN202421997355.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-16
AI Technical Summary
Due to the integrated molding of the material box, the existing silicon wafer box is single in size and cannot be compatible with multi-size battery cells. The bearing surfaces formed by the bottom plate of the material box are all flat, making it difficult to ensure that the two adjacent silicon wafers are aligned up and down, resulting in the silicon wafer being easily broken and scratched during material collection.
A silicon wafer material box including a box base plate and a box baffle is designed. The top surface of the box base plate has multiple inclined surfaces intersecting the bottom surface to form a storage area. After the silicon wafer is placed in the storage area, it slides down along the inclined surface and resists the material collection on the inner wall surface of the corresponding box baffle.
Through this design, the silicon wafer material box can adapt to silicon wafers of different sizes, reduce the probability of secondary defects such as gate breakage and scratches, and improve the material collection quality of the silicon wafer.
Smart Images
Figure CN223023238U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of solar cells, and particularly relates to a silicon wafer cassette. Background Art
[0002] As an important industrial raw material, silicon wafers are widely used in the production and manufacturing of products such as solar cells and circuit boards. Therefore, before the silicon wafers leave the factory, it is necessary to strictly control their quality to ensure the quality of products such as solar cells and circuit boards made of silicon wafers.
[0003] However, for the quality inspection of silicon wafers, generally, a silicon wafer sorter is used to implement the quality inspection of silicon wafers. The silicon wafer sorter includes multiple detection devices, so as to complete the quality inspection of silicon wafers by integrating multiple detection items. Different types of silicon wafers may have different sizes (for example: the sizes of battery wafers include specifications such as 166mm, 182mm, and 210mm, etc.), so the relevant components of the detection device need to be manually adjusted to adapt to the detection of silicon wafers of different sizes.
[0004] Therefore, it has the following defects:
[0005] 1) Since the cassette is integrally formed, the size is single and cannot be compatible with multi-size battery wafers;
[0006] 2) Since the bearing surfaces formed by the bottom plates of the cassettes are all flat surfaces, and in the conventional integrally formed cassettes, it is difficult to ensure that adjacent two silicon wafers are aligned vertically. Therefore, in actual operation, it is very easy to cause secondary defects such as broken grids and scratches of the silicon wafers. Summary of the Utility Model
[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved silicon wafer cassette.
[0008] To solve the above technical problem, the technical solution adopted by the utility model is as follows:
[0009] A silicon wafer cassette includes a cassette bottom plate and cassette baffles. The bottom surface of the cassette bottom plate is a flat surface, and the top surface of the cassette bottom plate includes multiple inclined surfaces intersecting with the bottom surface, wherein the downward sliding guides formed by the multiple inclined surfaces are the same. There are multiple cassette baffles, and each cassette baffle is detachably installed on the cassette bottom plate from the lower part. A storage area is formed between the inner wall surface of the cassette baffle above the top surface side and the top surface of the cassette bottom plate. After the silicon wafers are placed in the storage area, the silicon wafers slide down along the inclined surfaces and abut against the inner wall surfaces of the corresponding cassette baffles to align and collect the materials.
[0010] Preferably, the angles formed by each inclined surface and the bottom surface are equal. In this way, the sliding is smoother.
[0011] In a specific implementation and preferred aspect, the multiple inclined surfaces are flush. In this way, the damage caused by the collision of the silicon wafers during sliding is further reduced.
[0012] According to a specific implementation and preferred aspect of the present utility model, the box bottom plate includes a central module and a plurality of support modules located around the central module, wherein the support surfaces formed by the central module and each support module constitute the top surface. Therefore, on the premise of reducing the contact area, the down-sliding alignment and material collection are completed, and the damage rate of the silicon wafers is reduced.
[0013] Preferably, there are four support modules, and each adjacent two support modules are spaced apart. This is conducive to achieving less contact and down-sliding guidance.
[0014] Furthermore, in the orthographic projection from the top surface to the bottom surface, the four support modules form the four corners of a square contour, and the box baffle is detachably installed on the outer end faces of the support modules where the square contour is located.
[0015] According to another specific implementation and preferred aspect of the present utility model, docking parts are formed on the outer end faces of each support module, and the box baffle is perpendicular to the bottom surface of the box bottom plate and is detachably installed on the docking parts. Therefore, no matter where it slides inward, at least it can ensure that the positioning reference surface is always at a constant angle, so as to provide the alignment degree for material collection.
[0016] Preferably, each docking part is a notch groove recessed inward from the outer end face, and the box baffle is fitted and installed in the notch groove. This avoids the box baffle causing loading obstacles, and the bottom surfaces of the box baffles are flush with the bottom surfaces of the support modules, making the placement of the material box more stable.
[0017] In some specific implementation manners, two docking parts are respectively formed on the two outer end faces of the four corners of the square contour formed by each support module, that is, when all the box baffles are installed, the eight box baffles are correspondingly distributed at the four corners of the square contour. Therefore, selective installation can be carried out according to silicon wafers of different sizes.
[0018] In addition, the top of the box baffle is inclined from outside to inside, and the contact surfaces formed with the silicon wafers are all perpendicular to the bottom surface, that is, the top inclination avoids the silicon wafers being scratched during material collection. At the same time, when the silicon wafers are aligned and collected in the storage area, at least two box baffles abut against the sides of the silicon wafers to form a positioning fence (generally, three to four are enough to form the abutment).
[0019] Due to the implementation of the above technical solutions, the present utility model has the following advantages compared with the prior art:
[0020] The existing silicon wafer cassette, due to its one-piece molding, has a single size and cannot be compatible with multi-size battery wafers (silicon wafers). At the same time, since the bearing surfaces formed by the bottom plate of the cassette are all flat surfaces, in the conventional one-piece molded cassette, it is very difficult to ensure that adjacent two silicon wafers are aligned vertically. Therefore, in the actual operation of material collection, it is very easy to cause secondary defects such as broken grids and scratches on the silicon wafers. However, the overall design of the silicon wafer cassette in the present utility model cleverly solves various deficiencies of the existing structure. After adopting this silicon wafer cassette, based on the size of the silicon wafer, a cassette baffle is installed around the bottom plate of the cassette, and a storage area is formed between the inner wall surface of the cassette baffle above the top surface side and the top surface of the cassette bottom plate. After the silicon wafers are placed in the storage area, the silicon wafers slide down along the inclined surface and abut against the inner wall surface of the corresponding cassette baffle for aligned material collection. Therefore, on the one hand, based on the detachable connection between the cassette bottom plate and the cassette baffle, the size of the storage area can be adaptively changed according to the size of the silicon wafer to meet the material collection requirements; on the other hand, through the setting method of inconsistent seat thickness of the cassette bottom plate, and under the sliding guidance in the same direction, the silicon wafers are aligned for material collection, that is, the probability of secondary defects such as broken grids and scratches is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a schematic structural diagram of the silicon wafer cassette of this embodiment;
[0022] Figure 2 is Figure 1 the front view schematic diagram of;
[0023] Figure 3 is Figure 2 the left view schematic diagram of;
[0024] Figure 4 is Figure 2 the right view schematic diagram of;
[0025] Figure 5 is Figure 2 the top view schematic diagram of;
[0026] Wherein: 1. Cassette bottom plate; 10. Bottom surface; 11. Top surface; 110. Inclined surface; 1a. Central module; 1b. Support module; 10b. Docking part;
[0027] 2. Cassette baffle;
[0028] Q. Storage area. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] In order to make the above - mentioned objects, features and advantages of the present utility model more obvious and understandable, the present utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.
[0030] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.
[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0032] In the present utility model, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above - mentioned terms in the present utility model can be understood according to specific circumstances.
[0033] In the utility model, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0034] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.
[0035] As Figures 1 to 5 shown, the wafer cassette provided in this embodiment includes a cassette bottom plate 1 and cassette baffles 2. The bottom surface 10 of the cassette bottom plate 1 is a plane, and the top surface 11 of the cassette bottom plate 1 includes a plurality of inclined surfaces 110 intersecting with the bottom surface 10, and the downward sliding guides formed by the inclined surfaces 110 are the same.
[0036] Specifically, the cassette bottom plate 1 includes a central module 1a and a plurality of support modules 1b located around the central module 1a. The support surfaces formed by the central module 1a and each support module 1b constitute the top surface 11. Therefore, under the premise of reducing the contact area, the downward sliding alignment and material collection are completed, and the damage rate of the wafers is reduced.
[0037] In some specific embodiments, there are four support modules 1b, which are respectively module A, module B, module C, and module D (distributed clockwise at intervals). The bottom surfaces of module A, module B, module C, and module D are flush, and the support surfaces of module A, module B, module C, and module D are flush with the support module 1b to form a top surface 11 with the same inclination angle (that is, the four inclined surfaces are flush, and the angles formed by each inclined surface and the bottom surface are equal). At the same time, in the orthographic projection from the top surface 11 to the bottom surface 10, the four support modules 1b form the four corners of a square contour. The cassette baffle 2 is detachably installed on the outer end surfaces of the support modules 1b where the square contour is located. In addition, a storage area Q is formed between the inner wall surface of the cassette baffle 2 above the top surface 11 side and the top surface 11 of the cassette bottom plate 1. After the wafers are placed in the storage area Q, the wafers slide down along the inclined surfaces and abut against the corresponding inner wall surfaces of the cassette baffle 2 for alignment and material collection.
[0038] In this example, the maximum thickness of module A is 30 mm, the maximum thickness of module B is 18 mm, the maximum thickness of module C is 6 mm, and the maximum thickness of module D is 17 mm. That is, the thickness of module C is the thinnest. Therefore, when the wafers are collected, they slide to point C. In this way, by this setting method with inconsistent thickness of the cassette bottom plate 1, secondary defects such as broken grids and scratches caused by uneven falling of the cassette can be improved.
[0039] In some specific embodiments, docking portions 10b are formed on the outer end faces of the respective support modules 1b, and the cartridge baffle 2 is perpendicular to the bottom surface 10 of the cartridge bottom plate 1 and is detachably mounted on the docking portion 10b. Therefore, no matter where it slides inward, at least the positioning reference surface can be ensured to always be at a constant angle, so as to provide the alignment degree for material collection.
[0040] Each docking portion 10b is a notch groove recessed inward from the outer end face, and the cartridge baffle 2 is fitted and installed in the notch groove. This avoids the cartridge baffle causing an obstacle to transfer, and the bottom surfaces of the respective cartridge baffles are flush with the bottom surface of the support module, so that the placement of the cartridge is more stable. At the same time, two docking portions are respectively formed on the two outer end faces at the four corners of the square contour formed by the respective support modules 1b, that is, when all the cartridge baffles are installed, the eight cartridge baffles are correspondingly distributed at the four corners of the square contour. Therefore, selective installation can be performed according to wafers of different sizes.
[0041] In addition, the top of the cartridge baffle 2 is inclined from outside to inside, and the contact surfaces formed with the wafers are all perpendicular to the bottom surface, that is, the inclination of the top avoids the wafers being scratched during material collection. At the same time, when the wafers are aligned and collected in the storage area, at least two cartridge baffles abut against the sides of the wafers to form a positioning fence (generally, three to four are sufficient to form the abutment).
[0042] In summary, after adopting this silicon wafer cassette, based on the size of the silicon wafer, cassette baffles are installed around the bottom plate of the cassette, and a storage area is formed between the inner wall surface of the cassette baffle above the top surface side and the top surface of the bottom plate of the cassette. After the silicon wafers are placed in the storage area, the silicon wafers slide down along the inclined surface and abut against the inner wall surface of the corresponding cassette baffle to align and collect the materials. Therefore, on the one hand, based on the detachable connection between the bottom plate of the cassette and the cassette baffle, the size of the storage area can be adaptively changed according to the size of the silicon wafer to meet the material collection requirements; on the other hand, through the setting method of inconsistent seat thickness of the bottom plate of the cassette and under the sliding guidance in the same direction, the silicon wafers are aligned to collect the materials, that is, the probability of secondary defects such as broken gates and scratches is reduced; on the third hand, the angles formed by each inclined surface and the bottom surface are equal, so that the sliding is smoother. At the same time, multiple inclined surfaces are flush-mounted, which further reduces the damage caused by the collision of the silicon wafers during sliding; on the fourth hand, the supporting surface formed by the central module and each supporting module constitutes an inclined surface. Therefore, on the premise of reducing the contact area, the sliding alignment and material collection are completed, and the damage rate of the silicon wafers is reduced; on the fifth hand, docking parts are formed on the outer end surfaces of each supporting module, and the cassette baffle is perpendicular to the bottom surface of the bottom plate of the cassette and is disassembled and assembled on the docking parts. Therefore, no matter where it slides inward, at least it can ensure that the positioning reference surface is always at a constant angle, so as to provide the alignment degree of material collection. At the same time, each docking part is a notch groove recessed inward from the outer end surface, and the cassette baffle is matched and installed in the notch groove, which avoids the cassette baffle causing transfer obstacles, and the bottom surface of each cassette baffle is flush with the bottom surface of the supporting module, which makes the placement of the cassette more stable; on the sixth hand, the top of the cassette baffle is inclined from outside to inside, and the contact surface formed with the silicon wafer is perpendicular to the bottom surface, that is, the top inclination avoids the silicon wafers being scratched during material collection. At the same time, when the silicon wafers are aligned and collected in the storage area, at least two cassette baffles abut against the sides of the silicon wafers to form a positioning grid (generally, three to four form the abutment).
[0043] The above has made a detailed description of the present invention, aiming to enable those skilled in this field to understand the content of the present invention and implement it. However, it cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.
Claims
1. A silicon wafer material box, comprising a box bottom plate (1) and a box baffle (2), characterized in that: The bottom surface (10) of the box bottom plate (1) is a plane, and the top surface (11) of the box bottom plate (1) includes a plurality of inclined surfaces (110) intersecting with the bottom surface (10), wherein the downward guides formed by the plurality of inclined surfaces (110) are the same. There are a plurality of box baffles (2), and each of the box baffles (2) is detachable from the bottom of the box bottom plate (1), and a storage area (Q) is formed between the inner wall surface of the box baffle (2) located above the top surface (11) and the top surface (11) of the box bottom plate (1). After the silicon wafer is placed in the storage area (Q), the silicon wafer slides down along the inclined surface (110) and contacts the corresponding inner wall surface of the box baffle (2) to align and collect the material.
2. The silicon wafer material box according to claim 1, characterized in that: The angles formed by each of the inclined surfaces (110) and the bottom surface (10) are equal.
3. The silicon wafer material box according to claim 2, characterized in that: The plurality of inclined surfaces (110) are arranged flush with each other.
4. The silicon wafer material box according to claim 1, characterized in that: The box bottom plate (1) comprises a central module (1a) and a plurality of supporting modules (1b) located around the central module (1a), wherein the supporting surface formed by the central module (1a) and each of the supporting modules (1b) constitutes the top surface (11).
5. The silicon wafer material box according to claim 4, characterized in that: There are four support modules (1b), and every two adjacent support modules (1b) are spaced apart from each other.
6. The silicon wafer material box according to claim 5, characterized in that: In the orthographic projection from the top surface (11) to the bottom surface (10), the four support modules (1b) form the four corners of a square outline, and the box baffle (2) is detachable from the outer end surface of the support module (1b) where the square outline is located.
7. The silicon wafer material box according to claim 6, characterized in that: A docking portion (10b) is formed on the outer end surface of each supporting module (1b), and the box baffle (2) is perpendicular to the bottom surface (10) of the box bottom plate (1) and can be assembled or disassembled on the docking portion (10b).
8. The silicon wafer material box according to claim 7, characterized in that: Each of the docking portions (10b) is a notch groove recessed inward from the outer end surface, and the box baffle (2) is matched and installed in the notch groove.
9. The silicon wafer material box according to claim 8, characterized in that: The bottom surface of each box baffle (2) is flush with the bottom surface of the supporting module (1b).
10. The silicon wafer material box according to claim 1, characterized in that: The top of the box baffle (2) is inclined from outside to inside, and the contact surface with the silicon wafer is perpendicular to the bottom surface (10); and / or, when the silicon wafer is aligned and collected in the storage area (Q), at least two of the box baffles (2) are in contact with the side of the silicon wafer to form a positioning grid.