Double-silicon-wafer feeding device

Abstract

The utility model provides a double-silicon-wafer feeding device. The double-silicon-wafer feeding device comprises a guide rail, a hand drawing mechanism and a wafer receiving mechanism. The hand drawing mechanism slides along the guide rail and comprises a first hand drawing platform and a second hand drawing platform which are arranged at an interval; a first silicon wafer placing part is arranged on the first hand-drawing platform, and a second silicon wafer placing part is arranged on the second hand-drawing platform; the splicing mechanism comprises a splicing platform and a supporting piece, and a first splicing part and a second splicing part are formed on the splicing platform; wherein the hand drawing mechanism can move to a wafer taking position, so that the first silicon wafer placing part and the second silicon wafer placing part are respectively positioned below the first wafer receiving part and the second wafer receiving part; passing areas corresponding to the first hand drawing platform and the second hand drawing platform are arranged in the middle of the first piece receiving part and the middle of the second piece receiving part respectively, and the piece receiving mechanism can move in the vertical direction to drive the piece receiving platform to move to the position above and below the hand drawing mechanism. A double-silicon-wafer hand drawing mechanism is adopted, so that the productivity is higher; and the double silicon wafers are directly replaced from the hand drawing mechanism to the wafer receiving mechanism, so that the taking and placing precision is high.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafers, and particularly to a double-silicon-wafer loading device. Background Art

[0002] Currently, the silicon-wafer loading devices in mass production on the market are single-silicon-wafer loading devices, and they use pin belts for transmission; however, during the operation of the pin belts, movement deviations are likely to occur, resulting in the silicon wafers being placed with overlapping edges; currently, this abnormality has not been completely solved, and overlapping edges of the silicon wafers will cause missed suction and suction cup marks; secondly, during the transmission process of the pin belts, debris particles are likely to adhere to the splicing platform due to broken and cracked silicon wafers, resulting in small-batch scratches; due to the concealment of small-batch scratches, the production capacity and yield of the entire process are greatly affected.

[0003] Therefore, it is necessary to design a double-silicon-wafer loading device with high production capacity and picking and placing accuracy. Utility Model Content

[0004] The present application provides a double-silicon-wafer loading device with high production capacity and picking and placing accuracy.

[0005] According to an embodiment of the present specification, a double-silicon-wafer loading device is provided, including:

[0006] A guide rail;

[0007] A pulling mechanism that slides along the guide rail and includes a first pulling platform and a second pulling platform arranged at intervals; a first silicon-wafer placement part is provided on the first pulling platform, and a second silicon-wafer placement part is provided on the second pulling platform;

[0008] A splicing mechanism that includes a splicing platform and a support member, and a first splicing part and a second splicing part are formed on the splicing platform;

[0009] Wherein, the pulling mechanism can move to a wafer-taking position so that the first silicon-wafer placement part and the second silicon-wafer placement part are respectively located below the first splicing part and the second splicing part; through areas corresponding to the first pulling platform and the second pulling platform are respectively provided in the middle of the first splicing part and the second splicing part, and the splicing mechanism can move in the vertical direction to drive the splicing platform to move above and below the pulling mechanism.

[0010] Further, the splicing mechanism includes a first support platform, a second support platform, and a third support platform that are arranged alternately with the first pulling platform and the second pulling platform; the first support platform and the second support platform jointly form the first splicing part, and the second support platform and the third support platform jointly form the second splicing part.

[0011] Further, the double-wafer loading device further includes a lifting mechanism, which includes a base, a telescopic cylinder, and a support plate. The first support platform is fixed on the support plate, and two ends of the telescopic cylinder are respectively connected to the base and the support plate.

[0012] Further, the wafer bonding mechanism further includes a support member located above the bonding platform. The support member includes a main rod and three connecting rods. One ends of the three connecting rods are respectively connected to the main rod, and the other ends are respectively connected to the first support platform, the second support platform, and the third support platform.

[0013] Further, the three connecting rods are connected to the main rod through pins and can move in the vertical direction to adjust the connection positions with the main rod.

[0014] Further, a plurality of first positioning members and a plurality of first glass gaskets are respectively provided on the first support platform, the second support platform, and the third support platform.

[0015] Further, the first wafer placement portion includes a first adsorption hole and a second glass gasket, the second wafer placement portion includes a second adsorption hole and a third glass gasket. The first bonding portion and the second bonding portion are both square and each includes four of the first glass gaskets; the first positioning members are provided at the edges of the first bonding portion and the second bonding portion.

[0016] Further, three wafer picking positions are provided on the bonding platform;

[0017] Two sets of the first wafer placement portions are provided on the first extraction platform, and two sets of the second wafer placement portions are provided on the second extraction platform.

[0018] Further, the double-wafer loading device further includes a position sensor arranged along the guide rail to determine whether the extraction mechanism slides to the wafer picking position.

[0019] Further, the extraction mechanism further includes a connecting plate for connecting the first extraction platform and the second extraction platform. The connecting plate is in sliding fit with the guide rail.

[0020] The present application has the following beneficial effects: By respectively placing the double wafers on the first extraction platform and the second extraction platform of the extraction mechanism, the production capacity is higher; and the double wafers are directly replaced from the extraction mechanism to the bonding mechanism, with high picking and placing accuracy.

[0021] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments in accordance with this specification, and are used together with the specification to explain the principles of this specification.

[0023] Figure 1 It is a schematic structural diagram of the double-wafer loading device of this application;

[0024] Figure 2 It is a schematic structural diagram of the assembly of the wafer bonding mechanism and the lifting mechanism of this application;

[0025] Figure 3 It is a schematic structural diagram of the wafer bonding mechanism of this application;

[0026] Figure 4 It is a schematic structural diagram of the lifting mechanism of this application;

[0027] Figure 5 It is a schematic structural diagram of the wafer extraction mechanism, the wafer bonding mechanism and the lifting mechanism of this application;

[0028] Figure 6 It is a schematic structural diagram of the support member of this application;

[0029] Figure 7 It is a schematic structural diagram of the wafer extraction mechanism of this application.

[0030] Explanation of reference numerals:

[0031] 10 - Guide rail;

[0032] 20 - Wafer extraction mechanism; 21 - First wafer extraction platform; 211 - First wafer placement part; 2111 - First adsorption hole; 2112 - Second glass gasket; 22 - Second wafer extraction platform; 221 - Second wafer placement part; 2211 - Second adsorption hole; 2212 - Third glass gasket; 23 - Air pipe; 24 - Connection plate;

[0033] 30 - Wafer bonding mechanism; 31 - Wafer bonding platform; 311 - First support platform; 312 - Second support platform; 313 - Third support platform; 32 - First wafer bonding part; 33 - Second wafer bonding part; 34 - Support member; 341 - Main rod; 342 - Connecting rod; 35 - First positioning member; 36 - First glass gasket;

[0034] 40 - Lifting mechanism; 41 - Base; 42 - Telescopic cylinder; 43 - Support plate. Detailed implementation manners

[0035] Refer to Figure 1 and Figure 3As shown, this embodiment discloses a double-wafer loading device, which can be used not only for the transfer of wafers, but also for the transfer of devices such as solar cells. And this loading device can convey two wafers at a time, improving the wafer loading production capacity.

[0036] Specifically, the double-wafer loading device includes a guide rail 10, a wafer-picking mechanism 20 and a wafer-receiving mechanism 30. The wafer-picking mechanism 20 slides along the guide rail 10 and includes a first wafer-picking platform 21 and a second wafer-picking platform 22 arranged at intervals; a first wafer placement part 211 is provided on the first wafer-picking platform 21, and a second wafer placement part 221 is provided on the second wafer-picking platform 22; the wafer-receiving mechanism 30 includes a wafer-receiving platform 31 and a support member 34, and a first wafer-receiving part 32 and a second wafer-receiving part 33 are formed on the wafer-receiving platform 31.

[0037] Among them, the wafer-picking mechanism 20 can move to a wafer-picking position, so that the first wafer placement part 211 and the second wafer placement part 221 are respectively located below the first wafer-receiving part 32 and the second wafer-receiving part 33; through areas corresponding to the first wafer-picking platform 21 and the second wafer-picking platform 22 are respectively provided in the middle of the first wafer-receiving part 32 and the second wafer-receiving part 33, and the wafer-receiving mechanism 30 can move in the vertical direction to drive the wafer-receiving platform 31 to move above and below the wafer-picking mechanism 20.

[0038] In this way, by respectively placing the two wafers on the first wafer-picking platform 21 and the second wafer-picking platform 22 of the wafer-picking mechanism 20, the wafer-picking mechanism 20 slides on the guide rail 10, eliminating the adverse effects caused by the running error of the pin belt and ensuring the stable operation of the loading device. In addition, when the wafer-picking mechanism 20 slides to a wafer-picking position and the wafer-receiving mechanism 30 moves from the bottom to the top, the first wafer and the second wafer on the first wafer-picking platform 21 and the second wafer-picking platform 22 are transferred to the first wafer-receiving part 32 and the second wafer-receiving part 33, completing the transfer of the two wafers and ensuring the placing accuracy.

[0039] In this embodiment, referring to Figure 2-3 As shown, the wafer-receiving platform 31 includes a first support platform 311, a second support platform 312 and a third support platform 313 that are arranged staggeredly with the first wafer-picking platform 21 and the second wafer-picking platform 22. That is, starting from one side of the first support platform 311, the first wafer-picking platform 21, the second support platform 312, the second wafer-picking platform 22 and the third support platform 313 are also sequentially arranged.

[0040] Further, a first tab portion 32 is formed between the first support platform 311 and the second support platform 312; a second tab portion 33 is formed between the second support platform 312 and the third support platform 313. That is, in this embodiment, the second support platform 312 carries two silicon wafers simultaneously. In this way, the overall structure of the drawer mechanism 20 can be made simpler, and the gravity of the hoisting of the support member 34 can be reduced. The first tab portion 32 and the second tab portion 33 mentioned here only support the two ends of the silicon wafer, and there is no supporting force in the middle part of the silicon wafer.

[0041] In another feasible embodiment, two second support platforms 312 can also be provided between the first drawer platform 21 and the second drawer platform 22. The two second support platforms 312 cooperate with the first support platform 311 and the second support platform 312 respectively to form a silicon wafer tab portion.

[0042] In this embodiment, by providing the suspended tab platform 31, the obstacles encountered in the operation of the drawer mechanism 20 are eliminated; and a method of using the support member 34 for suspension is proposed to solve the horizontal problem of the tab platform 31.

[0043] Further, referring to Figure 6 As shown, the support member 34 is located above the tab platform 31. It includes a main rod 341 and three connecting rods 342. One ends of the three connecting rods 342 are respectively connected to the main rod 341, and the other ends are respectively connected to the first support platform 311, the second support platform 312, and the third support platform 313. The above connections can all be fixedly connected by screws, which is convenient for later disassembly and installation.

[0044] Further, one ends of the three connecting rods 342 are respectively perpendicular to the main rod 341, and the other ends are respectively perpendicular to the first support platform 311, the second support platform 312, and the third support platform 313. In this way, a square space is formed between the support member 34 and the tab mechanism 30. The space is large, and an avoidance position can be formed with the drawer mechanism 20 for the drawer mechanism 20 to slide along the guide rail 10.

[0045] In this embodiment, one ends of the three connecting rods 342 are respectively connected to the main rod 341 by pins and can move vertically to adjust the connection position with the main rod 341. In this way, the heights of the other ends of the three connecting rods 342 connected to the tab platform 31 can be synchronously adjusted to adapt to different process requirements.

[0046] In this embodiment, referring to Figure 4-5As shown in the figure, the double-wafer loading device further includes a lifting mechanism 40. The lifting mechanism 40 includes a base 41, a telescopic cylinder 42, and a support plate 43. The first support platform 311 is fixed on the support plate 43. The two ends of the telescopic cylinder 42 are respectively connected to the base 41 and the support plate 43. In this way, the telescopic cylinder 42 drives the first support platform 311 to move up and down, and synchronously drives the second support platform 312 and the third support platform 313 to move up and down.

[0047] In another implementable embodiment, a lifting mechanism 40 can also be synchronously arranged on one side of the third support platform 313. In this way, the first support platform 311 and the third support platform 313 are respectively lifted by the lifting mechanisms 40 near them, and the stability is good.

[0048] In this embodiment, a plurality of wafer-taking positions are provided on the bonding platform 31, and a plurality of first positioning members 35 and a plurality of first glass gaskets 36 are provided at a single wafer-taking position. The first positioning member 35 mentioned here refers to a bonding platform pin, which is used to finely adjust the position of the wafer to ensure the accurate placement position of the wafer. In addition, the first glass gasket 36 is located on the upper surface of the bonding platform 31 and is used to contact the wafer, avoiding the wafer from contacting the bonding platform 31, effectively protecting the cleanliness of the wafer, and improving the yield rate of the wafer.

[0049] Specifically, both the first bonding part 32 and the second bonding part 33 are square and respectively include four first glass gaskets 36; the first positioning members 35 are arranged at the edges of the first bonding part 32 and the second bonding part 33 to position the wafer, with high picking and placing accuracy, thereby reducing the probability of overlap; and the hidden cracked wafers will directly fall from the bonding platform to the lower part, without affecting the subsequent wafers.

[0050] In addition, in this embodiment, since the second support platform 312 is shared, that is, it supports double wafers at the same time, the first glass gaskets 36 on the second support platform extend respectively towards the adjacent first pulling platform 21 and the second pulling platform 22.

[0051] In this embodiment, three wafer-taking positions are provided for the first positioning members 35 and the first glass gaskets 36. In this way, the bonding mechanism 30 can carry six wafers at the same time, facilitating the grasping in the next process. Of course, the wafer-taking positions can also be set in multiple groups according to actual needs, such as two groups, four groups, etc., to meet the requirements of different processes and devices.

[0052] Refer to Figure 7As shown, the first silicon wafer placement part 211 includes a first adsorption hole 2111 and a second glass gasket 2112, and the second silicon wafer placement part 221 includes a second adsorption hole 2211 and a third glass gasket 2212. In this embodiment, one end of the air pipe 23 is respectively connected to the first adsorption hole 2111 and the second adsorption hole 2211, and the other end uses a vacuum pump or a vacuum system to create a negative pressure environment, generating a suction force between the silicon wafer and the adsorption surface, so as to adsorb the silicon wafer on the surfaces of the first extraction platform 21 and the second extraction platform 22.

[0053] Of course, in addition to the above gas adsorption, mechanical adsorption can also be used: using a movable suction cup or adsorption device to adsorb an object by changing the pressure or generating a vacuum. Or electrostatic adsorption: using the electrostatic principle to adsorb an object on the surface, by applying a charge on the adsorption surface, or generating an electrostatic field on the object surface, so that the object is adsorbed on the surface. Or chemical adsorption: using chemical adsorption force to adsorb an object on the surface. Or gravity adsorption: by adjusting the surface roughness or shape, making the object be adsorbed on the surface under the action of gravity. Of course, the above specific adsorption methods include but are not limited to the above methods, and are not specifically limited here. Selecting a suitable adsorption method depends on the properties of the adsorbed object, surface characteristics, and specific application requirements.

[0054] In addition, in this embodiment, by providing the second glass gasket 2112 and the third glass gasket 2212, the cleanliness of the silicon wafer is effectively protected, and the yield rate of the silicon wafer is improved.

[0055] In this embodiment, two groups of first silicon wafer placement parts 211 are provided on the first extraction platform 21, and two groups of second silicon wafer placement parts 221 are provided on the second extraction platform 22. In this way, when one group of adsorption holes and glass gaskets work abnormally, the other group of adsorption holes and glass gaskets can be adjusted in time to perform the extraction work of the silicon wafer; of course, by providing two groups of adsorption holes and glass gaskets, it can also be used to synchronously transfer four silicon wafers to improve the working efficiency of the double-silicon wafer loading device.

[0056] In this embodiment, the double-silicon wafer loading device further includes a position sensor, and the position sensor is arranged along the guide rail 10 to judge whether the extraction mechanism 20 slides to the wafer picking position. The position sensors mentioned here include but are not limited to linear position sensors, ultrasonic position sensors, laser ranging sensors, magnetic position sensors, etc. The specific position sensor is not limited here, and a suitable position sensor can be selected in combination with application requirements, such as measurement range, accuracy, environmental conditions, etc.

[0057] In this embodiment, referring to Figure 7 As shown, the extraction mechanism 20 further includes a connecting plate 24, and the connecting plate 24 is used to connect the first extraction platform 21 and the second extraction platform 22, and the connecting plate 24 is slidably matched with the guide rail 10.

[0058] In a feasible embodiment, the mating relationship between the guide rail 10 and the connecting plate 24 can be an interference fit, which means that the size of the connecting plate 24 is slightly larger than that of the guide rail 10, and pressure needs to be applied to combine the two parts together. Or a clearance fit, where there is a certain clearance between the guide rail 10 and the connecting plate 24, allowing them to move relatively freely, but the clearance is not too large.

[0059] Of course, the mating relationship between the above-mentioned guide rail 10 and the connecting plate 24 includes but is not limited to the above methods, and specific details are not restricted here. It can be adjusted in combination with design requirements, working environment, and expected usage conditions, etc.

Claims

1. A dual silicon wafer feeding device, characterized in that: include: guide; A hand-drawing mechanism slides along the guide rail, comprising a first hand-drawing platform and a second hand-drawing platform arranged at intervals; The first handle platform is provided with a first silicon wafer placement portion, and the second handle platform is provided with a second silicon wafer placement portion; The splicing mechanism comprises a splicing platform and a supporting member, wherein the splicing platform is formed with a first splicing portion and a second splicing portion; In which, the hand-pulling mechanism can be moved to a wafer taking position so that the first silicon wafer placing part and the second silicon wafer placing part are respectively located below the first wafer connecting part and the second wafer connecting part; the middle parts of the first wafer connecting part and the second wafer connecting part are respectively provided with passing areas corresponding to the first hand-pulling platform and the second hand-pulling platform, and the wafer connecting mechanism can be moved in the vertical direction to drive the wafer connecting platform to move above and below the hand-pulling mechanism.

2. The dual silicon wafer loading device according to claim 1, characterized in that: The sheet-jointing platform includes a first support platform, a second support platform and a third support platform which are arranged alternately with the first hand-jointing platform and the second hand-jointing platform; the first support platform and the second support platform together form the first sheet-jointing portion, and the second support platform and the third support platform together form the second sheet-jointing portion.

3. The dual silicon wafer loading device according to claim 2, characterized in that: The dual silicon wafer loading device also includes a lifting mechanism, which includes a base, a telescopic cylinder and a support plate. The first support platform is fixed on the support plate, and the two ends of the telescopic cylinder are respectively connected to the base and the support plate.

4. The dual silicon wafer loading device according to claim 2, characterized in that: The support member is located on the upper part of the splice platform, and includes a main rod and three connecting rods, one end of the three connecting rods is respectively connected to the main rod, and the other end is respectively connected to the first supporting platform, the second supporting platform and the third supporting platform.

5. The dual silicon wafer loading device according to claim 4, characterized in that: The three connecting rods are connected to the main rod through pins and can be moved in a vertical direction to adjust the connection position with the main rod.

6. The dual silicon wafer loading device according to claim 2, characterized in that: A plurality of first positioning members and a plurality of first glass gaskets are respectively disposed on the first supporting platform, the second supporting platform and the third supporting platform; the first connecting piece portion and the second connecting piece portion are both square and include four first glass gaskets respectively; the first positioning member is disposed on the edges of the first connecting piece portion and the second connecting piece portion.

7. The dual silicon wafer loading device according to claim 6, characterized in that: The first silicon wafer placement portion includes a first adsorption hole and a second glass spacer, and the second silicon wafer placement portion includes a second adsorption hole and a third glass spacer.

8. The dual silicon wafer loading device according to claim 7, characterized in that: The film-joining platform is provided with three film-taking positions; The first handle platform is provided with two groups of the first silicon wafer placing parts, and the second handle platform is provided with two groups of the second silicon wafer placing parts.

9. The dual silicon wafer loading device according to claim 1, characterized in that: The dual silicon wafer loading device further comprises a position sensor, which is arranged along the guide rail to determine whether the hand-drawing mechanism slides to a wafer taking position.

10. The dual silicon wafer loading device according to claim 1, characterized in that: The hand-drawing mechanism further includes a connecting plate, which is used to connect the first hand-drawing platform and the second hand-drawing platform, and the connecting plate is slidably matched with the guide rail.

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