Silicon wafer conveying device

By using ion air circulation curtain to form circulation wind, the silicon wafer is stabilized in the void, and the problems of surface pollution, abrasions and unstable transmission in the existing conveying methods are solved, and efficient and stable silicon wafer transportation is achieved.

CN223023244UActive Publication Date: 2025-06-24HEFEI & SOLAR TECH
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Patent Information

Application Number
CN202422096001.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-27
Publication Date
2025-06-24
Estimated Expiration
2034-08-27

AI Technical Summary

Technical Problem

In the existing silicon wafer conveying methods, belt transmission and suction cup grabbing will cause surface contamination, abrasions and unstable transmission of silicon wafers, affecting the yield rate and transmission efficiency of solar cells.

Method used

Multiple vertically placed ion air curtains are used to form circulating air through the ion air generator to stabilize the silicon wafer in the gaps, so that it remains vertical during the transportation process, avoiding bumps, scratches and sliding.

Benefits of technology

The contactless and damage-free vertical transport of silicon wafers is achieved, which reduces the risk of surface pollution and damage, and greatly improves the yield rate and transmission efficiency of solar cells.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a silicon wafer conveying device, and relates to the technical field of solar cell preparation. The silicon wafer conveying device comprises a plurality of ion wind circulation curtains which are vertically arranged, ion wind generators corresponding to the ion wind circulation curtains, and cushion blocks installed at the bottoms of the ion wind circulation curtains. The ionic wind circulation curtain comprises a front air outlet panel and a rear air outlet panel which are parallel to each other; a gap between the front air outlet panel and the rear air outlet panel is used for storing vertical silicon wafers; the cushion block is movably connected with the ionic wind circulation curtain; the cushion block is switched between a first locking position and a second locking position; under the condition that the cushion block is located at the first locking position, the gap is communicated with the outside, so that a vertical silicon wafer enters and exits the gap; the cushion block at the second locking position is used for supporting the silicon wafer vertically placed in the gap; the ion wind generator is used for forming circulating wind in the gap so as to stabilize the silicon wafers vertically placed in the gap. According to the scheme, non-contact conveying of the silicon wafers in the vertical state can be achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of solar cell preparation, in particular to a wafer conveying device. Background Art

[0002] During the production and manufacturing process of solar cells, belt transmission, suction cup grasping and other methods are mostly used for wafer picking and conveying. Belt transmission will make the wafer directly contact with the belt, and dirt such as water or dust on the belt surface may cause serious pollution to the wafer surface, affecting the yield of solar cells. Moreover, once the wafer slips during the transmission process, it will also affect the transmission efficiency of the wafer. Suction cup grasping will also make the wafer directly contact with the suction cup, resulting in scratches on the wafer surface, affecting the yield of solar cells. And after the suction cup moves to the wafer stacking position, the sucked wafers are stacked together by releasing the suction cup, which easily causes the wafers to be stacked unevenly and generate errors, and even the stacking height exceeds the requirements and cannot be loaded, affecting the transmission efficiency of the wafers. Therefore, both belt transmission and suction cup grasping methods may reduce the yield of solar cells and the transmission efficiency of wafers. Summary of the Utility Model

[0003] In view of this, the embodiment of the utility model provides a wafer conveying device, which can realize non-contact conveying of wafers in a vertical state and reduce the risk of damage during the wafer conveying process.

[0004] To achieve the above object, the utility model actually provides a wafer conveying device, including:

[0005] A plurality of vertically placed ion wind circulation curtains, an ion wind generator corresponding to each ion wind circulation curtain, and a spacer installed at the bottom of each ion wind circulation curtain;

[0006] The above-mentioned ion wind circulation curtain includes a front air outlet panel and a rear air outlet panel that are parallel to each other;

[0007] The gap between the above-mentioned front air outlet panel and the above-mentioned rear air outlet panel is used to store vertical wafers;

[0008] The above-mentioned spacer is movably connected to the above-mentioned ion wind circulation curtain;

[0009] The above-mentioned spacer switches between a first locking position and a second locking position;

[0010] When the above-mentioned spacer is in the above-mentioned first locking position, the above-mentioned gap communicates with the outside to enable vertical wafers to enter and exit the above-mentioned gap;

[0011] The above-mentioned spacer in the above-mentioned second locking position is used to support the above-mentioned wafers vertically placed in the above-mentioned gap;

[0012] The above ion wind generator is used to form a circulating wind in the gap between the above front air outlet panel and the above rear air outlet panel to stabilize the above silicon wafer vertically placed in the gap.

[0013] One embodiment of the above utility model has the following advantages or beneficial effects: By placing the silicon wafer in the ion wind circulating curtain provided with the front air outlet panel and the rear air outlet panel, the front air outlet panel and the rear air outlet panel blow air on both surfaces of the silicon wafer at the same time, thereby forming a circulating wind on each surface respectively, so as to generate a pressure difference with the surrounding atmosphere, stabilize the silicon wafer in the gap, prevent the silicon wafer from tilting during transportation, reduce the risk of the surface of the silicon wafer being knocked, scratched or abraded during transportation, and greatly improve the yield rate of solar cells. In addition, the circulating wind on both surfaces of the silicon wafer can also clean the dirt on the surface of the silicon wafer. Due to the blowing of the wind, dust cannot adhere to the surface of the silicon wafer during transportation, making the surface of the silicon wafer cleaner. While improving the yield rate, it also makes the prepared solar cell beautiful in appearance, clean and tidy.

[0014] By using the cushion block installed at the bottom of the ion wind circulating curtain to support the silicon wafer vertically placed in the gap, the silicon wafer stands firmly in the gap during transportation, that is, it will neither fall nor slide, improving the transportation stability of the silicon wafer and reducing the risk of the silicon wafer falling off and the damage rate.

[0015] The further effects of the above non-conventional optional methods will be described below in combination with specific embodiments. Description of the Drawings

[0016] The drawings are used to better understand the present utility model and do not constitute an improper limitation to the present utility model. Among them:

[0017] Figure 1 is a schematic structural view of a silicon wafer conveying device according to an embodiment of the present utility model;

[0018] Figure 2 is a left view of a silicon wafer conveying device according to an embodiment of the present utility model;

[0019] Figure 3 is a bottom view of a silicon wafer conveying device according to an embodiment of the present utility model;

[0020] Figure 4 is a side view of an ion wind circulating curtain according to an embodiment of the present utility model;

[0021] Figure 5 is a sectional view of an ion wind circulating curtain according to an embodiment of the present utility model;

[0022] Figure 6 is a schematic view of a rotatingly connected cushion block located at a first locking position according to an embodiment of the present utility model;

[0023] Figure 7 Schematic diagram of the spacer block with rotational connection according to an embodiment of the present utility model being in the second locking position;

[0024] Figure 8 Schematic diagram of the spacer block with folding connection according to an embodiment of the present utility model being in the first locking position;

[0025] Figure 9 Schematic diagram of the spacer block with folding connection according to an embodiment of the present utility model being in the second locking position;

[0026] Figure 10 Schematic diagram of the spacer block with telescopic connection according to an embodiment of the present utility model being in the first locking position;

[0027] Figure 11 Schematic diagram of the spacer block with telescopic connection according to an embodiment of the present utility model being in the second locking position;

[0028] Figure 12 Schematic structural diagram of a silicon wafer conveying device provided with a multi-joint robotic arm according to an embodiment of the present utility model.

[0029] Reference numerals:

[0030] 10 - Ion wind circulation curtain; 101 - First ion wind circulation curtain; 102 - Second ion wind circulation curtain; 103 - Third ion wind circulation curtain; 104 - Fourth ion wind circulation curtain; 11 - Front air outlet panel; 12 - Rear air outlet panel; 121 - Uniform flow air holes; 13 - Upper air outlet hole; 14 - Lower air outlet hole; 15 - Upper air outlet pipe; 16 - Lower air outlet pipe; 17 - Bottom plate; 20 - Ion wind generator; 30 - Spacer block; 40 - Silicon wafer; 50 - Rotating component; 60 - Folding component; 70 - Telescopic component; 80 - Carrying structure; 90 - Start valve; 100 - Multi-joint robotic arm; 110 - Rotational connection structure. Detailed implementation manners

[0031] In the existing silicon wafer picking and conveying method, the silicon wafers are generally placed horizontally on the conveying device or in a horizontal state when picked up by a suction cup. However, due to the next process step in the preparation process of solar cells, the silicon wafers need to be placed in a flower basket, and the silicon wafers are in a vertically placed state in the flower basket. Therefore, the existing silicon wafer picking and conveying method not only results in a low yield of solar cells produced, but also after the silicon wafers are conveyed to the flower basket, workers still need to adjust the horizontally placed silicon wafers to a vertically placed state and move them into the flower basket for subsequent production processes.

[0032] The exemplary embodiments of the present utility model will be described below in conjunction with the accompanying drawings. Various details of the embodiments of the present utility model are included to facilitate understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present utility model. Similarly, descriptions of well-known functions and structures are omitted in the following description for clarity and conciseness.

[0033] In the embodiments of the present utility model, "vertical" refers to the vertical direction relative to the horizontal direction, where the horizontal direction refers to the direction parallel to the horizontal plane. In the embodiments of the present utility model, "first", "second", etc. are used to distinguish different structures or the same structures in different positions, and do not limit the quantity, order, etc. of the structures or components.

[0034] Figure 1 is a schematic structural view of a wafer conveying device according to an embodiment of the present utility model, Figure 2 is a left view of the wafer conveying device according to an embodiment of the present utility model. As Figure 1 and Figure 2 shown, the wafer conveying device of the embodiment of the present utility model mainly includes: a plurality of vertically arranged ion wind circulation curtains 10, an ion wind generator 20 corresponding to each ion wind circulation curtain 10, and a spacer 30 installed at the bottom of each ion wind circulation curtain 10; the above ion wind circulation curtain 10 includes a front air outlet panel 11 and a rear air outlet panel 12 that are parallel to each other; the gap between the above front air outlet panel 11 and the above rear air outlet panel 12 is used to store vertical wafers 40; the above spacer 30 is movably connected to the above ion wind circulation curtain 10; the above spacer 30 switches between a first locking position and a second locking position; when the above spacer 30 is in the above first locking position, the above gap communicates with the outside to enable vertical wafers 40 to enter and exit the above gap; the above spacer 30 in the above second locking position is used to support the above wafers 40 vertically placed in the above gap; the above ion wind generator 20 is used to form a circulating wind in the gap between the above front air outlet panel 11 and the above rear air outlet panel 12 to stabilize the above wafers 40 vertically placed in the above gap.

[0035] Among them, the ion wind circulation curtains 10 can be arranged in a multi-row and multi-column structure; the multiple ion wind circulation curtains 10 in each adjacent two rows are arranged in a dislocation manner.

[0036] As an example, Figure 3 is a bottom view of the wafer conveying device according to an embodiment of the present utility model. As Figure 3As shown, in the x direction, the ionic wind circulation curtain 10 can be provided with several rows. When there are four rows, multiple first ionic wind circulation curtains 101 are arranged in parallel, multiple second ionic wind circulation curtains 102 are arranged in parallel, multiple third ionic wind circulation curtains 103 are arranged in parallel, and multiple fourth ionic wind circulation curtains 104 are arranged in parallel. However, in the x direction, the first ionic wind circulation curtain 101, the second ionic wind circulation curtain 102, the third ionic wind circulation curtain 103, and the fourth ionic wind circulation curtain 104 are arranged staggeredly. In the y direction, the ionic wind circulation curtain can be provided with several columns. The first ionic wind circulation curtain 101 and the second ionic wind circulation curtain 102 are arranged in parallel to form one column, and the third ionic wind circulation curtain 103 and the fourth ionic wind circulation curtain 104 are arranged in parallel to form one column. However, the first ionic wind circulation curtain 101 and the third ionic wind circulation curtain 103 are not in the same column, that is, in the y direction, the first ionic wind circulation curtain 101 and the third ionic wind circulation curtain 103 are arranged staggeredly. Through the above settings, as Figure 3 shown, it can make the ionic wind circulation curtains in each column jointly transport the same silicon wafer 40. For example, the first ionic wind circulation curtain 101 and the second ionic wind circulation curtain 102 in the first column jointly transport a silicon wafer 40, and the third ionic wind circulation curtain 103 and the fourth ionic wind circulation curtain 104 in the second column jointly transport another silicon wafer 40, etc. And because the ionic wind circulation curtains in different rows are arranged staggeredly, the gaps between the ionic wind circulation curtains in each column are reduced, and the problem that the airflows affect each other due to the close positions of the ionic wind circulation curtains, resulting in the silicon wafers being unable to be stably placed vertically in the gaps, is avoided. Compared with the silicon wafer conveying device in which the ionic wind circulation curtains are not arranged staggeredly, more silicon wafers can be transported more safely with a smaller volume, greatly improving the conveying efficiency of the silicon wafers.

[0037] Each ionic wind circulation curtain 10 corresponds to an ionic wind generator 20 to provide wind for the ionic wind circulation curtain 10 when the ionic wind generator 20 is turned on. As Figure 1 shown, when the ionic wind circulation curtain 10 is arranged in multiple rows and columns, and the multiple ionic wind circulation curtains 10 in each adjacent two rows are arranged dislocationally, the corresponding ionic wind generators 20 are also arranged in multiple rows and columns, and the ionic wind generators 20 in each adjacent two rows are arranged dislocationally.

[0038] Figure 4 is a side view of the ionic wind circulation curtain according to an embodiment of the present invention. As Figure 4 shown, an upper air outlet 13 and a lower air outlet 14 are further provided in the ionic wind circulation curtain 10. Among them, the upper air outlet 13 is connected to the front air outlet panel 11 to introduce the wind generated by the ionic wind generator 20 into the front air outlet panel 11; the lower air outlet 14 is connected to the rear air outlet panel 12 to introduce the wind generated by the ionic wind generator 20 into the rear air outlet panel 12.

[0039] Uniformly arranged flow equalizing air holes 121 are provided on the surface of the front air outlet panel 11 facing the gap where the vertical silicon wafers 40 are stored and on the surface of the rear air outlet panel 12 facing the gap where the vertical silicon wafers 40 are stored. Figure 5 It is a sectional view of the ion wind circulation curtain according to an embodiment of the present invention. When the plane where the silicon wafers 40 placed vertically in the gap is used as the dividing surface, the structure of the surface of the rear air outlet panel 12 facing the gap is shown. Figure 5 . As Figure 5 shown, a number of uniformly arranged flow equalizing air holes 121 are provided on the surface of the rear air outlet panel 12 facing the gap. Similarly, a number of uniformly arranged flow equalizing air holes 121 are also provided on the surface of the front air outlet panel 11 facing the gap. After the upper air outlet hole 13 introduces air into the front air outlet panel 11 and the lower air outlet hole 14 introduces air into the rear air outlet panel 12, the air blows out through the flow equalizing air holes 121 on the front air outlet panel 11 and the rear air outlet panel 12, so as to form a circulating air flow in the gap between the front air outlet panel 11 and the rear air outlet panel 12.

[0040] When there are vertical silicon wafers 40 in the above-mentioned gap, the air blown out from the flow equalizing air holes 121 on the front air outlet panel 11 can blow to one side of the silicon wafers 40 facing the front air outlet panel 11 and form a circulating air flow on this side; the air blown out from the flow equalizing air holes 121 on the rear air outlet panel 12 blows to one side of the silicon wafers 40 facing the rear air outlet panel 12 and forms a circulating air flow on this side. By increasing the air flow rate on both surfaces of the silicon wafers 40, a pressure difference is formed with the surrounding atmosphere, so that the vertical silicon wafers 40 placed in the gap are firmly erected and will not move or tilt to one side of the front air outlet panel 11 or the rear air outlet panel 12, reducing the risk of the surface of the silicon wafers 40 being bumped, scratched or abraded during the conveying process, and greatly improving the yield rate of the solar cells. In addition, the circulating air flow on both surfaces of the silicon wafers 40 can also clean the dirt on the surface of the silicon wafers. Due to the blowing of the air, dust cannot adhere to the surface of the silicon wafers during the conveying process, making the surface of the silicon wafers cleaner.

[0041] In an alternative embodiment, in order to connect the upper air outlet hole 13 and the lower air outlet hole 14 to the ion wind generator 20, as Figure 4As shown in the figure, the silicon wafer conveying device further includes: an upper air outlet pipe 15 connecting the ion wind generator 20 and the upper air outlet 13, and a lower air outlet pipe 16 connecting the ion wind generator 20 and the lower air outlet 14. After the ion wind generator 20 corresponding to the ion wind circulation curtain 10 is started, the wind generated in the ion wind generator 20 flows along the upper air outlet pipe 15 and the lower air outlet pipe 16 at the same time, flows into the front air outlet panel 11 through the upper air outlet pipe 15 and the upper air outlet 13. At the same time, it flows into the rear air outlet panel 12 through the lower air outlet pipe 16 and the lower air outlet 14, and is blown out from the uniform flow air holes 121 on the front air outlet panel 11 and the rear air outlet panel 12. When a silicon wafer is placed in the gap, the wind blown out from the uniform flow air holes 121 forms a circulation on both surfaces of the silicon wafer, generating a pressure difference with the surrounding atmosphere, so that the silicon wafer can be stably erected in the gap and will not tilt to any side.

[0042] Furthermore, the upper air outlet pipe 15 and the lower air outlet pipe 16 have the same length, so that the wind generated by the ion wind generator 20 can be blown out from the uniform flow air holes 121 on the front air outlet panel 11 and the rear air outlet panel 12 at the same time, thus avoiding the situation where the wind blowing on both sides of the silicon wafer 40 is not blown out at the same time and the silicon wafer 40 tilts due to uneven force on the silicon wafer 40.

[0043] In an alternative embodiment, as Figure 4 shown, the above-mentioned ion wind circulation curtain 10 may further include a bottom plate 17 located on the side of the rear air outlet panel 12 away from the front air outlet panel 11. The bottom plate 17 is used to fix the upper air outlet 13 and the lower air outlet 14. The front air outlet panel 11 is connected through the upper air outlet 13, and the rear air outlet panel 12 is connected through the lower air outlet 14, so as to integrate the various components in the ion wind circulation curtain 10 into one body, improving the strength and support of the device.

[0044] In addition, the bottom plate 17 is a hollow structure, and the upper air outlet pipe 15 and the lower air outlet pipe 16 are located in the hollow structure. The bottom plate 17 can be in a "C" - shaped structure. One end of the upper air outlet pipe 15 is located on the upper frame of the bottom plate 17 to connect the ion wind generator 20. The pipe body of the upper air outlet pipe 15 winds around in the hollow structure, and the other end is connected and fixed to the upper air outlet 13 on the edge of the upper frame. The upper air outlet 13 extends downward, making the connected front air outlet panel 11 in a vertical posture; one end of the lower air outlet pipe 16 is located on the upper frame of the bottom plate 17 to connect the ion wind generator 20. The pipe body extends downward in the hollow structure, and the other end is connected and fixed to the lower air outlet 14 on the edge of the lower frame. The lower air outlet 14 extends upward, so that the connected rear air outlet panel 12 is in a vertical posture.

[0045] A spacer block 30 is provided at the bottom of each ion wind circulation curtain 10. The spacer block 30 can be made of metal, plastic, graphene, or other materials, but is not limited thereto. The surface of the spacer block 30 for supporting the silicon wafer 40 is provided with an anti-slip pad, so that the supported silicon wafer 40 is not likely to slide left and right during transportation, reducing the probability of damage to the silicon wafer 40. At the same time, during the transportation of the silicon wafer 40, there will be no position deviation. As an example, the anti-slip pad can be made of polyvinyl chloride (PVC), rubber, or other materials.

[0046] The surface of the spacer block 30 for supporting the silicon wafer 40 can be provided with a groove, so that the bottom of the silicon wafer 40 can fall into the groove, further preventing the silicon wafer 40 from moving or tilting on the spacer block 30.

[0047] In addition, the spacer block 30 is movably connected to the ion wind circulation curtain 10. Generally, the spacer block 30 can be movably connected to the lower frame of the bottom plate 17. Here, the movable connection can be a rotary connection, a folding connection, a telescopic connection, or the like, but is not limited thereto.

[0048] The above three connection methods are described below through specific examples:

[0049] The first example, Figure 6 is a schematic diagram of a spacer block with a rotary connection according to an embodiment of the present invention in a first locked position; Figure 7 is a schematic diagram of a spacer block with a rotary connection according to an embodiment of the present invention in a second locked position. When a rotary connection is adopted, as shown in Figure 6 and Figure 7 The spacer block 30 is arranged below the bottom plate 17 through a rotating member 50 and can be switched between a first locked position and a second locked position through the rotating member 50. During the transportation of the silicon wafer 40, the spacer block 30 is in the first locked position and does not block the vertical silicon wafer 40 from entering and exiting the gap. When the vertical silicon wafer 40 enters the gap, the spacer block 30 rotates from the first locked position to the second locked position through the rotating member 50, and the spacer block 30 can support the silicon wafer 40 located in the gap, so that the silicon wafer 40 does not move in the vertical direction during transportation. When the silicon wafer 40 is transported to the destination, the spacer block 30 rotates from the second locked position to the first locked position through the rotating member 50, so that the silicon wafer 40 can be removed from the gap, thereby completing the transportation of the silicon wafer 40.

[0050] For example, the rotating member 50 can be a pneumatic rotary joint. The pneumatic rotary joint can enable the spacer 30 to rotate and switch between the first locking position and the second locking position. The connection of the pneumatic rotary joint to the spacer 30 and the ion wind circulation curtain 10 can be divided into the following two cases: In the first case, the above pneumatic rotary joint is fixedly connected to the above spacer 30 and rotatably connected to the above ion wind circulation curtain 10; in the second case, the above pneumatic rotary joint is rotatably connected to the above spacer 30 and fixedly connected to the above ion wind circulation curtain 10. By rotatably connecting the pneumatic rotary joint only to one of the spacer 30 and the ion wind circulation curtain 10, it is avoided that during the process of the spacer 30 switching between the first locking position and the second locking position, the situation where the two connection points rotate simultaneously and cannot be switched occurs.

[0051] Second example, Figure 8 is a schematic diagram of the folded and connected spacer in the first locking position according to an embodiment of the present invention; Figure 9 is a schematic diagram of the folded and connected spacer in the second locking position according to an embodiment of the present invention. When using a folded connection, as Figure 8 and Figure 9 shown, the spacer 30 is arranged below the bottom plate 17 through the folding member 60 and can be switched between the first locking position and the second locking position through the folding member 60. During the process of conveying the silicon wafer 40, it is in the first locking position and will not block the vertical silicon wafer 40 from entering and exiting the gap. When the vertical silicon wafer 40 enters the gap, the spacer 30 switches from the first locking position to the second locking position through the folding member 60, and the spacer 30 can then support the silicon wafer 40 located in the gap, so that the silicon wafer 40 will not move in the vertical direction during the conveying process. When the silicon wafer 40 is conveyed to the destination, the spacer 30 switches from the second locking position to the first locking position through the folding member 60, enabling the silicon wafer 40 to be removed from the gap, thereby completing the conveying of the silicon wafer 40.

[0052] Third example, Figure 10 is a schematic diagram of the telescopically connected spacer in the first locking position according to an embodiment of the present invention; Figure 11 is a schematic diagram of the telescopically connected spacer in the second locking position according to an embodiment of the present invention. When using a telescopic connection, as Figure 10 and Figure 11As shown, the spacer block 30 is disposed below the bottom plate 17 through the telescopic member 70 and can be switched between the first locking position and the second locking position through the telescopic member 70. During the process of conveying the silicon wafer 40, the spacer block 30 is in the first locking position and will not block the vertical silicon wafer 40 from entering and exiting the gap. When the vertical silicon wafer 40 enters the gap, the spacer block 30 extends towards the gap through the telescopic member 70 to switch from the first locking position to the second locking position. The extended spacer block 30 can then support the silicon wafer 40 located in the gap, so that the silicon wafer 40 will not move in the vertical direction during the conveying process. When the silicon wafer 40 is conveyed to the destination, the spacer block 30 switches from the second locking position to the first locking position through the telescopic member 70, enabling the silicon wafer 40 to be removed from the gap, thus completing the conveying of the silicon wafer 40.

[0053] It should be understood that Figures 6 - 11 only a partial structure of the silicon wafer conveying device of the embodiment of the present invention is shown.

[0054] In an alternative embodiment, as Figures 1 - 2 shown, the silicon wafer conveying device may further include a carrier structure 80, wherein the carrier structure 80 is used to fix a plurality of the above-mentioned ion wind circulation curtains 10 and a plurality of the above-mentioned ion wind generators 20. The carrier structure 80 can be located between the ion wind circulation curtain 10 and the ion wind generator 20, thereby integrating a plurality of ion wind circulation curtains 10 and a plurality of ion wind generators 20 into one body.

[0055] In an alternative embodiment, as Figure 1 and Figure 3 shown, the silicon wafer conveying device may further include a plurality of start valves 90. Each start valve 90 is used to control the ion wind generator 20 connected thereto. To save space, each start valve 90 can be connected to a plurality of ion wind generators 20, that is, it can simultaneously control the start and stop of a plurality of ion wind generators 20. As an example, as Figure 1 shown, since the ion wind generators 20 are arranged in a multi-row and multi-column structure, each start valve 90 can control the ion wind generators 20 located in the same row. As another example, the silicon wafer conveying device may be provided with only one start valve 90 for controlling the start and stop of all ion wind generators 20. The number of start valves 90 and the ion wind generators 20 connected thereto can be set according to specific circumstances and will not be limited one by one here.

[0056] It can be understood that during the conveying process of the silicon wafer 40, when the start valve 90 is started, the spacer block 30 can be simultaneously switched from the first locking position to the second locking position; when the start valve 90 is closed, the spacer block 30 can be simultaneously switched from the second locking position to the first locking position.

[0057] In an alternative embodiment, as Figure 12As shown, the wafer conveying device may further include a multi-joint robotic arm 100. The multi-joint robotic arm 100 is connected to the carrying structure 80; the multi-joint robotic arm 100 cooperates with joints and robotic arms to fold and extend under the drive of an external force, so as to drive the carrying structure 80, and a plurality of the ion wind circulation curtains 10 and a plurality of the ion wind generators 20 fixed to the carrying structure 80 to lift and move.

[0058] In an alternative embodiment, as Figure 12 shown, the wafer conveying device may further include a rotary connection structure 110 connecting the multi-joint robotic arm 100 and the carrying structure 80. The rotation of the rotary connection structure 110 is used to drive the carrying structure 80, and a plurality of the ion wind circulation curtains 10 and a plurality of the ion wind generators 20 fixed to the carrying structure 80 to rotate.

[0059] As Figure 12 shown, when the wafer conveying device of the embodiment of the present invention is loaded with wafers 40, through the cooperation of the multi-joint robotic arm 100 and the rotary connection structure 110, the movement of the wafer conveying device can be realized to convey the wafers 40.

[0060] For the wafer conveying device of the embodiment of the present invention, by placing the wafer in the ion wind circulation curtain provided with a front air outlet panel and a rear air outlet panel, the front air outlet panel and the rear air outlet panel blow air on two surfaces of the wafer at the same time, so as to form circulating air on the two surfaces respectively, so as to generate a pressure difference with the surrounding atmosphere, and vertically and stably hold the wafer in the gap, so that the wafer will not tilt during the conveying process, reducing the risk of the surface of the wafer being knocked, scratched and abraded during the conveying process, and greatly improving the yield of the solar cell. In addition, the circulating air on the two surfaces of the wafer can also clean the dirt on the surface of the wafer. Due to the blowing of the air, dust cannot adhere to the surface of the wafer during the conveying process of the wafer, making the surface of the wafer cleaner. While improving the yield, it also makes the prepared solar cell beautiful in appearance, clean and tidy.

[0061] By using the cushion blocks installed at the bottom of the ion wind circulation curtain to support the wafers vertically placed in the gap, the wafers are stably erected in the gap during the conveying process, that is, they will not fall and will not slide, improving the conveying stability of the wafers and reducing the risk of wafer detachment and damage rate.

[0062] In summary, the embodiment of the present invention provides the following technical solutions:

[0063] Technical solution 1. A wafer conveying device, comprising:

[0064] A plurality of vertically arranged ionic wind circulation curtains 10, ionic wind generators 20 corresponding to each ionic wind circulation curtain 10, and pads 30 installed at the bottom of each ionic wind circulation curtain 10;

[0065] The ionic wind circulation curtain 10 includes a front air outlet panel 11 and a rear air outlet panel 12 that are parallel to each other;

[0066] The gap between the front air outlet panel 11 and the rear air outlet panel 12 is used to store vertical silicon wafers 40;

[0067] The pad 30 is movably connected to the ionic wind circulation curtain 10;

[0068] The pad 30 switches between a first locking position and a second locking position;

[0069] When the pad 30 is in the first locking position, the gap communicates with the outside to allow the vertical silicon wafers 40 to enter and exit the gap;

[0070] The pad 30 in the second locking position is used to support the silicon wafers 40 vertically placed in the gap;

[0071] The ionic wind generator 20 is used to form a circulating wind in the gap between the front air outlet panel 11 and the rear air outlet panel 12 to stabilize the vertical silicon wafers 40 placed in the gap.

[0072] Technical solution 2. The silicon wafer conveying device according to technical solution 1, wherein the ionic wind circulation curtain 10 further includes an upper air outlet hole 13 and a lower air outlet hole 14; wherein,

[0073] The upper air outlet hole 13 is connected to the front air outlet panel 11 and is used to introduce the wind of the ionic wind generator 20 into the front air outlet panel 11; the lower air outlet hole 14 is connected to the rear air outlet panel 12 and is used to introduce the wind of the ionic wind generator 20 into the rear air outlet panel 12.

[0074] Technical solution 3. The silicon wafer conveying device according to technical solution 2, wherein the surfaces of the front air outlet panel 11 and the rear air outlet panel 12 facing the gap are provided with uniformly arranged flow equalizing air holes 121.

[0075] Technical solution 4. The silicon wafer conveying device according to technical solution 1, wherein a plurality of vertically arranged ionic wind circulation curtains 10 are arranged in a multi-row and multi-column structure; wherein,

[0076] Every two adjacent rows of the plurality of ionic wind circulation curtains 10 are arranged with dislocation.

[0077] Technical solution 5. The silicon wafer conveying device according to technical solution 2 is provided with an upper air outlet pipe 15 connecting the ion wind generator 20 and the upper air outlet 13, and a lower air outlet pipe 16 connecting the ion wind generator 20 and the lower air outlet 14.

[0078] Technical solution 6. The silicon wafer conveying device according to technical solution 5,

[0079] the upper air outlet pipe 15 and the lower air outlet pipe 16 have the same length;

[0080] and / or,

[0081] the ion wind circulation curtain 10 further includes a bottom plate 17 located on the side of the rear air outlet panel 12 away from the front air outlet panel 11;

[0082] the bottom plate 17 is a hollow structure, and the upper air outlet pipe 15 and the lower air outlet pipe 16 are located in the hollow structure.

[0083] Technical solution 7. The silicon wafer conveying device according to technical solution 1 further includes: a carrying structure 80, wherein,

[0084] the carrying structure 80 is used to fix a plurality of the ion wind circulation curtains 10 and a plurality of the ion wind generators 20.

[0085] Technical solution 8. For the silicon wafer conveying device according to technical solution 1, the surface of the spacer 30 for supporting the silicon wafer 40 is provided with an anti-slip pad.

[0086] Technical solution 9. The silicon wafer conveying device according to technical solution 1 further includes a plurality of start valves 90, wherein,

[0087] each start valve 90 is used to control the ion wind generator 20 connected thereto.

[0088] Technical solution 10. The silicon wafer conveying device according to technical solution 1 further includes: a pneumatic rotary joint, wherein,

[0089] the pneumatic rotary joint is fixedly connected to the spacer 30 and rotatably connected to the ion wind circulation curtain 10;

[0090] Or,

[0091] the pneumatic rotary joint is rotatably connected to the spacer 30 and fixedly connected to the ion wind circulation curtain 10.

[0092] Technical solution 11. The silicon wafer conveying device according to technical solution 7 further includes a multi-joint robotic arm 100;

[0093] the multi-joint robotic arm 100 is connected to the carrying structure 80;

[0094] The folding and extension of the multi-joint robotic arm 100 are used to drive the lifting and movement of the carrying structure 80, the plurality of ion wind circulation curtains 10 fixed to the carrying structure 80, and the plurality of ion wind generators 20.

[0095] Technical solution 12. The silicon wafer conveying device according to technical solution 11 further includes a rotary connection structure 110 connecting the multi-joint robotic arm 100 and the carrying structure 80;

[0096] The rotation of the rotary connection structure 110 is used to drive the rotation of the carrying structure 80, the plurality of ion wind circulation curtains 10 fixed to the carrying structure 80, and the plurality of ion wind generators 20.

[0097] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A silicon wafer conveying device, characterized in that: include: A plurality of vertically placed ion wind circulation curtains (10), an ion wind generator (20) corresponding to each ion wind circulation curtain (10), and a pad (30) installed at the bottom of each ion wind circulation curtain (10); The ion wind circulation curtain (10) comprises a front air outlet panel (11) and a rear air outlet panel (12) which are parallel to each other; The gap between the front air outlet panel (11) and the rear air outlet panel (12) is used to store vertical silicon wafers (40); The cushion block (30) is movably connected to the ion wind circulation curtain (10); The cushion block (30) switches between a first locking position and a second locking position; When the cushion block (30) is in the first locking position, the gap is connected to the outside, so that a vertical silicon chip (40) can enter and exit the gap; The cushion block (30) in the second locking position is used to support the silicon wafer (40) vertically placed in the gap; The ion wind generator (20) is used to form a circulating wind in the gap between the front air outlet panel (11) and the rear air outlet panel (12) to stabilize the silicon wafer (40) placed vertically in the gap.

2. The silicon wafer conveying device according to claim 1, characterized in that: The ion wind circulation curtain (10) further comprises an upper air outlet (13) and a lower air outlet (14); wherein: The upper air outlet hole (13) is connected to the front air outlet panel (11) and is used to introduce the wind from the ion wind generator (20) into the front air outlet panel (11); the lower air outlet hole (14) is connected to the rear air outlet panel (12) and is used to introduce the wind from the ion wind generator (20) into the rear air outlet panel (12).

3. The silicon wafer conveying device according to claim 2, characterized in that: The front air outlet panel (11) and the rear air outlet panel (12) are provided with uniformly arranged uniform flow air holes (121) on one side facing the gap.

4. The silicon wafer conveying device according to claim 1, characterized in that: A plurality of vertically placed ion wind circulation curtains (10) are arranged in a structure of multiple rows and multiple columns; wherein: The plurality of ion wind circulation curtains (10) in every two adjacent rows are staggered.

5. The silicon wafer conveying device according to claim 2, characterized in that: An upper air outlet pipe (15) connecting the ion wind generator (20) and the upper air outlet hole (13) and a lower air outlet pipe (16) connecting the ion wind generator (20) and the lower air outlet hole (14) are provided.

6. The silicon wafer conveying device according to claim 5, characterized in that: The upper air outlet pipe (15) and the lower air outlet pipe (16) have the same length; and / or, The ion wind circulation curtain (10) further comprises a bottom plate (17) located on a side of the rear air outlet panel (12) away from the front air outlet panel (11); The bottom plate (17) is a hollow structure, and the upper air outlet pipe (15) and the lower air outlet pipe (16) are located in the hollow structure.

7. The silicon wafer conveying device according to claim 1, characterized in that: Also includes: A load-bearing structure (80), wherein The bearing structure (80) is used to fix a plurality of the ion wind circulation curtains (10) and a plurality of the ion wind generators (20).

8. The silicon wafer conveying device according to claim 1, characterized in that: The surface of the cushion block (30) used for supporting the silicon wafer (40) is provided with an anti-slip pad.

9. The silicon wafer conveying device according to claim 1, characterized in that: Also included are a plurality of start-up valves (90), wherein: Each start-up valve (90) is used to control the ion wind generator (20) to which it is connected.

10. The silicon wafer conveying device according to claim 1, characterized in that: Also includes: Pneumatic rotary joint, wherein The pneumatic rotary joint is fixedly connected to the cushion block (30) and is rotationally connected to the ion wind circulation curtain (10); or, The pneumatic rotary joint is rotationally connected to the cushion block (30) and is fixedly connected to the ion wind circulation curtain (10).

11. The silicon wafer conveying device according to claim 7, characterized in that: Also included is a multi-joint robotic arm (100); The multi-joint mechanical arm (100) is connected to the bearing structure (80); The folding and stretching of the multi-joint mechanical arm (100) is used to drive the lifting and movement of the bearing structure (80), the plurality of ion wind circulation curtains (10) fixed to the bearing structure (80), and the plurality of ion wind generators (20).

12. The silicon wafer conveying device according to claim 11, characterized in that: It also includes a rotating connection structure (110) connecting the multi-joint mechanical arm (100) and the bearing structure (80); The rotation of the rotating connection structure (110) is used to drive the bearing structure (80), the plurality of ion wind circulation curtains (10) fixed to the bearing structure (80), and the plurality of ion wind generators (20) to rotate.