Power module and motor controller

Abstract

The utility model discloses a power module, comprising a cooling plate which comprises an upper surface and a lower surface along a first direction; the fins are arranged on the upper surface of the cooling plate; the elastic sealing ring is formed after a liquid material is solidified on the upper surface of the cooling plate, the elastic sealing ring extends in the circumferential direction, and the fins are surrounded by the elastic sealing ring; the fixing parts are arranged at the two ends of the cooling plate in the second direction, the fixing parts and the cooling plate are integrally formed, the fixing parts are used for being connected with external equipment, and the second direction is perpendicular to the first direction. According to the utility model, the fins, the elastic sealing rings and the fixing points can be integrated to the power module, and the power module integrates functions, reduces parts, is flexible to assemble, simplifies the assembly process and is convenient to apply. The utility model also provides a motor controller.

Description

Technical Field

[0001] The utility model relates to the field of power modules, and particularly to a power module and a motor controller. Background Art

[0002] As the core module part of a motor controller, there are usually two cooling methods for a power module. One cooling method is through single-sided water cooling, that is, a welding sheet is used to weld the back surface of the power module to the cooling plate of the water channel, and the coolant exchanges heat through the water channel structure through convection, so as to take away the heat generated by the power module. For the single-sided water cooling method, an additional welding plate is required to be placed between the back surface of the power module and the cooling plate of the water channel to realize the connection between the power module and the water channel.

[0003] Another cooling method is to dissipate heat through the fin structure of the heat dissipation bottom plate. This kind of power module itself has a fin structure, and the heat dissipation bottom plate and the water channel structure are connected through a sealing ring and a pressing plate. The fin structure is placed in the cavity of the water channel structure, and the heat generated by the power module is taken away by the flow of the coolant in the cavity. The heat dissipation bottom plate and the water channel structure are connected through a sealing ring and a pressing plate to prevent the coolant from leaking out. For this cooling method, additional sealing rings and pressing plates are required to realize the sealed connection between the heat dissipation bottom plate of the power module and the water channel structure.

[0004] For the above two cooling methods of the power module, in the assembly process of the power module and the water channel, more parts are required, the process is complex and the efficiency is low. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the problem that in the assembly process of the existing power module and the water channel, more parts are required, the process is complex and the efficiency is low. The utility model provides a power module, which can integrate fins, elastic sealing rings and fixing points into the power module. This power module has integrated functions, reduces parts, is flexible in assembly, simplifies the assembly process and is convenient for application.

[0006] To solve the above technical problems, an embodiment of the utility model discloses a power module, including:

[0007] A cooling plate, along a first direction, the cooling plate includes an upper surface and a lower surface;

[0008] A plurality of fins, arranged on the upper surface of the cooling plate;

[0009] An elastic sealing ring, which is formed by curing a liquid material on the upper surface of the cooling plate. The elastic sealing ring extends circumferentially, and the elastic sealing ring surrounds the plurality of fins;

[0010] The fixing part is arranged at both ends of the cooling plate along the second direction. The fixing part is integrally formed with the cooling plate and is used for connecting with an external device. The second direction is perpendicular to the first direction.

[0011] Adopting the above technical solution, the power module includes a cooling plate and fins, and can achieve cooling by placing the fins in the water channel. Therefore, compared with the single-sided water cooling method in the prior art, this technical solution does not require an additional welding plate to be placed between the back of the power module and the cooling plate of the water channel to realize the connection between the power module and the cooling plate of the water channel.

[0012] In addition, adopting this technical solution, the fixing part is integrally formed with the cooling plate of the power module, that is, the power module comes with its own fixing part. When assembling the power module, no additional pressing plate is required, and the fixing part can complete the fixed connection between the power module and the water channel only through screws.

[0013] Adopting this technical solution, an elastic sealing ring is formed after the liquid material is cured on the upper surface of the cooling plate, that is, the power module in this technical solution comes with its own elastic sealing ring. Therefore, when assembling the power module, no additional sealing ring is required to realize the sealed connection between the power module and the water channel. Moreover, since the elastic sealing ring has elasticity and can be deformed under pressure during the connection process between the power module and the water channel, the elastic sealing ring in this technical solution can be adapted to water channels of various sizes for connection.

[0014] According to another specific embodiment of the present invention, the liquid material is liquid silicone.

[0015] According to another specific embodiment of the present invention, the power module further includes a packaging part, and the packaging part is formed after the liquid heat dissipation material is cured on the lower surface of the cooling plate.

[0016] Adopting the above technical solution, the packaging part is formed after the liquid heat dissipation material is cured on the lower surface of the cooling plate. Therefore, the heat generated by the power module can be transferred to the fins faster and dissipated through the fins.

[0017] According to another specific embodiment of the present invention, the liquid heat dissipation material is an epoxy resin material, and the thermal conductivity of the epoxy resin material is 3 - 5 W / (m·K).

[0018] Adopting the above technical solution, compared with the conventional epoxy resin material, the thermal conductivity of the conventional epoxy resin material is only 0.3 W / (m·K), while the thermal conductivity of the epoxy resin material adopted in this technical solution is 3 - 5 W / (m·K). The high - thermal - conductivity epoxy resin material can make the heat generated by the power module be transferred to the fins faster and dissipated through the fins.

[0019] According to another specific embodiment of the present utility model, the power module includes a ceramic layer, a chip, and a plurality of signal pin pins. The ceramic layer is connected to the lower surface of the cooling plate. The chip is disposed on the ceramic layer. The encapsulation part is formed after a liquid heat dissipation material is solidified on the surface of the ceramic layer. The surface area of the encapsulation part is equal to the surface area of the lower surface of the cooling plate. The chip is encapsulated within the encapsulation part;

[0020] Along the third direction, the plurality of signal pin pins are disposed at one end of the power module. One end of the plurality of signal pin pins is electrically connected to the chip, and the other end of the plurality of signal pin pins is used for electrical connection with a PCB board. The third direction is perpendicular to the first direction.

[0021] By adopting the above technical solution, by arranging a ceramic layer between the chip and the cooling plate, it is avoided that the chip and the cooling plate form an electrical connection to cause a short circuit. One end of the signal pin pin is electrically connected to the chip, and the other end of the signal pin pin is electrically connected to the PCB board to form current transmission.

[0022] The encapsulation part is formed after being solidified on the surface of the ceramic layer. The chip is encapsulated within the encapsulation part. Therefore, the upper surface of the chip transfers heat to the encapsulation part through contact with the encapsulation part. And the surface area of the encapsulation part is equal to the surface area of the lower surface of the cooling plate. Therefore, the heat conduction area of the upper surface of the chip is enlarged, so that the heat generated on the upper surface of the chip is transferred to the cooling plate faster through the encapsulation part, thereby performing cooling and heat dissipation. The lower surface of the chip contacts the cooling plate through the ceramic layer. Therefore, heat can be directly transferred to the cooling plate, thereby performing cooling and heat dissipation.

[0023] According to another specific embodiment of the present utility model, the power module includes a DC bus bar and an AC bus bar. Along the third direction, the AC bus bar is disposed at one end of the lower surface of the cooling plate. Along the second direction, the AC bus bar is spaced from the plurality of signal pin pins. One end of the AC bus bar is electrically connected to the chip, and the other end of the AC bus bar is used for electrical connection with a three-phase bus bar;

[0024] Along the third direction, the DC bus bar is disposed at the other end of the lower surface of the cooling plate. One end of the DC bus bar is electrically connected to the chip, and the other end of the DC bus bar is used for electrical connection with a capacitor.

[0025] An embodiment of the present utility model also discloses a motor controller, including:

[0026] A water channel;

[0027] The power module described in any one of the foregoing, the fixing part of the power module is fixedly connected to the motor controller, and the elastic sealing ring of the power module is sealingly connected to the water channel.

[0028] With the above technical solution, the power module is sealingly connected to the water channel through an elastic sealing ring to prevent coolant leakage.

[0029] According to another specific embodiment of the present invention, the water channel includes a sealing groove, the elastic sealing ring of the power module elastically abuts against the sealing groove, the elastic sealing ring is embedded in the sealing groove, the water channel and the cooling plate of the power module define a cooling cavity, and a plurality of fins of the power module are disposed in the cooling cavity.

[0030] With the above technical solution, the elastic sealing ring elastically abuts against the sealing groove of the water channel, and the elastic sealing ring is embedded in the sealing groove. In addition, the elastic sealing ring can also be adapted to the sealing grooves of water channels of various sizes for connection, with higher adaptability. The heat generated by the power module is transferred to the fins. The fins are disposed in the cooling cavity, and the coolant flows through the fins in the cooling cavity to cool and dissipate heat from the power module.

[0031] According to another specific embodiment of the present invention, the fixing portion of the power module is fixedly connected to the motor controller by screws. Description of the Drawings

[0032] Figure 1 Shows a schematic connection diagram of the power module and the water channel in an embodiment of the present invention.

[0033] Figure 2a Shows a cross-sectional view of the connection between the power module and the water channel in an embodiment of the present invention.

[0034] Figure 2b Shows an embodiment of the present invention Figure 2a Partial enlarged view of area A.

[0035] Figure 3 Shows a perspective view of the power module in an embodiment of the present invention Figure 1 .

[0036] Figure 4 Shows a second perspective view of the power module in an embodiment of the present invention.

[0037] Figure 5 Shows a perspective view of the power module in an embodiment of the present invention Figure 3 .

[0038] Description of the Reference Numerals

[0039] Power module 1; ceramic layer 11; chip 12; signal pin 13; DC busbar 14; AC busbar 15;

[0040] Water channel 2; sealing groove 21; cooling cavity 22;

[0041] Fixing part 3;

[0042] Elastic sealing ring 4;

[0043] Fin 5;

[0044] Cooling plate 6; upper surface 61; lower surface 62;

[0045] Encapsulation part 7. Specific implementation mode

[0046] The following specific embodiments illustrate the implementation mode of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Although the description of the present utility model will be introduced in conjunction with the preferred embodiments, this does not mean that the features of this utility model are limited to this implementation mode. On the contrary, the purpose of introducing the utility model in conjunction with the implementation mode is to cover other alternatives or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without these details. In addition, in order to avoid confusing or obscuring the key points of the present utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other.

[0047] It should be noted that in this specification, similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] In the description of this embodiment, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "bottom", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0049] The terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0050] In the description of this embodiment, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this embodiment can be understood according to specific situations.

[0051] To make the objectives, technical solutions, and advantages of the present utility model clearer, the embodiments of the present utility model will be further described in detail below with reference to the accompanying drawings.

[0052] Refer to Figures 1 to 2b , this application provides a motor controller (not shown in the figure). The motor controller includes three power modules 1 and a water channel 2. The power module 1 includes four fixing parts 3 and an elastic sealing ring 4. The power module 1 is fixedly connected to the motor controller through the fixing parts 3. The fixing parts 3 are fixedly connected to the water channel 2 of the motor controller by screws. The elastic sealing ring 4 of the power module 1 is sealingly connected to the water channel 2 of the motor controller.

[0053] With the above technical solution, the fixing parts 3 of the power module 1 are fixedly connected to the water channel 2 of the motor controller by screws, and the power module 1 is sealingly connected to the water channel 2 through the elastic sealing ring 4 to prevent coolant leakage.

[0054] It should be noted that the number of the power modules 1 is not specifically limited in the embodiments of this application. For example, in other possible embodiments, the number of the power modules 1 can be four, five, etc. The number of the fixing parts 3 is not specifically limited in the embodiments of this application. For example, in other possible embodiments, the number of the fixing parts 3 can be five, six, etc.

[0055] In some possible embodiments, refer to Figures 1 to 2b , the water channel 2 includes a sealing groove 21. The power module 1 includes a plurality of fins 5 and a cooling plate 6. The elastic sealing ring 4 of the power module 1 elastically abuts against the sealing groove 21. The elastic sealing ring 4 is embedded in the sealing groove 21. The water channel 2 and the cooling plate 6 of the power module 1 define a cooling cavity 22. A plurality of fins 5 of the power module 1 are disposed in the cooling cavity 22.

[0056] With the above technical solution, the elastic sealing ring 4 elastically abuts against the sealing groove 21 of the water channel 2, and the elastic sealing ring 4 is embedded in the sealing groove 21. In addition, the elastic sealing ring 4 can also be adapted to the sealing grooves 21 of water channels 2 with various sizes for connection, with higher adaptability. The heat generated by the power module 1 is transferred to the fin 5, the fin 5 is placed in the cooling cavity 22, and the coolant flows through the fin 5 in the cooling cavity 22, and the power module 1 is cooled and dissipated by the fin 5.

[0057] Next, refer to Figures 3 to 5 , and a detailed explanation of the power module 1 will be given. Along the first direction ( Figure 3 the X direction in ), the cooling plate 6 is square, and the cooling plate 6 includes an upper surface 61 and a lower surface 62. A plurality of fins 5 are provided on the upper surface 61 of the cooling plate 6.

[0058] The elastic sealing ring 4 is formed by curing a liquid material on the upper surface 61 of the cooling plate 6. The liquid material is liquid silicone. The elastic sealing ring 4 extends circumferentially, and the elastic sealing ring 4 surrounds a plurality of fins 5. The four fixing parts 3 are respectively circular. Along the second direction ( Figure 3 the Y direction in ), two fixing parts 3 are provided at one end of the cooling plate 6, and two fixing parts 3 are provided at the other end of the cooling plate 6. The fixing parts 3 are integrally formed with the cooling plate 6. The fixing parts 3 are used for connecting with external devices, and the second direction is perpendicular to the first direction.

[0059] With the above technical solution, the power module 1 includes a cooling plate 6 and a plurality of fins 5, and can realize cooling and temperature reduction by placing the plurality of fins 5 in the water channel 2. Therefore, compared with the single-sided water cooling method in the prior art, this technical solution does not require an additional welding plate to be placed between the back of the power module and the cooling plate of the water channel to realize the connection between the power module and the cooling plate of the water channel.

[0060] In addition, with this technical solution, the fixing parts 3 are integrally formed with the cooling plate 6 of the power module 1, that is, the power module 1 is provided with the fixing parts 3 by itself. When the power module 1 is assembled, no additional pressing plate is required, and the fixing parts 3 can be used to complete the fixed connection between the power module 1 and the water channel 2 only by screws.

[0061] With this technical solution, the elastic sealing ring 4 is formed by curing a liquid material on the upper surface 61 of the cooling plate 6, that is, the power module 1 in this technical solution is provided with the elastic sealing ring 4 by itself. Therefore, when the power module 1 is assembled, no additional sealing ring is required to realize the sealed connection between the power module 1 and the water channel 2. And, because the elastic sealing ring 4 has elasticity and can be deformed under pressure during the connection process between the power module 1 and the water channel 2, therefore, the elastic sealing ring 4 in this technical solution can be adapted to the sealing grooves 21 of water channels 2 with various sizes for connection.

[0062] The embodiments of the present application do not specifically limit the shape of the cooling plate 6. For example, in other possible embodiments, the shape of the cooling plate 6 can be rectangular, circular, etc. The embodiments of the present application do not specifically limit the shape of the fixing part 3. For example, in other possible embodiments, the shape of the fixing part 3 can be square, trapezoidal, etc.

[0063] In some possible embodiments, referring to Figure 4 and Figure 5 , the power module 1 further includes a packaging part 7. The packaging part 7 is square in shape and is formed by curing a liquid heat dissipation material on the lower surface 62 of the cooling plate 6.

[0064] Adopting the above technical solution, the packaging part 7 is formed by curing a liquid heat dissipation material on the lower surface 62 of the cooling plate 6. Therefore, the heat generated by the power module 1 can be transferred to the fin 5 faster, and the heat is dissipated through the fin 5.

[0065] In some possible embodiments, the liquid heat dissipation material is an epoxy resin material, and the thermal conductivity of the epoxy resin material is 3 - 5 W / (m·K).

[0066] Adopting the above technical solution, compared with the conventional epoxy resin material, the thermal conductivity of the conventional epoxy resin material is only 0.3 W / (m·K), while the thermal conductivity of the epoxy resin material adopted in this technical solution is 3 - 5 W / (m·K). The high - thermal - conductivity epoxy resin material can make the heat generated by the power module 1 be transferred to the fin 5 faster, and the heat is dissipated through the fin 5.

[0067] It should be noted that the embodiments of the present application do not specifically limit the shape of the packaging part 7. For example, in other possible embodiments, the shape of the packaging part 7 can be rectangular, etc., and the shape of the packaging part 7 is determined by the shape of the cooling plate 6.

[0068] In some possible embodiments, referring to Figure 4 and Figure 5 , the power module 1 includes a ceramic layer 11, six chips 12 and seven signal pin pins 13. The ceramic layer 11 is connected to the lower surface 62 of the cooling plate 6. The chips 12 are arranged on the ceramic layer 11. The packaging part 7 is formed by curing a liquid heat dissipation material on the surface of the ceramic layer 11. The surface area of the packaging part 7 is equal to the surface area of the lower surface 62 of the cooling plate 6. The chips 12 are encapsulated in the packaging part 7.

[0069] Along the third direction ( Figure 4 the Z - direction in Figure 4in the X direction

[0070] With the above technical solution, by arranging a ceramic layer 11 between the chip 12 and the cooling plate 6, it is avoided that the chip 12 and the cooling plate 6 form an electrical connection to cause a short circuit. One end of the signal pin 13 is electrically connected to the chip 12, and the other end of the signal pin 13 is electrically connected to the PCB board to form current transmission.

[0071] The encapsulation part 7 is formed after being cured on the surface of the ceramic layer 11, and the chip 12 is encapsulated in the encapsulation part 7. Therefore, through the contact with the encapsulation part 7, the upper surface of the chip 12 transfers heat to the encapsulation part 7, and the surface area of the encapsulation part 7 is equal to the surface area of the lower surface 62 of the cooling plate 6. Therefore, the heat conduction area of the upper surface of the chip 12 is enlarged, so that the heat generated on the upper surface of the chip 12 is transferred to the cooling plate 6 faster through the encapsulation part 7, thereby performing cooling and heat dissipation. The lower surface of the chip 12 contacts the cooling plate 6 through the ceramic layer 11, so that heat can be directly transferred to the cooling plate 6, thereby performing cooling and heat dissipation.

[0072] It should be noted that the number of chips 12 is not specifically limited in the embodiments of the present application. For example, in other possible implementation manners, the number of chips 12 can be eight, ten, etc. The number of signal pins 13 is not specifically limited in the embodiments of the present application. For example, in other possible implementation manners, the number of signal pins 13 can be eight, nine, ten, etc.

[0073] In some possible implementation manners, referring to Figure 4 and Figure 5 , the power module 1 includes three DC busbars 14 and an AC busbar 15. Along the third direction ( Figure 4 the Z direction in Figure 4 ), the AC busbar 15 is arranged at one end of the lower surface 62 of the cooling plate 6. Along the second direction (

[0074] the Y direction in

[0075] ), the AC busbar 15 is arranged at intervals with seven signal pins 13. Three signal pins 13 are located on the left side of the AC busbar 15, and four signal pins 13 are located on the right side of the AC busbar 15. One end of the AC busbar 15 is electrically connected to the chip 12, and the other end of the AC busbar 15 is used for electrical connection with the three-phase busbar.

[0076] Although the present utility model has been illustrated and described by referring to some preferred embodiments thereof, those of ordinary skill in the art should understand that the above content is a further detailed description of the present utility model in combination with specific embodiments, and it cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. Those skilled in the art can make various changes in form and details, including making several simple deductions or substitutions, without departing from the spirit and scope of the present utility model.

Claims

1. A power module, characterized in that: The power module comprises: A cooling plate, along a first direction, the cooling plate comprising an upper surface and a lower surface; a plurality of fins disposed on the upper surface of the cooling plate; An elastic sealing ring, wherein the elastic sealing ring is formed by solidifying a liquid material on the upper surface of the cooling plate, the elastic sealing ring extends in a circumferential direction, and the elastic sealing ring surrounds the plurality of fins; The fixing part is arranged at both ends of the cooling plate along the second direction, the fixing part is integrally formed with the cooling plate, and the fixing part is used to connect with an external device. The second direction is perpendicular to the first direction.

2. The power module according to claim 1, characterized in that: The liquid material is liquid silicone.

3. The power module according to claim 1, characterized in that: The power module further includes a packaging portion, and the packaging portion is formed by solidifying a liquid heat dissipation material on the lower surface of the cooling plate.

4. The power module according to claim 3, characterized in that: The liquid heat dissipation material is an epoxy resin material, and the thermal conductivity of the epoxy resin material is 3-5 W / (m·K).

5. The power module according to claim 3, characterized in that: The power module includes a ceramic layer, a chip and a plurality of signal pins, the ceramic layer is connected to the lower surface of the cooling plate, the chip is arranged on the ceramic layer, the packaging part is formed by solidifying a liquid heat dissipation material on the surface of the ceramic layer, the surface area of ​​the packaging part is equal to the surface area of ​​the lower surface of the cooling plate, and the chip is packaged in the packaging part; Along the third direction, the multiple signal pins are arranged at one end of the power module, one end of the multiple signal pins is electrically connected to the chip, and the other end of the multiple signal pins is used to be electrically connected to the PCB board, and the third direction is perpendicular to the first direction.

6. The power module according to claim 5, characterized in that: The power module includes a DC copper busbar and an AC copper busbar. Along the third direction, the AC copper busbar is arranged at one end of the lower surface of the cooling plate. Along the second direction, the AC copper busbar is arranged at intervals with the plurality of signal pins. One end of the AC copper busbar is electrically connected to the chip, and the other end of the AC copper busbar is used to be electrically connected to the three-phase busbar. Along the third direction, the DC copper busbar is disposed at the other end of the lower surface of the cooling plate, one end of the DC copper busbar is electrically connected to the chip, and the other end of the DC copper busbar is used to be electrically connected to the capacitor.

7. A motor controller, characterized in that: The motor controller comprises: waterway; The power module according to any one of claims 1 to 6, wherein the fixing portion of the power module is fixedly connected to the motor controller, and the elastic sealing ring of the power module is sealingly connected to the water channel.

8. The motor controller according to claim 7, characterized in that: The water channel includes a sealing groove, the elastic sealing ring of the power module elastically abuts against the sealing groove, the elastic sealing ring is embedded in the sealing groove, the water channel and the cooling plate of the power module define a cooling cavity, and a plurality of fins of the power module are placed in the cooling cavity.

9. The motor controller according to claim 7, characterized in that: The fixing portion of the power module is fixedly connected to the motor controller via screws.

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