Chip assembly of chip with preset adhesive film

Abstract

The chip assembly comprises the chip and the adhesive film, the adhesive film is located on the top face of the chip, four sets of damping pieces are distributed on the bottom face of the adhesive film in a rectangular mode, magnetic attraction grooves are formed in the surfaces of the damping pieces, the bottom face of the adhesive film is fixedly connected with four sets of magnetic attraction blocks, and the magnetic attraction blocks are arranged on the bottom face of the adhesive film. Through the arrangement of the structure of the damping sheet, the magnetic suction groove and the magnetic suction block, the problem that the whole chip assembly needs to be replaced when the glue film is damaged and the performance is reduced due to the fact that a traditional preset glue film and a chip cannot be detached is solved, magnetic suction type connection is convenient to independently detach and replace when the glue film goes wrong, the cost and resource waste are reduced, and the service life of the chip assembly is prolonged. Through the arrangement of the glue film structure composed of the silica gel sheet, the heat conduction plate, the heat absorption plate and the heat dissipation plate, the silica gel sheet enhances the attachment and heat conduction with the chip, the multiple layers of graphite sheets of the heat conduction plate can rapidly conduct heat, the liquid paraffin in the heat absorption plate can buffer heat, and the heat dissipation plate and the heat dissipation fins on the heat dissipation plate effectively improve the heat dissipation efficiency. Therefore, the heat dissipation performance is integrally improved.

Description

Technical Field

[0001] The utility model relates to the field of chips, in particular to a chip component of a chip with a pre - placed glue film. Background Technique

[0002] With the rapid development of electronic technology, the performance of chips has been continuously improved, the integration degree has become higher and higher, and the heat generated during their operation has also increased sharply. During the operation of chips, excessive temperature will seriously affect the performance, stability and service life of chips. Traditional chip heat dissipation methods, such as using heat sinks and fans, often cannot meet the heat dissipation requirements when facing high - performance and high - power chips.

[0003] The pre - placed glue film technology is applied in chip packaging, but the heat dissipation performance of the pre - placed glue film still needs to be further improved and optimized. Traditional pre - placed glue films usually form an inseparable overall structure with chips, which leads to the situation that once the glue film is damaged, aged or its performance deteriorates, since the glue film cannot be replaced separately, the entire chip component may need to be replaced. With the increase of chip working frequency and integration degree, more and more heat is generated. Due to the inseparability of the glue film and the chip, when it is necessary to optimize and improve the heat dissipation performance of the chip, restricted by the overall structure, it is difficult to flexibly adjust the heat dissipation characteristics of the glue film and replace it with a more efficient heat dissipation structure.

[0004] Therefore, a chip component of a chip with a pre - placed glue film is proposed. Content of the Utility Model

[0005] In view of the above problems, the utility model provides a chip component of a chip with a pre - placed glue film to solve the problems raised in the above background technique.

[0006] The technical solution of the utility model is as follows:

[0007] A chip component of a chip with a pre - placed glue film, including a chip and a glue film. The glue film is located on the top surface of the chip. Four groups of shock - absorbing pieces are rectangularly distributed on the bottom surface of the glue film. Magnetic absorption grooves are formed on the surface of the shock - absorbing pieces. Four groups of magnetic absorption blocks are fixedly connected to the bottom surface of the glue film. The sizes of the magnetic absorption grooves and the magnetic absorption blocks are the same. The glue film includes a silica gel sheet, a heat conduction plate, a heat absorption plate and a heat dissipation plate.

[0008] In a further technical solution, the silica gel sheet is fixedly connected to the top surface of the chip, and the heat conduction plate is fixedly connected to the top surface of the silica gel sheet.

[0009] Through the above technical solution, the silica gel sheet has a certain heat conduction ability, can quickly receive the heat generated by the chip, and transfer it to the heat conduction plate above, improving the heat conduction efficiency. Secondly, the silica gel sheet is soft in texture, can buffer the physical impact and pressure on the chip, reduce the risk of chip damage, and can also fill the possible tiny unevenness on the chip surface to ensure close fit with the heat conduction plate and avoid voids affecting the heat transfer effect.

[0010] In a further technical solution, the heat absorption surface of the heat absorption plate is fixedly connected to the top surface of the heat conduction plate, and the heat release surface of the heat absorption plate is fixedly connected to the bottom surface of the heat dissipation plate.

[0011] Through the above technical solution, heat can smoothly transfer from the heat conduction plate through the heat absorption plate to the heat dissipation plate, reducing the thermal resistance in the heat transfer process and improving the heat dissipation efficiency.

[0012] In a further technical solution, a cavity is provided inside the heat absorption plate, and the cavity of the heat absorption plate is filled with liquid paraffin.

[0013] Through the above technical solution, liquid paraffin has a high latent heat of phase change. When the heat absorption plate reaches a certain temperature, the liquid paraffin undergoes a phase change and can absorb a large amount of heat, realizing efficient heat absorption and heat storage.

[0014] In a further technical solution, injection grooves are provided on the surface of the heat absorption plate, and sealing sheets are glued to the inner walls of the injection grooves.

[0015] Through the above technical solution, the presence of the injection grooves makes the filling and replacement operations of the liquid paraffin more convenient. Without disassembling the entire heat absorption plate, the material can be directly injected through the injection grooves, saving operation time.

[0016] In a further technical solution, a number of heat dissipation fins are provided on the top surface of the heat dissipation plate.

[0017] Through the above technical solution, the heat dissipation fins significantly increase the contact area between the heat dissipation plate and the air, enabling more heat to be quickly transferred to the surrounding environment and improving the heat dissipation efficiency.

[0018] Compared with the prior art, the present utility model has the following beneficial effects:

[0019] 1. By setting up the structure of the shock-absorbing sheet, magnetic attraction groove and magnetic attraction block, the problem that the traditional pre-set glue film cannot be disassembled from the chip, resulting in the need to replace the entire chip component when the glue film is damaged and its performance deteriorates, is solved. The magnetic attraction connection facilitates the separate disassembly and replacement when the glue film has problems, reducing costs and resource waste;

[0020] 2. By setting up a film structure composed of a silica gel sheet, a heat conduction plate, a heat absorption plate, and a heat dissipation plate, the silica gel sheet enhances the adhesion and heat conduction with the chip. The multi-layer graphite sheets of the heat conduction plate can quickly conduct heat. The liquid paraffin in the heat absorption plate can buffer heat, and the heat dissipation plate and the heat dissipation fins on it effectively improve the heat dissipation efficiency, thus overall enhancing the heat dissipation performance.

[0021] 3. By setting up the injection grooves on the surface of the heat absorption plate and the structure that can be filled with liquid paraffin inside, the problem that it is difficult to flexibly adjust the heat dissipation characteristics and replace the high-efficiency heat dissipation structure due to the inseparability of the film and the chip is solved. Different performance liquid paraffins or other phase change materials can be injected through the injection grooves to flexibly optimize the heat dissipation performance. Description of the Drawings

[0022] Figure 1 is the overall structure schematic diagram of the present utility model;

[0023] Figure 2 is the assembly structure schematic diagram of the film of the present utility model;

[0024] Figure 3 is the present utility model Figure 2 The enlarged structure schematic diagram at A in;

[0025] Figure 4 is the structure schematic diagram of the top surface of the chip and the bottom surface of the film of the present utility model;

[0026] Figure 5 is the present utility model Figure 4 The enlarged structure schematic diagram at B in.

[0027] Explanation of the Reference Numerals in the Drawings:

[0028] 1. Chip; 2. Film; 21. Silica gel sheet; 22. Heat conduction plate; 23. Heat absorption plate; 231. Injection groove; 232. Liquid paraffin; 233. Sealing sheet; 24. Heat dissipation plate; 25. Heat dissipation fin; 3. Shock-absorbing sheet; 4. Magnetic absorption groove; 5. Magnetic absorption block. Detailed Embodiments

[0029] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0030] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0031] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "provided with", "connected", etc. shall be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] Embodiment:

[0033] Please refer to Figures 1-5, A chip component of a chip with a pre - installed glue film, comprising a chip 1 and a glue film 2. The glue film 2 is located on the top surface of the chip 1. Four groups of shock - absorbing sheets 3 are rectangularly distributed on the bottom surface of the glue film 2. Each group of shock - absorbing sheets 3 has two sheets, which are arranged in an L - shape. And the shock - absorbing sheet 3 is specifically a rubber pad. A magnetic suction groove 4 is formed on the surface of the shock - absorbing sheet 3. Four groups of magnetic suction blocks 5 are fixedly connected to the bottom surface of the glue film 2. The sizes of the magnetic suction groove 4 and the magnetic suction block 5 are the same. The glue film 2 includes a silica gel sheet 21, a heat - conducting plate 22, a heat - absorbing plate 23, and a heat - dissipating plate 24. The silica gel sheet 21 is fixedly connected to the top surface of the chip 1. The heat - conducting plate 22 is fixedly connected to the top surface of the silica gel sheet 21. The heat - conducting plate 22 is specifically formed by stacking multiple layers of graphite sheets. The silica gel sheet has a certain heat - conducting ability, can quickly receive the heat generated by the chip 1, and transfer it to the heat - conducting plate above, improving the heat - conduction efficiency. Secondly, the silica gel sheet 21 is soft in texture, can buffer the physical impact and pressure received by the chip 1, reduce the risk of chip damage, and can also fill the possible minute unevenness on the surface of the chip 1 to ensure close fit with the heat - conducting plate 22, avoiding voids that affect the heat - transfer effect. The heat - absorbing surface of the heat - absorbing plate 23 is fixedly connected to the top surface of the heat - conducting plate 22. The heat - releasing surface of the heat - absorbing plate 23 is fixedly connected to the bottom surface of the heat - dissipating plate 24, enabling heat to smoothly transfer from the heat - conducting plate 22 through the heat - absorbing plate 23 to the heat - dissipating plate 24, reducing the thermal resistance in the heat - transfer process and improving the heat - dissipation efficiency. A cavity is provided inside the heat - absorbing plate 23, and a liquid paraffin 232 is filled in the cavity of the heat - absorbing plate 23. The liquid paraffin has a high latent heat of phase change. When the heat - absorbing plate 23 reaches a certain temperature, the liquid paraffin 232 undergoes a phase change and can absorb a large amount of heat, achieving efficient heat absorption and heat storage. An injection groove 231 is formed on the surface of the heat - absorbing plate 23. A sealing piece 233 is glued to the inner wall of the injection groove 231. The existence of the injection groove 231 makes the filling and replacement operations of the liquid paraffin 232 more convenient. Without disassembling the entire heat - absorbing plate 23, the material can be directly injected through the injection groove 231, saving operation time and facilitating the injection of the liquid paraffin 232. A number of heat - dissipating fins 25 are formed on the top surface of the heat - dissipating plate 24, and the heat - dissipating fins 25 are formed by cutting on the top surface of the heat - dissipating plate 24. The heat - dissipating fins 25 significantly increase the contact area between the heat - dissipating plate 24 and the air, enabling more heat to be quickly transferred to the surrounding environment and improving the heat - dissipation efficiency.

[0034] During operation: When the chip 1 operates, heat is generated. The heat is first conducted to the silica gel sheet 21 in close contact with it. The silica gel sheet 21 has certain heat conduction performance and transfers the heat to the heat conduction plate 22 below. The heat conduction plate 22 composed of multiple layers of graphite sheets can quickly conduct the heat further. Then the heat is conducted to the heat absorption plate 23. The liquid paraffin 232 filled inside the heat absorption plate 23 changes from solid state to liquid state when reaching the phase change temperature, absorbing a large amount of heat, realizing the initial buffering and adjustment of the chip temperature. The remaining heat after being absorbed by the heat absorption plate 23 is transferred to the heat dissipation plate 24. The heat dissipation fins 25 on the top surface of the heat dissipation plate 24 increase the heat dissipation area and improve the heat exchange efficiency with the surrounding environment, dissipating the heat. When the chip assembly is impacted or vibrated by the outside, the shock-absorbing sheet 3 distributed at the rectangular position on the bottom surface of the adhesive film 2 plays a role. The shock-absorbing sheet 3 absorbs and buffers the vibration energy through its own elastic deformation, reducing the impact force transmitted to the chip 1, thereby protecting the chip 1 from damage. When it is necessary to disassemble the adhesive film 2 for replacement or repair, utilize the acting force opposite to the magnetic force of the external magnetic attraction device. Since the sizes of the magnetic attraction groove 4 and the magnetic attraction block 5 are the same and they are connected by magnetic attraction, under the reverse magnetic force, the magnetic attraction block 5 disengages from the magnetic attraction groove 4, thus realizing the separation of the adhesive film 2 from the chip 1 and completing the disassembly operation conveniently and quickly.

[0035] The above-described embodiments only represent the specific implementation manners of the present utility model, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model.

Claims

1. A chip assembly of a chip with a pre-adhesive film, comprising a chip (1) and an adhesive film (2), characterized in that: The adhesive film (2) is located on the top surface of the chip (1); four groups of shock-absorbing plates (3) are rectangularly distributed on the bottom surface of the adhesive film (2); magnetic suction grooves (4) are provided on the surfaces of the shock-absorbing plates (3); four groups of magnetic suction blocks (5) are fixedly connected to the bottom surface of the adhesive film (2); the sizes of the magnetic suction grooves (4) and the magnetic suction blocks (5) are consistent; the adhesive film (2) comprises a silicone sheet (21), a heat-conducting plate (22), a heat-absorbing plate (23), and a heat-dissipating plate (24).

2. The chip assembly of a chip with a pre-adhesive film according to claim 1, characterized in that: The silicone sheet (21) is fixedly connected to the top surface of the chip (1), and the heat conducting plate (22) is fixedly connected to the top surface of the silicone sheet (21).

3. The chip assembly of a chip with a pre-adhesive film according to claim 1, characterized in that: The heat absorbing surface of the heat absorbing plate (23) is fixedly connected to the top surface of the heat conducting plate (22), and the heat releasing surface of the heat absorbing plate (23) is fixedly connected to the bottom surface of the heat dissipating plate (24).

4. The chip assembly of a chip with a pre-adhesive film according to claim 1, characterized in that: A cavity is provided inside the heat absorbing plate (23), and the cavity of the heat absorbing plate (23) is filled with liquid paraffin (232).

5. The chip assembly of a chip with a pre-adhesive film according to claim 1, characterized in that: An injection groove (231) is provided on the surface of the heat absorbing plate (23), and a sealing sheet (233) is glued to the inner wall of the injection groove (231).

6. The chip assembly of a chip with a pre-adhesive film according to claim 1, characterized in that: A plurality of heat dissipation fins (25) are provided on the top surface of the heat dissipation plate (24).

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