Lead structure of transistor chip

Abstract

The utility model provides a lead structure, belongs to the technical field of transistor chip equipment, and particularly relates to a lead structure of a transistor chip. Comprising a connecting column, the lower portion of the connecting column is connected with a plurality of lead wire structures which are arranged in a sliding groove and slide in the sliding groove by arranging the sliding groove, each lead wire structure comprises a connecting shell arranged in the sliding groove, and the side, close to the sliding groove, of the interior of the connecting shell is connected with a lead wire arranged in the connecting shell through a spring supporting plate. The problem that the number and density of the leads on the lead frame in the prior art cannot adapt to the actual use condition is solved, the leads inserted into the connecting shells can slide in the sliding grooves by means of the connecting shells, and different numbers of the leads can be arranged below the connecting columns by arranging different numbers of the connecting shells arranged in the sliding grooves, so that the service life of the lead frame is prolonged, and the service life of the lead frame is prolonged. The number and density of the leads are determined according to the holes in specific use conditions.

Description

Technical Field

[0001] The utility model provides a lead structure, belonging to the technical field of transistor chip devices, and particularly relates to a lead structure of a transistor chip. Background Art

[0002] A transistor generally refers to any single element based on semiconductor materials. Transistors have functions such as detection, Rectification , amplification, switching, voltage stabilization, signal modulation, etc. Transistors can be used for various digital and analog functions. The lead frame of a transistor chip refers to a thin metal frame used to connect the contact points inside the semiconductor integrated circuit chip and the external wires. It is a main structural material for semiconductor packaging and mainly serves as the chip carrier of an integrated circuit. The lead frame is a key structural component that electrically connects the internal circuit leads of the chip to the external leads through bonding materials to form an electrical circuit, playing the role of a bridge connecting to the external wires.

[0003] After the lead frame in the prior art is produced and used, the number of leads is fixedly connected and cannot be changed according to actual needs in terms of the number and density of the leads. If a lead frame with other numbers and densities is required, a new frame needs to be produced, resulting in low adaptability and inconvenient use. Summary of the Utility Model

[0004] In order to make up for the deficiencies of the prior art, the embodiments of the present application provide a lead structure of a transistor chip, which solves the problem that the number and density of leads on the lead frame in the prior art cannot adapt to the actual use situation. By arranging the leads inserted into the connection shell, the connection shell can be slid in the chute. By arranging different numbers of connection shells placed in the chute, different numbers of leads can be arranged below the connection column, and the number and density of the leads are determined according to the holes in the specific use situation.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A lead structure of a transistor chip, including a connection column, and a plurality of lead structures placed inside and slidable in the chute are connected below the connection column through the chute. The lead structure includes a connection shell placed in the chute, and a lead placed inside the connection shell is connected to one side of the connection shell close to the chute through a spring support plate.

[0006] Preferably: At the opening of the chute, there are blocking plates connected to the chute and symmetrically distributed, and the gap between the blocking plates corresponds to the connection shell.

[0007] Preferably: One end of the connection shell close to the chute is connected with a limiting plate whose width is greater than that of the connection shell and placed above the blocking plate, and a limiting rod is connected inside the connection shell through a rotating shaft placed below the spring support plate.

[0008] Preferably, an arc-shaped rotating groove is provided on one side of the limiting rod close to the limiting plate and is arranged inside the connecting shell for the limiting rod to rotate therein. A first spring is connected inside the rotating groove and has the other end connected to the limiting rod.

[0009] Preferably, one end of the lead wire close to the spring support plate is connected with an inverted L-shaped connecting rod corresponding to the limiting rod.

[0010] Preferably, the chute has an opening at only one end. Inside the end of the chute close to the opening, corresponding blocking balls are connected through symmetrically distributed second springs.

[0011] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0012] In the present utility model, by arranging the lead wire inserted into the connecting shell, the connecting shell can be slid in the chute. By arranging different numbers of connecting shells placed in the chute, different numbers of lead wires can be arranged below the connecting column. According to the holes in the specific usage situation, the number and density of the lead wires are determined.

[0013] Other advantages, objectives, and features of the present utility model will be described to some extent in the subsequent description, and to some extent, will be obvious to those skilled in the art based on the study of the following text, or can be taught from the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a perspective view of a lead wire structure of a transistor chip according to the present utility model;

[0015] Figure 2 is a cross-sectional view of a lead wire structure of a transistor chip according to the present utility model;

[0016] Figure 3 is a cross-sectional view of a connecting shell of a lead wire structure of a transistor chip according to the present utility model;

[0017] Figure 4 is a cross-sectional view of a chute of a lead wire structure of a transistor chip according to the present utility model.

[0018] As shown in the figure:

[0019] 1. Connecting column;

[0020] 111. Chute; 112. Blocking plate; 113. Second spring; 114. Blocking ball;

[0021] 2. Lead wire structure;

[0022] 211. Connection shell; 212. Spring support plate; 213. Lead wire; 214. Limiting plate; 215. Limiting rod; 216. Rotating groove; 217. First spring; 218. Connecting rod. Detailed implementation mode

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs; the terms used in the description of the present invention in this specification are only for the purpose of describing specific implementation manners and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] As Figure 1 and Figure 4 shown, a lead wire structure of a transistor chip provided by the present invention includes a connecting column 1, a plurality of lead wire structures 2 located below the connecting column 1 and connected by a sliding groove 111 and sliding inside the sliding groove 111, and blocking plates 112 located at the opening of the sliding groove 111 and connected to the sliding groove 111 and symmetrically distributed. The gap between the blocking plates 112 corresponds to the connection shell 211. Only one end of the sliding groove 111 has an opening. At the end of the sliding groove 111 near the opening, corresponding blocking balls 114 are connected by symmetrically distributed second springs 113 inside. The lead wire structure 2 includes a connection shell 211 placed inside the sliding groove 111. Inside the connection shell 211, a lead wire 213 placed inside the connection shell 211 is connected by a spring support plate 212 on one side close to the sliding groove 111.

[0027] In this implementation scheme, by setting the lead wire 213 inserted into the connection shell, the connection shell 211 can be slid inside the sliding groove 11111. By setting different numbers of connection shells 211 placed inside the sliding groove 111, different numbers of lead wires 213 can be set below the connecting column 1. According to the holes in the specific usage situation, the number and density of the lead wires are determined, and the adaptability is relatively high.

[0028] As shown in Figure 2 and Figure 3 As shown, one end of the connecting shell 211 close to the sliding groove 111 is connected with a limiting plate 214 whose width is greater than that of the connecting shell 211 and is placed above the baffle plate 112. The inside of the connecting shell 211 is connected with a limiting rod 215 through a rotating shaft 214 placed below the spring support plate 212. An arc-shaped rotating groove 216 for the limiting rod 215 to rotate inside is arranged on one side of the limiting rod 215 close to the limiting plate 214. A first spring 217 whose other end is connected with the limiting rod 215 is connected in the rotating groove 216. One end of the lead wire 213 close to the spring support plate 212 is connected with an inverted L-shaped connecting rod 218 corresponding to the limiting rod 215.

[0029] In this embodiment, after the lead wire 213 is inserted into the connecting shell 211, the bottom side of the L-shaped connecting rod 218 will first contact the limiting rod 215. The limiting rod 215 rotates and deflects by means of the rotating shaft 214 and the rotating groove 216, compressing the first spring 217. When the bottom side of the connecting rod 218 passes through the limiting rod 215, it will compress the spring support plate 212. After the wider end of the connecting rod 218 completely passes through, the limiting rod 215 resets, and jointly clamps the lead wire 213 with the spring support plate 212 to complete the fixation.

[0030] It should be noted that the present utility model all adopts bonding materials to achieve electrical connection and form an electrical circuit.

[0031] During use, according to the specific usage situation, after determining the number of connecting shells 211, the connecting shells 211 are pushed into the sliding groove 111 by squeezing the blocking ball 114 and the second spring 113 with the limiting plate 214. Then one end of the connecting rod 218 of the lead wire 213 is inserted into the connecting shell 211, and with the combined action of the rotating shaft 214, the limiting rod 215 and the spring support plate 212, the fixation of the lead wire 213 is completed. The structure of the present utility model is simple and the operation is convenient.

[0032] Although the present utility model has been disclosed above with preferred embodiments, it is not intended to limit the present utility model. Anyone familiar with this technology can make various modifications and decorations without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be defined by the claims.

Claims

1. A lead structure of a transistor chip, comprising a connecting column (1), characterized in that: A plurality of lead structures (2) are connected to the bottom of the connection column (1) by arranging a slide groove (111) and are placed inside the slide groove (111) and slide inside the slide groove (111). The lead structure (2) comprises a connection shell (211) placed inside the slide groove (111), and a side of the connection shell (211) close to the slide groove (111) is connected to a lead (213) placed inside the connection shell (211) via a spring support plate (212).

2. The lead structure of a transistor chip according to claim 1, characterized in that: The opening of the slide groove (111) is provided with a blocking plate (112) connected to the slide groove (111) and symmetrically distributed, and the gap between the blocking plates (112) corresponds to the connection shell (211).

3. The lead structure of a transistor chip according to claim 2, characterized in that: One end of the connection shell (211) close to the slide groove (111) is connected to a limit plate (214) having a width greater than the connection shell (211) and disposed above the blocking plate (112); the interior of the connection shell (211) is connected to a limit rod (215) via a rotating shaft disposed below the spring support plate (212).

4. The lead structure of a transistor chip according to claim 3, characterized in that: A side of the limiting rod (215) close to the limiting plate (214) is provided with an arc-shaped rotation groove (216) placed inside the connecting shell (211) and allowing the limiting rod (215) to rotate inside, and a first spring (217) whose other end is connected to the limiting rod (215) is connected inside the rotation groove (216).

5. The lead structure of a transistor chip according to claim 3, characterized in that: One end of the lead wire (213) close to the spring support plate (212) is connected to an inverted L-shaped connecting rod (218) corresponding to the limiting rod (215).

6. The lead structure of a transistor chip according to claim 1, characterized in that: The slide groove (111) has an opening at only one end, and the interior of the end of the slide groove (111) close to the opening is connected to a corresponding blocking ball (114) via symmetrically distributed second springs (113).

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