Gas pre-cooling device for fuel cell test
By using gas pre-cooling devices with pre-cooling units, heat dissipation units and semiconductor refrigeration units in fuel cell testing equipment, the problems of low temperature control accuracy and huge equipment in the prior art are solved, and high-precision gas pre-cooling and miniaturization of the device are achieved.
Patent Information
- Application Number
- CN202421657046.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The gas pre-cooling device of existing fuel cell testing equipment has problems such as low temperature control accuracy, huge equipment and high maintenance costs, which affects the testing accuracy.
A gas pre-cooling device including a pre-cooling unit, a heat dissipation unit and a semiconductor refrigeration unit is adopted to achieve pre-cooling of gas through the cold end of the semiconductor refrigeration unit with the gas heat exchange with the gas channel, and the hot end with the cooling liquid in the cooling channel.
It improves the temperature control accuracy of gas pre-cooling, realizes the miniaturization of the device, reduces maintenance costs, and extends service life.
Smart Images
Figure CN223023290U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of fuel cells, and particularly relates to a gas precooling device for fuel cell testing. Background Art
[0002] To simulate real working conditions, low-temperature hydrogen and low-temperature air are used in fuel cell test equipment during the low-temperature cold start experiment of fuel cells. At present, the traditional gas precooling device of fuel cell test equipment mainly uses an oil-cooled heat exchanger. Specifically, the silicone oil is cooled by a refrigerant compressor, and then the gas is cooled by the cooled silicone oil. Among them, there are many components that make up the oil-cooled heat exchanger, mainly including refrigerant, compressor, silicone oil, plate heat exchanger, and water-cooling system, etc. Not only the manufacturing and maintenance costs are high, but also the volume is relatively large, which is not convenient for transportation. At the same time, there is also the problem of low temperature control accuracy of low-temperature hydrogen and low-temperature air, which is not conducive to improving the test accuracy. Summary of the Utility Model
[0003] In view of this, the utility model aims to propose a gas precooling device for fuel cell testing, which is beneficial to improving the temperature control accuracy and realizing miniaturization.
[0004] To achieve the above object, the technical solution of the utility model is realized as follows:
[0005] A gas precooling device for fuel cell testing includes a precooling unit, a heat dissipation unit, and a thermoelectric cooling unit disposed between the precooling unit and the heat dissipation unit;
[0006] The precooling unit includes a gas channel, the heat dissipation unit includes a cooling channel, the cold end of the thermoelectric cooling unit can perform heat exchange with the gas in the gas channel, and the hot end of the thermoelectric cooling unit can perform heat exchange with the coolant in the cooling channel.
[0007] Further, the precooling unit includes a gas precooling pipeline, and the gas channel is disposed inside the gas precooling pipeline; the heat dissipation unit includes a coolant pipeline, and the cooling channel is disposed inside the coolant pipeline; the thermoelectric cooling unit includes a plurality of thermoelectric cooling chips, the cold ends of each thermoelectric cooling chip are connected to the gas precooling pipeline, and the hot ends of each thermoelectric cooling chip are connected to the coolant pipeline.
[0008] Further, each thermoelectric cooling chip includes a cold-end insulating substrate and a hot-end insulating substrate arranged oppositely, and a P-type semiconductor and an N-type semiconductor disposed between the cold-end insulating substrate and the hot-end insulating substrate; the cold-end insulating substrate is connected to the gas precooling pipeline, and the hot-end insulating substrate is connected to the coolant pipeline.
[0009] Further, a first connection plane is provided on the outer peripheral wall of the gas pre-cooling pipeline, and a second connection plane is provided on the outer peripheral wall of the coolant pipeline; each of the cold-end insulating substrates is connected to the first connection plane, and each of the hot-end insulating substrates is connected to the second connection plane.
[0010] Further, the first connection planes are multiple and arranged circumferentially along the gas pre-cooling pipeline, and the coolant pipelines are multiple and corresponding to each of the first connection planes one by one; a plurality of the thermoelectric cooling chips are provided between the second connection plane of each of the coolant pipelines and the corresponding first connection plane.
[0011] Further, the gas pre-cooling pipeline includes a hydrogen pre-cooling sub-pipeline and an air pre-cooling sub-pipeline, and the thermoelectric cooling units are provided between the hydrogen pre-cooling sub-pipeline and the coolant pipeline, and between the air pre-cooling sub-pipeline and the coolant pipeline.
[0012] Further, both the hydrogen pre-cooling sub-pipeline and the air pre-cooling sub-pipeline are in an S shape.
[0013] Further, it further includes a controller connected to each of the thermoelectric cooling chips; the controller has multiple control gears, and the number of the electrically conductive thermoelectric cooling chips is different at different control gears.
[0014] Further, it further includes a box body, and the pre-cooling unit, the heat dissipation unit and the thermoelectric cooling unit are all arranged on the box body.
[0015] Further, an air inlet and an air outlet are provided on the box body, and two ends of the gas channel are respectively connected to the air inlet and the air outlet; and / or, a liquid inlet and a liquid outlet are provided on the box body, and two ends of the cooling channel are respectively connected to the liquid inlet and the liquid outlet.
[0016] Compared with the prior art, the present utility model has the following advantages:
[0017] In the gas pre-cooling device for fuel cell testing of the present utility model, through the cooperative setting of the pre-cooling unit, the heat dissipation unit and the thermoelectric cooling unit, and the heat exchange between the cold end of the thermoelectric cooling unit and the gas in the gas channel of the pre-cooling unit, and the heat exchange between the hot end of the thermoelectric cooling unit and the coolant in the cooling channel of the heat dissipation unit, the characteristics of high temperature control accuracy, equipment miniaturization, no need for refrigerant and long service life of the thermoelectric cooling technology can be utilized, which is not only beneficial to the miniaturized design of the whole device, reduces the device maintenance cost, but also is beneficial to improving the temperature control accuracy of gas pre-cooling, and has a good use effect.
[0018] In addition, the semiconductor refrigeration unit includes a plurality of semiconductor refrigeration chips, which is conducive to improving the refrigeration efficiency. The cooperative setting of the first connection plane and the second connection plane, and the connection of the cold-end insulating substrate to the first connection plane and the hot-end insulating substrate to the second connection plane are conducive to increasing the contact area between the gas pre-cooling pipeline and each semiconductor refrigeration chip, as well as between the coolant pipeline and each semiconductor refrigeration chip, thereby facilitating the improvement of gas refrigeration and the overall heat exchange efficiency of the device.
[0019] Secondly, the first connection planes are arranged in a plurality along the circumferential direction of the gas pre-cooling pipeline, the coolant pipelines are a plurality corresponding to each first connection plane one by one, and a plurality of semiconductor refrigeration chips are provided between the second connection plane of each coolant pipeline and the corresponding first connection plane, which can increase the heat exchange area and path and improve the heat exchange efficiency between the pre-cooling unit and the heat dissipation unit. The gas pre-cooling pipeline includes a hydrogen pre-cooling sub-pipeline and an air pre-cooling sub-pipeline. Semiconductor refrigeration units are provided between the hydrogen pre-cooling sub-pipeline and the coolant pipeline, and between the air pre-cooling sub-pipeline and the coolant pipeline, which is conducive to improving the generalization of components and reducing the preparation and maintenance costs of the device.
[0020] In addition, both the hydrogen pre-cooling sub-pipeline and the air pre-cooling sub-pipeline are in an S shape, which is conducive to increasing the refrigeration area to meet different gas refrigeration requirements and expanding the application range of the device. By setting a controller with multiple control gears, and at different control gears, the number of electrically conductive semiconductor refrigeration chips is different, it is also conducive to adjusting the working number of semiconductor refrigeration chips according to the gas pre-cooling requirements, thereby facilitating the precise temperature control. Setting a box body is conducive to the arrangement and installation of the pre-cooling unit, the heat dissipation unit and the semiconductor refrigeration unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The drawings forming a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:
[0022] Figure 1 is a schematic diagram of the overall structure of the gas pre-cooling device for fuel cell testing according to the embodiment of the present invention;
[0023] Figure 2 is a schematic diagram of the structure when the pre-cooling unit, the heat dissipation unit and the semiconductor refrigeration unit are assembled according to the embodiment of the present invention;
[0024] Figure 3 is a schematic diagram of the structure of the hydrogen pre-cooling sub-pipeline according to the embodiment of the present invention;
[0025] Figure 4 is a schematic diagram of the working principle of the semiconductor refrigeration chip according to the embodiment of the present invention;
[0026] Description of the reference numerals in the drawings:
[0027] 1. Box body; 11. First air inlet; 12. First air outlet; 13. Second air inlet; 14. Second air outlet; 15. Liquid inlet; 16. Liquid outlet;
[0028] 2. Thermoelectric cooler; 21. Cold-end insulating substrate; 22. Hot-end insulating substrate; 23. P-type semiconductor; 24. N-type semiconductor; 25. Conductive sheet;
[0029] 3. Gas precooling pipeline; 30. Gas channel; 4. Coolant pipeline; 40. Cooling channel; 5. Controller; 6. Power supply. Detailed implementation manners
[0030] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.
[0031] In the description of the present invention, it should be noted that if terms indicating orientation or positional relationship such as "upper", "lower", "inner", "outer", etc. appear, they are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, if terms such as "first", "second", etc. appear, they are also only for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0032] In addition, in the description of the present invention, unless otherwise clearly defined, the terms "installation", "connection", "connection", "connecting member" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in combination with specific situations.
[0033] The present invention will be described in detail below with reference to the drawings and in combination with embodiments.
[0034] This embodiment relates to a gas precooling device for fuel cell testing, which is beneficial to realizing the miniaturization of the device, reducing the maintenance cost of the device, and improving the temperature control accuracy of gas precooling, and has a good use effect.
[0035] In terms of the overall structure, as Figures 1 to 3 shown, the gas precooling device for fuel cell testing in this embodiment includes a precooling unit, a heat dissipation unit, and a thermoelectric cooling unit disposed between the precooling unit and the heat dissipation unit.
[0036] Moreover, the precooling unit includes a gas channel 30, the heat dissipation unit includes a cooling channel 40, the cold end of the semiconductor refrigeration unit can exchange heat with the gas in the gas channel 30, and the hot end of the semiconductor refrigeration unit can exchange heat with the coolant in the cooling channel 40.
[0037] At this time, with the above settings, the gas in the gas channel 30 can be cooled by the heat exchange between the cold end of the semiconductor refrigeration unit and the gas in the gas channel 30, and the heat can be taken away by the coolant through the heat exchange between the hot end of the semiconductor refrigeration unit and the coolant in the cooling channel 40. Thus, the precooling operation of the gas is realized. At the same time, the characteristics of high temperature control accuracy, small size of the equipment, no need for refrigerant, and long service life of the semiconductor refrigeration technology can be utilized to realize the small-sized design of the device, reduce the maintenance cost of the device, and improve the temperature control accuracy of the gas precooling, so it has high practicability.
[0038] Based on the above overall introduction, in this embodiment, as a preferred implementation form, refer to Figure 2 As shown, the precooling unit includes a gas precooling pipeline 3, and the gas channel 30 is arranged inside the gas precooling pipeline 3. The heat dissipation unit includes a coolant pipeline 4, and the cooling channel 40 is arranged inside the coolant pipeline 4. Moreover, the semiconductor refrigeration unit includes a plurality of semiconductor refrigeration chips 2, the cold ends of each semiconductor refrigeration chip 2 are all connected to the gas precooling pipeline 3, and the hot ends of each semiconductor refrigeration chip 2 are all connected to the coolant pipeline 4. With such settings, the refrigeration efficiency can be improved by using a plurality of semiconductor refrigeration chips 2.
[0039] During specific implementation, in this embodiment, as a preferred exemplary structure, refer to Figure 4 As shown, each semiconductor refrigeration chip 2 includes a cold-end insulating substrate 21 and a hot-end insulating substrate 22 arranged oppositely, and a P-type semiconductor 23 and an N-type semiconductor 24 arranged between the cold-end insulating substrate 21 and the hot-end insulating substrate 22. The cold-end insulating substrate 21 is connected to the gas precooling pipeline 3, and the hot-end insulating substrate 22 is connected to the coolant pipeline 4.
[0040] Of course, in this embodiment Figure 4 mainly shows the general structure of the semiconductor refrigeration chip 2 and that it needs to be connected to the power supply 6 during operation. For the related structural parts not mentioned in the semiconductor refrigeration chip 2 of this embodiment, the semiconductor refrigeration chip 2 well-known to those skilled in the art can be referred to. For example, both the cold-end insulating substrate 21 and the hot-end insulating substrate 22 are made of common insulating ceramic sheets, the P-type semiconductor 23 and the N-type semiconductor 24 are connected by a metal conductive sheet 25, and the end where the current flows from the N-type semiconductor 24 to the P-type semiconductor 23 is the cold end, and this cold end is connected to the cold-end insulating substrate 21, etc.
[0041] In addition, in this embodiment, as a preferred implementation form, continue to refer to Figure 2 As shown, a first connection plane is provided on the outer peripheral wall of the gas precooling pipe 3, and a second connection plane is provided on the outer peripheral wall of the coolant pipe 4. At the same time, each cold-end insulating substrate 21 is connected to the first connection plane, and each hot-end insulating substrate 22 is connected to the second connection plane.
[0042] It can be understood that the matching setting of the first connection plane and the second connection plane, and the connection of the cold-end insulating substrate 21 to the first connection plane and the hot-end insulating substrate 22 to the second connection plane are beneficial to increasing the contact area between the gas precooling pipe 3 and each semiconductor refrigeration chip 2, and between the coolant pipe 4 and each semiconductor refrigeration chip 2, thereby being beneficial to improving the gas refrigeration and the overall heat exchange efficiency of the device.
[0043] Secondly, as a further setting form, in this embodiment, the first connection planes are multiple arranged circumferentially along the gas precooling pipe 3, and the coolant pipes 4 are multiple corresponding one by one to each first connection plane. A plurality of semiconductor refrigeration chips 2 are provided between the second connection plane of each coolant pipe 4 and the corresponding first connection plane. The main advantage of such a setting is that it can increase the heat exchange area and path, and improve the heat exchange efficiency between the precooling unit and the heat dissipation unit.
[0044] It is worth mentioning that, in this embodiment, as a preferred implementation form, the gas precooling pipe 3 can adopt a square pipe, and the first connection plane can be the side surfaces formed on the four side walls of the square pipe. At the same time, the coolant pipe 4 can also adopt a square pipe or a common flat pipe (such as a flat pipe with a trapezoidal cross-section), and the second connection plane is formed on the side wall of the coolant pipe 4 corresponding to the first connection plane.
[0045] Of course, in addition to adopting a square pipe, the gas precooling pipe 3 can also adopt a pipe with a triangular cross-section, as well as polygonal structures such as pentagons and hexagons according to the refrigeration and heat exchange requirements. At this time, a plurality of first connection planes are correspondingly formed on each side wall of the gas precooling pipe 3. At the same time, the coolant pipe 4 is not limited to a square pipe or a flat pipe. It can be a pipe with a polygonal cross-section or a pipe with an irregular cross-section. When the cross-section of the coolant pipe 4 is a pipe with an irregular cross-section, it is preferably provided with a side wall on which a second connection plane can be formed.
[0046] Furthermore, the gas precooling pipe 3 and the coolant pipe 4 of this embodiment can preferably be made of stainless steel material to have better rust prevention performance, which is beneficial to improving the service life of the device.
[0047] In this embodiment, as a preferred implementation form, the gas pre-cooling pipeline 3 includes a hydrogen pre-cooling sub-pipeline and an air pre-cooling sub-pipeline. A thermoelectric cooling unit is provided between the hydrogen pre-cooling sub-pipeline and the coolant pipeline 4, and between the air pre-cooling sub-pipeline and the coolant pipeline 4. The main advantage of such a setting is that it is conducive to improving the generalization of components and reducing the device preparation and maintenance costs.
[0048] Specifically, in this embodiment, as a preferred implementation form, refer to Figure 3 As shown, the hydrogen pre-cooling sub-pipeline is in an S shape. At the same time, the air pre-cooling sub-pipeline can also be designed in an S shape to increase the cooling area, and thus be applicable to different gas cooling requirements and expand the application range of the device.
[0049] At this time, the gas channel 30 of this embodiment includes a hydrogen channel provided in the hydrogen pre-cooling sub-pipeline and an air channel provided in the air pre-cooling sub-pipeline. It should be noted that in this embodiment Figure 3 only the schematic of the hydrogen pre-cooling sub-pipeline designed in an S shape is given, and the dotted line is only the schematic of the box 1 and not the specific structural shape of the box 1 described below.
[0050] Moreover, in this embodiment, the hydrogen pre-cooling sub-pipeline and the air pre-cooling sub-pipeline are both in an S shape, which is only a preferred example. If applied to scenarios with different cooling requirements, the structural shapes of both can be adjusted adaptively. For example, when applied to scenarios with small cooling requirements, both the hydrogen pre-cooling sub-pipeline and the air pre-cooling sub-pipeline are straight lines, etc.
[0051] In addition, in this embodiment, as a preferred implementation form, refer to Figure 1 As shown, it further includes a controller 5 connected to each thermoelectric cooling chip 2. The controller 5 has multiple control gears, and at different control gears, the number of electrically conductive thermoelectric cooling chips 2 is different.
[0052] By setting the controller 5 with multiple control gears and having different numbers of electrically conductive thermoelectric cooling chips 2 at different control gears, it is also conducive to adjusting the working number of the thermoelectric cooling chips 2 according to the gas pre-cooling requirements, thereby facilitating precise temperature control.
[0053] Here, the controller 5 of this embodiment can adopt a control device with touch function well-known to those skilled in the art, such as a tablet computer, a PLC touch all-in-one machine, etc.
[0054] In addition to this, in this embodiment, as a preferred implementation form, refer to Figure 1As shown in the figure, the gas precooling device for fuel cell testing in this embodiment further includes a box body 1, and a precooling unit, a heat dissipation unit, a semiconductor refrigeration unit, and a controller 5 are all arranged on the box body 1. Thus, it is beneficial to the arrangement and installation of the precooling unit, the heat dissipation unit, the semiconductor refrigeration unit, and the controller 5.
[0055] Moreover, in this embodiment, as a preferred implementation form, an air inlet and an air outlet are provided on the box body 1, and both ends of the gas channel 30 are respectively connected to the air inlet and the air outlet. At the same time, as a preferred implementation form, a liquid inlet 15 and a liquid outlet 16 are provided on the box body 1, and both ends of the cooling channel 40 are respectively connected to the liquid inlet 15 and the liquid outlet 16.
[0056] Specifically, in implementation, the air inlet of this embodiment includes a first air inlet 11 and a second air inlet 13, and the air outlet includes a first air outlet 12 and a second air outlet 14. Among them, both ends of the hydrogen channel in the hydrogen precooling sub-pipeline are respectively connected to the first air inlet 11 and the first air outlet 12, and both ends of the air channel in the air precooling sub-pipeline are respectively connected to the second air inlet 13 and the second air outlet 14. Furthermore, in this embodiment, the coolant can adopt water, and the flow path of the coolant can flow reversely with hydrogen and oxygen, so as to improve the heat exchange efficiency.
[0057] The gas precooling device for fuel cell testing in this embodiment, through the coordinated setting of the precooling unit, the heat dissipation unit, and the semiconductor refrigeration unit, and the heat exchange between the cold end of the semiconductor refrigeration unit and the gas in the gas channel 30 of the precooling unit, and the heat exchange between the hot end of the semiconductor refrigeration unit and the coolant in the cooling channel 40 of the heat dissipation unit, can utilize the characteristics of high temperature control accuracy, small equipment size, no need for refrigerant, and long service life of semiconductor refrigeration technology. It is not only beneficial to the miniaturized design of the overall device, reduces the device maintenance cost, but also is beneficial to improving the temperature control accuracy of gas precooling, and has a good use effect.
[0058] At the same time, the gas precooling device for fuel cell testing in this embodiment, based on the use of the semiconductor refrigeration method, can adjust the temperature control accuracy to ±0.5°C. Compared with the highest temperature control accuracy of ±1°C in the prior art using the silicone oil cooling method, it has better temperature control performance, which is beneficial to improving the gas precooling effect and the fuel cell testing accuracy.
[0059] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A gas precooling device for fuel cell testing, characterized in that: It comprises a precooling unit and a heat dissipation unit, and a semiconductor refrigeration unit arranged between the precooling unit and the heat dissipation unit; The precooling unit comprises a gas channel (30), the heat dissipation unit comprises a cooling channel (40), the cold end of the semiconductor refrigeration unit can exchange heat with the gas in the gas channel (30), and the hot end of the semiconductor refrigeration unit can exchange heat with the cooling liquid in the cooling channel (40).
2. The gas precooling device for fuel cell testing according to claim 1, characterized in that: The precooling unit comprises a gas precooling pipeline (3), and the gas channel (30) is arranged in the gas precooling pipeline (3); The heat dissipation unit comprises a coolant pipeline (4), and the cooling channel (40) is arranged in the coolant pipeline (4); The semiconductor refrigeration unit comprises a plurality of semiconductor refrigeration sheets (2), the cold end of each semiconductor refrigeration sheet (2) is connected to the gas precooling pipeline (3), and the hot end of each semiconductor refrigeration sheet (2) is connected to the cooling liquid pipeline (4).
3. The gas precooling device for fuel cell testing according to claim 2, characterized in that: Each of the semiconductor refrigeration sheets (2) comprises a cold end insulating substrate (21) and a hot end insulating substrate (22) arranged opposite to each other, and a P-type semiconductor (23) and an N-type semiconductor (24) arranged between the cold end insulating substrate (21) and the hot end insulating substrate (22); The cold end insulating substrate (21) is connected to the gas precooling pipeline (3), and the hot end insulating substrate (22) is connected to the cooling liquid pipeline (4).
4. The gas precooling device for fuel cell testing according to claim 3, characterized in that: A first connection plane is provided on the outer peripheral wall of the gas precooling pipeline (3), and a second connection plane is provided on the outer peripheral wall of the coolant pipeline (4); Each of the cold-end insulating substrates (21) is connected to the first connecting plane, and each of the hot-end insulating substrates (22) is connected to the second connecting plane.
5. The gas precooling device for fuel cell testing according to claim 4, characterized in that: The first connection planes are multiple and arranged along the circumference of the gas precooling pipe (3), and the coolant pipes (4) are multiple and correspond to the first connection planes one by one. A plurality of the semiconductor cooling sheets (2) are provided between the second connection plane of each of the cooling liquid pipes (4) and the corresponding first connection plane.
6. The gas precooling device for fuel cell testing according to claim 2, characterized in that: The gas precooling pipeline (3) comprises a hydrogen precooling sub-pipeline and an air precooling sub-pipeline, and the semiconductor refrigeration unit is provided between the hydrogen precooling sub-pipeline and the coolant pipeline (4), and between the air precooling sub-pipeline and the coolant pipeline (4).
7. The gas precooling device for fuel cell testing according to claim 6, characterized in that: The hydrogen precooling sub-pipeline and the air precooling sub-pipeline are both S-shaped.
8. The gas precooling device for fuel cell testing according to claim 2, characterized in that: It also includes a controller (5) connected to each of the semiconductor cooling sheets (2); The controller (5) has a plurality of control gears, and in different control gears, the number of electrically conductive semiconductor cooling sheets (2) is different.
9. The fuel cell test gas precooling device according to any one of claims 1 to 8, characterized in that: It also comprises a box body (1), on which the pre-cooling unit, the heat dissipation unit and the semiconductor refrigeration unit are all arranged.
10. The gas precooling device for fuel cell testing according to claim 9, characterized in that: The box body (1) is provided with an air inlet and an air outlet, and the two ends of the gas channel (30) are respectively connected to the air inlet and the air outlet; and / or, The box body (1) is provided with a liquid inlet (15) and a liquid outlet (16), and two ends of the cooling channel (40) are respectively connected to the liquid inlet (15) and the liquid outlet (16).