Multi-layer PCB (printed circuit board) with mistake-proof layers

Abstract

The utility model discloses a multilayer PCB (printed circuit board) with a mistake-proof layer, which comprises a plurality of layers of substrates stacked in sequence, the same edge position of each substrate is provided with a positioning area, the positioning area is internally provided with positioning holes, the sizes of the positioning holes of the plurality of layers of substrates are sequentially decreased from bottom to top, the plurality of layers of substrates are connected through connecting pieces, and the connecting pieces are connected with the plurality of layers of substrates. And the connecting pieces penetrate through the interiors of the positioning holes, each connecting piece is composed of a plurality of disc blocks with the same layer number as the multiple layers of substrates, and the sizes of the multiple disc blocks are sequentially decreased from bottom to top so as to form a tower-shaped structure. According to the utility model, the positioning holes with different sizes are arranged at the corresponding positions of the substrates of the multilayer circuit board, so that the placement layers of the substrates are distinguished according to the sizes of the positioning holes, and only the positioning holes with the corresponding sizes can be matched with the disc blocks on each layer of the connecting piece; therefore, the problem that the placing layers are upside down in the prior art is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer PCB circuit board with an anti-misalignment layer. Background Technique

[0002] The application of multi-layer PCB circuit boards is becoming more and more mature. During production, multiple substrate layers need to be stacked together and edge-sealed. To prevent the front and back positions of the substrate layers from being placed incorrectly during stacking, which may lead to changes in electrical characteristics, marks are currently often marked on the surface of the substrate layers. However, although this method solves the problem of incorrect placement of the front and back sides, it cannot solve the problem of the layers being upside down.

[0003] Therefore, we propose a multi-layer PCB circuit board with an anti-misalignment layer to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a multi-layer PCB circuit board with an anti-misalignment layer to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-layer PCB circuit board with an anti-misalignment layer includes multiple substrate layers stacked in sequence. At the same edge position of each substrate, a positioning area is provided, and a positioning hole is opened in the positioning area. The sizes of the positioning holes of the multiple substrate layers gradually decrease from bottom to top. The multiple substrate layers are connected by a connecting piece, and the connecting piece penetrates through the inside of the positioning holes. The connecting piece is composed of multiple disc blocks with the same number as the number of substrate layers of the multi-layer substrate, and the sizes of the multiple disc blocks gradually decrease from bottom to top to form a tower-like structure.

[0007] In a further embodiment, the lower port of the positioning hole is chamfered to form an outwardly inclined expansion groove.

[0008] In a further embodiment, a frustum block that matches the expansion groove is provided at the bottom of the disc block.

[0009] In a further embodiment, at least two positioning holes are provided on each substrate.

[0010] In a further embodiment, a fixed rod is connected to the top end of the connecting piece with an offset center position, and a pressing piece is rotatably sleeved outside the fixed rod. The lower surface of the pressing piece is flush with the surface of the uppermost substrate.

[0011] In a further embodiment, the inner diameter difference between the positioning holes of adjacent substrates is 1-3 mm.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model solves the problem that the stacking levels are upside down in the prior art by opening positioning holes with different sizes at corresponding positions of each substrate of a multi-layer circuit board, so as to distinguish the stacking levels of each substrate by the sizes of the positioning holes, and only the positioning holes with corresponding sizes can be matched with the disc blocks on each layer of the connecting piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic exploded view of the utility model;

[0015] Figure 2 It is a schematic structural view of the connecting piece of the utility model;

[0016] Figure 3 It is a schematic half-sectional view of the installation of the substrate after being stacked and the connecting piece of the utility model;

[0017] Figure 4 It is a schematic half-sectional view of the positioning hole after the substrate is stacked of the utility model.

[0018] In the figure: 1. Substrate; 11. Positioning area; 12. Positioning hole; 121. Expanded groove; 2. Connecting piece; 21. Disc block; 211. Frustum block; 3. Fixed rod; 4. Pressing piece. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0020] In the description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] Please refer to Figures 1-4 , a multi-layer PCB circuit board with an anti-misalignment layer, including multiple layers of substrates 1 stacked in sequence. At the same edge position of each substrate 1, a positioning area 11 is provided. The positioning area 11 is at the edge position and does not affect the main working area of the substrate 1. A positioning hole 12 is opened in the positioning area 11. The sizes of the positioning holes 12 of the multiple layers of substrates 1 decrease sequentially from bottom to top. Since the sizes are different, they correspond to different layers. The multiple layers of substrates 1 are connected by a connecting member 2, and the connecting member 2 penetrates through the inside of the positioning hole 12. The connecting member 2 is composed of multiple disc blocks 21 with the same number as the number of layers of the multiple layers of substrates 1, and the sizes of the multiple disc blocks 21 decrease sequentially from bottom to top to form a tower-like structure, so that the substrate 1 where the largest positioning hole 12 is located is placed at the bottom layer, and then decreases sequentially upwards, and the substrate 1 where the smallest positioning hole 12 is located is placed at the top layer.

[0023] Furthermore, the inner diameter difference between the positioning holes 12 of adjacent substrates 1 is 1 - 3 mm to facilitate the distinction of the substrates 1 with different-sized positioning holes 12.

[0024] In order to further facilitate the connection between the substrate 1 and the connecting member 2, it is set that the lower port of the positioning hole 12 is chamfered to form an outwardly inclined expansion groove 121. The bottom port of the expansion groove 121 is larger in size relative to the upper port of the positioning hole 12, which is convenient for quickly aligning with the disc block 21. At the same time, the sizes of the two ports of the positioning hole 12 passing through the upper and lower surfaces of the substrate 1 are set inconsistently, which also facilitates the user to distinguish the front and back sides of each layer of the substrate 1 and effectively prevents the misplacement of the front and back positions of the substrate 1. A frustum block 211 matching the expansion groove 121 is provided at the bottom of the disc block 21, and the frustum block 211 just blocks the expansion groove 121 to ensure the stable connection between the two.

[0025] In order to reduce the offset and misalignment of the substrates 1 after stacking, it is set that each substrate 1 is provided with at least two positioning holes 12, and correspondingly, the same number of connecting members 2 are also provided. One connecting member 2 and a column of positioning holes 12 form a group, so that the positioning holes 12 and the connecting members 2 between different groups can limit each other, thereby preventing the substrates 1 from offsetting and misaligning.

[0026] The top end of the connecting member 2 is offset from the center position and connected with a fixed rod 3, and a pressing piece 4 is rotatably sleeved outside the fixed rod 3. The lower surface of the pressing piece 4 is flush with the surface of the uppermost substrate 1. When the distal end of the pressing piece 4 rotates to the positions on both symmetric sides of the center of the connecting member 2 with respect to the fixed rod 3, the length of the pressing piece 4 does not exceed the top surface of the connecting member 2, so as not to affect the stacking operation of the substrate 1. When the distal end of the pressing piece 4 rotates to the same side of the connecting member 2 as the fixed rod 3, the length of the pressing piece 4 exceeds the top surface of the connecting member 2, so that the uppermost substrate 1 can be pressed tightly, making the connection of the substrate 1 firm.

[0027] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0028] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-layer PCB circuit board with anti-mismatching layers, comprising a multi-layer substrate (1) stacked in sequence, characterized in that: A positioning area (11) is provided at the same edge position of each substrate (1), and a positioning hole (12) is provided in the positioning area (11). The sizes of the positioning holes (12) of the multi-layer substrate (1) decrease from bottom to top. The multi-layer substrates (1) are connected by a connecting piece (2), and the connecting piece (2) passes through the inside of the positioning hole (12). The connecting piece (2) is composed of a plurality of disc blocks (21) having the same number of layers as the multi-layer substrate (1), and the sizes of the plurality of disc blocks (21) decrease from bottom to top, so as to form a tower-like structure.

2. A multi-layer PCB circuit board with anti-mismatching layers according to claim 1, characterized in that: The lower end of the positioning hole (12) is chamfered to form an outwardly inclined expansion groove (121).

3. A multi-layer PCB circuit board with anti-mismatching layers according to claim 2, characterized in that: A truncated cone block (211) matching the expansion groove (121) is provided at the bottom of the disc block (21).

4. The multi-layer PCB circuit board with anti-mismatching layer according to claim 1, characterized in that: At least two positioning holes (12) are provided on each base plate (1).

5. The multi-layer PCB circuit board with anti-mismatching layer according to claim 1, characterized in that: The top end of the connecting member (2) is connected to a fixed rod (3) at a position offset from the center, and a pressing plate (4) is rotatably sleeved outside the fixed rod (3), wherein the lower surface of the pressing plate (4) is flush with the surface of the uppermost substrate (1).

6. The multi-layer PCB circuit board with anti-mismatching layers according to claim 1, characterized in that: The difference in inner diameters of the positioning holes (12) of adjacent substrates (1) is 1-3 mm.

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