Automatic board disassembling system for printed circuit board after lamination

Abstract

The utility model relates to the field of printed circuit boards, and provides an automatic board disassembling system for printed circuit boards after lamination, which is used for separating product stacks of the printed circuit boards and comprises a first automatic board disassembling device, at least one second automatic board disassembling device, at least one third automatic board disassembling device and a conveying device. The first automatic board disassembling device is provided with a first grabbing part, the first grabbing part comprises a plurality of clamping jaws and a plurality of suction cups, the clamping jaws can grab hanging lugs of the printed circuit board pressing jig, and the suction cups can adsorb at least one assembly in a product stack of printed circuit boards. The first automatic plate disassembling device, the second automatic plate disassembling device and the third automatic plate disassembling device are arranged in the conveying direction of the conveying device, and the second automatic plate disassembling device is close to the third automatic plate disassembling device. Therefore, the second automatic board dismounting device and the third automatic board dismounting device can carry out board dismounting operation on product stacks of printed circuit boards on the same station on the conveying device.

Description

Technical Field

[0001] This application relates to the technical field of printed circuit board manufacturing, and particularly to an automatic board separation system after pressing of a printed circuit board. Background Art

[0002] An important step in the production process of printed circuit boards is to press a product stack containing multiple printed circuit boards (as shown in Figure 1 ) under high temperature and high pressure, such as oil pressure pressing. After pressing, the product stack needs to be separated from the multi-layer printed circuit boards and the interlayers (such as steel plates, rubber pads, etc.) between the printed circuit boards through a board separation process. In the prior art, this board separation process basically relies on manual assembly lines for board separation operations. The product stacks entering the assembly line often have high temperatures, large weights, and many layers, making the labor intensity of the workers in the board separation process relatively high and the work efficiency relatively low.

[0003] CN112093480A discloses a PCB internal pressing process section device and its material taking workbench. The PCB internal pressing process section device includes: a material taking workbench, which is used to grab and convey plates, and the transfer and conveying table of the material taking workbench is located beside the plate conveying mechanism; an operation workbench, which is provided with a plate conveying mechanism, and the plate conveying mechanism is used to transport the plates conveyed by the lifting and transfer mechanism to the upper side of the plate conveying mechanism; a loading and conveying mechanism, which is arranged beside the operation workbench and is used to convey plates; a plate suction machine, which sucks and positions the plates conveyed by the loading and conveying mechanism, and the plate suction machine is correspondingly located above the loading and conveying mechanism.

[0004] The PCB internal pressing process section device disclosed in the above-mentioned invention patent application can only automate part of the work content of the board separation process, and still requires manual removal of some board layers, with a relatively low degree of automation. Utility Model Content

[0005] In view of the state of the above-mentioned prior art, this application is made. The purpose of this application is to provide an automatic board separation system after pressing of a printed circuit board to realize the automated operation of the board separation process of the printed circuit board.

[0006] This application provides an automatic board separation system after pressing of a printed circuit board for separating a product stack of printed circuit boards, which includes a first automatic board separation device, at least one second automatic board separation device, at least one third automatic board separation device, and a conveying device.

[0007] The first automatic board separation device has a first grasping part.

[0008] The first grasping part includes a plurality of clamping jaws and a plurality of suction cups. The clamping jaws can grasp the hanging ears of the printed circuit board pressing fixture, and the suction cups can adsorb at least one component in the product stack of the printed circuit board.

[0009] The first automatic board disassembling device, the second automatic board disassembling device, and the third automatic board disassembling device are arranged along the conveying direction of the conveying device. The second automatic board disassembling device is close to the third automatic board disassembling device, so that the second automatic board disassembling device and the third automatic board disassembling device can perform board disassembling operations on the product stack of the printed circuit board at the same station on the conveying device.

[0010] In at least one possible implementation, the first grasping part further includes at least a pair of limiting clamps. The pair of limiting clamps can clamp the opposite sides of at least one component in the product stack and form a vertical downward limit on the component to prevent the component from falling off.

[0011] In at least one possible implementation, the automatic board disassembling system after pressing of the printed circuit board further includes a visual recognition system. The visual recognition system can recognize at least one piece of information among the colors, appearances, shape features, and markings of different components of the product stack, so that the second automatic board disassembling device and the third automatic board disassembling device can distinguish the types of the disassembled components.

[0012] In at least one possible implementation, the automatic board disassembling system after pressing of the printed circuit board further includes an electrostatic elimination device. The electrostatic elimination device includes a blowing device and an ion generating device. The ion generating device can generate positive ions and negative ions, and the blowing device can blow the positive ions and the negative ions to the components of the product stack to eliminate or reduce the static electricity of the components.

[0013] In at least one possible implementation, the first automatic board disassembling device and the second automatic board disassembling device include six-axis articulated robotic arms, and the third automatic board disassembling device includes four-axis articulated robotic arms.

[0014] In at least one possible implementation, the second automatic board disassembling device and / or the third automatic board disassembling device is provided with a vibration device.

[0015] In at least one possible implementation, the conveying device includes an upper conveyor belt, a lower conveyor belt, and a lift.

[0016] In at least one possible implementation, the maximum load weight of the first automatic board disassembling device is higher than the maximum load weights of the second automatic board disassembling device and the third automatic board disassembling device.

[0017] In at least one possible implementation, the automatic board separating system after pressing of the printed circuit board further includes a film separator, and the film separator is close to the first automatic board separating device to separate the polyester film.

[0018] In at least one possible implementation, the second automatic board separating device and the third automatic board separating device are oppositely arranged on both sides of the conveying direction of the conveying device.

[0019] The automatic board separating system after pressing of the printed circuit board provided by this application can use multiple automatic board separating devices to perform automatic board separating operations. Compared with the traditional manual board separating method, it can reduce the labor intensity of workers, improve the efficiency of the board separating operation, reduce the damage to the printed circuit board products during the board separating operation, and improve the qualified rate of the printed circuit board finished products. Brief Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of a product stack of a printed circuit board according to an embodiment of this application.

[0021] Figure 2 It is a schematic structural diagram of an automatic board separating system according to an embodiment of this application.

[0022] Figure 3 It is a schematic structural diagram of a separation jig according to an embodiment of this application.

[0023] Figure 4 It is another schematic structural diagram of a separation jig according to an embodiment of this application.

[0024] Description of the Reference Numerals

[0025] 100 First automatic board separating device

[0026] 200 Second automatic board separating device

[0027] 300 Third automatic board separating device

[0028] 400 Conveying device

[0029] 500 Film separator

[0030] 110 First grasping part

[0031] 111 Claw

[0032] 112 Limit clip

[0033] 113 Suction cup Detailed Embodiments

[0034] Exemplary embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood that these specific descriptions are only used to teach those skilled in the art how to implement the present application, rather than to exhaust all feasible ways of the present application, nor to limit the scope of the present application.

[0035] An embodiment of the present application provides an automatic board separating system after pressing of a printed circuit board (hereinafter, sometimes simply referred to as "automatic board separating system"). As Figure 2 shown, the automatic board separating system may include a first automatic board separating device 100, at least one second automatic board separating device 200, at least one third automatic board separating device 300, and a conveying device 400.

[0036] In a preferred example, as Figure 1 shown, the product stack of printed circuit boards for which the automatic board separating system is used for board separation may include multiple components stacked in sequence from top to bottom, specifically including an upper jig, an upper thick steel plate (for example, 8 mm thick), a rubber pad, a thin steel plate (for example, 1 mm thick), a circuit board (i.e., the product), a lower thick steel plate (for example, 8 mm thick), and a lower jig. Among them, the product stack may include multiple sets of rubber pads, thin steel plates, and circuit boards stacked, that is, multiple sets of rubber pads, thin steel plates, and circuit boards may be provided between the upper jig, the upper thick steel plate and the lower thick steel plate, and the lower jig. It can be understood that the specific structure of the product stack of printed circuit boards applicable to the present application is not limited to this. For example, in some products, kraft paper may replace the above-mentioned rubber pads.

[0037] The first automatic board separating device 100, the second automatic board separating device 200, and the third automatic board separating device 300 may be arranged along the conveying device 400. The conveying device 400 can transport the product stack of printed circuit boards so that the product stack can be sequentially transported to the operation positions (workstations) of each automatic board separating device.

[0038] The second automatic board separating device 200 may be close to the third automatic board separating device 300 so that the second automatic board separating device 200 and the third automatic board separating device 300 can perform board separation operations on the product stack of printed circuit boards at the same workstation on the conveying device 400.

[0039] Preferably, the second automatic board separating device 200 and the third automatic board separating device 300 may be arranged oppositely on both sides ( Figure 2 the left and right directions in Figure 2 the up and down directions) of the conveying direction of the conveying device 400, that is, the second automatic board separating device 200 and the third automatic board separating device 300 are arranged oppositely sandwiching the conveying device 400 at the same position in the conveying direction.

[0040] In the operation of disassembling the product stack described above, the first automatic disassembly device 100 of this automatic disassembly system can be used to separate the upper fixture, the upper thick steel plate, the lower thick steel plate, and the lower fixture. The second automatic disassembly device 200 can be used to separate the circuit board (product) and the rubber pad. The third automatic disassembly device 300 can be used to disassemble the thin steel plate. When this automatic disassembly system is operating, the conveying device 400 first conveys the product stack to the operating position (workstation) of the first automatic disassembly device 100, and the first automatic disassembly device 100 can separate the upper fixture, the upper thick steel plate from the product stack (including separating the upper fixture and the upper thick steel plate from each other). After that, the conveying device 400 can convey the product stack to the workstations of the second automatic disassembly device 200 and the third automatic disassembly device 300 to separate the circuit board, the rubber pad, and the thin steel plate. After the separation of multiple groups of rubber pads, thin steel plates, and circuit boards is completed, the conveying device 400 then transports the remaining product stack back to the workstation of the first automatic disassembly device 100 to separate the lower thick steel plate and the lower fixture.

[0041] Preferably, the second automatic disassembly device 200 and the third automatic disassembly device 300 can operate alternately simultaneously to improve production efficiency.

[0042] Preferably, the conveying device 400 can include an upper conveyor belt, a lower conveyor belt, and a lift with different heights. The product stack after the separation of multiple groups of rubber pads, thin steel plates, and circuit boards can be transported back to the workstation of the first automatic disassembly device 100 via the lower conveying device and the lift.

[0043] It can be understood that the side of the conveying device 400 can have multiple stacking areas to classify and stack various different components of the product stack.

[0044] As Figure 3 and Figure 4 shown, the first disassembly device 100 can include a first grasping part 110. The first grasping part 110 can include multiple clamping jaws 111 and multiple suction cups 113. The clamping jaws 111 can grasp the lugs of the printed circuit board pressing fixture (i.e., the above-mentioned upper fixture and lower fixture), and the suction cups 113 can adsorb at least one component in the product stack of the printed circuit board, especially can adsorb the pressing fixture and / or the thick steel plate (upper thick steel plate, lower thick steel plate). The first grasping part 110 further includes at least a pair of limiting clamps 112. A pair of limiting clamps 112 can clamp the opposite sides of at least one component in the product stack (especially the upper and lower fixtures) and form a vertical downward limit on the component to prevent the component from falling off (it can be understood that the weight of the fixture and the thick steel plate is usually large and may fall off due to various sudden abnormal conditions such as poor adsorption of the suction cup, power failure, and air supply interruption). Exemplarily, the first grasping part 110 can include four clamping jaws 111, four suction cups 113, and a pair of limiting clamps 112.

[0045] Preferably, the gripper 111 and the limit clip 112 can be controlled by a cylinder, and the cylinder can be connected to a solenoid valve.

[0046] The second automatic board removal device 200 and the third automatic board removal device 300 can respectively include a second grasping part and a third grasping part. Both the second grasping part and the third grasping part can include suction cups, and the load-bearing capacities of the suction cups of the second grasping part and the third grasping part can be different.

[0047] Preferably, the load capacity (maximum load weight) of the first automatic board removal device 100 can be higher than that of the second automatic board removal device 200 and the third automatic board removal device 300. Exemplarily, the load capacity of the first automatic board removal device 100 can be 50 kg, the load capacity of the second automatic board removal device 200 can be 12 kg, and the load capacity of the third automatic board removal device 300 can be 15 kg.

[0048] Preferably, the first automatic board removal device 100 and the second automatic board removal device 200 can include a six-axis articulated robot arm, and the third automatic board removal device 300 can include a four-axis articulated robot arm. The grasping part can be arranged at the working end of the robot arm.

[0049] Preferably, the automatic board removal system can further include a vision recognition system. The vision recognition system of the automatic board removal system can identify the materials of different layers according to at least one of the information such as the color, appearance, shape characteristics, and markings of the components in different layers of the printed circuit board product stack. So that the second automatic board removal device 200 and the third automatic board removal device 300 can distinguish the types of components to be disassembled. Color sensors can also be arranged at the first automatic board removal device 100, the second automatic board removal device 200, and the third automatic board removal device 300. The color sensors can detect the color of the components, especially the color of the bottom of the components being clamped, to prevent incorrect separation and placement of the components due to component adhesion, etc.

[0050] Preferably, the automatic board removal system can further include an electrostatic elimination device to reduce or avoid the adjacent components in the product stack being adsorbed to each other due to static electricity, resulting in difficulty in separating the product stack. More preferably, the electrostatic elimination device can be a blowing-type electrostatic elimination device, which can include a blowing device and an ion generating device. Positive and negative ions are generated by the ion generating device, and the positive and negative ions can neutralize the static charges of the materials in the product stack through blowing, thereby eliminating static electricity.

[0051] Preferably, the second automatic board removal device 200 and / or the third automatic board removal device 300 can be respectively provided with a vibration device, such as a vibration cylinder, to separate the components by vibration when using the suction cup to adsorb the components of the product stack. When the second automatic board removal device 200 and / or the third automatic board removal device 300 are operating, their robot arms can also be shaken up and down to prevent the components of the product stack from sticking together.

[0052] Optionally, the automatic board splitting system may include a plurality of second automatic board splitting devices 200 and / or third automatic board splitting devices 300. It can be understood that in the case of a large number of product stack layers, the working time for removing the middle layer of the product stack is longer than the working time for removing the upper and lower fixtures and thick steel plates. At this time, setting a plurality of second automatic board splitting devices and / or third automatic board splitting devices can improve work efficiency.

[0053] Preferably, the automatic board splitting system may further include a film separator 500, especially a polyester film separator (polyester film is PET film), for removing the polyester film (PET film) disposed between the upper thick steel plate, the lower thick steel plate and the rubber pad.

[0054] Preferably, the automatic board splitting system may further include a protective housing body, which can isolate the automatic board splitting system from the outside. The protective housing body may include a housing frame and a housing cladding, and the housing cladding may cover the housing frame. Preferably, the housing frame may be formed by building aluminum profiles, and the housing cladding may be made of polyvinyl chloride (PVC) material. The protective housing body may further include a plurality of housing doors, which may be disposed near the material stacking position of the automatic board splitting system for timely pushing out the stacked product stack components. It can be understood that the protective housing body can enhance production safety and play a role in dust prevention for the system.

[0055] The following briefly describes some beneficial effects of the above embodiments of the present application.

[0056] The post-lamination automatic board splitting system for printed circuit boards provided by the embodiments of the present application can perform automated board splitting operations using a plurality of automatic board splitting devices. Compared with the traditional manual board splitting method, it can reduce the labor intensity of workers, improve the board splitting operation efficiency, reduce the damage to printed circuit board products during the board splitting operation, and improve the qualified rate of printed circuit board finished products.

[0057] It can be understood that in the present application, when the number of components or members is not particularly limited, the number may be one or more, and here the plurality means two or more. For the case where the number of components or members shown in the drawings and / or described in the specification is a specific number such as two, three, four, etc., the specific number is usually exemplary rather than restrictive, and it can be understood as a plurality, that is, two or more. However, this does not mean that the present application excludes the case of one.

[0058] It should be understood that the above embodiments are merely exemplary and are not used to limit the present application. Those skilled in the art can make various modifications and changes to the above embodiments under the teaching of the present application without departing from the scope of the present application.

Claims

1. A system for automatically removing printed circuit boards after pressing, used for separating the product stacks of printed circuit boards, characterized in that: It includes a first automatic panel disassembly device, at least one second automatic panel disassembly device, at least one third automatic panel disassembly device and a conveying device, The first automatic panel removal device has a first gripping portion, The first grasping portion includes a plurality of clamping claws and a plurality of suction cups, wherein the clamping claws can grasp the ears of the printed circuit board pressing jig, and the suction cups can absorb at least one component in the product stack of the printed circuit board. The first automatic panel removal device, the second automatic panel removal device and the third automatic panel removal device are arranged along the conveying direction of the conveying device, and the second automatic panel removal device is close to the third automatic panel removal device so that the second automatic panel removal device and the third automatic panel removal device can remove the panels from the product stack of printed circuit boards at the same workstation on the conveying device.

2. The system for automatically removing printed circuit boards after lamination according to claim 1, characterized in that: The first gripping portion further comprises at least one pair of limiting clamps, which can clamp opposite sides of at least one component in the product stack and limit the component in a vertical downward direction to prevent the component from falling off.

3. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: It also includes a visual recognition system that can recognize at least one of the colors, appearances, shape features and logos of different components of the product stack, so that the second automatic panel removal device and the third automatic panel removal device can distinguish the types of separated components.

4. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: It also includes a static electricity elimination device, which includes a blowing device and an ion generating device. The ion generating device can generate positive ions and negative ions. The blowing device can blow the positive ions and the negative ions to the components of the product stack to eliminate or reduce the static electricity of the components.

5. The system for automatically removing printed circuit boards after lamination according to claim 1, characterized in that: The first automatic panel removal device and the second automatic panel removal device include six-axis articulated robotic arms, and the third automatic panel removal device includes a four-axis articulated robotic arm.

6. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: The second automatic panel removing device and / or the third automatic panel removing device are provided with a vibration device.

7. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: The conveying device comprises an upper conveying belt, a lower conveying belt and an elevator.

8. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: The maximum load weight of the first automatic panel removing device is higher than the maximum load weight of the second automatic panel removing device and the maximum load weight of the third automatic panel removing device.

9. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: It also includes a film separator, which is close to the first automatic plate removing device to separate the polyester film.

10. The system for automatically disassembling printed circuit boards after lamination according to claim 1, characterized in that: The second automatic panel removing device and the third automatic panel removing device are arranged opposite to each other on both sides of the conveying direction of the conveying device.

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