Wireless charging device

Abstract

The utility model discloses a wireless charging device. The wireless charging device comprises a shell, a coil module and a semiconductor refrigeration piece, one surface of the shell is a contact surface; the coil module and the semiconductor refrigeration part are both arranged in the shell, the cold end of the semiconductor refrigeration part is in heat conduction connection with the contact surface, the semiconductor refrigeration part is provided with an annular part, and the annular part surrounds the periphery of the coil module. The annular part of the semiconductor refrigeration part is arranged around the periphery of the coil module, and the cold end of the semiconductor refrigeration part is in heat conduction connection with the contact surface, so that the part, in contact with the electronic equipment, of the contact surface can be cooled, the installation space is saved, the wireless charging device is thinner and more portable, and meanwhile, fan blowing and direct heat conduction can be saved; the temperature is transmitted, energy consumption is saved, and under the condition of the same size, the electric quantity for charging electronic equipment can be increased.

Description

Technical Field

[0001] The utility model relates to the technical field of charging devices, in particular to a wireless charging device. Background Art

[0002] With the development and popularization of portable electronic devices such as smart phones and tablet computers, people's dependence on electronic devices in life and work is becoming more and more serious, and the power consumption of electronic devices is also increasing faster. How to conveniently charge electronic devices has become one of the considerations in the development of electronic devices.

[0003] In recent years, wireless charge technology has been gradually applied to electronic devices such as mobile phones. It transmits electric energy through the alternating magnetic field generated by the coil. There is no need to connect a charging cable between the wireless charging device and the electronic device, so it can be adapted to various electronic devices with different specifications or models. Users no longer need to carry various charging cables with different interfaces to adapt to different electronic devices, which not only facilitates the use of users, but also reduces the use cost of users to a certain extent.

[0004] The main structure of the current wireless charging device includes a housing, a circuit board, a battery and a coil module. The circuit board, the battery and the coil module are all arranged in the housing. The battery and the coil module are both electrically connected to the circuit board. The coil module is used to generate a magnetic field to charge the electronic device. In the prior art, in order to dissipate heat from the coil module, a semiconductor refrigerating element is usually arranged in the housing. However, this method still conducts heat to the housing, and usually needs to cooperate with a fan for heat dissipation, which occupies a large space and consumes a high energy. Therefore, it is necessary to improve the current wireless charging device. Summary of the Utility Model

[0005] In view of this, aiming at the deficiencies existing in the prior art, the main purpose of the utility model is to provide a wireless charging device, which can effectively solve the problem that the internal temperature of the existing wireless charging device will be conducted to the housing.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A wireless charging device includes a housing, a coil module and a semiconductor refrigerating element; one surface of the housing is a contact surface; the coil module and the semiconductor refrigerating element are both arranged in the housing, the cold end of the semiconductor refrigerating element is thermally conduction-connected to the contact surface, and the semiconductor refrigerating element has an annular part, and the annular part surrounds the outer periphery of the coil module.

[0008] As a preferred solution, a heat dissipation component is arranged inside the housing. The heat dissipation component includes a heat conduction plate and a heat dissipation member; the heat conduction plate is thermally conduction-connected to the hot end of the semiconductor refrigeration component, and the heat dissipation member is fixedly connected to the heat conduction plate.

[0009] As a preferred solution, a first heat guiding member is arranged at the hot end of the semiconductor refrigeration component. The first heat guiding member is in contact with the heat conduction plate. A second heat guiding member is arranged at the cold end of the semiconductor refrigeration component. The second heat guiding member is in contact with the contact surface.

[0010] As a preferred solution, the overall shape of the semiconductor refrigeration component is an annular hollow structure, and it has a through hole in the center. The coil module is located in the through hole.

[0011] As a preferred solution, the semiconductor refrigeration component includes a base portion. The annular portion is located on the peripheral edge of the surface of the base portion and encloses a groove with the base portion. The groove faces the side of the contact surface, and the groove is formed at the cold end of the semiconductor refrigeration component. The coil module is located in the groove.

[0012] As a preferred solution, the semiconductor refrigeration component is plate-shaped, and the outer contour of the base portion is square or circular.

[0013] As a preferred solution, a magnet is arranged inside the housing. The magnet is located between the coil module and the annular portion.

[0014] As a preferred solution, one side of the coil module faces the contact surface. A first magnetic isolation sheet is laminated on the other side of the coil module. A second magnetic isolation sheet is arranged at the central hole of the coil module. The second magnetic isolation sheet is laminated and fixed together with the first magnetic isolation sheet.

[0015] As a preferred solution, a circuit board and a battery are further arranged inside the housing; the battery, the coil module, and the semiconductor refrigeration component are all electrically connected to the circuit board. The heat dissipation member is located on the side of the heat conduction plate and is arranged side by side and horizontally with the battery, the coil module, and the circuit board.

[0016] As a preferred solution, the battery is located on the side of the heat conduction plate away from the semiconductor refrigeration component, and a heat insulation layer is wrapped on the battery.

[0017] The utility model has obvious advantages and beneficial effects compared with the prior art. Specifically, it can be seen from the above technical solutions:

[0018] By setting the annular part of the semiconductor refrigeration component around the outer periphery of the coil module, and connecting the cold end of the semiconductor refrigeration component to the contact surface by thermal conduction, the part of the contact surface that contacts the electronic device can be cooled, saving installation space, making the wireless charging device thinner and more portable, and at the same time saving fan blowing, directly conducting heat, transferring temperature, saving energy consumption, and under the same volume, this product can increase the amount of electricity that can be charged for electronic devices.

[0019] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic assembly perspective view of the first preferred embodiment of the utility model;

[0021] Figure 2 It is a three-dimensional schematic diagram of the assembly of the first preferred embodiment of the utility model from another angle;

[0022] Figure 3 It is an exploded view of the first preferred embodiment of the utility model;

[0023] Figure 4 It is an exploded view from another angle of the first preferred embodiment of the utility model;

[0024] Figure 5 It is a cross-sectional view of the first preferred embodiment of the utility model;

[0025] Figure 6 This is an enlarged schematic diagram of the internal structure assembly of the first preferred embodiment of the utility model;

[0026] Figure 7 This is an enlarged schematic diagram of the internal structure assembly of the first preferred embodiment of the utility model from another angle;

[0027] Figure 8 This is an enlarged schematic diagram of the internal structure assembly of the second preferred embodiment of the utility model;

[0028] Figure 9 This is an enlarged schematic diagram of the internal structure assembly of the second preferred embodiment of the utility model from another angle;

[0029] Figure 10 yes Figure 8 Schematic diagram of the decomposition of

[0030] Figure 11 yes Figure 9 Schematic diagram of the decomposition.

[0031] Description of the accompanying drawings:

[0032] 10. Outer shell 11. Contact surface

[0033] 12. Accommodating cavity 20. Circuit board

[0034] 30. Battery 31. Heat insulation layer

[0035] 40. Coil module 41. Central hole

[0036] 50. Semiconductor refrigeration component 51. Annular part

[0037] 52. Base 501. Through hole

[0038] 502. Groove 60. Heat dissipation component

[0039] 61. Heat conducting plate 62. Heat dissipation part

[0040] 63. Heat dissipation fan 71. First magnetic isolation sheet

[0041] 72. Second magnetic isolation sheet 73. Second heat conduction part

[0042] 74. Magnet. Detailed implementation manner

[0043] Please refer to Figures 1 to 7 as shown, which shows the specific structure of the first preferred embodiment of the present utility model, including an outer shell 10, a circuit board 20, a battery 30, a coil module 40 and a semiconductor refrigeration component 50.

[0044] One side of the outer shell 10 is a contact surface 11, the outer surface of the contact surface 11 is used to contact an electronic device (such as a mobile phone, a tablet computer, etc.), and the inner surface of the contact surface 11 contacts the semiconductor refrigeration component 50. In this embodiment, an accommodating cavity 12 is provided inside the outer shell 10, and the outer shell 10 is of a cuboid structure.

[0045] The circuit board 20, the battery 30, the coil module 40 and the semiconductor refrigeration element 50 are all arranged in the housing 10. The battery 30, the coil module 40 and the semiconductor refrigeration element 50 are all electrically connected to the circuit board 20. The cold end of the semiconductor refrigeration element 50 is thermally connected to the contact surface 11. The contact surface 11 is cooled by the cold end of the semiconductor refrigeration element 50, thereby cooling the electronic device contacted by the contact surface 11. The semiconductor refrigeration element 50 has an annular portion 51, which surrounds the outer periphery of the coil module 40, which can save installation space. In this embodiment, the circuit board 20, the battery 30, the coil module 40 and the semiconductor refrigeration element 50 are all fixed in the accommodating cavity 12. The battery 30 is located on the side of the heat conducting plate 61 away from the semiconductor refrigeration element 50, and the battery 30 is wrapped with a heat insulation layer 31 to effectively isolate the heat of the hot end of the semiconductor refrigeration element 50, which can prevent high temperature from affecting the performance of the battery 30. The first magnetic shielding sheet 71 is overlapped on the side of the coil module 40 facing away from the contact surface 11, and the second magnetic shielding sheet 72 is arranged at the central hole 41 of the coil module 40. The second magnetic shielding sheet 72 is overlapped and fixed with the first magnetic shielding sheet 71. The coil module 40 is used to generate a magnetic field to charge the electronic device. The second magnetic shielding sheet 72 and the first magnetic shielding sheet 71 are used to reduce electromagnetic interference and protect the coil module 40 and other components from mechanical damage. The semiconductor refrigeration component 50 is an annular hollow structure with a through hole 501 at the center. The coil module 40 is located in the through hole 501, and the semiconductor refrigeration component 50 is an annular portion 51. The inner and outer contours of the semiconductor refrigeration component 50 are circular, and of course, they can also be square or other shapes, without limitation.

[0046] Furthermore, a heat dissipation assembly 60 is provided in the housing 10, and the heat dissipation assembly 60 includes a heat conducting plate 61 and a heat sink 62; the heat conducting plate 61 is directly facing the hot end of the semiconductor refrigeration element 50 and is connected to the hot end of the semiconductor refrigeration element 50 by thermal conduction, and the heat sink 62 is fixedly connected to the heat conducting plate 61 and is located on the side of the heat conducting plate 61, and the heat sink 62 is arranged side by side with the battery 30, the coil module 40 and the circuit board 20 to better achieve thinning and space saving, and to further dissipate heat for the coil module 40, and the temperature of the coil module 40 is transferred to the heat sink 62 through the heat conducting plate 61, so as to achieve a better heat dissipation effect. In this embodiment, the side of the coil module 40 away from the contact surface 11 and the hot end of the semiconductor refrigeration element 50 are fixedly attached to one surface of one end of the heat conducting plate 61, and the heat sink 62 is fixedly attached to the other surface of the other end of the heat conducting plate 61. In addition, the hot end of the semiconductor refrigeration component 50 is provided with a first heat conducting component (not shown in the figure), and the first heat conducting component is in contact with the heat conducting plate 61. The cold end of the semiconductor refrigeration component 50 is provided with a second heat conducting component 73, and the second heat conducting component 73 is in contact with the contact surface 11, and is used to transfer the temperature of the semiconductor refrigeration plate 50. The outer diameter of the second heat conducting component 72 is larger than the outer diameter of the semiconductor refrigeration component 50 to increase the temperature conduction area and improve the heat conduction efficiency. The first heat conducting component and the second heat conducting component 73 are thermal grease or other heat conducting media, without limitation.

[0047] In addition, a magnet 74 is disposed in the housing 10 . The magnet 74 is located between the coil module 40 and the annular portion 51 . The magnet 74 is an open annular structure. The magnet 74 is used to absorb the electronic device to facilitate positioning of the wireless charging position of the electronic device.

[0048] The working principle of this embodiment is described in detail as follows:

[0049] When in use, the electronic device is placed on the contact surface 11, and the magnet 74 is used to adsorb and fix the electronic device. At this time, the coil module 40 is paired with the internal device of the electronic device. After the pairing is successful, the battery 30 supplies power to the coil module 40 through the circuit board 20, and the coil module 40 generates a magnetic field to wirelessly charge the electronic device. During the charging process, the battery 30 supplies power to the semiconductor refrigeration element 50 through the circuit board 20, so that the semiconductor refrigeration element 50 works to cool the contact surface 11 and the electronic device to prevent the temperature of the housing 10 and the electronic device from being too high. At the same time, the heat generated by the coil module 40 is transferred to the heat sink 62 through the heat conduction plate 61, and the heat is dissipated by the heat sink 62.

[0050] Please refer to Figures 8 to 11 As shown, it shows the specific structure of the second preferred embodiment of the utility model. The specific structure of this embodiment is basically the same as the specific structure of the first preferred embodiment mentioned above, and the difference is that:

[0051] In this embodiment, the semiconductor refrigerating element 50 is plate-shaped and includes a base portion 52. The annular portion 51 is located at the peripheral edge of the surface of the base portion 52 and encloses a groove 502 with the base portion 52. The groove 502 faces the side of the contact surface, and the groove 502 is formed at the cold end of the semiconductor refrigerating element 50. The coil module 40 and the magnet 74 are both located in the groove 502, and the bottom surface of the groove 502 is the cold surface, so that the semiconductor refrigerating element 50 can synchronously cool the coil module 40 and the magnet 74, achieving a better cooling effect. Also, the outer contour of the base portion 52 is square or circular, without limitation.

[0052] In addition, a cooling fan 63 is provided on the heat dissipation element 62 to achieve a better heat dissipation effect.

[0053] The working principle of this embodiment is basically the same as that of the aforementioned first preferred embodiment, and the working principle of this embodiment will not be described in detail here.

[0054] The design focus of the present utility model lies in: by arranging the annular portion of the semiconductor refrigerating element around the outer periphery of the coil module, and thermally connecting the semiconductor refrigerating element to the contact surface, the portion of the contact surface in contact with the electronic device can be cooled, saving installation space, making the wireless charging device thinner and more portable. At the same time, it can save the blowing of the fan, directly conduct heat, transfer the temperature, and save energy consumption. In the case of the same volume, the amount of electricity that this product can supply for the electronic device to charge increases.

[0055] The above are only the preferred embodiments of the present utility model, and do not impose any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes, and modifications made to the above embodiments according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A wireless charging device, characterized in that: It includes a shell, a coil module and a semiconductor refrigeration component; one side of the shell is a contact surface; the coil module and the semiconductor refrigeration component are both arranged in the shell, the cold end of the semiconductor refrigeration component is thermally connected to the contact surface, and the semiconductor refrigeration component has an annular portion, which surrounds the outer circumference of the coil module.

2. The wireless charging device according to claim 1, characterized in that: A heat dissipation assembly is arranged in the shell, and the heat dissipation assembly includes a heat conduction plate and a heat sink; the heat conduction plate is connected to the hot end of the semiconductor refrigeration element by thermal conduction, and the heat sink is fixedly connected to the heat conduction plate.

3. The wireless charging device according to claim 2, characterized in that: The hot end of the semiconductor refrigeration element is provided with a first temperature conducting element, and the first temperature conducting element is in contact with the heat conducting plate. The cold end of the semiconductor refrigeration element is provided with a second temperature conducting element, and the second temperature conducting element is in contact with the contact surface.

4. The wireless charging device according to claim 1, characterized in that: The semiconductor refrigeration component is an annular hollow structure as a whole, with a through hole penetrating the center thereof, and the coil module is located in the through hole.

5. The wireless charging device according to claim 1, characterized in that: The semiconductor refrigeration element includes a base, the annular portion is located at the surface periphery of the base and forms a groove with the base, the groove faces one side of the contact surface, and the groove is formed at the cold end of the semiconductor refrigeration element, and the coil module is located in the groove.

6. The wireless charging device according to claim 5, characterized in that: The semiconductor refrigeration element is plate-shaped, and the outer contour of the base is square or circular.

7. The wireless charging device according to claim 1, characterized in that: A magnet is arranged in the shell, and the magnet is located between the coil module and the annular portion.

8. The wireless charging device according to claim 1, characterized in that: One side of the coil module faces the contact surface, and the other side of the coil module is overlapped with a first magnetic isolation sheet. A second magnetic isolation sheet is arranged at the center hole of the coil module, and the second magnetic isolation sheet is overlapped and fixed with the first magnetic isolation sheet.

9. The wireless charging device according to claim 2, characterized in that: A circuit board and a battery are also arranged in the housing; the battery, the coil module and the semiconductor refrigeration element are all electrically connected to the circuit board, and the heat sink is located on the side of the heat conductive plate and is arranged side by side with the battery, the coil module and the circuit board.

10. The wireless charging device according to claim 9, characterized in that: The battery is located on a side of the heat conducting plate away from the semiconductor refrigeration component, and a heat insulating layer is wrapped on the battery.

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