Silicon wafer feeding mechanism and production line
By designing a silicon wafer loading mechanism including a multi-storey loading rack, a multi-layer loading rack and an independent loading rack, the problems of cumbersome loading flow and temporary storage of silicon wafers in the prior art are solved, and the rapid, accurate and classified transmission of silicon wafers are achieved, and the problem of mixing is avoided.
Patent Information
- Application Number
- CN202420899678.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The flow of existing silicon wafers is complicated and the transfer is temporarily chaotic, which is prone to the problem of mixing the wafers.
A silicon wafer loading mechanism is designed, including a multi-storey loading rack, a multi-layer loading rack and an independent loading rack. Through automated control and the design of multi-layer conveying lines, the rapid, accurate and classified transmission of silicon wafers can be achieved.
It realizes rapid flow of silicon wafers and clear temporary storage, avoids the problem of mixing films and improves the transmission efficiency and quality.
Smart Images
Figure CN223032329U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of solar photovoltaic silicon wafer loading, and particularly relates to a silicon wafer loading mechanism and a production line provided with the loading mechanism. Background Art
[0002] When packaging silicon wafers currently, it is necessary to load and transfer the silicon wafers. However, for the transfer and movement of different types of silicon wafers such as defective silicon wafers, finished silicon wafers, and silicon wafers to be placed, the structure is complex, the flow is cumbersome, and the transfer line is miscellaneous and not refined. Not only is the flow slow, but the intermediate transfer and temporary storage are chaotic, and the problem of wafer mixing is extremely likely to occur. Summary of the Invention
[0003] This application provides a silicon wafer loading mechanism and a production line provided with the loading mechanism, and solves the technical problems of cumbersome flow and chaotic intermediate transfer and temporary storage in the existing loading process.
[0004] To solve at least one of the above technical problems, the technical solution adopted in this application is:
[0005] A silicon wafer loading mechanism includes:
[0006] A multi-bin loading rack, which is provided with bins for placing packaging materials;
[0007] A multi-layer loading rack, which is provided with a plurality of conveyor lines for transporting cassettes carrying different types of silicon wafers;
[0008] An independent loading rack, which is equipped with a loading table for transporting empty cassettes;
[0009] The independent loading rack is placed between the multi-bin loading rack and the multi-layer loading rack, and is configured close to the side of the multi-bin loading rack, and is docked with the multi-layer loading rack.
[0010] Further, the multi-bin loading rack, the independent loading rack and the multi-layer loading rack are arranged in the same column in sequence; and the multi-bin loading rack is a suspended loading rack, the independent loading rack is a lifting loading rack, and the multi-layer loading rack is a horizontal transfer loading rack.
[0011] Further, the multi-bin loading rack further includes:
[0012] A placement rack for supporting the bins, which is provided with a transfer table for placing the bins;
[0013] A suction tray for picking and placing packaging materials;
[0014] And a transfer rack for controlling the suction tray;
[0015] The suction tray is suspended above the transfer table, controlled by the transfer rack disposed on one side of the placement rack, and moves along the length, width, and height directions of the placement rack.
[0016] Furthermore, at least two of the positions are provided on the placement rack, and the positions are arranged in the same column along the length direction of the placement rack;
[0017] Preferably, the suction tray is configured as a double-group structure, and the number thereof is the same as the number of the positions arranged in the same column along the length direction of the placement rack.
[0018] Furthermore, in the multi-layer loading rack, there is a first conveyor line on the uppermost layer, a second conveyor line on the middle layer, and a third conveyor line on the lowermost layer. The transmission directions between the first conveyor line and the second conveyor line and the third conveyor line are opposite, and the third conveyor line is docked with the independent loading rack.
[0019] Furthermore, there is also a fourth conveyor line that cross-docks with the second conveyor line, and the fourth conveyor line moves along its length direction from the suspended end towards the side close to the second conveyor line.
[0020] Furthermore, the highest position of the loading table is set at the same height as the first conveyor line; its lowest position is set at the same height as the third conveyor line.
[0021] Furthermore, the independent loading rack further includes a lifting assembly and a loading motor disposed at the end of the multi-bin loading rack, and the loading table is connected to the lifting assembly.
[0022] Furthermore, there is also a pushing member, which is disposed on the side of the multi-bin loading rack close to the loading table; when the cartridge loaded with packaging materials is driven by the loading table to its lowest position, the pushing member can push the cartridge to be transferred to the corresponding docking conveyor line in the multi-layer loading rack.
[0023] A production line is equipped with the loading mechanism as described above.
[0024] The silicon wafer loading mechanism designed by the present application has a reasonable and simple structure design, can automatically classify and transfer various types of silicon wafers with fast flow, is fully automated controlled, safe and reliable, has a high grafting rate of each component, fast and simple flow transfer, clear transfer and temporary storage, and will not have the problem of mixed wafers; the transfer and transmission efficiency is high and the quality is good. The present application also proposes a production line provided with the loading mechanism. Description of the Drawings
[0025] Figure 1 It is a three-dimensional view of the loading unit of an embodiment of the present application;
[0026] Figure 2It is a perspective view of a multi-layer loading rack according to an embodiment of the present application.
[0027] In the figure:
[0028] 100, loading unit 10, multi-bin loading rack 11, transfer table
[0029] 12, bin 13, suction tray 14, transfer rack
[0030] 141, transfer component one 142, transfer component two 143, lifting component one
[0031] 20, multi-layer loading rack 21, conveyor line one 22, conveyor line two
[0032] 23, conveyor line three 24, conveyor line four 30, independent loading rack
[0033] 31, loading platform 32, loading motor 33, lifting component two
[0034] 34, pushing member 40, material box Detailed implementation manners
[0035] The present application will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0036] This embodiment provides a wafer loading mechanism 100, as Figure 1 shown, including a multi-bin loading rack 10 for placing packaging materials, a multi-layer loading rack 20 for transporting different types of wafers, and an independent loading rack 30 for placing empty material boxes 40. The multi-bin loading rack 10, the independent loading rack 30 and the multi-layer loading rack 20 are configured in the same column in the width direction of the packaging machine and are arranged at one end of the length of the packaging machine. The multi-bin loading rack 10 and the multi-layer loading rack 20 are respectively arranged on both sides of the width of the packaging machine, and the multi-layer loading rack 20 moves horizontally along its conveyor line and is connected to the conveyor line outside the packaging machine. The independent loading rack 30 is placed between the multi-bin loading rack 10 and the multi-layer loading rack 20, and the independent loading rack 30 is arranged close to the multi-bin loading rack 10 side. It mainly moves up and down and can be docked with the conveyor line three 23 in the multi-layer loading rack 20 for transporting the wafer material box 40 to be placed. Therefore, the independent loading rack 30 and the multi-layer loading rack 20 are in clearance fit. In order to improve the stability of the fixed position of the independent loading rack 15, it is fixed on the end frame of the multi-bin loading rack 10 close to the multi-layer loading rack 20, and part of it is connected to the frame in the transfer component one 141. The loading mechanism 100 proposed in the present application can not only classify and transfer different types of wafers such as abnormal wafers, finished wafers, and wafers to be placed, but also the transfer is fast and simple, the transfer and temporary storage are clear, and there will be no problem of wafer mixing.
[0037] In this embodiment, the silicon wafers are collectively referred to as a stack of substrates placed one on top of the other. The substrates can be square-structured or rectangular-structured, and all of them comply with all the units in this application and are within the scope of protection of this case.
[0038] Correspondingly, the cassette 40 is a box body with an open upper end surface and four top corners for regularizing silicon wafers. It can be made of a cardboard box, a plastic box, or a resin box, and a plastic box is preferably selected. The outer shape of the cassette 40 is the same as that of the silicon wafers, both being square-structured or rectangular-structured. There are notches on the four side vertical surfaces of the cassette 40, and trapezoidal grooves are also provided on the four side edges of its lower end plane. The notches and the grooves are in corresponding positions, mainly for avoiding the clamping of the manipulator. Among them, the long sides of all the grooves are of an open structure, and their short sides are all arranged towards the center position side of the cassette 40, and the connection parts of the four grooves are of an integral square or rectangular structure to improve the strength of the lower end surface support. For the clamping or transfer of rectangular silicon wafers, other components in this application can be applicable to this type of structure. Only by changing the regularizing width can the effect be ensured, and the corresponding drawings are omitted; only square-structured silicon wafers are taken as examples below.
[0039] The loading unit 100 can stack the silicon wafers into the cassette 40 filled with packaging materials (corrugated board and sulfur-free paper), and transfer the silicon wafers initially stacked in the cassette 40 to the next process through the manipulator.
[0040] On one side of the multi-bin loading rack 10, there is a transfer rack for operating the movement of the packaging materials. It can control the suction cup 13 to move along the width and length directions of the multi-bin loading rack 10, and can also drive the suction cup 13 to move vertically up and down along the height direction of the multi-bin loading rack 10.
[0041] Specifically, the multi-bin loading rack 10 is a suspended loading rack, including a fixed placement rack, on which there is a transfer table 11. On the transfer table 11, there are several bins 12 for placing packaging materials. On the bins, there are also suction cups 13 for picking and placing packaging materials and a transfer rack 14 for controlling the suction cups 13. The transfer rack 14 includes a first transfer component 141 for sliding along the length direction of the placement rack, a second transfer component 142 for moving across the width direction of the placement rack, and a first lifting component 143 for moving up and down along the height direction of the bin 12. Among them, the first transfer component 141 is configured on the side of the multi-bin loading rack 10 away from the sorting process, and the second transfer component 142 is suspended directly above the bin 12; on the second transfer component 142, there is also a first lifting component 143 for controlling the suction cup 13.
[0042] The transfer component 141, the transfer component 142, and the lifting component 143 are all conventional components in the art and will not be elaborated here. The suction tray 13 is controlled by the lifting component 143, the transfer component 141, and the transfer component 142. It can sample the packaging materials in different bins 12, place the packaging materials into the material box 40 on the independent loading rack 30, and then retract to the bin 12 to prepare for sampling the next group of packaging materials.
[0043] The packaging materials include corrugated boards and sulfur-free papers, etc. Corrugated boards and sulfur-free papers are commonly used packaging materials in silicon wafer packaging, mainly used to protect silicon wafers from being scratched or damaged. Their structures are adapted to the size of the silicon wafers, mainly placed on both sides of the silicon wafers. The sulfur-free paper is placed closely against the upper and lower end faces of the silicon wafer, and the corrugated board is placed on the outer side of the sulfur-free paper. The bins 12 for corrugated boards and the bins 12 for sulfur-free papers are arranged in a row along the width direction of the multi-bin loading rack 10 and are configured side by side, that is, the bins 12 for corrugated boards are configured in the same column along the width direction of the multi-bin loading rack 10. Correspondingly, the bins 12 for sulfur-free papers are also configured in the same column along the width direction of the multi-bin loading rack 10. Then, a bin 12 for sulfur-free paper and a bin 12 for corrugated board are arranged at intervals in the same column along the length direction of the multi-bin loading rack 10, and the bin 12 for sulfur-free paper is arranged closer to the multi-layer loading rack 20.
[0044] The suction tray 13 has a double-group structure, that is, the number of suction trays 13 is the same as the number of bins 12 configured in the same column along the length direction of the placement rack. That is, two parallel suction trays 13 are provided on the transfer rack. It can synchronously suck sulfur-free paper and corrugated boards from the bins 12 for sulfur-free papers and the bins 12 for corrugated boards in the same column, and place the corrugated board and the sulfur-free paper into the material box 40 in sequence before placing the silicon wafer into the empty material box 40. After the silicon wafer is placed in the material box 40, it retracts to synchronously suck sulfur-free paper and corrugated boards, and then place the sulfur-free paper and the corrugated board on the upper surface of the silicon wafer in sequence, so that both sides of the silicon wafer are protected by packaging materials.
[0045] Such as Figure 2As shown, the multi-layer loading rack 20 is a loading rack with multi-layer horizontal transmission, including a first conveyor line 21 for transporting the good silicon wafer cartridges 40, a second conveyor line 22 for transporting the defective silicon wafer cartridges 40, a fourth conveyor line 24, and a third conveyor line 23 for transporting the silicon wafer cartridges to be placed. The first conveyor line 21, the second conveyor line 22, and the third conveyor line 23 are arranged in sequence from top to bottom along the height direction of the multi-layer loading rack 20; the second conveyor line 22 and the fourth conveyor line 24 are arranged on the same layer. That is to say, in the multi-layer loading rack 20, the first conveyor line 21 carrying the finished silicon wafer cartridges 40 is arranged on the topmost layer; the third conveyor line 23 carrying the silicon wafer cartridges to be placed is arranged on the bottommost layer; the second conveyor line 22 carrying the defective silicon wafer cartridges 40 is arranged in the middle layer, and it is vertically and cross-docked with the auxiliary fourth conveyor line 24 used when the defective silicon wafer cartridges 40 are initially unloaded.
[0046] Among them, the transmission direction of the first conveyor line 21 is different from that of the second conveyor line 22 and the third conveyor line 23. The transmission direction of the first conveyor line 21 is to move from the outside towards the side close to the independent loading rack 30; the transmission directions of the second conveyor line 22 and the third conveyor line 23 are both to move from one end close to the independent loading rack 30 towards the outside; the fourth conveyor line 24 is to move from the direction of its end far from the second conveyor line 22 towards the direction of its end close to the second conveyor line 22.
[0047] The cartridge 40 of the silicon wafers to be placed moves to the loading table outside the packaging machine through the third conveyor line 23. After the silicon wafers are placed in the cartridge 40 by the manipulator, it then moves from the outside to the end on the side close to the independent loading rack 30 through the first conveyor line 21. This position is close to the manipulator, facilitating the manipulator to clamp and transfer the silicon wafers and the cartridge 40 to the sorting process.
[0048] The silicon wafers that are unqualified after quality inspection are directly clamped and transferred by another manipulator to the cartridge 40 at the position on the fourth conveyor line 24 close to its end far from the second conveyor line 22. The cartridge 40 carrying the unqualified silicon wafers is driven by the fourth conveyor line 24 as an auxiliary line and moves along its transmission direction to its end close to the second conveyor line 22, and then flows to the second conveyor line 22; it then moves to the external recycling and processing station along the transmission direction of the second conveyor line 22 for unified collection.
[0049] The independent loading rack 30 is a lifting loading rack for placing the empty cartridges 40 retrieved from the sorting process. It includes a loading table 31, a second lifting component 33 arranged on the rack body where the first transfer component 141 is located, and a loading motor 32 for driving the second lifting component 33 to move up and down. The loading table 31 is directly connected to the second lifting component 33, and the loading motor 32 drives the second lifting component 33 to move to drive the loading table 31 to move vertically up and down. The highest position of the loading table 31 is set at the same height as the first conveyor line 21, and its lowest position is set at the same height as the third conveyor line 23.
[0050] At the lowest position of the loading table 31 and on one side close to the multi-bin loading rack 10, there is a pushing member 34 for pushing the material box 40. The pushing member 34 is fixed on one side of the frame of the multi-bin loading rack 10, and it can push the material box 40 to move towards the side close to the third conveyor line 23. The pushing member 34 can push the material box 40 to be transferred to the corresponding docking third conveyor line 23 in the multi-layer loading rack 20 when the material box 40 loaded with packaging materials is driven by the loading table 31 to its lowest position. The pushing member 34 can be a structure driven by a cylinder or a structure driven by a spring, which is a common structure in this field and is not specifically limited here, and the detailed drawings are omitted.
[0051] The loading table 31 is mainly used to place the empty material box 40 retrieved from the external process. At this time, there is no material in the material box 40, and it is an empty box body. The material box 40 is clamped by the manipulator and placed on the loading table 31 at the highest position in the independent loading rack 30. Through the cooperation of the first transfer assembly 141, the second transfer assembly 142, and the first lifting assembly 143, the suction cup 13 is controlled to sequentially pick up the corrugated board and the sulfur-free paper and place them into the empty material box 40, thus forming the material box 40 to be filled with silicon wafers. The material box 40 loaded with silicon wafers to be placed is driven by the loading table 31 and moves downward to its lowest position, that is, to the position where the third conveyor line 23 is located, and is pushed by the pushing member 34 arranged on one side of the loading table 31 at the lowest position and close to the multi-bin loading rack 10, and is transferred to the third conveyor line 23. The third conveyor line 23 then drives the material box 40 loaded with silicon wafers to be placed and moves outward to the position for loading silicon wafers. After the silicon wafers are placed in the material box 40 by the manipulator at the external loading position, it is transferred to the external end of the first conveyor line 21, and then driven by the first conveyor line 21 and moves along the transmission direction of the first conveyor line 21 to the end close to the independent loading rack 30, and is ready to be clamped by the manipulator and transferred to the next process.
[0052] In the loading mechanism 100, after the empty material box 40 is retrieved by the manipulator from the external process and placed on the loading table 31 in the independent loading rack 30, the transfer rack 14 controls the suction cup 13 to sequentially take out the corrugated board and the sulfur-free paper from the storage bin 12 and place them in the empty material box 40, forming the material box 40 to be filled with silicon wafers. This material box 40 is then driven by the loading table 31 in the independent loading rack 30 and descends from the highest position to the lowest position, that is, descends to the third conveyor line 23 for the material box 40 to be filled with silicon wafers in the multi-layer loading rack 20, and then is moved by the third conveyor line 23 to the external silicon wafer loading table. After the silicon wafer loading is completed, the material box 40 loaded with silicon wafers is then transferred to the topmost first conveyor line 21 and is conveyed to the end close to the independent loading rack 30 in the first conveyor line 21 and stops, waiting to be transferred by the manipulator to the sorting process. The manipulator transfers the material box 40 loaded with silicon wafers on the first conveyor line 21 to the next process.
[0053] A production line is equipped with the feeding mechanism 100 as described above.
[0054] A wafer feeding mechanism designed according to the present application has a reasonable and simple structure design. It can automatically classify and transfer various types of wafers with fast turnover, full-automatic control, safety and reliability. The grafting rate of each component is high, the turnover and transmission are fast and simple, the transfer and temporary storage are clear, and there will be no problem of wafer mixing; the transfer and transmission efficiency is high and the quality is good. The present application also proposes a production line provided with the feeding mechanism.
[0055] The above has described the embodiments of the present application in detail. The above content is only the preferred embodiment of the present application and cannot be considered as limiting the scope of implementation of the present application. All equivalent changes and improvements made according to the scope of the present application should still fall within the patent coverage of the present application.
Claims
1. A silicon wafer feeding mechanism, characterized in that: include: A multi-bin loading rack, which has bins for placing packaging materials; A multi-layer loading rack with several conveyor lines for transferring boxes containing different types of silicon wafers; Independent loading rack, equipped with a loading platform for the transmission of empty material boxes; The independent loading rack is placed between the multi-bin loading rack and the multi-layer loading rack, and is configured close to one side of the multi-bin loading rack, and is docked with the multi-layer loading rack.
2. A silicon wafer feeding mechanism according to claim 1, characterized in that: The multi-bin loading rack, the independent loading rack and the multi-layer loading rack are arranged in the same row in sequence; and the multi-bin loading rack is a suspended loading rack, the independent loading rack is a lifting loading rack, and the multi-layer loading rack is a horizontal transmission loading rack.
3. A silicon wafer feeding mechanism according to claim 1 or 2, characterized in that: The multi-bin loading rack also includes: A placement rack for supporting the bins, on which a transfer platform for placing the bins is provided; Suction tray for picking up and placing packaging materials; and a transfer rack for controlling the suction tray; The suction plate is suspended above the transfer platform and is controlled by the transfer rack arranged on one side of the placement rack, and moves along the length, width and height directions of the placement rack.
4. A silicon wafer feeding mechanism according to claim 3, characterized in that: At least two of the storage bins are arranged on the placement rack, and the storage bins are arranged in the same row along the length direction of the placement rack.
5. A silicon wafer feeding mechanism according to claim 4, characterized in that: The suction trays are configured as a double-group structure, and the number of the suction trays is the same as the number of the storage locations configured in the same row along the length direction of the placement rack.
6. A silicon wafer loading mechanism according to any one of claims 1-2, 4-5, characterized in that: The multi-layer loading rack is provided with a conveyor line 1 on the top layer, a conveyor line 2 on the middle layer and a conveyor line 3 on the bottom layer, and the transmission direction of the conveyor line 1 is opposite to that of the conveyor line 2 and the conveyor line 3, and the conveyor line 3 is docked with the independent loading rack.
7. A silicon wafer feeding mechanism according to claim 6, characterized in that: It also includes a transmission line 4 cross-jointed with the transmission line 2, and the transmission line 4 moves along its length direction from the suspended end toward a side close to the transmission line 2.
8. The silicon wafer loading mechanism according to claim 7, characterized in that: The highest position of the loading platform is arranged at the same height as the conveying line; and the lowest position thereof is arranged at the same height as the conveying line.
9. A silicon wafer loading mechanism according to any one of claims 1-2, 4-5, 7-8, characterized in that: The independent loading rack also includes a lifting assembly and a loading motor arranged at the end of the multi-bin loading rack, and the loading platform is connected to the lifting assembly.
10. The silicon wafer loading mechanism according to claim 9, characterized in that: A push-up member is also provided, which is arranged on one side of the multi-bin loading rack close to the loading platform; when the material box carrying the packaging material is driven to its lowest position by the loading platform, the push-up member can push the material box to be transferred to the corresponding docking conveying line in the multi-layer loading rack.
11. A production line, characterized in that: The invention is provided with a feeding mechanism as described in any one of claims 1 to 10.