Electroplating hanger and electroplating device
By providing a flow guide portion communicating with the conductive ring groove on the base material of the electroplating hanger, the problem of waste of liquid being brought out by the electroplating hanger is solved, and the effective discharge of liquid is achieved, material saving and cost reduction is achieved.
Patent Information
- Application Number
- CN202422197092.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-09
AI Technical Summary
In the semiconductor electroplating process, after the electroplating tray is taken out from the electroplating cell, a large amount of liquid will be brought out, resulting in waste of liquid and increasing the electroplating cost.
An electroplating hanger is designed, and the base material is provided with a flow guide portion communicating with the groove of the conductive ring to discharge liquid in the groove and reduce the amount of liquid discharge.
Through the design of the flow guide part, the amount of liquid brought out by the electroplating hanger from the electroplating tank is effectively reduced, liquid waste is reduced, materials are saved, and electroplating costs are reduced.
Smart Images
Figure CN223033500U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing processes, and more specifically, to an electroplating fixture and an electroplating device. Background Art
[0002] In the electroplating process of semiconductors, it is necessary to fix the pre-plated product on the fixture, and then put the fixture and the pre-plated product into the electroplating bath together to form a metal coating on the surface of the pre-plated product. After electroplating is completed, the fixture needs to be taken out of the electroplating bath.
[0003] After research by the inventor, it is found that after the fixture is taken out of the electroplating bath, a large amount of liquid will remain on the fixture, and the liquid carried out by the fixture cannot be recycled, resulting in serious waste and greatly increasing the electroplating cost. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an electroplating fixture and an electroplating device, which can reduce the amount of liquid carried out by the fixture from the electroplating bath, save materials and reduce costs.
[0005] The embodiments of the utility model are implemented as follows:
[0006] In a first aspect, the utility model provides an electroplating fixture, including:
[0007] A substrate;
[0008] A conductive ring, the conductive ring is fixed on the substrate; the conductive ring is provided with a groove for placing the pre-plated product;
[0009] A drainage part is arranged at the bottom of the substrate, and the drainage part is communicated with the groove for draining the liquid in the groove.
[0010] In an alternative embodiment, the drainage part includes a drainage groove and / or a drainage hole, and the drainage groove and / or the drainage hole are respectively communicated with the groove.
[0011] In an alternative embodiment, the aperture of the drainage hole is 2 mm to 5 mm.
[0012] In an alternative embodiment, a plurality of the drainage parts are arranged at intervals, and the number of the drainage parts is 3 to 5.
[0013] In an alternative embodiment, a drainage hole is arranged on the substrate, and a pipeline is installed in the drainage hole.
[0014] In an alternative embodiment, the substrate is in a plate shape, and at one end where the drainage part is arranged, the thickness of the substrate is 15 mm to 20 mm.
[0015] In an alternative embodiment, a sealing member is arranged in the conductive ring.
[0016] In an alternative embodiment, fixing holes are further provided on the substrate, and the fixing holes are provided at an end of the substrate away from the diversion portion.
[0017] In an alternative embodiment, a cover plate is further included. The cover plate is fixedly connected to the substrate, and the cover plate covers the conductive ring.
[0018] In a second aspect, the present invention provides an electroplating device, including an electroplating bath and the electroplating hanger according to any one of the foregoing embodiments.
[0019] The beneficial effects of the embodiments of the present invention include:
[0020] For the electroplating hanger provided by the embodiment of the present invention, a diversion portion communicating with the groove of the conductive ring is provided on the substrate, and a large amount of liquid remaining in the groove can be discharged from the diversion portion, reducing the amount of liquid brought out of the electroplating bath by the electroplating hanger, reducing the waste of electroplating liquid, saving materials, and reducing costs.
[0021] The electroplating device provided by the embodiment of the present invention includes the above-mentioned electroplating hanger. By providing a diversion portion on the substrate, a large amount of liquid remaining in the electroplating hanger can be discharged, reducing the amount of electroplating liquid brought out by the electroplating hanger, thereby reducing the waste of electroplating liquid, saving materials, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0023] Figure 1 is a schematic structural diagram of the electroplating hanger provided by the embodiment of the present invention;
[0024] Figure 2 is a schematic cross-sectional structure diagram of the conductive ring and the diversion hole of the electroplating hanger provided by the embodiment of the present invention.
[0025] Reference numerals: 100 - electroplating hanger; 110 - substrate; 111 - fixing hole; 113 - first mounting hole; 120 - conductive ring; 121 - groove; 123 - seal; 125 - screw; 130 - diversion portion; 131 - diversion hole; 140 - copper buckle; 141 - wire. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0026] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.
[0030] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0031] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0032] In the electroplating process of semiconductors, it is necessary to fix the pre-plated product on a fixture, and then put the fixture and the pre-plated product together into an electroplating bath to form a metal coating on the surface of the pre-plated product. After electroplating is completed, the fixture needs to be taken out of the electroplating bath. Currently, after the fixture is taken out of the electroplating bath, a large amount of liquid remains on the fixture, and the liquid carried away by the fixture cannot be recycled, resulting in serious waste of electroplating liquid and greatly increasing the electroplating cost.
[0033] To overcome at least one defect in the prior art, this embodiment proposes an electroplating fixture that can reduce the amount of liquid carried out of the electroplating bath by the fixture, save materials, and reduce costs.
[0034] Please refer to Figure 1 and Figure 2 As shown in and, an electroplating fixture 100 provided in this embodiment includes a base material 110 and a conductive ring 120. The conductive ring 120 is fixed on the base material 110; the conductive ring 120 is provided with a groove 121 for placing the pre-plated product. A diversion part 130 is provided at the bottom of the base material 110. The diversion part 130 is communicated with the groove 121 and is used for discharging the liquid in the groove 121. Since a diversion part 130 communicated with the groove 121 of the conductive ring 120 is provided on the base material 110, a large amount of liquid remaining in the groove 121 can be discharged from the diversion part 130, reducing the amount of liquid carried out of the electroplating bath by the electroplating fixture 100, reducing the waste of electroplating liquid, saving materials, and reducing costs.
[0035] Optionally, the base material 110 can be made of corrosion-resistant and anti-conductive materials such as PVDF or PTE.
[0036] Optionally, the diversion part 130 includes a diversion groove and / or diversion holes 131, and the diversion groove and / or diversion holes 131 are respectively communicated with the groove 121. It can be understood that the diversion part 130 can only include the diversion holes 131, and each diversion hole 131 is communicated with the groove 121 of the conductive ring 120. Or, the diversion part 130 can only include the diversion groove, and each diversion groove is communicated with the groove 121 of the conductive ring 120. Or, the diversion part 130 includes both the diversion holes 131 and the diversion groove. The diversion holes 131 and the diversion groove are respectively communicated with the groove 121 of the conductive ring 120.
[0037] Optionally, the aperture of the diversion hole 131 is 2 mm to 5 mm. For example, the aperture is 2 mm, 3 mm, 4 mm, 4.5 mm or any value in the range of 2 mm to 5 mm. It can be understood that the cross-sectional shape of the diversion hole 131 is not limited to being circular, oval, triangular, quadrilateral, pentagonal or hexagonal, etc., and no specific limitation is made here.
[0038] If a diversion groove is provided, the groove width of the diversion groove can be set to 2 mm to 5 mm. For example, the groove width is 2 mm, 3 mm, 4 mm, 4.5 mm or any value in the range of 2 mm to 5 mm. The groove depth of the diversion groove can be set to 2 mm to 5 mm. For example, the groove depth is 2 mm, 3 mm, 4 mm, 4.5 mm or any value in the range of 2 mm to 5 mm. No specific limitation is made here.
[0039] Optionally, a plurality of diversion portions 130 are arranged at intervals, and the number of the diversion portions 130 is 3 to 5. The number of the diversion grooves can be one or more, and the number of the diversion holes 131 can be one or more. If both the diversion holes 131 and the diversion grooves are provided, the sum of the number of the diversion holes 131 and the number of the diversion grooves is three to five.
[0040] In this embodiment, the diversion holes 131 and the diversion grooves are respectively opened along a straight line, and are opened from the groove 121 of the conductive ring 120 to the bottom edge of the substrate 110. It should be noted that the bottom of the substrate 110 refers to the lower end when the substrate 110 is normally hung, that is, when the substrate 110 is vertically placed. The liquid is discharged from the diversion holes 131 or the diversion grooves at the bottom of the substrate 110 under the action of gravity. In this embodiment, the diversion holes 131 and the diversion grooves are respectively opened along a straight line, which can reduce the flow resistance of the liquid in the diversion holes 131 or the diversion grooves, improve the discharge efficiency, shorten the liquid discharge time, and thus improve the efficiency of the entire electroplating process.
[0041] Of course, in some other embodiments, the diversion holes 131 and the diversion grooves can also be designed to be curved, such as wavy, Z-shaped or arc-shaped, etc., and no specific limitation is made here.
[0042] Optionally, the substrate 110 is provided with diversion holes 131, and pipes are installed in the diversion holes 131. In some embodiments, some pipes can be installed in the diversion holes 131 for discharging liquid, and the pipes are made of materials with corrosion-resistant characteristics. The pipes are convenient for guiding the flow of liquid.
[0043] Optionally, the substrate 110 is in a plate shape, and at the end where the diversion portion 130 is provided, the thickness of the substrate 110 is 15 mm to 20 mm. Preferably, the thickness of the substrate 110 is 15 mm to 17 mm. The thickness of the substrate 110 at the bottom is relatively greater than the thickness of other positions of the substrate 110. Such a setting can make up for the weakening of the structural strength caused by opening the diversion holes 131 or the diversion grooves at the bottom, and ensure that the substrate 110 has sufficient strength.
[0044] Optionally, the substrate 110 is further provided with fixing holes 111, and the fixing holes 111 are provided at the end of the substrate 110 away from the diversion portion 130. After the fixing holes 111 are provided, it is convenient to hang the substrate 110 on the bracket after the substrate 110 is taken out of the electroplating bath.
[0045] In this embodiment, the conductive ring 120 is fixedly connected to the base material 110. The connection methods include but are not limited to screw 125 connection, bolt connection, clamping connection, bonding or welding, etc., and no specific limitation is made here. A groove 121 is provided on the inner ring of the conductive ring 120. The pre-plated product can be a wafer or a circuit board, etc. Taking a wafer as an example, the wafer is placed in the groove 121. The groove 121 plays a role in positioning and fixing the pre-plated product.
[0046] Optionally, a seal 123 is provided inside the conductive ring 120. The seal 123 can be a sealing ring or a sealing coating. Optionally, the seal 123 is attached to the inner wall of the groove 121. After the pre-plated product is installed, the seal 123 is located between the pre-plated product and the conductive ring 120. The seal 123 can play a certain buffering role, protect the edge of the pre-plated product, reduce friction and wear or collision, and play a protective role for the pre-plated product. Optionally, the seal 123 is made of non-conductive materials such as rubber and resin.
[0047] It can be understood that a copper buckle 140 and a wire 141 are also provided on the base material 110. The copper buckle 140 is fixed on the base material 110. One end of the wire 141 is connected to the copper buckle 140, and the other end is connected to the conductive ring 120. The number of wires 141 is multiple. One end of each wire 141 is connected to the copper buckle 140, and the other end is connected to the conductive ring 120. Optionally, the wire 141 is made of copper wire. The connection points of the wire 141 and the conductive ring 120 are evenly distributed along the circumference of the conductive ring 120, which is beneficial to improving the uniformity of electroplating.
[0048] Optionally, the copper buckle 140 and the wire 141 can also be made of other metals or conductive materials other than copper, and no specific limitation is made here. The conductive ring 120 is made of a metal material.
[0049] Optionally, the electroplating fixture 100 further includes a cover plate (not shown in the figure). The cover plate is fixedly connected to the base material 110, and the cover plate covers the conductive ring 120. A first mounting hole 113 is provided on the base material 110, and a second mounting hole corresponding to the first mounting hole 113 is provided on the cover plate. The cover plate and the base material 110 are fixedly connected by passing bolts or screws through the first mounting hole 113 and the second mounting hole. The setting of the cover plate can play a protective role for the pre-plated product.
[0050] Of course, in some other embodiments, the cover plate and the base material 110 can also adopt other connection methods, such as clamping connection, riveting connection or hinged connection, etc., and no specific limitation is made here.
[0051] The working principle of the electroplating fixture 100 is as follows:
[0052] Taking an electroplated wafer as an example, first place the wafer in the groove 121 of the conductive ring 120, cover the cover plate, place the substrate 110 in the electroplating bath. After the copper buckle 140 is electrified, the liquid in the electroplating bath is guided to the surface of the wafer by the current to form a metal layer, such as a copper layer, on the surface of the wafer. After electroplating is completed, take out the substrate 110. Since a large amount of electroplating liquid remains in the groove 121 of the conductive ring 120, when the substrate 110 is taken out in a vertical state, the liquid remaining in the groove 121 can be discharged through the diversion part 130 at the bottom and fall back into the electroplating bath, thereby reducing the amount of liquid taken away by the electroplating fixture 100 from the electroplating bath, reducing the waste of liquid, saving materials and reducing costs. Moreover, the design of multiple diversion holes 131 or multiple diversion grooves is conducive to quickly and thoroughly discharging the liquid in the groove 121 and improving the liquid discharge efficiency.
[0053] The embodiment of the present invention also provides an electroplating device, including an electroplating bath and the electroplating fixture 100 as described in any one of the foregoing embodiments. The electroplating fixture 100 can be used in electroplating processes for electroplating copper or other metals, such as for the wiring process of wafers, copper thickening process, etc., which are not specifically limited here.
[0054] In summary, the electroplating fixture 100 and the electroplating device provided by the embodiment of the present invention have the following beneficial effects, including:
[0055] The electroplating fixture 100 provided by the embodiment of the present invention is provided with a diversion part 130 communicating with the groove 121 of the conductive ring 120 on the substrate 110, which can discharge a large amount of liquid remaining in the groove 121 from the diversion part 130, reduce the amount of liquid taken out of the electroplating bath by the electroplating fixture 100, reduce the waste of electroplating liquid, save materials and reduce costs.
[0056] The electroplating device provided by the embodiment of the present invention includes the above-mentioned electroplating fixture 100. By opening a diversion part 130 on the substrate 110, a large amount of liquid remaining in the electroplating fixture 100 can be discharged, reducing the amount of electroplating liquid taken out by the electroplating fixture 100, thereby reducing the waste of electroplating liquid, saving materials and reducing costs.
[0057] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. An electroplating rack, characterized in that: include: A substrate (110); A conductive ring (120), the conductive ring (120) being fixed on the substrate (110); the conductive ring (120) being provided with a groove (121) for placing a pre-plated product; A flow guide portion (130) is provided at the bottom of the substrate (110); the flow guide portion (130) is in communication with the groove (121) and is used to discharge the liquid in the groove (121).
2. The electroplating rack according to claim 1, characterized in that: The flow guide portion (130) comprises a flow guide groove and / or a flow guide hole (131), and the flow guide groove and / or the flow guide hole (131) are respectively connected to the groove (121).
3. The electroplating rack according to claim 2, characterized in that: The diameter of the guide hole (131) is 2 mm to 5 mm.
4. The electroplating rack according to claim 1, characterized in that: The plurality of guide portions (130) are arranged at intervals, and the number of the guide portions (130) is 3 to 5.
5. The electroplating rack according to claim 1, characterized in that: The substrate (110) is provided with a flow guide hole (131), and a pipeline is installed in the flow guide hole (131).
6. The electroplating rack according to claim 1, characterized in that: The substrate (110) is in a plate shape, and at one end where the flow guide portion (130) is provided, the thickness of the substrate (110) is 15 mm to 20 mm.
7. The electroplating rack according to claim 1, characterized in that: A sealing member (123) is provided inside the conductive ring (120).
8. The electroplating rack according to claim 1, characterized in that: The substrate (110) is also provided with a fixing hole (111), and the fixing hole (111) is provided at an end of the substrate (110) away from the flow guide portion (130).
9. The electroplating rack according to any one of claims 1 to 8, characterized in that: It also comprises a cover plate, the cover plate is fixedly connected to the substrate (110), and the cover plate is arranged on the conductive ring (120).
10. An electroplating device, characterized in that: The invention comprises an electroplating pool and an electroplating rack as claimed in any one of claims 1 to 9.