Air supply wind wheel, fan module and range hood

Abstract

The utility model relates to an air supply wind wheel, a fan module and a range hood. The air supply wind wheel comprises a wind wheel body and a temperature adjusting assembly. Wherein the wind wheel body comprises fan blades, and the temperature adjusting assembly comprises a semiconductor chilling plate and a heat storage part. The semiconductor chilling plate is arranged on the fan blades, the working face of the semiconductor chilling plate is opposite to the fan blade where the semiconductor chilling plate is located, and the heat storage piece is arranged between the non-working face of the semiconductor chilling plate and the fan blades. According to the air supply wind wheel, the semiconductor chilling plates are additionally arranged on the fan blades, so that the air supply temperature not only depends on the environment temperature, but can actively change the air supply airflow temperature by means of refrigeration or heating of the working surfaces of the semiconductor chilling plates. Meanwhile, heat generated or absorbed by the non-working face of the semiconductor chilling plate can be temporarily absorbed or provided by the heat storage piece. Therefore, the air supply wind wheel adjusts the air supply temperature through the semiconductor chilling plate, so that the air supply temperature is not passively limited by the environment temperature any more, the air supply wind wheel better meets the requirements of users, and the air supply comfort is improved.

Description

Technical Field

[0001] The present application relates to the technical field of kitchen appliances, and particularly to a blowing air wheel, a fan module, and a range hood. Background Art

[0002] The main body of a fan range hood can be divided into two major parts: a fan module and a range hood module. The main function of the range hood module is to extract cooking fumes, and the main function of the fan module is to circulate air in the kitchen to cool down the indoor temperature. The fan module mainly cools the head and upper limbs of the cook by blowing high-speed air at the cook.

[0003] However, since the fan module can only drive air circulation, the blowing air temperature basically depends on the ambient temperature. For example, in hot summer when the kitchen temperature is very high, the temperature blown out by the fan module will also be very high, resulting in poor blowing comfort. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a blowing air wheel, a fan module, and a range hood that can improve blowing comfort for the above problems.

[0005] A blowing air wheel, the blowing air wheel includes:

[0006] An air wheel body, including blades; and

[0007] A temperature adjustment component, including a thermoelectric cooler and a heat storage member; the thermoelectric cooler is disposed on the blade and is configured such that its working surface faces away from the blade on which it is located, and the heat storage member is disposed between the non-working surface of the thermoelectric cooler and the blade.

[0008] In one embodiment, the blowing air wheel includes multiple groups of the temperature adjustment components;

[0009] All the temperature adjustment components are configured to be selectively partially or fully operative; or, the thermoelectric coolers of at least some of the temperature adjustment components are configured to be connected in parallel with each other or the power supply circuits are independent of each other.

[0010] In one embodiment, the blowing air wheel further includes a controller and a temperature sensor, the controller is electrically connected to all the temperature adjustment components, and the temperature sensor is electrically connected to the controller.

[0011] In one embodiment, the air wheel body includes multiple blades and multiple groups of the temperature adjustment components, and all the temperature adjustment components are respectively disposed on at least two blades.

[0012] In one embodiment, each blade is provided with a group of the temperature adjustment components.

[0013] In one embodiment, the working surface is a refrigerating surface and the non - working surface is a heat - dissipating surface; or, the working surface is a heat - dissipating surface and the non - working surface is a refrigerating surface.

[0014] In one embodiment, the air - supply wind wheel includes multiple groups of the temperature - regulating components, and all the temperature - regulating components include a first temperature - regulating component and a second temperature - regulating component; in the first temperature - regulating component, the working surface of the thermoelectric cooler is the refrigerating surface and the non - working surface is the heat - dissipating surface; in the second temperature - regulating component, the working surface of the thermoelectric cooler is the heat - dissipating surface and the non - working surface is the refrigerating surface.

[0015] A fan module includes the above - mentioned air - supply wind wheel.

[0016] In one embodiment, the fan module further includes a housing and a panel structure. The housing has an air - supply air duct inside, the air - supply wind wheel is arranged in the air - supply air duct, and the housing also has an air outlet communicating with the air - supply air duct; the panel structure is arranged on the housing and is configured to be able to open and close the air outlet.

[0017] An oil - fume extractor includes the above - mentioned air - supply wind wheel or the above - mentioned fan module.

[0018] For the above - mentioned air - supply wind wheel, fan module and oil - fume extractor, a thermoelectric cooler is added to the wind blade, so that the air - supply temperature not only depends on the ambient temperature, but can actively change the temperature of the air - supply air flow by means of the refrigeration or heating of the working surface of the thermoelectric cooler. At the same time, the heat generated or absorbed by the non - working surface of the thermoelectric cooler can be temporarily adsorbed or provided by the heat - storage member. In this way, the air - supply wind wheel adjusts the temperature of the air - supply through the thermoelectric cooler, making it no longer passively limited by the ambient temperature, better meeting the user's needs and improving the comfort of the air - supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic structural diagram of an oil - fume extractor with an air - supply wind wheel in an embodiment of the present application.

[0021] Figure 2 For Figure 1 Another perspective structural diagram of the shown oil - fume extractor.

[0022] Figure 3 The Figure 1 schematic cross-sectional structure diagram of the fan module in the range hood shown in

[0023] Figure 4 The Figure 3 schematic enlarged structure diagram of the fan module at A shown in

[0024] Figure 5 The Figure 1 schematic structure diagram of the fan module when the outer shell assembly is in the open state shown in

[0025] Figure 6 The Figure 1 schematic structure diagram of the fan module when the outer shell assembly is in the closed state shown in

[0026] Figure 7 The Figure 1 schematic flow diagram of the control method of the air supply impeller in the range hood shown in

[0027] Description of reference numerals: 100, range hood; 10, fan module; 11, air supply impeller; 111, impeller body; 1111, blades; 1113, frame; 113, temperature adjustment component; 1131, semiconductor refrigeration sheet; 30, range hood module; 31, outer shell assembly; 311, outer shell body; 3111, air supply air duct; 3113, air inlet; 3115, air outlet; 313, panel structure; 50, cover plate assembly. Detailed implementation manners

[0028] To make the above objects, features, and advantages of the present application more apparent and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0030] In addition, if the term "and / or" appears, "and / or" is merely a description of the relationship between associated objects and indicates that three relationships can exist. For example, A and / or B can represent the relationship between A and B: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, in this text, the character " / " generally indicates an "or" relationship between the associated objects before and after it. If the terms "first" and "second" appear, these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, four, five, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In this application, unless otherwise clearly specified and limited, if there are descriptions such as a first feature being "on" or "under" a second feature, etc., the meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0034] Please refer to Figures 1 to 4 , the air supply impeller 11 provided by an embodiment of the present application includes an impeller body 111 and a temperature adjustment component 113. Among them, the impeller body 111 includes blades 1111, and the temperature adjustment component 113 includes a semiconductor refrigeration sheet 1131 and a heat storage member (not shown in the figure). The semiconductor refrigeration sheet 1131 is disposed on the blade 1111 and is configured such that its working surface faces away from the blade 1111 where it is located, and the heat storage member is disposed between the non-working surface of the semiconductor refrigeration sheet 1131 and the blade 1111.

[0035] The air supply impeller 11 can be used in devices such as a range hood 100, an air purifier, an air humidifier, etc. Specifically, the air supply impeller 11 can be used in the range hood 100 for use during cooking to deliver cold air to the kitchen, promote air circulation in the kitchen interior, and reduce the ambient temperature around the user.

[0036] In one embodiment, the impeller body 111 is a cross-flow impeller, including multiple blades 1111 and a frame 1113. All the blades 1111 are disposed on the frame 1113 around an axis. The impeller body 111 can rotate around this axis and drive air to flow to form an air supply airflow when rotating. The temperature adjustment component 113 can be adhered to the blade 1111 by means of back glue, etc. It can be understood that in some other embodiments, the impeller body 111 can also be a centrifugal impeller, an axial-flow impeller, etc., which are not specifically limited herein.

[0037] The semiconductor refrigeration sheet 1131 has a cooling surface and a heat dissipation surface. When working, the cooling surface absorbs heat to form a low temperature, and the heat dissipation surface releases heat to form a high temperature. The working surface can be one of the cooling surface and the heat dissipation surface, and the non-working surface is the other of the cooling surface and the heat dissipation surface. In some other embodiments, the semiconductor refrigeration sheet 1131 can also exchange the positions of its cooling surface and heat dissipation surface by reversing the positive and negative poles of the power supply.

[0038] Among them, the heat storage member is disposed on the non-working surface of the semiconductor and can exchange heat with the non-working surface. When the non-working surface is the heat dissipation surface, the heat storage member can absorb the heat released by the heat dissipation surface. When the non-working surface is the cooling surface, the heat storage member can serve as the high-temperature heat source of the cooling surface to provide heat for it to absorb. It can be understood that the heat storage member has a relatively large specific heat capacity to ensure its strong heat absorption or release ability and small temperature fluctuations during the heat absorption or heat release process. Specifically, the specific heat capacity of the heat storage member is not less than 0.35×10^ 3 J / (kg·℃), and specifically not less than 3.5×10^ 3J / (kg·℃). In addition, the heat storage member may also have good heat conduction ability, with a thermal conductivity coefficient not less than 200 W / m·K, and specifically not less than 300 W / m·K. In a specific embodiment, the material of the heat storage member is a sensible heat storage material such as aluminum or copper. In some other embodiments, the material of the heat storage member may also be a phase change heat storage material, a thermochemical heat storage material, etc., which are not specifically limited herein.

[0039] It can be understood that the working surface of the semiconductor refrigeration sheet 1131 faces away from the wind blade 1111, and thus can exchange heat with the air flowing through the wind blade 1111, that is, adjust the temperature of the air driven by the wind blade 1111, and then change the temperature of the air supply flow.

[0040] For the above-mentioned air supply wind wheel 11, by adding a semiconductor refrigeration sheet 1131 to the wind blade 1111, the air supply temperature not only depends on the ambient temperature, but can actively change the air supply flow temperature by means of the refrigeration or heating of the working surface of the semiconductor refrigeration sheet 1131. At the same time, the heat generated or absorbed by the non-working surface of the semiconductor refrigeration sheet 1131 can be temporarily adsorbed or provided by the heat storage member. In this way, the air supply wind wheel 11 adjusts the air supply temperature through the semiconductor refrigeration sheet 1131, so that it is no longer passively limited by the ambient temperature, better meeting the user's needs and improving the comfort of the air supply.

[0041] In some embodiments, the air supply wind wheel 11 includes multiple temperature adjustment components 113, and all the temperature adjustment components 113 are configured to selectively work partially or all. In other words, all the temperature adjustment components 113 can, according to the selection, work partially, work all, or not work at all.

[0042] It can be understood that whether the temperature adjustment component 113 works is judged by whether its semiconductor refrigeration sheet 1131 is powered on. All the temperature adjustment components 113 can be at least divided into two groups, and each group can work independently relative to the other temperature adjustment components 113. In a specific embodiment, each temperature adjustment component 113 can work independently. According to the different numbers of working temperature adjustment components 113, the power of the air supply wind wheel 11 for temperature adjustment is also different. Taking the working surfaces of all the temperature adjustment components 113 as refrigerating surfaces as an example, there are differences in the refrigerating powers that can be achieved when all the temperature adjustment components 113 work partially and all. It is easy to know that the refrigerating power achieved when all the temperature adjustment components 113 work is higher than that achieved when only some of the temperature adjustment components 113 work. Correspondingly, when all the temperature adjustment components 113 work, the temperature of the blown air supply flow is lower than that of the air supply flow when only some of the temperature adjustment components 113 work.

[0043] In this way, by partially or fully operating all the temperature adjustment components 113, the power for temperature adjustment by the air supply impeller 11 can be changed. The user can, as needed, select for some or all of the temperature adjustment components 113 to operate, or even control the number of the temperature adjustment components 113 in operation, so as to adjust the temperature of the air supply airflow blown out by the air supply impeller 11 to an optimal state.

[0044] In some embodiments, the thermoelectric coolers 1131 of at least some of the temperature adjustment components 113 are configured to be connected in parallel with each other or have independent power supply circuits.

[0045] In this way, the thermoelectric coolers 1131 that are connected in parallel with each other or have independent power supply circuits can be powered on or off independently of each other, so as to enable all the temperature adjustment components 113 to operate partially or fully.

[0046] In some other embodiments, all the thermoelectric coolers 1131 can also be connected in series, and partial non-operation can be achieved through partial short-circuiting or other means, as long as it can be realized that some of the temperature adjustment components 113 can operate partially or fully, and specific limitations are not made here.

[0047] In some embodiments, the air supply impeller 11 further includes a temperature sensor for detecting the kitchen ambient temperature.

[0048] In this way, the temperature sensor can detect the kitchen ambient temperature in real time, based on which the operation of the temperature adjustment components 113 can be controlled more accurately, improving the comfort of the air supply airflow.

[0049] In some embodiments, the air supply impeller 11 further includes a controller, the controller is electrically connected to all the temperature adjustment components 113, and the temperature sensor is electrically connected to the controller.

[0050] The controller is used to control whether each temperature adjustment component 113 operates. Specifically, the controller can, based on the detection result of the temperature sensor, control some or all of the temperature adjustment components 113 to operate. The controller can automatically control the temperature adjustment components 113 based on the detection result of the temperature sensor, or can also control the temperature adjustment components 113 in combination with user instructions.

[0051] The controller can be, but is not limited to, a control main board, etc. The connection between it and all the temperature adjustment components 113 and the temperature sensor can be a wired electrical connection or a wireless electrical connection, as long as it can realize the communication control of the temperature adjustment components 113 and the communication with the temperature sensor, and specific limitations are not made here. When a wired connection is adopted, the temperature adjustment components 113 and the temperature sensor can obtain power from the controller.

[0052] In this way, under the action of the controller, the temperature adjustment component 113 can work accurately, which helps to reduce the operation difficulty and improve the accuracy of the temperature of the air supply airflow.

[0053] Please refer to Figure 7 further. A predetermined temperature threshold values T1 and T2 (T1 > T2) are set. When the range hood 100 is operating, the temperature sensor detects the real-time temperature t of the kitchen interior. When t ≤ T2, the temperature of the kitchen interior is appropriate, and it is only necessary to drive the kitchen air to flow through the air supply impeller 11. When T2 < t < T1, the temperature of the kitchen interior is slightly high, and half of the semiconductor refrigeration chip 1131 operates to reduce the real-time temperature of the kitchen. When t ≥ T1, the kitchen is hot, and the entire semiconductor refrigeration chip 1131 operates to reduce the real-time temperature of the kitchen. By detecting the real-time interior temperature t, the partial or full operation of the semiconductor refrigeration chip 1131 is adjusted, so that the temperature of the air supply airflow reaches the most suitable state, improving the user experience.

[0054] In some embodiments, the impeller body 111 includes multiple blades 1111 and multiple temperature adjustment components 113. All the temperature adjustment components 113 are respectively arranged on at least two blades 1111. In other words, the temperature adjustment components 113 are arranged on at least two blades 1111.

[0055] In this way, the temperature adjustment components 113 on different blades 1111 can exchange heat at different positions, which helps to improve the heat exchange efficiency and the temperature uniformity of the air supply airflow.

[0056] Further, each blade 1111 is provided with a set of temperature adjustment components 113. It can be understood that the number of the temperature adjustment components 113 can be the same as the number of the blades 1111, and each blade 1111 is provided with a set of temperature adjustment components 113.

[0057] In this way, each blade 1111 has a temperature adjustment component 113 that can adjust the temperature of the air. Finally, the temperature of the air supply airflow generated by the air supply impeller 11 is more uniform, and the air passing through the blade 1111 can quickly exchange heat with the corresponding temperature adjustment component 113.

[0058] In some embodiments, the working surface of the semiconductor refrigeration chip 1131 is the refrigerating surface, and the non-working surface is the heat dissipating surface; or, the working surface is the heat dissipating surface, and the non-working surface is the refrigerating surface.

[0059] If the working surface is the refrigerating surface and the non-working surface is the heat dissipating surface, when the semiconductor refrigeration chip 1131 operates, it can reduce the air temperature through the working surface, and the heat generated by the heat dissipating surface can be absorbed by the heat storage member. If the working surface is the heat dissipating surface and the non-working surface is the refrigerating surface, when the semiconductor refrigeration chip 1131 operates, it can increase the air temperature through the working surface, and the heat absorbed by the refrigerating surface can be provided by the heat storage member.

[0060] In this way, the air supply impeller 11 can provide a refrigeration or heating function to meet the user's temperature adjustment needs.

[0061] In another embodiment, the air supply impeller 11 includes multiple temperature adjustment components 113. All the temperature adjustment components 113 include a first temperature adjustment component and a second temperature adjustment component; in the first temperature adjustment component, the working surface of the thermoelectric cooler 1131 is the refrigerating surface, and the non-working surface is the heat dissipating surface; in the second temperature adjustment component, the working surface of the thermoelectric cooler 1131 is the heat dissipating surface, and the non-working surface is the refrigerating surface.

[0062] It can be understood that the first temperature adjustment component and the second temperature adjustment component are configured to work alternatively.

[0063] In this way, when temperature adjustment is required, according to different refrigeration and heating demands, the first temperature adjustment component and the second temperature adjustment component can work alternatively. For example, when the temperature is hot in summer, the first temperature adjustment component works to lower the kitchen temperature, and the second temperature adjustment component does not work; when the temperature is cold in winter, the second temperature adjustment component works to raise the kitchen temperature, and the first temperature adjustment component does not work.

[0064] For the above-mentioned air supply impeller 11, when the temperature adjustment component 113 located on the blade 1111 is working, it can exchange heat with the air to change the temperature and improve the comfort of the temperature. In addition, the air supply impeller 11 can also compare with the predetermined temperature thresholds T1 and T2 based on the detection results of the temperature sensor, and selectively control all the temperature adjustment components 113 to work or part of the temperature adjustment components 113 to work to form an appropriate power, so as to make the temperature of the air supply airflow reach the most suitable state and improve the user experience.

[0065] Please refer to Figure 5 and Figure 6 simultaneously. The present application also provides a fan module 10, which includes the above-mentioned air supply impeller 11. The fan module 10 can be used in devices such as a range hood 100, an air purifier, and an air humidifier.

[0066] It can be understood that to achieve its normal function, the fan module 10 further includes a housing assembly 31. The housing assembly 31 includes a housing body 311, and there is an air supply air duct 3111 inside the housing body 311. The air supply impeller 11 is arranged in the air supply air duct 3111.

[0067] Further, the outer housing 311 of the fan module 10 also has an air inlet 3113 and an air outlet 3115 that communicate with the air supply duct 3111. The air supply impeller 11 rotates within the air supply duct 3111 to create a pressure difference. Under the action of the pressure difference, air flows from the air inlet 3113 through the air supply duct 3111 to the air outlet 3115, forming an air supply flow for outward air supply, enabling the air inside the kitchen to circulate.

[0068] The fan module 10 is specifically used for the range hood 100. The air inlet 3113 of the outer housing 311 can be located at its top, and the air outlet 3115 can be located on the front of the range hood 100, that is, the side facing the user when the range hood 100 is installed and in use, so that its air supply can smoothly blow towards the user.

[0069] In some embodiments, the outer housing assembly 31 further includes a panel structure 313. The panel structure 313 is provided on the outer housing 311 and is configured to be able to open and close the air outlet 3115.

[0070] It can be understood that the panel structure 313 is located on the surface of the outer housing 311 where the air outlet 3115 is formed, that is, on the front of the range hood 100, and the panel structure 313 can open and close the air outlet 3115 by not blocking or blocking the air outlet 3115.

[0071] Correspondingly, under the opening and closing action of the panel structure 313, the outer housing assembly 31 has a switchable open state and closed state. That is, when the panel structure 313 opens the air outlet 3115, the outer housing assembly 31 is in the open state, and when the panel structure 313 closes the air outlet 3115, the outer housing assembly 31 is in the closed state.

[0072] In this way, when the outer housing assembly 31 is performing air supply, the panel structure 313 can open the air outlet 3115 to enable normal air supply. When not performing air supply, the panel structure 313 can close the air outlet 3115 to reduce exposed holes, improve the sealing performance of the fan module 10 and the consistency of its front appearance.

[0073] Specifically, the panel structure 313 is provided on the surface of the outer housing 311 where the air outlet 3115 is formed and can slide along the height direction of the outer housing 311 to open and close the air outlet 3115 by ascending and descending sliding in its height direction. In some other embodiments, the panel structure 313 can also open and close the air outlet 3115 by flipping and opening, rotating and closing, etc., which are not specifically limited herein.

[0074] This application also provides an air - conditioner range hood, including the above - mentioned air supply impeller 11 or fan module 10.

[0075] Specifically, the air-conditioning range hood includes a fan module 10 and further includes a cover plate assembly 50. Among them, the cover plate assembly 50 can be used for appearance decoration. The top height of the cover plate assembly 50 is flush with the top height of the fan module 10, making the fan module 10 look unobtrusive and contributing to the stable installation of the fan module 10.

[0076] Understandably, to achieve its normal functions, the air-conditioning range hood further includes a range hood module 30. The range hood module 30 is used to suck oil fumes and discharge the oil fumes generated during cooking to the outside. The fan module 10 is used for air circulation in the kitchen to reduce the ambient temperature around the user. It can have all the technical effects of the above-mentioned air supply impeller 11, which will not be elaborated here.

[0077] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0078] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. An air supply impeller, characterized in that: The air supply impeller comprises: The wind wheel body (111) includes wind blades (1111); and A temperature regulating component (113) comprises a semiconductor cooling sheet (1131) and a heat storage element; the semiconductor cooling sheet (1131) is disposed on the fan blade (1111) and is configured such that a working surface faces away from the fan blade (1111) where the semiconductor cooling sheet (1131) is located; and the heat storage element is disposed between a non-working surface of the semiconductor cooling sheet (1131) and the fan blade (1111).

2. The air supply impeller according to claim 1, characterized in that: The air supply impeller comprises a plurality of groups of temperature adjustment components (113); All of the temperature adjustment components (113) are configured to selectively work partially or fully; or, the semiconductor cooling plates (1131) of at least some of the temperature adjustment components (113) are configured to be connected in parallel with each other or the power supply circuits are independent of each other.

3. The air supply impeller according to claim 2, characterized in that: The air supply impeller further comprises a controller and a temperature sensor, the controller being electrically connected to all the temperature adjustment components (113), and the temperature sensor being electrically connected to the controller.

4. The air supply impeller according to claim 1, characterized in that: The wind wheel body (111) comprises a plurality of wind blades (1111) and a plurality of sets of temperature adjustment components (113), and all of the temperature adjustment components (113) are respectively arranged on at least two of the wind blades (1111).

5. The air supply impeller according to claim 4, characterized in that: Each of the fan blades (1111) is provided with a set of the temperature adjustment components (113).

6. The air supply impeller according to any one of claims 1 to 5, characterized in that: The working surface is a cooling surface, and the non-working surface is a heat dissipation surface; or, the working surface is a heat dissipation surface, and the non-working surface is a cooling surface.

7. The air supply impeller according to any one of claims 1 to 5, characterized in that: The air supply wheel comprises a plurality of groups of the temperature regulating components (113), and all of the temperature regulating components (113) comprise a first temperature regulating component and a second temperature regulating component; the working surface of the semiconductor refrigeration plate (1131) in the first temperature regulating component is a cooling surface, and the non-working surface is a heat dissipation surface; the working surface of the semiconductor refrigeration plate (1131) in the second temperature regulating component is a heat dissipation surface, and the non-working surface is a cooling surface.

8. A fan module, characterized in that: It comprises the air supply impeller as described in any one of claims 1 to 7.

9. The fan module according to claim 8, characterized in that: The fan module further comprises an outer shell (311) and a panel structure (313); the outer shell (311) comprises an air supply duct (3111); the air supply impeller is arranged in the air supply duct (3111); the outer shell (311) further comprises an air outlet (3115) connected to the air supply duct (3111); the panel structure (313) is arranged in the outer shell (311) and is configured to be able to open and close the air outlet (3115).

10. A range hood, characterized in that: It comprises the air supply impeller as described in any one of claims 1 to 7 or the fan module as described in any one of claims 8 to 9.

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