Heat dissipation structure with introduced heat storage part and photographing equipment
By introducing the heat-dissipating structure of heat storage parts into terminal electronic products, and using hollow interlayers and phase change materials to achieve efficient heat conduction, the problems of noise and cost introduction in the prior art heat dissipation method are solved, and more effective temperature control and equipment operation time are achieved.
Patent Information
- Application Number
- CN202420432790.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-06
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-03-06
AI Technical Summary
The prior art is prone to introduce noise, dust and increase design costs when improving the heat dissipation capacity of terminal electronic products, and the equipment can be bulky and inconvenient to improve the heat dissipation effect by increasing the equipment size.
Using a heat dissipation structure introduced with the heat storage member, by setting a hollow interlayer between the heating element and the external housing and setting a heat storage member in the interlayer, the rapid transfer of heat is achieved by using a phase change method, thereby efficiently conducting heat to the heat storage member.
It effectively delays the equipment temperature rise rate and is suitable for electronic products with short-term high-power consumption operation. It keeps the temperature of internal heating components and accessible surfaces at a lower level, extends the equipment's high-performance operation time, and avoids corrosion of internal metal structures and pollution of external environment by heat storage parts.
Smart Images
Figure CN223038284U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation structures, and particularly relates to a heat dissipation structure introducing a heat storage component and a photographing device. Background Art
[0002] Currently, the size of terminal electronic products is getting smaller and smaller, while the power consumption is getting larger and larger. To ensure the normal operation of product functions, the heat generated by the internal components of the product must be exported to the external shell and dissipated into the environment in time. However, this will cause the temperature of the external shell of the product to rise rapidly. For some photographing devices, such as chargers, smart watches, head-mounted virtual reality devices, storage devices, etc., their external shells often come into contact with human skin during use, and the temperature of their external shells needs to be strictly controlled. Although such products usually only operate at high power consumption for several hours or even a few minutes, frequency reduction processing still needs to be carried out to balance the problem of excessive temperature of the external shell.
[0003] In the process of the rapid development of existing technologies, for some products such as fast chargers and high-performance head-mounted virtual reality devices, in order to ensure the device performance, powerful heat dissipation methods such as fans, semiconductor refrigeration chips, and even liquid cooling have to be used to reduce the device temperature. However, this will introduce problems such as noise, dust, and increased design costs. By increasing the product size to improve the heat dissipation space of the device, although the temperature problem can also be alleviated, it will cause the device to be bulky and inconvenient to carry, affecting the use experience. Summary of the Utility Model
[0004] The utility model aims to provide a technical solution to solve the above problems in order to overcome the above deficiencies.
[0005] A heat dissipation structure introducing a heat storage component is applicable to a photographing device. The photographing device includes a heating element and an external shell. The heat dissipation structure includes a heat storage component. A hollow interlayer is provided between the heating element and the external shell, and the heat storage component is arranged in the hollow interlayer.
[0006] Preferably, the heat dissipation structure further includes a heat conducting component, and the heat conducting component is arranged in the hollow interlayer corresponding to the heat storage component.
[0007] Preferably, the heat conducting component is arranged between the heating element and the heat storage component, or the heat conducting component is arranged between the heat storage component and the external shell.
[0008] Preferably, the heat conducting component is arranged between the heating element and the heat storage component, and the heat conducting component is used for evenly dispersing the heat generated by the heating element.
[0009] Preferably, the heat conducting component is in contact with the heat storage component.
[0010] Preferably, the external shell is provided with a through hole corresponding to the heat storage component.
[0011] Preferably, the heat storage member is made of a hydrogel, a phase change microcapsule composite resin, or a structural board material with an organic framework material sprayed on its surface.
[0012] Preferably, the heat conducting member is made of a flexible heat conducting silica gel, graphite, graphene, or a metal material.
[0013] Preferably, the heat storage member further includes a heat insulation frame, the heat insulation frame is arranged around the heat storage member, the heat storage member is isolated from the external housing through the heat insulation frame, and the heat insulation frame is made of a foam adhesive material.
[0014] A photographing device includes the heat dissipation structure described above.
[0015] Preferably, the photographing device further includes an inner housing, the inner housing is provided with a receiving cavity, the heating element is arranged in the receiving cavity, the hollow interlayer is formed between the inner housing and the external housing, and the heat storage member is arranged corresponding to the heating element on the inner housing.
[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0017] By introducing the heat storage member into the heat dissipation structure, the heat generated by the photographing device is stored, the rising rate of the device temperature is delayed, and it can be applied to the temperature control of electronic products that only operate at high power consumption for a short time. That is, with the same size design, using the terminal heat storage member of the present invention, the photographing device can synchronously keep the temperature of the internal heating components and the temperature of the touchable surface at a lower temperature or maintain the same temperature within the same operation time, and the device can operate with high performance for a longer time.
[0018] It can efficiently conduct the heat of the heat source to the heat storage member, while protecting the internal metal structural members of the photographing device from being corroded by the heat storage member and also preventing the heat storage member from being polluted by the external environment. It only needs to slightly expand the product size, has a very small impact on the appearance of the product, but can significantly improve the temperature control effect of the product;
[0019] The heat storage member is applied to a photographing device designed with a hollow interlayer, that is, the photographing device has the heating element and the external housing. By providing a hollow interlayer between the heating element and the external housing, the heat storage member is arranged corresponding to the heating element in the hollow interlayer, and by using the phase change method, rapid heat transfer can be achieved, so that the heat source generated by the inner heating housing can be efficiently conducted to the heat storage layer with heat conduction and heat storage functions.
[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0022] Figure 1 It is a schematic diagram of the hierarchical structure of the utility model;
[0023] Figure 2 This is a schematic diagram of the hierarchical structure of the hydrogel film used in the utility model;
[0024] Figure 3 It is a schematic diagram of the hierarchical structure of the structural plate used in the utility model;
[0025] Figure 4 It is a schematic diagram of the hierarchical structure of the heat storage sheet used in the utility model;
[0026] Figure 5 It is a structural schematic diagram of the utility model applied to photographing equipment;
[0027] Figure 6 The utility model is a structural schematic diagram applied to a camera.
[0028] The reference numerals and names in the figures are as follows:
[0029] External shell 1, heating element 2, lens circuit board 4, internal shell 5, heat conductor 10, waterproof double-sided tape 11, heat storage component 20, hydrogel film 21, hydrogel self-contained PET 22, phase change microcapsule 23, organic framework coating 24, waterproof breathable membrane 25, adhesive layer 26, resin wrapping layer 27, thermal insulation frame 30. DETAILED DESCRIPTION
[0030] The utility model is described in more detail. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements between them. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements between them.
[0031] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or component referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present utility model; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself. In the description of the present utility model, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of distinguishing the corresponding components. Without additional statements, the above words have no special meaning. Therefore, it should not be construed as a limitation on the protection scope of the present utility model. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically defined.
[0032] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used in this specification in the description of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model.
[0033] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0034] Now please refer to Figures 1-5 , in order to solve the above technical problems, the present application provides a heat dissipation structure introducing a heat storage member, which is applicable to a photographing device. The photographing device can be a mirrorless camera, an action camera, etc.
[0035] The photographing device includes a heating element 2 and an external housing 1. The heating element 2 can be an electronic component such as a sensor, a circuit board, a chip, etc., or a high-power consumption component such as a screen or a battery. The heat dissipation structure includes a heat storage member 20. A hollow interlayer is provided between the heating element 2 and the external housing 1. The heat storage member 20 is disposed in the hollow interlayer, and the heat storage member 20 can be disposed in the hollow interlayer corresponding to the heating element 2. The heat generated by the heating element 2 is diffused to the outside through the external housing 1 after being transferred by the heat storage member 20 and the hollow interlayer. The setting of the hollow interlayer and the heat storage member 20 can store the heat generated by the photographing device, delay the temperature rising rate of the device, and is applicable to the temperature control of a photographing device with high-power consumption operation in a short time. At the same time, the setting of the hollow interlayer enables the internal metal structural members of the photographing device not to directly contact the heat storage member 20, avoiding being corroded by the heat storage medium of the heat storage member 20.
[0036] In one embodiment, the heat dissipation structure further includes a heat conducting member 10, and the heat conducting member 10 is disposed in the hollow interlayer corresponding to the heat storage member 20. The heat conducting member 10 is disposed between the heating element 2 and the heat storage member 20, or the heat conducting member 10 is disposed between the heat storage member 20 and the external housing 1. When the heat conducting member 10 is disposed between the heating element 2 and the heat storage member 20, the heat conducting member 10 is used to evenly disperse the heat generated by the heating element 2, so that the heat dissipated by the heating element 2 can be evenly and quickly conducted to the heat storage member 20 or conducted to the external housing 1.
[0037] The heat conducting member 10 is attached to the heat storage member 20 to improve the heat conduction efficiency between the heat conducting member 10 and the heat storage member 20. In one embodiment, the heat generated by the heating element 2 is evenly and quickly conducted to the heat storage member 20 through the heat conducting member 10, and the heat storage member 20 stores the generated heat to delay the temperature rise rate during the use of the photographing device.
[0038] In one embodiment, the heat storage member 20 is a hydrogel film or a structural board with an organic framework material coating sprayed on the surface. The external housing 1 is provided with through holes corresponding to the heat storage member 20. The arrangement of the through holes enables the heat and water vapor in the device to be quickly discharged. The external housing 1 may also not be provided with through holes. In one embodiment, the heat storage member 20 is made of a phase change microcapsule composite resin material, which has good moisture absorption performance. Correspondingly, the external housing 1 does not need to be provided with through holes. It should be noted that whether the external housing 1 selectively provides through holes can be determined according to the overall design of the photographing device, and it does not affect the heat dissipation performance of the heat dissipation structure.
[0039] The heat conducting member 10 is made of flexible heat conducting silica gel, graphite, graphene or metal material.
[0040] The heat dissipation structure further includes a heat conducting member 10 and a heat insulation frame 30. The heat conducting member 10 is disposed in the hollow interlayer corresponding to the heat storage member 20. The heat conducting member 10 and the heat storage member 20 are attached through a waterproof double-sided adhesive 11, and heat transfer is formed between the heat conducting member 10 and the heat storage member 20. The heat generated by the heating element 2 is diffused to the outside through the external housing 1 after being transferred by the heat conducting member 10 and the heat storage member 20. Among them, the installation position of the heat storage member 20 is set according to product requirements, that is, the heat conducting member 10 is disposed between the heating element 2 and the heat storage member 20, or the heat conducting member 10 is disposed between the external housing 1 and the heat storage member 20. The heat insulation frame 30 surrounds the heat storage member 20, and the heat storage member 20 is isolated from the inside of the external housing 1 through the heat insulation frame 30. The heat insulation frame 30 is made of foam adhesive.
[0041] By introducing a heat storage component 20 into the heat dissipation structure, the heat generated by the photographing device is stored, and the rate of increase in the device temperature is delayed, which can be applied to the temperature control of electronic products that only operate at high power for a short period of time. That is, with the same size design, using the terminal heat storage component of the present invention, the photographing device can synchronously maintain the temperature of the internal heat-generating components and the temperature of the touchable surface at a lower temperature within the same operating time, or maintain the same temperature, and the device can operate with high performance for a longer time.
[0042] Meanwhile, the present application also provides a photographing device with a hollow sandwich structure in which the heat storage component 20 is applied. That is, the photographing device has a heat-generating element 2 and an outer housing 1. The photographing device further includes an inner housing 5. The inner housing 5 is provided with a receiving cavity. The heat-generating element 2 is disposed in the receiving cavity. A hollow sandwich layer is formed between the inner housing 5 and the outer housing 1. The heat storage component 20 is disposed on the inner housing 5 corresponding to the heat-generating element 2. Through the phase change heat storage material, rapid heat transfer is achieved, so that the heat source generated by the inner housing 5 can be efficiently conducted to the heat storage component 20 with heat conduction and heat storage functions.
[0043] In the above application environment, please refer to Figure 6 , taking a camera as an example, the heat storage component 20 is attached to the camera lens circuit board 4, so that the heat generated by the lens circuit board 4 after the shutter is pressed can be conducted to the heat storage component 20, thereby achieving efficient heat conduction of the heat source, and keeping the temperature of the camera lens and the temperature of the touchable surface at a lower temperature synchronously within a short time. It should be noted that this technical solution can also be applied to wired chargers, wireless chargers, head-mounted virtual reality devices, power banks with fast charging functions, mobile memories, smart watches (such as those that are prone to overheating during phone calls, video playback, etc.), etc. This embodiment will not list them one by one.
[0044] According to the above embodiments, in order to further elaborate on the functions of the heat conduction component 10 and the heat storage component 20 below, the material selection of the heat conduction component 10 and the heat storage component 20 will be described in more detail according to different application scenarios, including but not limited to the following embodiments:
[0045]
Embodiment 1
[0046] Please refer to Figures 2-3The heat storage element 20 is made of a hydrogel film 21 or a structural plate, wherein the hydrogel film 21 has a hydrogel-attached PET 22, which is adhered to the waterproof double-sided adhesive through the hydrogel-attached PET 22, and the structural plate includes a phase change microcapsule 23 and an organic framework coating 24 sprayed on the surface of the phase change microcapsule 23; since water vapor will appear when the temperature of the hydrogel film 21 or the structural plate rises, it is necessary to open a through hole on the external shell 1 for the heat storage element 20 to exchange water vapor. If the heat storage element 20 needs to communicate with the external When the outer shell 1 is bonded, a waterproof breathable membrane 25 is further provided on the heat storage component 20, the heat insulation frame 30 and the heat storage component 20 are connected to the outer shell 1 through the waterproof breathable membrane 25, and an adhesive layer 26 of a frame structure is bonded between the outer shell 1 and the waterproof breathable membrane 25, the adhesive layer 26 corresponds to the heat insulation frame 30, and can efficiently conduct the heat from the heat source to the heat storage component 20, while protecting the internal metal structural parts of the photographic equipment from being corroded by the heat storage component 20, and also preventing the heat storage component 20 from being polluted by the external environment.
[0047] Further on the basis of the above embodiment, the heat conducting member 10 is made of high thermal conductivity material, and the high thermal conductivity material includes graphite film, graphene film, copper foil and aluminum foil; the heat conducting member 10 made of high thermal conductivity material is mainly used when the temperature of the heating element 2 of the photographic equipment is uneven, and it can improve the temperature control effect.
[0048] [Example 2]
[0049] See also Figure 4 The heat storage element 20 is made of a heat storage sheet material, wherein the heat storage sheet includes a phase change microcapsule 23 and a resin wrapping layer 27 wrapped on the surface of the phase change microcapsule 23. The heat storage element 20 made of the heat storage sheet material can optionally have a through hole on the outer shell 1 to optimize the heat dissipation of the heat storage element 20; the heat conductive element 10 is made of a high thermal conductivity material, and the high thermal conductivity material includes a graphite film, a graphene film, a copper foil and an aluminum foil; the heat conductive element 10 made of a high thermal conductivity material is mainly used when the temperature of the heating element 2 of the photographic equipment is uneven, and it can improve the temperature control effect.
[0050] [Example 3]
[0051] See also Figures 2-3 The heat storage element 20 is made of a hydrogel film 21 or a structural plate, wherein the hydrogel film 21 has a hydrogel-attached PET 22, which is adhered to the waterproof double-sided adhesive through the hydrogel-attached PET 22, and the structural plate includes a phase change microcapsule 23 and an organic framework coating 24 sprayed on the surface of the phase change microcapsule 23; since water vapor will appear when the temperature of the hydrogel film 21 or the structural plate increases, it is necessary to open a through hole on the external shell 1 for the heat storage element 20 to exchange water vapor.
[0052] Furthermore, on the basis of the above embodiments, when the heat storage member 20 needs to be attached to the external housing 1, a waterproof and breathable membrane 25 is further provided on the heat storage member 20. The heat insulation frame 30 and the heat storage member 20 are docked to the external housing 1 through the waterproof and breathable membrane 25, and an adhesive layer 26 with a frame structure is attached between the external housing 1 and the waterproof and breathable membrane 25. The adhesive layer 26 corresponds to the heat insulation frame 30, which can efficiently conduct the heat of the heat source to the heat storage member 20, while protecting the internal metal structural members of the photographing device from being corroded by the heat storage member 20 and preventing the heat storage member 20 from being polluted by the external environment. The heat conducting member 10 is made of a flexible heat conducting material, and the flexible heat conducting material includes a heat conducting silica gel sheet. The heat conducting member 10 made of the flexible heat conducting material is mainly applied to the surface of the heat generating element 2 of the photographing device being relatively hard, which can improve the temperature control effect, utilize the flexibility of the heat conducting silica gel sheet to reduce the material contact thermal resistance, and further improve the temperature of the heat generating element 2.
[0053]
Embodiment 4
[0054] Please refer to Figure 4 , the heat storage member 20 is made of a heat storage sheet material. Among them, the heat storage sheet includes a phase change microcapsule 23 and a resin coating layer 27 wrapped on the surface of the phase change microcapsule 23. The heat storage member 20 made of the heat storage sheet material can selectively open through holes on the external housing 1 to optimize the heat dissipation of the heat storage member 20. The heat conducting member 10 is made of a flexible heat conducting material, and the flexible heat conducting material includes a heat conducting silica gel sheet. The heat conducting member 10 made of the flexible heat conducting material is mainly applied to the surface of the heat generating element 2 of the photographing device being relatively hard, which can improve the temperature control effect, utilize the flexibility of the heat conducting silica gel sheet to reduce the material contact thermal resistance, and further improve the temperature of the heat generating element 2.
[0055] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention.
Claims
1. A heat dissipation structure with a heat storage element, suitable for a photographing device, wherein the photographing device comprises a heating element and an external housing, characterized in that: The heat dissipation structure includes a heat storage component, a hollow interlayer is included between the heating element and the external shell, the heat storage component is arranged in the hollow interlayer, the heat storage component also includes a heat insulation frame, the heat insulation frame is arranged around the heat storage component, and the heat storage component is isolated from the external shell by the heat insulation frame.
2. A heat dissipation structure with a heat storage element according to claim 1, characterized in that: The heat dissipation structure further comprises a heat conducting member, and the heat conducting member is arranged in the hollow interlayer corresponding to the heat storage member.
3. A heat dissipation structure with a heat storage element according to claim 2, characterized in that: The heat conducting member is arranged between the heat storage member and the outer shell.
4. A heat dissipation structure with a heat storage element according to claim 2, characterized in that: The heat conducting member is disposed between the heating element and the heat storage member, and is used for uniformly dispersing the heat generated by the heating element.
5. A heat dissipation structure with a heat storage element according to claim 4, characterized in that: The heat conducting member is in contact with the heat storing member.
6. The heat dissipation structure with heat storage element according to claim 1, characterized in that: The outer shell is provided with a through hole corresponding to the heat storage element.
7. The heat dissipation structure with heat storage element according to claim 1, characterized in that: The heat storage element is made of hydrogel, phase-change microcapsule composite resin or a structural plate material with an organic framework material sprayed on the surface.
8. The heat dissipation structure with heat storage element according to claim 2, characterized in that: The heat conducting member is made of flexible heat conducting silicone, graphite, graphene or metal material.
9. The heat dissipation structure with heat storage element according to claim 1, characterized in that: The heat-insulating frame is made of foam rubber material.
10. A photographing device, characterized in that: A heat dissipation structure comprising a heat storage component as described in any one of claims 1 to 9.
11. A photographing device according to claim 10, characterized in that: The photographing device further comprises an internal shell, the internal shell is provided with a receiving cavity, the heating element is arranged in the receiving cavity, the hollow interlayer is formed between the internal shell and the external shell, and the heat storage component is arranged in the internal shell corresponding to the heating element.