Temperature control assembly and projection device adopting same

Abstract

The utility model relates to the field of heat dissipation of projection devices, and discloses a temperature control assembly and a projection device using the temperature control assembly, the temperature control assembly comprises a mounting substrate, the mounting substrate is formed by wrapping a rubber coating piece on the outer layer part of a metal substrate, the exposed metal surface without rubber coating on the metal substrate comprises a first area, a second area, a third area and a fourth area, the first area is provided with a heat conduction protruding block protruding out of the rubber coating piece, and a refrigeration piece is installed in the second area in a matched mode. The projection device comprises the temperature control assembly and a DMD chip installed corresponding to the first area of the temperature control assembly. According to the utility model, the capability of the working element of the projection device to adapt to the extreme ambient temperature is improved, and the temperature control design of the projection device is facilitated.

Description

Technical Field

[0001] The utility model relates to a component for temperature control, in particular to a temperature control component suitable for use on a projection device. Background Art

[0002] At present, to ensure the normal use of a projector under special working conditions, for example, the projector can still work properly under extreme ambient temperatures of -40 to 100 °C, it is necessary to provide a suitable working temperature for temperature-sensitive components in the projector. For example, in a projection display device, the DMD (Digital Micromirror Device) is a key chip for the display function, which is extremely sensitive to brightness and temperature. The working temperature of the DMD chip needs to be controlled within a reasonable range to ensure its normal operation. To achieve this goal, not only the cooling adjustment of temperature-sensitive components in the projector under normal working conditions needs to be considered, but also a suitable heating device needs to be provided under special working conditions. Since the size control of the projector is always a key design consideration factor, it is very necessary to provide a temperature control component suitable for use in a projection device under extreme environments. Currently, there is no component integrating this function on the market.

[0003] In the "Thermal Management System of a Laser Projector Adapted to a Wide Temperature Range" with the publication number CN116184750A, a low-temperature heating start mode and a high-temperature refrigeration and heat dissipation mode are proposed for the projector. Under the low-temperature heating start mode, a PTC (Positive Temperature Coefficient) heater is used to heat the air flow passing through the air path, and under the high-temperature refrigeration and heat dissipation mode, a TEC (Thermoelectric cooler) is used to assist in heat dissipation.

[0004] In addition, it is also mentioned in the prior art that a heat insulation layer can be used to enclose part of the surface of a heat conduction and cooling component, and the heat conduction and cooling component is cooperated with the TEC to reduce the condensation phenomenon.

[0005] None of the above prior arts mentions the design idea of integrating heating and refrigeration components. Summary of the Utility Model

[0006] In order to ensure the normal realization of the functions of a projector under extreme environments and minimize the design difficulty of a projection device that can meet this need, and to provide better working conditions for working components such as DMD chips that have high requirements for the working environment temperature, the technical problem to be solved by the utility model is to provide a temperature control component and a projection device using the temperature control component.

[0007] The technical solution adopted by the present utility model to solve its technical problems is: a temperature control component, including a mounting substrate, which is formed by wrapping a rubber-coated part on a part of the surface of a metal substrate. The exposed metal surface of the metal substrate without rubber coating includes a first region and a second region. The first region conducts heat with a working element, and a refrigerating element is matched and installed in the second region. The above solution assembles the element with a refrigerating function onto the same metal substrate by means of a rubber-coated part, and the first region can be used to directly abut and install with the working element that needs to dissipate heat, facilitating heat conduction. At the same time, the rubber coating treatment avoids the generation of condensation.

[0008] Furthermore, the exposed metal surface of the metal substrate without rubber coating also includes a third region, and a heating element is matched and installed in the third region, so that the surrounding environment temperature of the working element can be preheated by the heating element when there is a low-temperature start requirement.

[0009] The heating element can adopt a PTC heating block, an aluminum plate heating sheet, a graphene heating block, a silica gel heating sheet, a carbon crystal heating plate or a resistance wire.

[0010] The heating element is installed on the mounting substrate through a heat insulation fixing part, and the heat insulation fixing part is fixed on the mounting substrate. The heat insulation fixing part not only functions as a fixing part but also has a better heat insulation effect.

[0011] To minimize the size of the temperature control component and more reasonably arrange the heating element and the refrigerating element, the third region and the first region are located on the same side of the metal substrate, while the position of the second region is opposite to the position of the first region.

[0012] Furthermore, a heat conduction convex block protruding beyond the rubber-coated part is provided in the first region of the metal substrate, so that the working element can be in contact with the heat conduction convex block for heat transfer, and it is also convenient for the production of the mounting substrate. The heat conduction convex block is preferably integrally formed with the metal substrate, or a metal block bonded to the metal substrate can also be used.

[0013] The shape of the heat conduction convex block is a cuboid, and there are multiple surfaces available for selection to abut and install with the working element.

[0014] Furthermore, the exposed metal surface of the metal substrate without rubber coating also includes a fourth region, and a temperature sensing element is matched and installed in the fourth region, so that the temperature of the metal substrate can be measured by the temperature sensing element to judge the temperature change near the working element.

[0015] To improve the heat dissipation efficiency, a heat dissipation component can also be added to the temperature control component: the cold end of the refrigerating element is attached to the metal substrate, and the hot end of the refrigerating element is connected to a heat dissipation component.

[0016] To reduce the size of the temperature control component, a TEC cooling chip is recommended for the refrigeration component. To enhance the heat dissipation efficiency of the TEC cooling chip, a TEC heat sink can be connected to the hot end of the TEC cooling chip, and the cold end of the TEC cooling chip is attached to the metal substrate. The heat dissipation component includes a plurality of heat conducting fins connected to the heat conducting substrate, and the heat conducting substrate is attached to the hot end of the TEC cooling chip to improve the heat dissipation efficiency.

[0017] The TEC cooling chip can be limited in the space formed between the heat dissipation component, the metal substrate, and the encapsulation component, thereby completing the fixation of the TEC cooling chip. That is, the heat dissipation component also serves as a fixing component, which can reduce the overall size of the temperature control component.

[0018] The present utility model also provides a projection device employing the above temperature control component. The projection device includes a DMD chip, and the DMD chip is installed corresponding to the first area of the temperature control component to achieve the most efficient temperature control of the DMD chip.

[0019] The beneficial effects of the present utility model are as follows: The refrigeration component is assembled onto the encapsulation component of the metal substrate, and further, the heating component is also integrated on the same metal plate, which facilitates the temperature control design of the projection device. According to different usage scenarios, the refrigeration component can be activated to cool down or the heating component can be activated to heat up, improving the ability to adapt to extreme ambient temperatures. The integrated installation method can shorten the heat / cold dissipation in the path and improve the heat dissipation efficiency; by using the encapsulation method, the metal plate and the plastic part are made into one body, and the plastic part undertakes the functions of "assembly, heat insulation, and cold insulation", not only completing the structural installation but also avoiding the generation of condensation; the metal part only serves as a carrier for heat conduction and cold conduction, directly contacting working components such as the DMD chip in the projection device that have high requirements for the working environment temperature, and can quickly complete the temperature control of the working components. Description of the Drawings

[0020] Figure 1 is a schematic internal structure diagram of a projection device employing the temperature control component of the present utility model.

[0021] Figure 2 is a schematic overall structure diagram of the temperature control component of the present utility model.

[0022] Figure 3 is Figure 2 the assembly schematic diagram of

[0023] Figure 4 is Figure 2 the structural schematic diagram (A side) of the installation substrate in

[0024] Figure 5 is Figure 2 the structural schematic diagram (B side) of the installation substrate in

[0025] Figure 6 isFigure 2 Schematic cross-sectional view.

[0026] Figure 7 is Figure 2 Schematic diagram of the structure of the metal substrate in

[0027] In the figure, the markings are: 1 - temperature control component, 2 - DMD chip, 10 - metal substrate, 11 - TEC refrigeration chip, 12 - heat dissipation component, 13 - temperature sensing component, 14 - PTC heating block, 15 - rubber-coated component, 100 - heat conduction bump, 101 - first region, 102 - second region, 103 - third region, 104 - fourth region, 121 - heat conduction substrate, 122 - heat conduction fin, 16 - heat insulation plastic component. Detailed implementation mode

[0028] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0029] Such as Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown in the figure, the temperature control component of the present utility model includes a mounting substrate, which is formed by wrapping a part of the outer layer of a metal substrate 10 with a rubber coating 15. The exposed metal surface of the metal substrate 10 without rubber coating includes a first area 101, a second area 102, a third area 103, and a fourth area 104. Among them, a heat-conducting bump 100 that is thicker than the thickness of the metal substrate and protrudes beyond the rubber coating 15 is provided at the first area 101. The heat-conducting bump 100 can be directly used to abut against components such as DMD chips that are prone to temperature rise and have high heat dissipation requirements. The metal substrate 10 and the heat-conducting bump 100 are preferably made of metals with good heat conductivity such as aluminum and copper to achieve the purpose of quickly transferring heat. A TEC refrigeration sheet 11 is installed in the second area 102 in a matching manner. When the temperature of the working element corresponding to the first area 101 is higher than the appropriate temperature, the TEC refrigeration sheet 11 can be enabled to assist in heat dissipation. A PTC heating block 14 is installed in the third area 103 in a matching manner, and the PTC heating block 14 is fixed by a heat insulation fixing member 16. When the ambient temperature is lower than the appropriate temperature, the PTC heating block 14 can be enabled to heat, so that the area near the heat-conducting bump 100 quickly reaches the appropriate temperature. A temperature sensing element 13 is installed in the fourth area 104 in a matching manner, which is used to detect the temperature of the metal substrate and transmit the temperature signal, so as to control the start and stop of the TEC refrigeration sheet 11 and / or the PTC heating block 14, and the above components are fixed to the metal substrate by the rubber coating 15 or the heat insulation fixing member 16 of the mounting substrate. The rubber coating 15 and the heat insulation fixing member 16 can have different shapes according to different types and sizes of the selected corresponding refrigeration or heating components, so as to form a temperature control component that is convenient for disassembly and assembly. This temperature control component can both heat and dissipate heat, so it can be applied to relatively extreme ambient temperatures.

[0030] Obviously, according to the needs of space and size in the specific structural design, the first area, the second area, the third area, and the fourth area can be respectively arranged on different surfaces of the metal substrate, or arranged on the same surface of the metal substrate, and the areas can partially overlap or completely overlap with each other, and can be reasonably arranged according to specific circumstances. The metal substrate is not limited to the shape of an approximately square flat plate, and there can be local bending or uneven thickness, etc. The PTC heating block 14 can also be replaced by an aluminum plate heating sheet, a graphene heating block, a silica gel heating sheet, a carbon crystal heating plate, a resistance wire, etc.

[0031] Such as Figure 3 and Figure 4 、 Figure 5As shown, the third region 103 and the heat-conducting bump 100 are located on the same side of the metal substrate 10, while the second region 102 and the fourth region 104 are located on the other side of the metal substrate 10. Moreover, the position of the first mounting position 102 is opposite to that of the heat-conducting bump 100, facilitating the rapid conduction of the heat conducted by the heat-conducting bump 100 by the TEC cooling chip 11. The above arrangement is relatively compact, enabling the entire temperature control component to have a relatively flexible size design space, which is convenient for the installation and use of the temperature control component in the projection device.

[0032] To further improve the heat dissipation performance of the temperature control component, a heat dissipation component 12 is also connected to the TEC cooling chip 11. The heat dissipation component 12 is several heat-conducting fins 122 connected to a heat-conducting substrate 121. The heat-conducting substrate 121 is attached to the hot end of the TEC cooling chip 11, and the heat of the hot end of the TEC cooling chip 11 can be rapidly conducted out by other configured heat dissipation components, achieving the purpose of maintaining an appropriate working temperature near the heat-conducting bump 100.

[0033] Embodiment:

[0034] As Figures 1 to 7 shown, a certain projection device adopting the temperature control component 1 includes a mounting substrate, which is formed by partially wrapping the outer layer of the metal substrate 10 with a rubber coating 15. On one side of the A surface of the metal substrate 10, the exposed metal surface without rubber coating includes a heat-conducting bump 100 located in the first region 101 and protruding beyond the rubber coating 15 with a thickness greater than that of the mounting substrate, and a PTC heating block 14 mounted in a matching manner in the third region 103 beside it. On one side of the B surface of the metal substrate 10, the exposed metal surface without rubber coating includes a TEC cooling chip 11 mounted in a matching manner in the second region 102, and a temperature sensing component 13 mounted in a matching manner in the fourth region 104 beside it. A heat dissipation component 12 is also connected to the TEC cooling chip 11. The heat dissipation component 12 is several heat-conducting fins 122 connected to a heat-conducting substrate 121. The heat-conducting substrate 121 is attached to the hot end of the TEC cooling chip 11. Referring to Figure 2 , the shape of the heat-conducting bump 100 is preferably a cuboid, and its top surface and four side surfaces are all flat. When fitting with the working element, there are various installation methods, which is convenient for fitting the working element with high temperature control requirements to the heat-conducting bump 100 for installation. For example, the DMD chip 2 is fitted on the top surface of the heat-conducting bump 100 for installation.

[0035] Among them, the installation substrate adopts a metal-coated rubber solution and an in-mold injection molding process. With the help of the coated rubber part 15, the TEC cooling chip 11 is assembled onto the metal substrate 10, and then with the help of the heat insulation fixing part 16, the PTC heating block 14 is assembled onto the same metal substrate 10. It is possible to further complete the distribution and assembly of components with a relatively small size. The heat conduction efficiency of the coated rubber part 15 is very low, which can reduce the heat loss of the cooling and heating components and improve the cooling & heating efficiency; through the method of coating with rubber, the metal substrate 10 is isolated from the air, and the coated rubber part 15 is in direct contact with the air. Since the heat conduction efficiency of the coated rubber part 15 is very low, its surface temperature is close to the room temperature, reducing the temperature difference and preventing the occurrence of short circuits of electronic components caused by condensation. The cold surface of the TEC cooling chip 11 is in contact with the DMD chip 2 through the heat conduction bumps. The temperature of the cold surface can be monitored in real time through the temperature sensing part 13 to ensure that the DMD chip 2 has good heat dissipation conditions under high ambient temperature conditions. At the same time, the heat dissipation part 12 can also dissipate heat through other radiators configured by the projection device.

[0036] The PTC heating block 14, as a heating component, is installed together with the metal substrate 10. Under extreme low ambient temperature conditions such as -40°C, the metal substrate 10 can be preheated in advance to ensure that the DMD chip 2 starts to work at a temperature that meets the working conditions.

[0037] In the above structure, holes, grooves, ribs, walls and other structures can be directly formed on the coated rubber part 15 and the heat insulation fixing part 16 to facilitate reasonable load bearing and connection with the remaining components; the heating component, the cooling component and the temperature sensing component can be directly connected to the metal substrate 10 by means of bonding or the like, or connected to the coated rubber part 15 on the metal substrate 10 by means of bonding or the like; the heat dissipation part 12 and the heat insulation fixing part 16 can be bonded to the coated rubber part 15 or the metal substrate 10 or fixedly connected with screws or the like. The TEC cooling chip 11, as a cooling component, can be clamped between the heat dissipation part 12 and the metal substrate 10 or the coated rubber part 15 to be limited, that is, the cooling component can also be fixed through the limiting space formed between the heat dissipation part 12 and the metal substrate. Similarly, the heating component can also be fixed through the limiting space formed between the heat insulation fixing part 16 and the metal substrate 10.

[0038] The utility model is particularly suitable for use as an in-vehicle projection device.

Claims

1. A temperature control component, comprising a mounting substrate, wherein the mounting substrate is formed by a metal substrate (10) with a plastic coating (15) wrapped around a portion of its surface, and wherein: The exposed metal surface of the metal substrate (10) that is not coated with rubber comprises a first area (101) and a second area (102); the first area (101) conducts heat with a working element, and a refrigeration component is matched and installed in the second area (102).

2. The temperature control assembly according to claim 1, characterized in that: The exposed metal surface of the metal substrate (10) that is not coated with rubber further comprises a third area (103), and a heating element is matched and installed in the third area (103).

3. The temperature control assembly according to claim 2, characterized in that: The heating element is a PTC heating block (14), an aluminum plate heating sheet, a graphene heating block, a silicone heating sheet, a carbon crystal heating plate or a resistance wire.

4. The temperature control assembly according to claim 2, characterized in that: The heating element is mounted on the mounting substrate via a heat-insulating fixing element (16), and the heat-insulating fixing element (16) is fixed on the mounting substrate.

5. The temperature control assembly according to claim 2, characterized in that: The third region (103) and the first region (101) are located on the same side of the metal substrate (10), while the second region (102) is located opposite to the first region (101).

6. The temperature control assembly according to any one of claims 1 to 5, characterized in that: The first area (101) on the metal substrate (10) is provided with a heat-conducting protrusion (100) protruding outside the rubber encapsulation component (15).

7. The temperature control assembly according to claim 6, characterized in that: The heat-conducting protrusion (100) is in the shape of a cuboid.

8. The temperature control assembly according to any one of claims 1 to 5, characterized in that: The exposed metal surface of the metal substrate (10) that is not coated with rubber further comprises a fourth area (104), and a temperature sensing component (13) is matched and installed in the fourth area (104).

9. The temperature control assembly according to any one of claims 1 to 5, characterized in that: The cold end of the refrigeration component is in contact with the metal substrate (10), and the hot end of the refrigeration component is connected to a heat sink (12).

10. The temperature control assembly according to claim 9, characterized in that: The refrigeration component is confined within a space formed between the heat dissipation component (12), the metal substrate (10), and the rubber-coated component (15), and the heat dissipation component (12) is fixed on the mounting substrate.

11. The temperature control assembly according to claim 9, characterized in that: The refrigeration element is a TEC refrigeration sheet (11).

12. A projection device using the temperature control assembly according to any one of claims 1 to 11, the projection device comprising a DMD chip (2), characterized in that: The DMD chip (2) is installed corresponding to the first area (101) of the temperature control component.

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