Ceramic resistor
By using a parallel series structure in the ceramic resistor to connect the ceramic resistor sheet, and combining the insulating heat homogenization material and the metal conductive heat homogenization plate, the problem of temperature increase and large volume of the ceramic resistor when absorbing energy is solved, and the effect of reducing height, fast heat dissipation speed and improving energy absorption capacity is achieved.
Patent Information
- Application Number
- CN202421805363.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-29
AI Technical Summary
When existing ceramic resistors absorb energy, the temperature rises and the volume is large, resulting in an increase in heat dissipation requirements. Reducing the temperature rise by increasing the number of ceramic resistors will lead to an increase in height, an increase in production costs, and it is difficult to adapt to the development of miniaturized power equipment.
The special structural connection method is adopted that is connected in parallel and electrically series to connect the ceramic resistor sheet in the ceramic resistor, and combine the insulating homogenized material and metal conductive homogenized plate in the packaging to achieve the reduction of the overall height of the ceramic resistor and the improvement of the energy absorption capacity.
It effectively reduces the height and temperature rise of the ceramic resistor, improves the heat dissipation speed and energy absorption capacity, ensures the safety and reliability of the product, and reduces production costs.
Smart Images

Figure CN223038700U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a resistor, in particular to a ceramic resistor. Background Art
[0002] Ceramic resistors are widely used in fields such as power transmission and distribution, electric drive loads, AC and DC drives, pulse power supplies, induction heating, pulse networks, and lasers. Under the condition that the resistance value remains unchanged, the greater the energy, the larger the volume and the higher the temperature rise of the ceramic resistor, which leads to an increasing requirement for the heat dissipation of the ceramic resistor.
[0003] In response to the above requirements, currently, the temperature rise is usually reduced by increasing the number of ceramic resistors and increasing the heat dissipation area. However, increasing the number of ceramic resistors will increase the height of the ceramic resistor, and the more the overall series stacking number of ceramic resistors, the longer the ceramic resistor string, resulting in a doubling of the length and strength of the package body and a sharp rise in production costs.
[0004] In addition, currently, the overall power equipment is developing towards miniaturization. The method of increasing the height will limit the application range of the resistor and make it difficult to adapt to the rapid development of the industry. Therefore, there is an urgent need to provide a high-energy-absorbing ceramic resistor that does not increase the height and can reduce the temperature rise. Summary of the Utility Model
[0005] The purpose of the utility model is to solve the technical problem that currently, the temperature rise is usually reduced by increasing the number of ceramic resistors and increasing the heat dissipation area. However, increasing the number of ceramic resistors will increase the height of the ceramic resistor, and the more the overall series stacking number of ceramic resistors, the longer the ceramic resistor string, resulting in a doubling of the length and strength of the package body and a sharp rise in production costs, and to provide a ceramic resistor.
[0006] The concept of the utility model is: adopting a special structural connection method of parallel connection in structure and series connection in electricity for the ceramic resistor chips in the ceramic resistor to achieve the purpose of reducing the overall height of the ceramic resistor, facilitating installation, and having a large energy absorption.
[0007] The technical solution of the utility model to solve the above problems is as follows:
[0008] A ceramic resistor, characterized in that:
[0009] It includes a package body, an insulating and heat - equalizing material filled in the package body, and N ceramic resistor strings, N insulating rods, N heat - resistant insulating partition units, N metal conductive heat - equalizing plate units, and 2N connection components arranged in the package body; N≥2;
[0010] N ceramic resistor strings are respectively arranged in the package. Each of the N ceramic resistor strings includes X ceramic resistors arranged along the axial direction of the package, and an installation interval is provided between two adjacent ceramic resistors in the same ceramic resistor string; X≥2;
[0011] Each of the N heat-resistant insulating partition units includes X - 1 heat-resistant insulating partitions; the X - 1 heat-resistant insulating partitions of the N heat-resistant insulating partition units are respectively arranged in the installation intervals between two adjacent ceramic resistors in the N ceramic resistor strings;
[0012] Each of the N metal conductive heat dissipation plate units includes 2X metal conductive heat dissipation plates; 2 of the 2X metal conductive heat dissipation plates in the N metal conductive heat dissipation plate units are respectively arranged on the sides away from each other of the two ceramic resistors located at the edges in the N ceramic resistor strings, and the remaining 2X - 2 metal conductive heat dissipation plates are respectively arranged on both sides of the X - 1 heat-resistant insulating partitions in the N groups of heat-resistant insulating partition units and are respectively in contact with the corresponding ceramic resistors;
[0013] N insulating rods respectively pass through the X ceramic resistors in the N groups of ceramic resistor strings, the X - 1 heat-resistant insulating partitions in the N heat-resistant insulating partition units, and the 2X metal conductive heat dissipation plates in the N metal conductive heat dissipation plate units along the axial direction; 2N connecting components are respectively arranged at both ends of the N insulating rods;
[0014] Define the 2 metal conductive heat dissipation plates located at the edges in the N metal conductive heat dissipation plate units as the first edge plate and the second edge plate respectively, and the remaining metal conductive heat dissipation plates are successively the first intermediate plate, the second intermediate plate,..., the 2X - 2 intermediate plates in the direction from the first edge plate to the second edge plate;
[0015] The first edge plate of the first metal conductive heat dissipation plate unit is electrically connected to the first intermediate plate of the second metal conductive heat dissipation plate unit, the first intermediate plate of the first metal conductive heat dissipation plate unit is electrically connected to the second intermediate plate of the second metal conductive heat dissipation plate unit, and so on. The 2X - 2 intermediate plate of the first metal conductive heat dissipation plate unit is electrically connected to the second edge plate of the second metal conductive heat dissipation plate unit; the connection mode of the first metal conductive heat dissipation plate unit and the second metal conductive heat dissipation plate unit is adopted to realize the connection between the second metal conductive heat dissipation plate unit and the third metal conductive heat dissipation plate unit; and so on, until the connection between the N - 1th metal conductive heat dissipation plate unit and the Nth metal conductive heat dissipation plate unit is realized.
[0016] Further, each connecting component includes an elastic pin, and a metal end and a disc spring respectively sleeved on the insulating rod;
[0017] One end of the disc spring abuts against the metal conductive heat dissipation plate at the edge, and the other end abuts against the metal end;
[0018] The elastic pin passes through the metal end and the insulating rod, connecting the two into one body.
[0019] Further, the elastic pin passes through the metal end and the insulating rod in the radial direction.
[0020] Further, the contact area between the metal conductive heat sink and the insulating heat insulating material is larger than the contact area between the metal conductive heat sink and the ceramic resistor.
[0021] Further, both the metal conductive heat sink and the ceramic resistor are of annular structure.
[0022] Further, the insulating rod is an epoxy glass pull rod or a mica rod.
[0023] Further, the metal conductive heat sink is an aluminum plate or a copper plate; the insulating heat insulating material is a silicate mineral or insulating oil; the encapsulation body is made of porcelain, epoxy resin or epoxy vacuum impregnation.
[0024] Further, the shape of the encapsulation body is a cuboid, and N ceramic resistor strings are arranged side by side in the encapsulation body along the length direction of the encapsulation body. Or, the shape of the encapsulation body is cylindrical, and N ceramic resistor strings are arranged in the encapsulation body along the circumferential direction.
[0025] Compared with the prior art, the advantages of the present utility model are:
[0026] The beneficial effects of the present utility model are:
[0027] 1. The resistor provided by the present utility model has a small height, large energy absorption, and fast heat dissipation speed, and can effectively ensure the safe and reliable operation of the product.
[0028] 2. The present utility model transfers the heat of the ceramic resistor to the metal conductive heat sink, the metal conductive heat sink then transfers the heat to the insulating heat insulating material, and the insulating heat insulating material then transfers the heat to the encapsulation body, finally transferring the heat of the ceramic resistor evenly and quickly to the environment outside the encapsulation body.
[0029] 3. Under the same energy absorption setting, the ceramic resistor used in the resistor of the present utility model makes the adjacent two ceramic resistor strings arranged in parallel in structure through the metal end, the elastic pin and the disc spring, and keeps connected in series electrically, avoiding that the more the overall series stacking number of the ceramic resistors is, the longer the resistor string composed of the ceramic resistors is, resulting in the doubling of the length and mechanical strength of the encapsulation body and the sharp increase in production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic structural diagram of an embodiment of the present utility model.
[0031] Reference numerals: 1 - insulating rod; 2 - metal end; 3 - elastic pin; 4 - disc spring; 5 - metal conductive heat sink plate; 6 - heat-resistant insulating partition; 7 - ceramic resistor; 8 - insulating heat sink material; 9 - package body. Detailed implementation mode
[0032] The following further describes the content of the present utility model in detail in conjunction with the accompanying drawings and specific embodiments:
[0033] See Figure 1 , a ceramic resistor in this embodiment mainly includes a package body 9, an insulating heat sink material 8 filled in the package body 9, and N ceramic resistor strings, N insulating rods 1, N heat-resistant insulating partition units, N metal conductive heat sink plate units and 2N connection components arranged in the package body 9; N≥2.
[0034] Among them, the package body 9 is made of porcelain, epoxy resin or epoxy vacuum impregnation. The insulating heat sink material 8 is a silicate mineral or insulating oil, and specifically, quartz sand or 25# transformer oil can be used.
[0035] Specifically, in this embodiment, N = 2 is taken as an example for illustration.
[0036] The shape of the package body 9 is a cuboid. Two ceramic resistor strings are arranged side by side in the package body 9 along the length direction of the package body 9, and there is a gap between the two ceramic resistor strings along the radial direction of the package body 9, and this gap is filled with the above-mentioned insulating heat sink material 8. Each of the two ceramic resistor strings includes X ceramic resistors 7 arranged along the axial direction of the package body 9, and there is an installation gap between two adjacent ceramic resistors 7 in the same ceramic resistor string; X≥2, and its specific quantity can be specifically set according to actual needs, and it is not specifically limited in this embodiment.
[0037] Each of the two heat-resistant insulating partition units includes X - 1 heat-resistant insulating partitions 6; the X - 1 heat-resistant insulating partitions 6 of the two heat-resistant insulating partition groups are respectively arranged in the installation gaps between two adjacent ceramic resistors 7 in the two ceramic resistor strings; each of the two metal conductive heat sink plate units includes 2X metal conductive heat sink plates 5; two of the 2X metal conductive heat sink plates 5 in the two metal conductive heat sink plate units are respectively arranged on the sides away from each other of the two ceramic resistors 7 at the edges in the two ceramic resistor strings, and the remaining 2X - 2 metal conductive heat sink plates 5 are respectively arranged on both sides of the X - 1 heat-resistant insulating partitions 6 in the two heat-resistant insulating partition units and are respectively in contact with the corresponding ceramic resistors 7. The upper and lower surfaces of the heat-resistant insulating partition 6 and the ceramic resistor 7 are completely in contact with the metal conductive heat sink plate 5, and the edge of the metal conductive heat sink plate 5 extends into the insulating heat sink material 8. Through the above settings, the X ceramic resistors 7 in the same ceramic resistor string can be conducted through the metal conductive heat sink plate 5 and then insulated and isolated through the heat-resistant insulating partition 6.
[0038] Specifically, both the metal conductive heat spreader 5 and the ceramic resistor 7 are in a ring structure. The metal conductive heat spreader 5 can be an aluminum plate or a copper plate, or it can also be a new alloy material with a higher thermal conductivity. The ceramic resistor 7 has the same radial dimension as the heat-resistant insulating partition 6, and both are smaller than the radial dimension of the metal conductive heat spreader 5.
[0039] In this embodiment, the size of the metal conductive heat spreader 5 and the inner diameter of the package 9 are determined according to the diameter of the ceramic resistor 7. Since the thermal conductivity of the metal conductive heat spreader 5 is much greater than that of the ceramic resistor 7, it is necessary to set the contact area between the metal conductive heat spreader 5 and the insulating heat dissipation material 8 to be greater than the contact area between the ceramic resistor 7 and the metal conductive heat spreader 5. Only in this way can the heat generated by the ceramic resistor 7 be quickly and effectively transferred to the insulating heat dissipation material 8 through the metal conductive heat spreader 5. The metal conductive heat spreader 5 can not only be completely wrapped in the insulating heat dissipation material 8, but also transfer the heat on the metal conductive heat spreader 5 to the package 9 through the insulating heat dissipation material 8 quickly. Forming such a structure is beneficial to improving the heat dissipation efficiency and effectively controlling the volume at the same time.
[0040] Two insulating rods 1 respectively pass through X ceramic resistors 7 in two ceramic resistor strings, X - 1 heat-resistant insulating partitions 6 in two heat-resistant insulating partition units, and 2X metal conductive heat spreaders 5 in two metal conductive heat spreader units along the axial direction, thereby connecting the above structures into one body. The insulating rod 1 is an epoxy glass pull rod or a mica rod.
[0041] Four connecting components are respectively arranged at both ends of the two insulating rods 1. Specifically, the connecting component includes an elastic pin 3, and a metal end 2 and a disc spring 4 respectively sleeved on the insulating rod 1; one end of the disc spring 4 abuts against the metal conductive heat spreader 5 at the edge, and the other end abuts against the metal end 2; the elastic pin 3 passes through the metal end 2 and the insulating rod 1 to connect the two into one body, and an included angle is provided between the axial direction of the elastic pin 3 and the axial direction of the insulating rod 1. The elastic pin 3 passes through the metal end 2 and the insulating rod 1 along the radial direction.
[0042] For the convenience of description, define the two metal conductive heat spreaders 5 located at the edges in the two metal conductive heat spreader groups as the first edge plate and the second edge plate respectively, and the remaining metal conductive heat spreaders 5 are the first intermediate plate, the second intermediate plate,..., the 2X - 2 intermediate plates in sequence along the direction from the first edge plate to the second edge plate; the first edge plate of the first metal conductive heat spreader unit is electrically connected to the first intermediate plate of the second metal conductive heat spreader unit, the first intermediate plate of the first metal conductive heat spreader unit is electrically connected to the second intermediate plate of the second metal conductive heat spreader unit, and so on, the 2X - 2 intermediate plate of the first metal conductive heat spreader unit is electrically connected to the second edge plate of the second metal conductive heat spreader unit.
[0043] Through the above settings, the two ceramic resistors on the left and right can be connected in parallel in structure and in series electrically, which can effectively reduce the length of the ceramic resistor string. When the ceramic resistor 7 is assembled in the package 9, the energy absorption capacity of the ceramic electrical appliance can be doubled, improving the product performance. At the same time, the length and mechanical strength of the package 9 can be effectively controlled, reducing the length and mechanical strength of the package 9, making the cost more economical and the structure more reliable.
[0044] Of course, the above specific structure is only a specific embodiment of the present invention. In other embodiments of the present invention, the package 9 can also be set to be circular, and N ceramic resistor strings can be arranged in the package 9 along the circumferential direction.
[0045] The specific number of the ceramic resistor strings can also be set according to actual needs, such as three, four, etc. When the number of the ceramic resistor strings is three or more, the same connection method of the first metal conductive heat dissipation plate unit and the second metal conductive heat dissipation plate unit is adopted to realize the connection between the second metal conductive heat dissipation plate unit and the third metal conductive heat dissipation plate unit; and so on, until the connection between the (N - 1)th metal conductive heat dissipation plate unit and the Nth metal conductive heat dissipation plate unit is realized.
Claims
1. A ceramic resistor, characterized in that: It comprises a package (9), an insulating heat-saturating material (8) filled in the package (9), and N ceramic resistor strings, N insulating rods (1), N heat-resistant insulating partition units, N metal conductive heat-saturating plate units and 2N connecting components arranged in the package (9); N≥2; N ceramic resistor strings are respectively arranged in the packaging body (9), each comprising X ceramic resistors (7) arranged along the axial direction of the packaging body (9), and an installation interval is provided between two adjacent ceramic resistors (7) in the same ceramic resistor string; X≥2; Each of the N heat-resistant insulating partition units comprises X-1 heat-resistant insulating partitions (6); the X-1 heat-resistant insulating partitions (6) of the N heat-resistant insulating partition units are respectively arranged in the installation interval between two adjacent ceramic resistors (7) in the N ceramic resistor strings; Each of the N metal conductive vapor chamber units comprises 2X metal conductive vapor chambers (5); two metal conductive vapor chambers (5) in the N metal conductive vapor chamber units are respectively arranged on a side away from each other of two ceramic resistors (7) located at the edge of the N ceramic resistor strings, and the remaining 2X-2 metal conductive vapor chambers (5) are respectively arranged on both sides of X-1 heat-resistant insulating partitions (6) in the N groups of heat-resistant insulating partition units, and are respectively in contact with the corresponding ceramic resistors (7); N insulating rods (1) are respectively passed through X ceramic resistors (7) in N groups of ceramic resistor strings, X-1 heat-resistant insulating baffles (6) in N heat-resistant insulating baffle units, and 2X metal conductive soaker plates (5) in N metal conductive soaker plates units along the axial direction; 2N connecting components are respectively arranged at both ends of the N insulating rods (1); It is defined that two metal conductive vapor chambers (5) located at the edge of the N metal conductive vapor chamber units are respectively the first edge plate and the second edge plate, and the remaining metal conductive vapor chambers (5) are sequentially the first middle plate, the second middle plate, ..., the 2X-2 middle plate from the first edge plate to the second edge plate; The first edge plate of the first metal conductive heat spreader unit is electrically connected to the first middle plate of the second metal conductive heat spreader unit, the first middle plate of the first metal conductive heat spreader unit is electrically connected to the second middle plate of the second metal conductive heat spreader unit, and so on, the 2X-2 middle plate of the first metal conductive heat spreader unit is electrically connected to the second edge plate of the second metal conductive heat spreader unit; the same connection method between the first metal conductive heat spreader unit and the second metal conductive heat spreader unit is adopted to realize the connection between the second metal conductive heat spreader unit and the third metal conductive heat spreader unit; and so on, until the connection between the N-1th metal conductive heat spreader unit and the Nth metal conductive heat spreader unit is realized.
2. A ceramic resistor according to claim 1, characterized in that: Each of the connecting components comprises an elastic pin (3), and a metal end (2) and a disc spring (4) respectively mounted on the insulating rod (1); One end of the disc spring (4) abuts against the metal conductive heat spreader (5) at the edge, and the other end abuts against the metal end head (2); The elastic pin (3) passes through the metal end (2) and the insulating rod (1) to connect the two into one.
3. A ceramic resistor according to claim 2, characterized in that: The elastic pin (3) passes through the metal end head (2) and the insulating rod (1) in the radial direction.
4. A ceramic resistor according to any one of claims 1 to 3, characterized in that: The contact area between the metal conductive soaking plate (5) and the insulating soaking material (8) is greater than the contact area between the metal conductive soaking plate (5) and the ceramic resistor (7).
5. A ceramic resistor according to claim 4, characterized in that: The metal conductive heat spreader (5) and the ceramic resistor (7) are both annular structures.
6. A ceramic resistor according to claim 5, characterized in that: The insulating rod (1) is an epoxy glass drawing rod or a mica rod.
7. A ceramic resistor according to claim 6, characterized in that: The metal conductive soaking plate (5) is an aluminum plate or a copper plate; the insulating soaking material (8) is a silicate mineral or insulating oil; and the packaging body (9) is made of porcelain, epoxy resin or epoxy vacuum impregnation.
8. The ceramic resistor according to claim 1, characterized in that: The package body (9) is in the shape of a rectangular parallelepiped, and N ceramic resistor strings are arranged side by side in the package body (9) along the length direction of the package body (9).
9. The ceramic resistor according to claim 1, characterized in that: The package body (9) is cylindrical in shape, and N ceramic resistor strings are arranged in the package body (9) along a circumferential direction.
10. The ceramic resistor according to claim 1, characterized in that: The radial dimension of the ceramic resistor (7) is the same as that of the heat-resistant insulating partition (6), and is smaller than the radial dimension of the metal conductive heat spreader (5).