High-efficiency heat-conducting capacitor shell

By designing a capacitor shell that uses anti-interference metal die-casting and installs a heat sink, the capacitor is easily vulnerable to electromagnetic wave interference and poor heat dissipation during use, and achieves higher working stability and performance.

CN223038788UActive Publication Date: 2025-06-27ZHONGSHAN YSINTEK CASTING PROD CO LTD
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Patent Information

Application Number
CN202421836046.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2025-06-27
Estimated Expiration
2034-07-31

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Abstract

The utility model discloses a high-efficiency heat-conducting capacitor shell, which relates to the technical field of capacitor installation and comprises a shell main body integrally formed by anti-interference metal die casting, a plurality of radiating fins are arranged at the bottom of the shell main body, and the shell main body is provided with a placing area for placing a capacitor. One side of the shell main body is provided with an opening communicated with the placing area, and the shell main body comprises a mounting groove surrounding the opening. After the structure is adopted, the capacitor shell is formed by die-casting the anti-interference metal, and the capacitor is arranged in the capacitor shell, so that the interference of electromagnetic waves on the capacitor can be effectively reduced. After the structure of the utility model is adopted, the contact area between the plurality of heat dissipation blades installed at the bottom of the capacitor shell and air is large, and the heat conduction efficiency is high, so that after the capacitor is installed on the shell, the problem of performance reduction caused by over-high temperature of the capacitor is effectively improved.
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Description

Technical Field

[0001] The utility model relates to the field of capacitor installation, in particular to a capacitor housing with high heat conduction efficiency. Background Art

[0002] When a capacitor is working, being interfered by electromagnetic waves will lead to a decrease in the working stability of the capacitor and a large amount of heat will be dissipated during operation. In order to reduce the interference of electromagnetic waves on the capacitor during use and ensure the heat dissipation effect, it is necessary to design a capacitor housing that can reduce the interference of electromagnetic waves on the capacitor. Content of the Utility Model

[0003] The utility model aims to solve the problem that the working stability of the capacitor is easily reduced due to the interference of electromagnetic waves during the use of the capacitor, and it is necessary to reduce the interference of electromagnetic waves on the capacitor. Therefore, a capacitor housing that can reduce the interference of electromagnetic waves on the capacitor is proposed.

[0004] The utility model is realized by the following solutions:

[0005] A capacitor housing with high heat conduction efficiency, including a housing main body integrally formed by die-casting of anti-interference metal. A plurality of heat sinks are installed at the bottom of the housing main body. The housing main body is provided with a placement area for placing the capacitor. An opening communicating with the placement area is provided on one side of the housing main body. The housing main body includes an installation groove surrounding the opening.

[0006] For the capacitor housing with high heat conduction efficiency as described above, the anti-interference metal is made of ADC12 material, copper or cast iron.

[0007] For the capacitor housing with high heat conduction efficiency as described above, the installation groove is formed by laser etching process.

[0008] For the capacitor housing with high heat conduction efficiency as described above, a sealing ring is provided on the installation groove.

[0009] For the capacitor housing with high heat conduction efficiency as described above, the sealing ring is a silicone gasket.

[0010] For the capacitor housing with high heat conduction efficiency as described above, a plurality of partition plates are installed inside the housing main body, and the partition plates are used to separate the plurality of placement areas inside the housing main body.

[0011] For the capacitor housing with high heat conduction efficiency as described above, a plurality of positioning blocks are placed in the placement area, and the positioning blocks are used to position the installation position of the capacitor.

[0012] For the capacitor housing with high heat conduction efficiency as described above, the positioning blocks include positioning block A provided at four corners of the placement area, and the positioning blocks include two positioning block B oppositely provided on the inner wall of the housing.

[0013] The highly heat-conductive capacitor housing as described above, wherein the positioning block includes a positioning block C for dividing the placement area into two installation areas, and the positioning block C is provided at the center of the placement area.

[0014] The highly heat-conductive capacitor housing as described above, wherein mounting holes for fixing the housing body are installed at both ends of the partition.

[0015] Compared with the prior art, the beneficial effects of the present technical solution are as follows:

[0016] 1. After adopting the structure of the present utility model, since the capacitor housing is formed by anti-interference metal die-casting, by installing the capacitor inside the capacitor housing, the interference of electromagnetic waves on the capacitor can be effectively reduced.

[0017] 2. After adopting the structure of the present utility model, since the multiple heat dissipation fins installed at the bottom of the capacitor housing have a large contact area with air and a high heat conduction efficiency, the problem of performance degradation of the capacitor caused by overheating can be effectively improved after the capacitor is installed in the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of a highly heat-conductive capacitor housing.

[0020] Figure 2 It is a schematic top view structural diagram of a highly heat-conductive capacitor housing. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0022] Such as Figure 1 And 2An efficient heat-conducting capacitor housing is shown, which includes a housing body 1 integrally formed by die-casting of anti-interference metal. A plurality of heat sinks 3 are installed at the bottom of the housing body 1. The housing body 1 is provided with a placement area 2 for placing capacitors. An opening 5 communicating with the placement area 2 is provided on one side of the housing body 1. The housing body 1 includes a mounting groove 13 surrounding the opening 5. After adopting the structure of the present utility model, since the capacitor housing is formed by die-casting of anti-interference metal, by installing the capacitor in the capacitor housing, the interference of electromagnetic waves on the capacitor can be effectively reduced. After adopting the structure of the present utility model, since the plurality of heat dissipation blades installed at the bottom of the capacitor housing have a large contact area with the air and a high heat conduction efficiency, the problem of performance degradation of the capacitor caused by excessive temperature is effectively improved after the capacitor is installed in the housing.

[0023] In this embodiment, in order to enable the capacitor to have a certain anti-interference property, the anti-interference metal is made of ADC12 material, copper or cast iron. Preferably, it is die-cast and formed by ADC12 die-casting aluminum alloy. Relatively speaking, the ADC12 material has better anti-electromagnetic interference ability and is cheap. Using ADC12 material to make the capacitor housing has great advantages both in terms of anti-electromagnetic interference and price.

[0024] Furthermore, in order to enable the capacitor housing to have better waterproofness and airtightness, the mounting groove 13 is processed and formed by a laser etching process. A sealing ring 14 is provided on the mounting groove 13, and the sealing ring 14 is a silica gel pad. After adopting such a structure, since the mounting groove 13 is processed and formed by a laser etching process, and with this processing method and then using a silica gel pad for sealing, the waterproofness and airtightness of the capacitor heat dissipation housing are better.

[0025] Furthermore, in order to effectively improve the use of the internal space of the capacitor housing, a plurality of partition plates 11 are installed in the housing body 1, and the partition plates 11 are used to separate the plurality of placement areas 2 in the housing body 1. This capacitor housing is divided into a total of five placement areas 2 and can accommodate up to ten capacitors.

[0026] Further, in order to stably install the capacitor inside the housing main body 1, a plurality of positioning blocks 21 are placed in the placement area 2, and the positioning blocks 21 are used to position the installation position of the capacitor. The positioning blocks 21 include positioning blocks A211 provided at the four corners of the placement area 2, and the positioning blocks 21 include two positioning blocks B212 oppositely provided on the inner wall of the housing main body 1. The positioning blocks 21 include positioning blocks C213 for dividing the placement area into two installation areas, and the positioning blocks C213 are provided at the center of the placement area 2. Preferably, a cylindrical capacitor is installed inside the housing. The positioning blocks A211 and the positioning blocks B212 are positioning blocks with arc-shaped protrusions. By cooperating with the positioning blocks, the capacitor can be supported and positioned. Moreover, the positioning blocks C213 are positioning blocks with arcs provided at the center inside the placement area 2, and the placement area 2 can be divided into two areas for installing two capacitors.

[0027] Further, in order to stably install the capacitor on the device, mounting holes 12 for fixing the housing main body 1 are installed at both ends of the partition plate 11. When the capacitor housing needs to be installed, the capacitor can be installed only by matching the screws with the mounting holes.

[0028] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A highly efficient heat-conducting capacitor housing, characterized in that: The invention comprises a housing body (1) formed by die-casting of an anti-interference metal, a plurality of heat sinks (3) being mounted on the bottom of the housing body (1), the housing body (1) being provided with a placement area (2) for placing a capacitor, an opening (5) communicating with the placement area (2) being provided on one side of the housing body (1), and the housing body (1) comprising a mounting groove (13) surrounding the opening (5).

2. The high-efficiency heat-conducting capacitor housing according to claim 1, characterized in that: The anti-interference metal is made of ADC12 material, copper or cast iron.

3. The highly efficient heat-conducting capacitor housing according to claim 1, characterized in that: The mounting groove (13) is formed by laser etching process.

4. The high-efficiency heat-conducting capacitor housing according to claim 3, characterized in that: A sealing ring (14) is provided on the installation groove (13).

5. The highly efficient heat-conducting capacitor housing according to claim 4, characterized in that: The sealing ring (14) is a silicone pad.

6. The highly efficient heat-conducting capacitor housing according to claim 1, characterized in that: A plurality of partitions (11) are installed in the shell body (1), and the partitions (11) are used to separate a plurality of placement areas (2) in the shell body (1).

7. The highly efficient heat-conducting capacitor housing according to claim 6, characterized in that: The placement area (2) is provided with a plurality of positioning blocks (21), and the positioning blocks (21) are used to locate the installation position of the capacitor.

8. The highly efficient heat-conducting capacitor housing according to claim 7, characterized in that: The positioning block (21) comprises positioning blocks A (211) arranged at four corners of the placement area (2), and the positioning block (21) comprises two positioning blocks B (212) arranged opposite to each other on the inner wall of the shell body (1).

9. The highly efficient heat-conducting capacitor housing according to claim 7, characterized in that: The positioning block (21) comprises a positioning block C (213) for dividing the placement area into two installation areas, and the positioning block C (213) is arranged at the center of the placement area (2).

10. The highly efficient heat-conducting capacitor housing according to claim 1, characterized in that: Mounting holes (12) for fixing the housing body (1) are installed at both ends of the partition plate (11).