Low-noise chip capacitor
By setting up a connecting frame, conductive rod and conductive foot outside the chip capacitor, and using a conductive wire of flexible composite wire, the problem of noise generated by vibration of traditional chip capacitors is solved, and a more stable and lower noise capacitor design is achieved.
Patent Information
- Application Number
- CN202421418298.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-20
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-06-20
AI Technical Summary
During operation, traditional chip capacitors produce large noise due to current changes, which affect the overall performance and user experience of the equipment.
A low-noise patch capacitor is designed. By setting a connecting frame on the outside of the patch capacitor, and fixing a connecting sleeve and a through-through conductor rod at both ends. One end of the conductive rod is equipped with an arc-shaped head and the other end is equipped with a conductive foot. The conductor wire is made of a composite wire twisted by flexible metal base wire, polyester wire and rubber wire.
Through this structural design, the structural stability and mechanical strength of the capacitor can be effectively improved, vibrations can be absorbed and dispersed, noise levels can be significantly reduced, and user experience can be improved.
Smart Images
Figure CN223038789U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip capacitors, and particularly relates to a low-noise chip capacitor. Background Art
[0002] During the operation of traditional chip capacitors, due to the vibration caused by current changes, relatively large noise is often generated, affecting the overall performance of the device and the user experience. Most of these traditional capacitors adopt a rigid connection structure and lack an effective vibration absorption and dispersion mechanism, making it difficult to fundamentally solve the noise problem. In addition, these capacitors are often relatively simple in structural design and cannot effectively control vibration. Content of the Utility Model
[0003] The purpose of the utility model is to provide a low-noise chip capacitor in order to solve the problems such as easy generation of noise during the operation of common chip capacitors.
[0004] The utility model realizes the above purpose through the following technical solutions: including a chip capacitor, a connection frame is fixedly arranged outside the chip capacitor, two connection collar rings are fixedly arranged at both ends of the connection frame, conduction rods penetrate through the inner sides of the two connection collar rings, the connection collar rings and the conduction rods are fixed by buckles, one end of the conduction rod is provided with an arc head, and the other end of the conduction rod is provided with conduction feet.
[0005] Furthermore, a plurality of conduction wires are fixedly connected between the two conduction rods on the same side.
[0006] Furthermore, the conduction feet and the arc head are both fixedly connected to the conduction rod.
[0007] Furthermore, the conduction rod, the arc head and the conduction feet are all made of rubber materials.
[0008] Furthermore, the conduction wire is a composite wire formed by twisting a flexible metal-based wire, a polyester wire and a rubber wire.
[0009] Beneficial Effects: The utility model is reasonably designed and has the following beneficial effects:
[0010] 1. In the solution of the utility model, by arranging a connection frame outside the chip capacitor, fixedly arranging connection collar rings at both ends thereof, and conduction rods penetrating through the inner side, a novel structural design is formed, which can not only effectively improve the structural stability of the capacitor, but also the design of the arc head at one end of the conduction rod and the conduction feet at the other end enhances the overall mechanical strength of the capacitor, which is beneficial to the absorption and dispersion of vibration energy;
[0011] 2. In the solution of the present utility model, through the special design of the conduction feet and the conduction rod, effective management and reduction of vibration are achieved during the operation of the capacitor. The conduction rod can directly absorb the vibration between the chip capacitor and the connection frame, and transfer the vibration to the external main board through the conduction feet and dissipate it, significantly reducing the vibration amplitude, thereby reducing the generation of noise. The conduction rod, the arc head and the conduction feet made of rubber material utilize the excellent elasticity and damping performance of rubber, and can more effectively absorb and reduce vibration during the operation of the capacitor, thus significantly reducing the noise level and improving the user experience;
[0012] 3. In the solution of the present utility model, the conduction wire adopts a composite wire material composed of a flexible metal base wire, a polyester wire and a rubber wire, so that the conduction wire not only maintains good electrical conductivity, but also has the necessary elasticity and damping performance. When the conduction rod is vibrated, the conduction wire can effectively disperse the vibration to the entire connection frame structure, avoiding local concentration of vibration and further reducing vibration and noise. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic structural diagram of the present utility model.
[0014] In the figure: 1-chip capacitor, 2-connection frame, 3-connection collar, 4-conduction rod, 5-arc head, 6-conduction foot, 7-conduction wire. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0015] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.
[0016] Combined with Figure 1 A low-noise chip capacitor shown, including a chip capacitor 1, a connection frame 2 is fixedly arranged outside the chip capacitor 1, two connection collars 3 are fixedly arranged at both ends of the connection frame 2, a conduction rod 4 penetrates through the inner sides of the two connection collars 3, the connection collar 3 and the conduction rod 4 are fixed by a buckle, an arc head 5 is arranged at one end of the conduction rod 4, and a conduction foot 6 is arranged at the other end of the conduction rod 4.
[0017] Among them, a plurality of conduction wires 7 are fixedly connected between the two conduction rods 4 on the same side.
[0018] The conduction foot 6 and the arc head 5 are both fixedly connected to the conduction rod 4. The design of the conduction foot 6 and the conduction rod 4 is to absorb and disperse the vibration caused by the current change during the operation of the capacitor. The conduction rod 4 is connected to the capacitor through the connection collar 3 and can directly absorb the vibration from the chip capacitor 1 and the connection frame 2. The conduction foot 6 contacts the external main board and conducts and dissipates the vibration, reducing the vibration amplitude.
[0019] The conduction rod 4, the arc head 5, and the conduction support feet 6 are all made of rubber material. Since both the conduction support feet 6 and the conduction rod 4 are made of rubber material, rubber has good elasticity and damping properties, which can effectively reduce vibration and thus reduce noise.
[0020] The conduction wire 7 is a composite wire formed by stranding a flexible metal-based wire, a polyester wire, and a rubber wire, enabling the conduction wire 7 to have both electrical conductivity and certain elasticity and damping properties. When the conduction rod 4 on one side is vibrated, the conduction wire 7 can disperse the vibration throughout the connection frame 2 structure instead of concentrating at a certain point, and the dispersion effect further reduces vibration and noise.
[0021] Working principle: When the present utility model is in use, after the capacitor is powered on and operates, it generates vibration. The conduction rod made of rubber material can directly absorb the vibration between the chip capacitor and the connection frame, and transfer the vibration to the external main board through the conduction support feet and dissipate it, significantly reducing the vibration amplitude, and thus reducing the generation of noise. When the conduction rod is vibrated, the conduction wire can effectively disperse the vibration throughout the connection frame structure, avoiding local concentration of vibration and further reducing vibration and noise.
[0022] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.
[0023] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A low-noise chip capacitor, comprising a chip capacitor (1), characterized in that: A connecting frame (2) is fixedly provided on the outside of the chip capacitor (1), two connecting rings (3) are fixedly provided at both ends of the connecting frame (2), a conducting rod (4) is penetrated through the inside of the two connecting rings (3), the connecting rings (3) and the conducting rod (4) are fixed by a buckle, one end of the conducting rod (4) is provided with an arc head (5), and the other end of the conducting rod (4) is provided with a conducting foot (6).
2. A low noise chip capacitor according to claim 1, characterized in that: A plurality of conductive wires (7) are fixedly connected between the two conductive rods (4) on the same side.
3. A low noise chip capacitor according to claim 2, characterized in that: The conductive support leg (6) and the arc-shaped head (5) are both fixedly connected to the conductive rod (4).
4. A low noise chip capacitor according to claim 3, characterized in that: The conductive rod (4), the arc-shaped head (5) and the conductive support foot (6) are all made of rubber material.
5. A low noise chip capacitor according to claim 4, characterized in that: The conductive wire (7) is a composite wire formed by twisting flexible metal-based wire, polyester wire and rubber wire.