Chip double-sided processing device
By designing a chip double-sided processing device, and using the conveying mechanism and the flip mechanism to realize the automatic flip and double-sided processing of the chip, the problem of chip flip relies on manual operation in the prior art is solved, improving efficiency and reducing costs.
Patent Information
- Application Number
- CN202422163022.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-03
AI Technical Summary
In the existing chip processing technology, chip flips mainly rely on manual operations, resulting in high processing costs and low efficiency.
A chip double-sided processing device is designed, including a bracket, a conveying mechanism, a patch mechanism and a first flip mechanism. The conveying mechanism transports the chip to the patch mechanism for a single-sided patch. After flipping the first flipping mechanism, it is conveyed again to the patch mechanism for processing on the other side.
Automatic flip and double-sided processing of the chip is realized, reducing the need for manual intervention, improving processing efficiency and reducing costs.
Smart Images

Figure CN223038923U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of chip processing, and particularly to a chip double-sided processing device. Background Art
[0002] Chip processing refers to integrating and soldering microelectronic components, such as resistors, capacitors, etc., on the surface of a chip. Usually, microelectronic components need to be mounted on both the front and back sides of some chips, so the problem of chip flipping is involved in the chip processing process.
[0003] Currently, generally, the flipping of chips is completed manually, and this processing method has problems of high processing cost and low efficiency. Summary of the Utility Model
[0004] In order to solve the above technical problems, the present disclosure provides a chip double-sided processing device.
[0005] The present disclosure provides a chip double-sided processing device, and the chip double-sided processing device includes:
[0006] A bracket;
[0007] A conveying mechanism, which is arranged on the bracket and is configured to convey chips;
[0008] A chip mounting mechanism, which is relatively fixed to the bracket and is configured to process the surface of the chips delivered by the conveying mechanism;
[0009] A first flipping mechanism, which is configured to receive the chips and flip the chips during the process of the conveying mechanism conveying the chips.
[0010] In an embodiment of the present disclosure, the first flipping mechanism includes:
[0011] A fixing member, which is rotatably arranged on the conveying mechanism, and the fixing member is provided with a mounting groove configured to place the chips;
[0012] An elastic clamping member, which is arranged on the fixing member and is configured to clamp the chips located in the mounting groove;
[0013] A first flipping member, which is rotatably arranged on the bracket and is configured to push the fixing member to carry the chips to flip relative to the conveying mechanism when the fixing member reaches a preset position along with the conveying mechanism.
[0014] In one embodiment of the present disclosure, the conveying mechanism includes an endless conveyor belt and a driving mechanism for driving the endless conveyor belt to rotate in a preset direction. The chip pasting mechanism processes the chip on the upper surface of the endless conveyor belt, and the first flipping mechanism is configured to flip the chip above the endless conveyor belt; moreover, the chip double-sided processing device further includes:
[0015] An anti-drop mechanism configured to prevent the fixing member from dropping from the endless conveyor belt under its own weight during the cyclic movement along with the endless conveyor belt.
[0016] In one embodiment of the present disclosure, the anti-drop mechanism includes a first magnetic member and a second magnetic member that attract each other. The first magnetic member is disposed on the endless conveyor belt, and the second magnetic member is disposed on the fixing member;
[0017] A guiding member disposed on the bracket and having an arc-shaped guiding surface matching the end of the endless conveyor belt. The guiding member is configured such that when the fixing member carries the chip and is conveyed to the end of the endless conveyor belt, the fixing member is guided by the arc-shaped guiding surface to move along with the endless conveyor belt until it is magnetically attracted to the lower surface of the endless conveyor belt again.
[0018] In one embodiment of the present disclosure, the guiding member includes a substrate fixedly connected to the bracket and an arc-shaped guiding plate extending outward from the substrate. The arc-shaped guiding surface is located inside the arc-shaped guiding plate. The guiding member further includes a linear guiding plate parallel to the lower surface of the endless conveyor belt;
[0019] The fixing member is provided with rollers and is configured to roll along the arc-shaped guiding surface when the endless conveyor belt moves until it is guided by the linear guiding plate to be magnetically attracted to the lower surface of the endless conveyor belt again.
[0020] In one embodiment of the present disclosure, the anti-drop mechanism includes two spaced-apart guiding members, and the two guiding members are symmetrically disposed on the left and right sides of the fixing member such that the chip extends out from the gap between the two guiding members.
[0021] In one embodiment of the present disclosure, the chip double-sided processing device further includes a shipping mechanism configured to remove the chip after double-sided processing from the fixing member.
[0022] In one embodiment of the present disclosure, the shipping mechanism includes:
[0023] A shipping outlet disposed on the fixing member;
[0024] A stop assembly, which is arranged on the fixing member and configured to open or block the shipping outlet;
[0025] A chip pushing assembly, which is configured to push the chip out of the installation groove of the fixing member after the shipping outlet is opened.
[0026] In an embodiment of the present disclosure, the stop assembly includes:
[0027] A semi-cylindrical rotating shaft, which is rotatably arranged on the fixing member and configured to rotate between an open position and a blocking position under the action of a driving assembly to open or block the shipping outlet.
[0028] In an embodiment of the present disclosure, the driving assembly includes:
[0029] A first rolling gear, which is fixedly connected to the semi-cylindrical rotating shaft;
[0030] A first rack, which is fixedly arranged on the bracket and extends along the conveying direction of the conveying mechanism. The first rack is arranged on the downstream side of the first flipping member and configured to mesh with the first rolling gear to drive the semi-cylindrical rotating shaft to selectively open or block the shipping outlet.
[0031] In an embodiment of the present disclosure, the chip double-sided processing device further includes:
[0032] A second flipping mechanism, which is configured to flip the fixing member when the chip is separated from the fixing member so that the notch of the installation groove of the fixing member faces the same direction as the conveying direction.
[0033] In an embodiment of the present disclosure, the second flipping mechanism includes:
[0034] A second rolling gear, which is rotatably arranged on the fixing member;
[0035] A locking assembly, which is configured to lock the second rolling gear and the fixing member when the fixing member does not install a chip, or unlock the second rolling gear and the fixing member when the fixing member installs a chip;
[0036] A second rack, which is fixedly arranged on the bracket and extends along the conveying direction of the conveying mechanism. The second rack is arranged on the upstream side of the chip mounting mechanism and configured to mesh with the second rolling gear in the locked state of the second rolling gear and the fixing member to drive the fixing member to flip.
[0037] In one embodiment of the present disclosure, the chip pushing component includes:
[0038] A base, which is fixed to the bracket;
[0039] A first push plate configured to push the chip in the fixing member out of the mounting groove;
[0040] A second push plate, one end of which is hinged to the first push plate and the other end is hinged to the base, and torsion springs are provided between the first push plate and the second push plate, and between the second push plate and the base; and,
[0041] The first push plate is parallel to the surface of the fixing member under the action of the torsion spring.
[0042] One beneficial effect of the present disclosure is that the chip double-sided processing device provided by the present disclosure includes a bracket, a conveying mechanism, a chip mounting mechanism, and a first flipping mechanism. Among them, the conveying mechanism conveys the chips to be processed to the chip mounting mechanism for single-sided chip mounting. After the processing is completed, the chips are continuously conveyed by the conveying mechanism. When passing through the first flipping mechanism during the conveying process, the first flipping mechanism flips the chips, and the flipped chips are conveyed by the conveying mechanism to the chip mounting mechanism again, and the chip mounting mechanism processes the other side of the chips.
[0043] Obviously, the chip double-sided processing device provided by the present disclosure can not only complete the automatic conveying of chips, but most importantly, it can realize the automatic flipping of chips. Without manual intervention, the processing of both sides of the chips can be completed, which has the advantages of low cost and high efficiency.
[0044] Through the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings, other features and advantages of the present disclosure will become clear. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the present disclosure.
[0046] Figure 1 is a schematic diagram of the overall structure of a chip double-sided processing device provided by an embodiment of the present disclosure;
[0047] Figure 2 is a partial structural schematic diagram of a first flipping mechanism provided by an embodiment of the present disclosure;
[0048] Figure 3 is an exploded structural schematic diagram of a fixing member and a component connected to the fixing member provided by an embodiment of the present disclosure;
[0049] Figure 4 is a structural schematic diagram of an elastic clamping member and a spring provided by an embodiment of the present disclosure;
[0050] Figure 5 It is a schematic structural diagram of the cooperation between the first flipping member and the fixing member provided by an embodiment of the present disclosure;
[0051] Figure 6 It is a schematic structural diagram of the anti-drop mechanism provided by an embodiment of the present disclosure;
[0052] Figure 7 It is a schematic structural diagram of the guiding member provided by an embodiment of the present disclosure;
[0053] Figure 8 It is a schematic diagram of the outlet of the fixing member in a blocked state provided by an embodiment of the present disclosure;
[0054] Figure 9 It is a schematic diagram of the outlet of the fixing member in an open state provided by an embodiment of the present disclosure;
[0055] Figure 10 It is a schematic structural diagram of the cooperation between the fixing member and the goods pushing assembly when the outlet of the fixing member is in a blocked state provided by an embodiment of the present disclosure;
[0056] Figure 11 It is a schematic structural diagram of the cooperation between the fixing member and the goods pushing assembly when the outlet of the fixing member is in an open state provided by an embodiment of the present disclosure;
[0057] Figure 12 It is a schematic diagram of the installation position of the first rack provided by an embodiment of the present disclosure;
[0058] Figure 13 It is a schematic structural diagram of the second flipping mechanism provided by an embodiment of the present disclosure;
[0059] Figure 14 It is a schematic diagram of the positions of the elastic clamping member and the second rolling gear when the fixing member is installing a chip provided by an embodiment of the present disclosure;
[0060] Figure 15 It is a schematic diagram of the positions of the elastic clamping member and the second rolling gear when the fixing member has no chip provided by an embodiment of the present disclosure;
[0061] Figure 16 It is a schematic structural diagram of the goods pushing assembly provided by an embodiment of the present disclosure.
[0062] Figures 1 to 16 The one-to-one correspondence between the names of the components and the reference numerals in the figure is as follows:
[0063] 1. Bracket;
[0064] 2. Conveying mechanism; 21. Ring-shaped conveyor belt; 22. Driving mechanism;
[0065] 3. SMT mechanism;
[0066] 4. First flipping mechanism; 41. Fixed part; 411. Installation groove; 412. Roller; 413. Pin shaft; 414. Chute; 42. Elastic clamping part; 421. Connection part; 422. Contact part; 423. Buckle part; 424. Stress part; 43. First flipping piece; 431. Fixed base; 4311. Swing groove; 432. Movable rocker; 44. Spring; 45. Connecting rotating shaft; 451. Copper sleeve;
[0067] 5. Anti-drop mechanism; 51. First magnetic part; 52. Second magnetic part; 53. Guide part; 531. Substrate; 532. Arc guide plate; 533. Linear guide plate;
[0068] 6. Shipping mechanism; 61. Pushing component; 611. Base; 612. First push plate; 613. Second push plate; 621. Driving component; 6211. First rolling gear; 6212. First rack; 622. Semi-cylindrical rotating shaft; 63. Shipping outlet; 64. Shipping conveyor belt;
[0069] 7. Second flipping mechanism; 71. Second rolling gear; 711. Side end card slot; 72. Second rack;
[0070] 8. Chip. Detailed implementation manners
[0071] Now, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present disclosure.
[0072] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as a limitation to the present disclosure, its application, or its use.
[0073] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.
[0074] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0075] The following describes the specific implementation manners of the present disclosure with reference to the accompanying drawings.
[0076] In this article, "upper", "lower", "front", "rear", "left", "right", etc. are only used to represent the relative positional relationships between relevant parts, rather than defining the absolute positions of these relevant parts.
[0077] In this article, "first", "second", etc. are only used to distinguish each other, and do not indicate the importance and order, or the premise of each other's existence.
[0078] In this document, “equal”, “same”, etc. are not strictly limited in a mathematical and / or geometric sense, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.
[0079] In order to solve the problems of low automation level and low processing efficiency of chip processing devices in the prior art, the present disclosure provides a chip double-sided processing device. The chip double-sided processing device specifically includes a bracket 1, a conveying mechanism 2, a chip mounting mechanism 3 and a first flipping mechanism 4.
[0080] Among them, the conveying mechanism 2 is set on the bracket 1 and is configured to convey the chip 8; the patch mechanism 3 is relatively fixed to the bracket 1 and is configured to process the surface of the chip 8 delivered by the conveying mechanism 2; the first flipping mechanism 4 is configured to receive the chip 8 and flip the chip 8 over during the process of conveying the chip 8 by the conveying mechanism 2.
[0081] Specific as Figure 1 As shown, the chip mounting mechanism 3 is a device for processing the surface of the chip 8. In addition to being responsible for mounting components on the surface of the chip 8, it is also provided with a detection device to identify the front side of the chip 8 to determine the mounting position of the components.
[0082] The conveying mechanism 2 is arranged on the support 1, and conveys the chip 8 to be processed to the chip mounting mechanism 3 for processing. After the chip mounting mechanism 3 processes one surface of the chip 8, the conveying mechanism 2 conveys it to the first flipping mechanism 4, and the chip 8 is flipped under the action of the first flipping mechanism 4. Then, the conveying mechanism 2 sends the flipped chip 8 back to the chip mounting mechanism 3 for processing. At this point, both sides of the chip 8 have completed the mounting of components.
[0083] The chip double-sided processing device provided by the present disclosure can not only complete the automatic conveying of chips, but most importantly, it can realize the automatic flipping of chips, and can complete the processing of both sides of the chip without human intervention, which has the advantages of low cost and high efficiency.
[0084] In one embodiment of the present disclosure, the first flipping mechanism 4 includes a fixing member 41, an elastic clamping member 42 and a first flipping member 43. The fixing member 41 is rotatably arranged on the conveying mechanism 2, and the fixing member 41 is provided with a mounting groove 411, and the mounting groove 411 is configured to place the chip 8, and the elastic clamping member 42 is arranged on the fixing member 41, and is configured to clamp the chip 8 located in the mounting groove 411;
[0085] The first flipping member 43 is rotatably arranged on the bracket 1 and is configured to push the fixing member 41 to carry the chip 8 to flip relative to the conveying mechanism 2 when the fixing member 41 reaches the preset position along with the conveying mechanism 2.
[0086] As Figure 2 , Figure 3 shown, the fixing member 41 serves as the carrier of the chip 8 and is responsible for clamping the chip 8 to be processed. At the same time, the fixing member 41 is movably connected to the conveying mechanism 2. In an embodiment of the present disclosure, the fixing member 41 is connected to the conveying mechanism 2 through a connecting rotating shaft 45 to ensure relative rotation. Considering that the connecting rotating shaft 45 will cause wear to the fixing member 41 during the rotation of the fixing member 41 relative to the connecting rotating shaft 45, a copper sleeve 451 is further installed between the fixing member 41 and the connecting rotating shaft 45. Driven by the conveying mechanism 2, the fixing member 41 together with the chip 8 moves along with the conveying mechanism 2.
[0087] Specifically, as Figure 2 shown, the fixing member 41 is provided with an installation groove 411. When installing the chip, the chip 8 is pushed into the installation groove 411 along the extension direction of the installation groove 411.
[0088] In addition, in combination with Figure 4 analysis, the fixing member 41 is further provided with an elastic clamping member 42. When the chip 8 is not installed on the fixing member 41, the contact portion 422 of the elastic clamping member 42 protrudes from the installation groove 411, and the connecting portion 421 provided in a streamline shape smoothly connects the installation groove 411 and the contact portion 422.
[0089] During the process of the fixing member 41 clamping the chip 8, the side of the chip 8 gradually enters the fixing member 41 along the installation groove 411. Then, the side of the chip 8 first contacts the connecting portion 421, and the chip 8 presses the elastic clamping member 42 into the installation groove 411, finally making the side of the installation groove 411 coplanar with the contact portion 422. Since the force-receiving portion 424 of the elastic clamping member 42 is connected to the spring 44, the compressed spring 44 provides a clamping force to the side of the chip 8 through the contact portion 422 of the elastic clamping member 42, thereby clamping the chip 8.
[0090] The first flipping member 43 is rotatably arranged on the bracket 1, specifically including a fixed base 431 and a movable rocker 432. The fixed base 431 is fixed to the bracket 1, and the movable rocker 432 is arranged on the fixed base 431 and can rotate relative to the fixed base 431.
[0091] As Figure 5As shown, both sides of the fixing member 41 are provided with slide grooves 414 for cooperating with the ends of the movable rocker 432. The fixing base 431 of the first flip member 43 is provided with a swinging groove 4311 for the movable rocker 432 to move. The swinging groove 4311 limits the range of movement of the movable rocker 432, so that when the movable rocker 432 is not in contact with the fixing member 41, one end of the movable rocker 432 is just located on the same horizontal plane as the slide groove 414 of the fixing member 41.
[0092] After the conveying mechanism 2 conveys the fixing member 41 to the position of the first flipping member 43, one end of the movable rocker 432 of the first flipping member 43 enters the slide groove 414 of the fixing member 41. Since the rotation center of the movable rocker 432 and the flipping center of the fixing member 41 are not on the same horizontal plane, there will be no jamming phenomenon. Therefore, the movable rocker 432 can provide thrust to the fixing member 41 through the slide groove of the fixing member 41, thereby realizing the flipping of the fixing member 41.
[0093] After the fixing member 41 is turned over, one end of the movable rocker 432 matched with the slide slot 414 leaves the slide slot and returns to the initial position. At this point, the turning of the chip 8 is completed.
[0094] The chip double-sided processing device provided by the present disclosure clamps the chip 8 inside the fixing member 41 by means of the elastic clamping member 42, and realizes the flipping of the chip 8 by means of the cooperation between the first flipping member 43 and the fixing member 41, and has a simple structure and reliable flipping performance.
[0095] In one embodiment of the present disclosure, the conveying mechanism 2 includes an annular conveyor belt 21 and a driving mechanism 22 for driving the annular conveyor belt 21 to rotate in a preset direction. The patch mechanism 3 processes the chip 8 on the upper surface of the annular conveyor belt 21. The first flipping mechanism 4 is configured to flip the chip 8 above the annular conveyor belt 21. Moreover, the chip double-sided processing device also includes an anti-drop mechanism 5, which is configured to prevent the fixing part 41 from falling from the annular conveyor belt 21 under its own weight during the circular movement of the annular conveyor belt 21.
[0096] In practical applications, the conveying mechanism 2 uses an endless conveyor belt 21 as a carrier, and the endless conveyor belt 21 is driven by the driving mechanism 22 so that the endless conveyor belt 21 moves in a preset direction. Figure 1 As shown in FIG. 1 , the chip placement mechanism 3 processes the chip 8 on the upper surface of the endless conveyor belt 21 .
[0097] At the same time, considering the stability of the fixing member 41 and the surface of the endless conveyor belt 21 , the first turning mechanism 4 turns the chip 8 over the endless conveyor belt 21 .
[0098] During the process that the fixing member 41 follows the endless conveyor belt 21 from the upper surface to the lower surface, especially in the arc section of the endless conveyor belt 21, due to the deformation of the contact surface between the endless conveyor belt 21 and the fixing member 41, it is easy that the fixing member 41 is not stably attached to the surface of the endless conveyor belt 21. At the same time, affected by its own weight, the fixing member 41 is likely to be separated from the endless conveyor belt 21.
[0099] Therefore, in the chip double-sided processing device provided by the present disclosure, a anti-falling mechanism 5 is provided in the middle section where the fixing member 41 follows the endless conveyor belt 21 from the upper surface to the lower surface. As Figure 6 shown, during the process that the fixing member 41 follows the endless conveyor belt 21 from the upper surface to the lower surface, the anti-falling mechanism 5 plays an auxiliary fixing role on the fixing member 41, so that the fixing member 41 still adheres to the lower surface after entering the lower surface of the endless conveyor belt 21.
[0100] It should be noted here that the above-mentioned "upper surface" and "lower surface" are described with reference to the installation surface of the chip double-sided processing device. The above-mentioned installation surface can be the ground, etc. In the present disclosure, the surface of the endless conveyor belt 21 close to the installation surface is used as the lower surface, and the surface of the endless conveyor belt 21 far from the installation surface is used as the upper surface.
[0101] By providing the anti-falling mechanism 5 in the transition section between the upper surface and the lower surface of the endless conveyor belt 21, the chip double-sided processing device provided by the present disclosure ensures that after the fixing member 41 follows the conveying mechanism 2 to reach the lower surface of the endless conveyor belt 21, the surface of the fixing member 41 still adheres to the lower surface of the endless conveyor belt 21 to complete the subsequent processing process.
[0102] In an embodiment of the present disclosure, the anti-falling mechanism 5 includes a first magnetic member 51 and a second magnetic member 52 that attract each other and a guiding member 53. The first magnetic member 51 is arranged on the endless conveyor belt 21, and the second magnetic member 52 is arranged on the fixing member 41; the guiding member 53 is arranged on the bracket 1 and has an arc-shaped guiding surface matching the end of the endless conveyor belt 21, and the guiding member 53 is configured such that when the fixing member 41 carries the chip 8 and is conveyed to the end of the endless conveyor belt 21, the fixing member 41 is guided by the arc-shaped guiding surface to move with the endless conveyor belt 21 and is magnetically attracted to the lower surface of the endless conveyor belt 21 again.
[0103] Specifically, as Figure 3 、 Figure 6 shown, the second magnetic members 52 are arranged on both the upper and lower surfaces of the fixing member 41, and a plurality of first magnetic members 51 are embedded in the endless conveyor belt 21 at intervals. It should be noted that only some of the first magnetic members 51 are shown in the figure, but in actual applications, the first magnetic members 51 should be evenly arranged throughout the entire circumference of the endless conveyor belt 21.
[0104] When the conveying mechanism 2 conveys the fixing member 41 on the upper surface and the lower surface of the endless conveyor belt 21, the second magnetic member 52 on the fixing member 41 adsorbs to the first magnetic member 51 on the endless conveyor belt 21. At the same time, the fixing member 41 is connected to the endless conveyor belt 21 through the connecting rotating shaft 45. That is, the fixing member 41 is fixed relative to the endless conveyor belt 21 through the cooperation of the second magnetic member 52 and the connecting rotating shaft 45.
[0105] During the process that the fixing member 41 moves from the upper surface to the lower surface along with the endless conveyor belt 21, the chip double-sided processing device assists in fixing the fixing member 41 by arranging the guiding member 53. Specifically, the guiding member 53 is fixed to the bracket 1, and the guiding member 53 is provided with an arc-shaped guiding surface matching the end of the endless conveyor belt 21. The fixing member 41 contacts the arc-shaped guiding surface and gently enters the lower surface along with the endless conveyor belt 21 along the arc-shaped guiding surface. After the second magnetic member 52 on the fixing member 41 stably adsorbs to the first magnetic member 51 on the endless conveyor belt 21, the guiding member 53 disengages from the fixing member 41.
[0106] The chip double-sided processing device provided by the present disclosure arranges the guiding member 53, so that during the process that the fixing member 41 moves from the upper surface of the endless conveyor belt 21 to the lower surface of the endless conveyor belt 21, the movement track of the fixing member 41 is guided, so that the fixing member 41 finally stably fits with the lower surface of the endless conveyor belt 21.
[0107] In an embodiment of the present disclosure, the guiding member 53 includes a substrate 531 fixedly connected to the bracket 1, and an arc-shaped guiding plate 532 extending outward from the substrate 531. The arc-shaped guiding surface is located inside the arc-shaped guiding plate 532. The guiding member 53 further includes a linear guiding plate 533 parallel to the lower surface of the endless conveyor belt 21;
[0108] The fixing member 41 is provided with rollers 412 and is configured to roll along the arc-shaped guiding surface when the endless conveyor belt 21 moves until it is guided by the linear guiding plate 533 until the fixing member 41 is magnetically attracted to the lower surface of the endless conveyor belt 21 again.
[0109] As Figure 7 shown, the substrate 531 is fixedly connected to the bracket 1, and an arc-shaped guiding plate 532 extending outward is connected to the substrate 531. The arc-shaped guiding surface inside the arc-shaped guiding plate 532 is used to guide the movement of the fixing member 41.
[0110] After the fixing member 41 finishes moving along the arc-shaped guiding surface, the fixing member reaches the linear guiding plate 533, and the linear guiding plate 533 conveys the fixing member 41 for a sufficient distance to ensure that the surface of the fixing member 41 stably fits with the lower surface of the endless conveyor belt 21.
[0111] See Figure 3, a roller 412 is provided on the side of the fixing member 41, and the roller 412 is connected to the fixing member 41 through a pin shaft 413. During the process that the guiding member 53 guides the movement of the fixing member 41, the roller 412 on the fixing member 41 contacts the arc-shaped guiding surface and moves along the arc-shaped guiding surface.
[0112] In the chip double-sided processing device provided by the present disclosure, the guiding member 53 transmits a supporting force to the fixing member 41 through the roller 412 to guide the movement of the fixing member 41.
[0113] In an embodiment of the present disclosure, the anti-drop mechanism 5 includes two guiding members 53 arranged at intervals, and the two are symmetrically arranged on the left and right sides of the fixing member 41 respectively, and the chip 8 extends out from the gap between the two guiding members 53.
[0114] As Figure 6 shown, a guiding member 53 is provided on each of the brackets 1 on both sides of the annular conveyor belt 21, so that the force on the fixing member 41 is more reasonable. At the same time, during the movement of the fixing member 41 together with the chip 8 from the upper surface to the lower surface of the annular conveyor belt 21, the chip 8 extends out from the gap between the two guiding members 53. That is, during the process that the guiding member 53 guides the movement of the fixing member 41, the chip 8 installed inside the fixing member 41 does not contact the guiding member 53, avoiding wear of the chip 8 caused by the contact between the guiding member 53 and the chip 8.
[0115] In an embodiment of the present disclosure, the chip double-sided processing device further includes a shipping mechanism 6, and the shipping mechanism 6 is configured to move the chip 8 after double-sided processing out of the fixing member 41.
[0116] As Figure 1 shown, the chip double-sided processing device further includes a shipping mechanism 6, and the shipping mechanism 6 is arranged below the first flipping mechanism 4, making full use of the idle space formed between the brackets 1 and improving the space utilization rate.
[0117] At the same time, the shipping mechanism 6 will push out the chip 8 that has been processed on both sides from the fixing member 41, so that the processed chip 8 falls onto the shipping conveyor belt 64 and is finally conveyed to a preset position.
[0118] The chip double-sided processing device provided by the present disclosure realizes the full-automatic processing of the chip 8 from processing to shipping through the setting of the shipping mechanism 6, without manual intervention, and improves the processing efficiency of the chip 8.
[0119] In an embodiment of the present disclosure, the shipping mechanism 6 includes: a shipping port 63, a stop component, and a goods-pushing component 61. Among them, as Figure 8 , Figure 9As shown, the delivery outlet 63 is provided on the fixing member 41; the stop assembly is provided on the fixing member 41 and is configured to open or block the delivery outlet 63; the chip pushing assembly 61 is configured to push the chip 8 out of the mounting groove 411 of the fixing member 41 after the delivery outlet 63 is opened.
[0120] As Figure 11 shown, the chip pushing assembly 61 is provided on the bracket 1. After the chip 8 is processed on both sides, the stop assembly opens the delivery outlet 63 provided on the fixing member 41. At this time, the chip pushing assembly 61 pushes the chip 8 provided inside the fixing member 41 out of the mounting groove 411 through the delivery outlet 63, and the chip 8 falls onto the delivery conveyor belt 64 and is finally conveyed to a preset position.
[0121] As Figure 10 shown, when one side of the chip 8 is processed, the stop assembly blocks the delivery outlet 63 provided on the fixing member 41. At this time, the chip pushing assembly 61 is pressed down by the stop assembly and cannot take out the chip 8 provided inside the fixing member 41 through the delivery outlet 63.
[0122] The chip double-sided processing device provided by the present disclosure enables the chip 8 to be taken out only after both sides are processed by setting the chip pushing assembly 61 to selectively open or close the delivery outlet 63 on the fixing member 41.
[0123] In an embodiment of the present disclosure, the driving assembly 621 includes a first rolling gear 6211 and a first rack 6212. Among them, the first rolling gear 6211 is fixedly connected to the semi-cylindrical rotating shaft 622; the first rack 6212 is fixedly provided on the bracket 1 and extends along the conveying direction of the conveying mechanism 2. The first rack 6212 is arranged on the downstream side of the first flipping member 43 and is configured to mesh with the rolling gear to drive the semi-cylindrical rotating shaft 622 to selectively open or block the delivery outlet 63.
[0124] As Figure 2 、 Figure 3 shown, the fixing member 41 is provided with a semi-cylindrical rotating shaft 622 and a first rolling gear 6211. The semi-cylindrical rotating shaft 622 is hinged to the fixing member 41. At the same time, the first rolling gear 6211 is fixed to the semi-cylindrical rotating shaft 622.
[0125] After one side of the chip 8 is processed, after the fixing member 41 and the chip 8 are turned over by the first flipping mechanism 4, the fixing member 41 together with the chip 8 moves to the position of the first rack 6212 along with the annular conveyor belt 21. At this time, the delivery outlet 63 on the fixing member 41 is in an open state.
[0126] As Figure 12As shown, the first rack 6212 fixed to the bracket 1 cooperates with the first rolling gear 6211 and drives the first rolling gear 6211 to rotate. The semi-cylindrical rotating shaft 622 fixed to the first rolling gear 6211 also rotates relative to the fixing member 41 along with the first rolling gear 6211.
[0127] After the first rolling gear 6211 passes the first rack 6212, the first rolling gear 6211 drives the semi-cylindrical rotating shaft 622 to block the delivery outlet 63 on the fixing member 41. At this time, the relative positional relationship between the semi-cylindrical rotating shaft 622 and the fixing member 41 is as Figure 8 shown. Then the fixing member 41 continues to move along with the conveying mechanism 2. When passing through the delivery mechanism 6, since the semi-cylindrical rotating shaft 622 has blocked the delivery outlet 63 on the fixing member 41, the pusher assembly 61 of the delivery mechanism 6 cannot push the chip 8 out of the fixing member 41.
[0128] As Figure 10 shown, under the action of the semi-cylindrical rotating shaft 622, the pusher assembly 61 is pressed down. Thus, the semi-cylindrical rotating shaft 622 together with the fixing member 41 and the chip 8 pass through the delivery mechanism 6.
[0129] Considering that the pusher assembly 61 contacts the semi-cylindrical rotating shaft 622 and generates a force on the semi-cylindrical rotating shaft 622, which may cause the semi-cylindrical rotating shaft 622 to drive the first rolling gear 6211 to rotate. Therefore, in another embodiment provided by the present disclosure, a ratchet device is arranged inside the first rolling gear 6211, so that the first rolling gear 6211 can only rotate in one direction and will not cause the semi-cylindrical rolling body to rotate back due to the pusher assembly 61.
[0130] After the chip 8 is sent into the pasting mechanism 3 by the conveying mechanism 2 again, at this time, both sides of the chip 8 are processed, and the delivery outlet 63 of the fixing member 41 is still in a blocked state.
[0131] The fixing member 41 together with the chip 8 comes to the position of the first rack 6212 again along with the annular conveyor belt 21. The first rolling gear 6211 drives the semi-cylindrical rotating shaft 622 to rotate by cooperating with the first rack 6212, and the delivery outlet 63 of the fixing member 41 is in an open state. At this time, the relative positional relationship between the semi-cylindrical rotating shaft 622 and the fixing member 41 is as Figure 9 shown.
[0132] Then when the fixing member 41 together with the chip 8 passes through the delivery mechanism 6, as Figure 11 shown, the pusher assembly 61 of the delivery mechanism 6 pushes the chip 8 out of the fixing member 41, and then the processed chip 8 is conveyed to a preset position by the delivery conveyor belt 64.
[0133] The chip double-sided processing device provided by the present disclosure cooperates the first rolling gear 6211 with the first rack 6212 fixed on the bracket 1 to drive the semi-cylindrical rotating shaft 622 to rotate relative to the fixing member 41, so that the shipping port 63 opened on the fixing member 41 is continuously switched between opening and blocking, enabling the chip 8 on one processed side to pass through the shipping mechanism 6, and the chip 8 with both sides processed is taken out by the shipping mechanism 6.
[0134] In an embodiment of the present disclosure, the chip double-sided processing device further includes a second flipping mechanism 7, and the second flipping mechanism 7 is configured to flip the fixing member 41 when the chip 8 is separated from the fixing member 41, so that the notch of the installation groove 411 of the fixing member 41 faces the same direction as the conveying direction.
[0135] Specifically, as Figure 13 shown, the chip double-sided processing device provided by the present disclosure is provided with a second flipping mechanism 7 upstream of the chip mounting mechanism 3 to flip the fixing member 41 without the chip 8 installed, so that after the fixing member 41 mounts and processes the chip 8 next time, it cooperates with the first flipping mechanism 4 to realize the flipping of the chip 8.
[0136] By setting the second flipping mechanism 7, the chip double-sided processing device provided by the present disclosure adjusts the position of the fixing member 41 without the chip 8 installed, so that the notch of the installation groove 411 of the fixing member 41 faces the same direction as the conveying direction, so that after the fixing member 41 mounts the chip 8 subsequently, it cooperates with the first flipping mechanism 4 to drive the chip 8 to turn over, thereby realizing the repeated cyclic processing of the chip 8 by the chip double-sided processing device.
[0137] In an embodiment of the present disclosure, the second flipping mechanism 7 includes a second rolling gear 71, a locking assembly, and a second rack 72. The second rolling gear 71 is rotatably arranged on the fixing member 41; the locking assembly is configured to lock the second rolling gear 71 and the fixing member 41 when the fixing member 41 does not install the chip 8, or unlock the second rolling gear 71 and the fixing member 41 when the fixing member 41 installs the chip 8; the second rack 72 is fixedly arranged on the bracket 1 and extends along the conveying direction of the conveying mechanism. The second rack 72 is arranged on the upstream side of the chip mounting mechanism 3 and is configured to mesh with the second rolling gear 71 in the locked state of the second rolling gear 71 and the fixing member 41 to drive the fixing member 41 to flip.
[0138] To simplify the structure, in the embodiment provided by the present disclosure, the elastic clamping member 42 is used as the locking assembly. Specifically, referring to Figure 3 , a side-end card slot 711 is provided at the side end of the second rolling gear 71. When the fixing member 41 installs the chip 8, as Figure 14As shown, since the elastic clamping member 42 is pushed into the interior of the installation groove 411 by the chip 8, the buckle portion 423 of the elastic clamping member 42 is separated from the side slot 711 of the second rolling gear 71 at this time, and the second rolling gear 71 can rotate relative to the fixing member 41 at this time.
[0139] After one side of the chip 8 is processed, the fixing member 41 together with the chip 8 passes through the position of the second rack 72 along with the annular conveyor belt 21. The second rack 72 cooperates with the second rolling gear 71, and the second rolling gear 71 rotates relative to the fixing member 41. At this time, the fixing member 41 will not be turned over.
[0140] When both sides of the chip 8 are processed, after the fixing member 41 passes through the shipping mechanism 6, the chip 8 is taken out of the fixing member 41 by the shipping mechanism 6, and the elastic clamping member 42 inside the fixing member 41 pops out under the action of the spring 44, as Figure 15 shown. At this time, the buckle portion 423 of the elastic clamping member 42 enters the side slot 711 of the second rolling gear 71, so that the second rolling gear 71 is fixed relative to the fixing member 41, that is, the second rolling gear 71 cannot rotate relative to the fixing member 41.
[0141] When the fixing member 41 without the chip 8 passes through the second rack 72 along with the annular conveyor belt 21, the second rolling gear 71 cooperates with the second rack 72. Since the second rack 72 is fixed relative to the bracket 1, under the pulling force of the annular conveyor belt 21, the second rolling gear 71 drives the fixing member 41 to flip, realizing the flipping of the fixing member 41, so that the notch of the installation groove 411 of the fixing member 41 faces the conveying direction.
[0142] It should be noted that although the contact portion 422 and the buckle portion 423 of the elastic clamping member 42 are an integral body, considering that the force-bearing surfaces of the contact portion 422 and the buckle portion 423 are different during the working process. Specifically, the force-bearing surface of the contact portion 422 is the surface in contact with the side surface of the chip 8, while the force-bearing surface of the buckle portion 423 is the contact surface with the side surface of the slot of the second rolling gear 71. Therefore, the forces borne by the contact portion 422 and the buckle portion 423 during the working process are not the same. Therefore, in actual use, the user needs to adjust the dimensions and materials of the contact portion 422 and the buckle portion 423 of the elastic clamping member 42 according to the actual situation.
[0143] In addition, the second rolling gear 71 provided in the present disclosure is only exemplary. In actual application, in order to facilitate the second rolling gear 71 to drive the fixing member 41 to flip, it is necessary to correspondingly adjust the dimensions of the second rolling gear 71 according to the size and weight of the chip 8, which will not be elaborated in the present disclosure.
[0144] In an embodiment of the present disclosure, as Figure 16As shown, the chip pushing component 61 includes a base 611, a first push plate 612, and a second push plate 613. Among them, the base 611 is fixed to the bracket 1; the first push plate 612 is configured to push the chip 8 in the fixing member 41 out of the installation groove 411; one end of the second push plate 613 is hinged to the first push plate 612, and the other end is hinged to the base 611, and torsion springs are provided between the first push plate 612 and the second push plate 613, and between the second push plate 613 and the base 611; and the first push plate 612 is parallel to the surface of the fixing member under the action of the torsion spring.
[0145] The base 611 of the chip pushing component 61 is fixedly connected to the bracket 1, and the second push plate 613 is arranged on the base 611 and can rotate relative to the base 611. The first push plate 612 is hinged to the second push plate 613, and torsion springs are provided between the first push plate 612 and the second push plate 613, and between the second push plate 613 and the base 611.
[0146] Under the action of the torsion spring, the first push plate 612 is in a horizontal state in its natural state. When the outlet 63 of the fixing member 41 is in a blocked state, when the fixing member 41 together with the chip 8 passes through the discharging mechanism 6, the semi-cylindrical rotating shaft 622 will first contact the first push plate 612. Under the action of the semi-cylindrical rotating shaft 622, the first push plate 612 and the second push plate 613 are pressed down, and the fixing member 41 together with the chip 8 passes through the discharging mechanism 6.
[0147] When the outlet 63 of the fixing member 41 is in an open state, when the fixing member 41 together with the chip 8 passes through the discharging mechanism 6, the first push plate 612 will pass through the outlet 63 of the fixing member 41 and push out the chip 8 inside the fixing member 41 to complete the picking process.
[0148] The chip double-sided processing device provided by the present disclosure has a two-stage chip pushing component 61, so that the first push plate 612 and the second push plate 613 can be pressed down after being acted on by the semi-cylindrical rotating shaft 622. The flexibility of the structure is improved, and the multi-stage setting can effectively avoid the jamming phenomenon caused by the problem of the force application angle, thereby preventing the device from malfunctioning.
[0149] To better understand the chip double-sided processing device of the present disclosure, an application scenario is introduced.
[0150] The user places the chip 8 to be processed into the installation groove 411 of the fixing member upstream of the chip mounting mechanism 3. Driven by the conveying mechanism 2, the fixing member 41 together with the chip 8 enters the chip mounting mechanism 3, and the chip mounting mechanism 3 processes the upper surface of the chip 8.
[0151] After the single-sided processing of the chip 8 is completed by the chip mounting mechanism 3, the conveying mechanism 2 conveys the fixing member 41 and the chip 8 to the position of the first flipping mechanism 4, and the fixing member 41 and the chip 8 are flipped. At this time, the outlet 63 on the fixing member 41 is in an open state.
[0152] Under the action of the anti-drop mechanism 5, the fixing member 41 and the chip 8 come to the lower surface of the endless conveyor belt 21, and the surface of the fixing member 41 is attached to the lower surface of the endless conveyor belt 21. Then, the fixing member 41 and the chip 8 pass by the first rack 6212. Under the action of the first rack 6212, the first rolling gear 6211 drives the semi-cylindrical rotating shaft 622 to rotate, and the outlet 63 on the fixing member 41 is converted to a blocked state.
[0153] After that, the fixing member 41 together with the chip 8 passes through the discharging mechanism 6. Since the outlet 63 is in a blocked state at this time, the first push plate 612 and the second push plate 613 of the discharging mechanism 6 are pressed down by the semi-cylindrical rotating shaft 622, and the fixing member 41 together with the chip 8 passes through the discharging mechanism 6.
[0154] Along with the endless conveyor belt 21, the fixing member 41 together with the chip 8 comes to the second rack 72. At this time, the buckle portion 423 of the elastic clamping member 42 is separated from the side slot 711 of the second rolling gear 71. The second rolling gear 71 can rotate relative to the fixing member 41, but the second rolling gear 71 and the first rolling gear 6211 do not affect each other. Therefore, after the fixing member 41 together with the chip 8 passes through the second rack 72, the state of the outlet 63 on the fixing member 41 does not change and remains in a blocked state.
[0155] The fixing member 41 together with the chip 8 enters the chip mounting mechanism 3 again. Different from the first time it enters the chip mounting mechanism 3, the chip 8 has been turned over this time, that is, the chip mounting mechanism 3 processes the other side of the chip 8. After the processing is completed, the fixing member 41 together with the chip 8 comes to the first flipping mechanism 4 again. However, since the notch of the mounting groove 411 of the fixing member 41 faces the opposite direction to the conveying direction of the endless conveyor belt 21 at this time, when the first flipping member 43 contacts the fixing member 41, it is lifted by the fixing member 41, and the fixing member 41 and the chip 8 pass through the first flipping mechanism 4. At this time, the state of the outlet 63 on the fixing member 41 still remains in a blocked state.
[0156] After that, the fixing member 41 together with the chip 8 passes by the first rack 6212. Under the action of the first rack 6212, the first rolling gear 6211 drives the semi-cylindrical rotating shaft 622 to rotate, and the state of the outlet 63 on the fixing member 41 is converted to an open state.
[0157] As the fixing member 41 and the chip 8 pass through the shipping mechanism 6, the first push plate 612 of the shipping mechanism 6 passes through the shipping port 63 of the fixing member 41, and pushes the chip 8 out of the mounting groove 411 of the fixing member. The pushed-out chip 8 falls onto the shipping conveyor belt 64 and is conveyed to a preset position.
[0158] As for the elastic clamping member 42 in the fixing member 41 that holds the chip 8, since the chip 8 is taken out, the elastic clamping member 42 pops out under the action of the spring 44, and the buckle portion 423 of the elastic clamping member 42 is inserted into the end slot of the second rolling gear 71. At this time, the second rolling gear 71 cannot rotate relative to the fixing member 41.
[0159] As the fixing member 41 is sent to the second rack 72 by the annular conveyor belt 21, under the action of the second rack 72, the second rolling gear 71 drives the fixing member 41 to flip together, so that the notch of the mounting groove 411 of the fixing member 41 faces the conveying direction of the annular conveyor belt 21.
[0160] Thus, the process of chip 8 processing ends.
[0161] The embodiments of the present disclosure have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to technologies in the market, or to enable other ordinary skill in the art in the technical field to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.
Claims
1. A chip double-sided processing device, characterized in that: The chip double-sided processing device comprises: Bracket (1); A conveying mechanism (2), the conveying mechanism (2) being arranged on the support (1) and configured to convey a chip (8); a chip mounting mechanism (3), the chip mounting mechanism (3) being fixed relative to the support (1) and being configured to process the surface of the chip (8) delivered by the conveying mechanism (2); A first flipping mechanism (4), wherein the first flipping mechanism (4) is configured to receive the chip (8) and flip the chip (8) over during the process of the chip (8) being transported by the transport mechanism (2).
2. The chip double-side processing device according to claim 1, characterized in that: The first turning mechanism (4) comprises: a fixing member (41), the fixing member (41) being rotatably arranged on the conveying mechanism (2), the fixing member (41) being provided with a mounting groove (411), the mounting groove (411) being configured to place the chip (8); an elastic clamping member (42), the elastic clamping member (42) being disposed on the fixing member (41) and configured to clamp the chip (8) located in the mounting groove (411); A first flipping member (43), the first flipping member (43) is rotatably arranged on the bracket (1), and is configured to push the fixing member (41) to carry the chip (8) to flip relative to the conveying mechanism (2) when the fixing member (41) reaches a preset position along with the conveying mechanism (2).
3. The chip double-side processing device according to claim 2, characterized in that: The conveying mechanism (2) comprises an endless conveyor belt (21) and a driving mechanism (22) for driving the endless conveyor belt (21) to rotate in a preset direction; the chip placement mechanism (3) processes the chip (8) on the upper surface of the endless conveyor belt (21); the first flipping mechanism (4) is configured to flip the chip (8) above the endless conveyor belt (21); and the chip double-sided processing device further comprises: An anti-drop mechanism (5) is configured to prevent the fixing member (41) from falling from the endless conveyor belt (21) under its own weight during the cyclic movement of the endless conveyor belt (21).
4. The chip double-side processing device according to claim 3, characterized in that: The anti-fall mechanism (5) comprises a first magnetic member (51) and a second magnetic member (52) which attract each other, the first magnetic member (51) being arranged on the endless conveyor belt (21), and the second magnetic member (52) being arranged on the fixing member (41); A guide member (53), wherein the guide member (53) is arranged on the bracket (1) and has an arc-shaped guide surface matching the end of the circular conveyor belt (21), and the guide member (53) is configured such that when the fixing member (41) carries the chip (8) and is conveyed to the end of the circular conveyor belt (21), the fixing member (41) is guided by the arc-shaped guide surface to move along with the circular conveyor belt (21) until it is magnetically attracted to the lower surface of the circular conveyor belt (21) again.
5. The chip double-side processing device according to claim 4, characterized in that: The guide member (53) comprises a base plate (531) fixedly connected to the bracket (1), and an arc-shaped guide plate (532) extending outward from the base plate (531), wherein the arc-shaped guide surface is located inside the arc-shaped guide plate (532), and the guide member (53) further comprises a straight guide plate (533) parallel to the lower surface of the endless conveyor belt (21); The fixing member (41) is provided with a roller (412) and is configured to roll along the arc-shaped guide surface as the endless conveyor belt (21) moves until it is guided by the linear guide plate (533) to the fixing member (41) and is magnetically attracted to the lower surface of the endless conveyor belt (21) again.
6. The chip double-side processing device according to claim 4, characterized in that: The anti-drop mechanism (5) comprises two guide members (53) arranged at an interval, and the two guide members (53) are symmetrically arranged on the left and right sides of the fixing member (41) and allow the chip (8) to extend from the gap between the two guide members (53).
7. The chip double-side processing device according to claim 2, characterized in that: The chip double-side processing device further comprises a shipping mechanism (6), wherein the shipping mechanism (6) is configured to remove the chip (8) after double-side processing from the fixing member (41).
8. The chip double-side processing device according to claim 7, characterized in that: The shipping mechanism (6) comprises: A delivery port (63), the delivery port (63) being arranged on the fixing member (41); a stopper assembly, the stopper assembly being arranged on the fixing member (41) and being configured to open or block the delivery port (63); A pushing component (61), the pushing component (61) being configured to push the chip (8) out of the mounting groove (411) of the fixing member (41) after the delivery port (63) is opened.
9. The chip double-side processing device according to claim 8, characterized in that: The stopper assembly comprises: A semi-cylindrical rotating shaft (622) is rotatably arranged on the fixing member (41) and is configured to rotate between an open position and a blocked position under the action of a driving assembly (621) to open or block the delivery port (63).
10. The chip double-side processing device according to claim 9, characterized in that: The driving component (621) comprises: A first rolling gear (6211), wherein the first rolling gear (6211) is fixedly connected to the semi-cylindrical rotating shaft (622); A first rack (6212), the first rack (6212) is fixedly arranged on the bracket (1) and extends along the conveying direction of the conveying mechanism (2), the first rack (6212) is arranged on the downstream side of the first flip member (43), and is configured to mesh with the first rolling gear (6211) to drive the semi-cylindrical rotating shaft (622) to selectively open or block the delivery port (63).
11. The chip double-side processing device according to claim 10, characterized in that: The chip double-sided processing device also includes: A second flipping mechanism (7), wherein the second flipping mechanism (7) is configured to flip the fixing member (41) after the chip (8) is detached from the fixing member (41), so that the orientation of the notch of the mounting slot (411) of the fixing member (41) is consistent with the conveying direction.
12. The chip double-side processing device according to claim 11, characterized in that: The second turning mechanism (7) comprises: a second rolling gear (71), the second rolling gear (71) being rotatably disposed on the fixing member (41); a locking assembly, the locking assembly being configured to lock the second rolling gear (71) and the fixing member (41) when the chip (8) is not installed on the fixing member (41), or to unlock the second rolling gear (71) and the fixing member (41) when the chip (8) is installed on the fixing member (41); A second rack (72), the second rack (72) is fixedly arranged on the bracket (1) and extends along the conveying direction of the conveying mechanism (2), the second rack (72) is arranged on the upstream side of the patch mechanism, and is configured to mesh with the second rolling gear (71) when the second rolling gear (71) and the fixing member (41) are in a locked state, so as to drive the fixing member (41) to flip.
13. The chip double-side processing device according to claim 10, characterized in that: The goods pushing component (61) comprises: A base (611), the base (611) being fixed to the bracket (1); a first push plate (612), the first push plate (612) being configured to push the chip (8) in the fixing member (41) out of the installation groove (411); a second push plate (613), one end of the second push plate (613) being hinged to the first push plate (612), and the other end of the second push plate (613) being hinged to the base (611), and a torsion spring is provided between the first push plate (612) and the second push plate (613), and between the second push plate (613) and the base (611); and The first push plate (612) is parallel to the surface of the fixing member under the action of the torsion spring.