Chip packaging assembly

Abstract

The utility model discloses a chip packaging assembly, which comprises a packaging plate, a packaging groove is arranged on the packaging plate, a chip is arranged in the packaging groove, a plurality of fixing assemblies used for fixing the chip are fixedly connected onto the packaging plate, and an auxiliary cooling assembly is fixedly connected onto the packaging plate. The auxiliary cooling assembly comprises a plurality of mounting holes formed in the packaging plate, the mounting holes are communicated with the packaging groove, heat conduction rods are fixedly inserted into the mounting holes, one end of each heat conduction rod is tightly attached to the chip, and a metal sheet is fixedly connected to the end, away from the chip, of each heat conduction rod; and the side wall of the upper side of the metal sheet is uniformly and fixedly connected with a plurality of cooling fins. According to the utility model, auxiliary heat dissipation and cooling can be carried out on the whole chip, the influence of the packaging assembly on the heat dissipation efficiency of the chip is effectively reduced, and the temperature of the packaged chip during operation is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging component. Background Art

[0002] A chip is a microelectronic component with miniaturized circuits. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as the wiring, are interconnected and fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a packaging component to form a micro-structure with the required circuit functions.

[0003] When the existing chip packaging components package the chip, they will cover and block some parts of the chip. Since a large amount of heat is generated during the operation of the chip, the heat of the parts covered and blocked by the packaging components cannot be dissipated quickly, resulting in the heat dissipation efficiency of the chip. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a chip packaging component to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] The utility model provides a chip packaging component, including a packaging board. An encapsulation groove is opened on the packaging board, and a chip is arranged in the encapsulation groove. A plurality of fixing components for fixing the chip are fixedly connected to the packaging board, and an auxiliary cooling component is fixedly connected to the packaging board;

[0007] The auxiliary cooling component includes a plurality of mounting holes opened on the packaging board. The plurality of mounting holes are all communicated with the encapsulation groove. A heat conduction rod is fixedly inserted in each of the plurality of mounting holes. One end of the heat conduction rod is in close contact with the chip. A metal sheet is fixedly connected to the end of the heat conduction rod far from the chip. A plurality of heat dissipation fins are evenly fixedly connected to the side wall on the upper side of the metal sheet. A heat collecting block is fixedly connected to the end of the heat dissipation fin far from the metal sheet. A heat conduction silicone grease is coated between the heat collecting block and the chip.

[0008] Further, the fixing component includes two connecting pieces fixedly connected to the packaging board by locking screws. The same U-shaped locking pressing plate is fixedly connected between the two connecting pieces. The U-shaped locking pressing plate is located at the corner of the chip. Screw holes are opened on both the packaging board and the connecting piece, and the locking screw is threadedly sleeved in the screw hole.

[0009] Further, triangular indicating grooves are opened on the side wall on the upper side of the packaging board and the side wall on the upper side of the chip.

[0010] Furthermore, a plurality of heat dissipation holes communicating with the encapsulation grooves are formed in the side walls on both the upper and lower sides of the encapsulation board.

[0011] Furthermore, a plurality of slot holes are formed in the metal sheet, and the plurality of slot holes are uniformly distributed on the metal sheet.

[0012] Furthermore, a plurality of serpentine heat dissipation members are fixedly connected to the side walls on the upper sides of the plurality of heat dissipation fins, and the serpentine heat dissipation members are made of the same material as the heat dissipation fins.

[0013] Furthermore, a triangular alignment groove is formed at the upper right corner of the encapsulation board.

[0014] Furthermore, the heat conduction rods, the metal sheet, the heat dissipation fins, and the heat collecting blocks are all made of copper.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] With the auxiliary cooling assembly provided in the present utility model, during encapsulation, the chip is placed in the encapsulation groove and fixed by four fixing components. When the chip is operating, the plurality of heat conduction rods provided can absorb the heat on the chip located in the encapsulation groove, and the plurality of heat conduction rods can transfer the absorbed heat to the metal sheet located outside the encapsulation board, so as to quickly transfer the heat on the chip located inside the encapsulation board for heat dissipation. The plurality of heat collecting blocks provided cooperate with the thermal conductive silicone grease to absorb the heat on the chip located outside the encapsulation board, and can transfer the heat to the plurality of heat dissipation fins for rapid heat dissipation, thereby being able to assist in heat dissipation and cooling of the overall chip, effectively reducing the influence of the encapsulation assembly on the heat dissipation efficiency of the chip, and effectively reducing the temperature of the chip during operation after encapsulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0018] Figure 2 is a top view of the present utility model;

[0019] Figure 3 is Figure 1 a schematic diagram of the structure of the auxiliary cooling assembly in

[0020] Figure 4 is Figure 1 a schematic diagram of the structure of the encapsulation board in

[0021] Figure 5 is Figure 1 a schematic diagram of the structure of the fixing component in

[0022] In the figure: 1, encapsulation board; 2, encapsulation slot; 3, chip; 4, fixing component; 5, mounting hole; 6, heat conduction rod; 7, metal sheet; 8, heat sink; 9, heat collecting block; 10, thermal conductive silicone grease; 11, locking screw; 12, connecting piece; 13, U-shaped locking pressing plate; 14, screw hole; 15, triangular indicating groove; 16, heat dissipation hole; 17, slot hole; 18, serpentine heat dissipation piece; 19, triangular alignment groove. Specific implementation manner

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figures 1-5 , the present invention provides a chip encapsulation component, including an encapsulation board 1, an encapsulation slot 2 is opened on the encapsulation board 1, a chip 3 is arranged in the encapsulation slot 2, and a plurality of fixing components 4 for fixing the chip 3 are fixedly connected to the encapsulation board 1, and an auxiliary cooling component is fixedly connected to the encapsulation board 1;

[0025] The auxiliary cooling component includes a plurality of mounting holes 5 opened on the encapsulation board 1, all the plurality of mounting holes 5 communicate with the encapsulation slot 2, a heat conduction rod 6 is fixedly inserted in each of the plurality of mounting holes 5, one end of the heat conduction rod 6 is in close contact with the chip 3, a metal sheet 7 is fixedly connected to the end of the heat conduction rod 6 away from the chip 3, a plurality of heat sinks 8 are uniformly fixedly connected to the side wall on the upper side of the metal sheet 7, a heat collecting block 9 is fixedly connected to the end of the heat sink 8 away from the metal sheet 7, and a thermal conductive silicone grease 10 is coated between the heat collecting block 9 and the chip 3.

[0026] In the above embodiment, during encapsulation, the chip 3 is placed in the encapsulation slot 2, and the chip 3 is fixed by four fixing components 4. When the chip 3 is running, the plurality of heat conduction rods 6 arranged can absorb the heat on the chip 3 located in the encapsulation slot 2, and the plurality of heat conduction rods 6 can transfer the absorbed heat to the metal sheet 7 located outside the encapsulation board 1, so that the heat on the chip 3 located inside the encapsulation board 1 can be quickly transferred out for heat dissipation. The plurality of heat collecting blocks 9 arranged cooperate with the thermal conductive silicone grease 10 to absorb the heat on the chip 3 located outside the encapsulation board 1, and can transfer the heat to the plurality of heat sinks 8 for quick heat dissipation, so that the overall chip 3 can be assisted in heat dissipation and temperature reduction, effectively reducing the influence of the encapsulation component on the heat dissipation efficiency of the chip 3, and effectively reducing the temperature of the chip 3 during operation after encapsulation.

[0027] The fixing component 4 includes two connecting pieces 12 fixedly connected to the encapsulation board 1 by locking screws 11. A same U-shaped locking pressing plate 13 is fixedly connected between the two connecting pieces 12. The U-shaped locking pressing plate 13 is located at the corner of the chip 3. Screw holes 14 are formed in both the encapsulation board 1 and the connecting piece 12. The locking screw 11 is threadedly sleeved in the screw hole 14. During use, the U-shaped locking pressing plate 13 is pressed against the corner of the chip 3, and the connecting piece 12 is fixed to the encapsulation board 1 by the locking screw 11, completing the firm fixation of the chip 3. The operation is simple and convenient.

[0028] Triangular indicating grooves 15 are formed in the side walls on the upper side of the encapsulation board 1 and the side walls on the upper side of the chip 3, which can improve the convenience of aligning the position during the encapsulation of the chip 3, and improve the encapsulation efficiency and accuracy.

[0029] A plurality of heat dissipation holes 16 communicating with the encapsulation groove 2 are formed in the side walls on the upper and lower sides of the encapsulation board 1, which can improve the heat dissipation efficiency of the encapsulation board 1.

[0030] A plurality of slot holes 17 are formed in the metal sheet 7, and the plurality of slot holes 17 are evenly distributed on the metal sheet 7. The provided slot holes 17 can improve the smoothness of the air flow near the metal sheet 7 and improve the heat dissipation efficiency of the metal sheet 7.

[0031] A plurality of serpentine heat dissipation members 18 are fixedly connected to the side walls on the upper sides of the plurality of heat dissipation fins 8. The serpentine heat dissipation members 18 are made of the same material as the heat dissipation fins 8. The provided serpentine heat dissipation members 18 can increase the heat dissipation area of the auxiliary cooling component, thereby improving the heat dissipation efficiency.

[0032] A triangular alignment groove 19 is formed at the upper right corner of the encapsulation board 1, which can facilitate the alignment of the position during the installation of the encapsulation board 1.

[0033] The heat conducting rods 6, the metal sheet 7, the heat dissipation fins 8, and the heat collecting blocks 9 are all made of copper, and copper has good heat conducting performance.

[0034] Working principle: During encapsulation, the chip 3 is placed in the encapsulation groove 2, and the chip 3 is fixed by four fixing components 4. When the chip 3 is running, the provided plurality of heat conducting rods 6 can absorb the heat on the chip 3 located in the encapsulation groove 2, and the plurality of heat conducting rods 6 can transfer the absorbed heat to the metal sheet 7 located outside the encapsulation board 1, thereby quickly transferring the heat on the chip 3 located inside the encapsulation board 1 for heat dissipation. The provided plurality of heat collecting blocks 9 and the thermal conductive silicone grease 10 cooperate with each other to absorb the heat on the chip 3 located outside the encapsulation board 1, and can transfer the heat to the plurality of heat dissipation fins 8 for rapid heat dissipation, thereby assisting in heat dissipation and temperature reduction of the overall chip 3, effectively reducing the influence of the encapsulation component on the heat dissipation efficiency of the chip 3, and effectively reducing the temperature of the chip 3 during operation after encapsulation.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging assembly, comprising a packaging board (1), characterized in that: The packaging plate (1) is provided with a packaging groove (2), a chip (3) is arranged in the packaging groove (2), a plurality of fixing components (4) for fixing the chip (3) are fixedly connected to the packaging plate (1), and an auxiliary cooling component is fixedly connected to the packaging plate (1); The auxiliary cooling component comprises a plurality of mounting holes (5) opened on the packaging plate (1), the plurality of mounting holes (5) are all connected to the packaging groove (2), a heat conducting rod (6) is fixedly inserted in the plurality of mounting holes (5), one end of the heat conducting rod (6) is tightly fitted with the chip (3), the end of the heat conducting rod (6) away from the chip (3) is fixedly connected to a metal sheet (7), the side wall on the upper side of the metal sheet (7) is evenly fixedly connected to a plurality of heat sinks (8), the end of the heat sink (8) away from the metal sheet (7) is fixedly connected to a heat collecting block (9), and a heat conducting silicone paste (10) is coated between the heat collecting block (9) and the chip (3).

2. A chip packaging assembly according to claim 1, characterized in that: The fixing assembly (4) comprises two connecting members (12) fixedly connected to the packaging board (1) by locking screws (11); a same U-shaped locking pressure plate (13) is fixedly connected between the two connecting members (12); the U-shaped locking pressure plate (13) is located at a corner of the chip (3); screw holes (14) are provided on the packaging board (1) and the connecting members (12); the locking screws (11) are threadedly sleeved in the screw holes (14).

3. A chip packaging assembly according to claim 2, characterized in that: The side wall on the upper side of the packaging plate (1) and the side wall on the upper side of the chip (3) are both provided with a triangular indicator groove (15).

4. A chip packaging assembly according to claim 3, characterized in that: The side walls on both the upper and lower sides of the packaging plate (1) are provided with a plurality of heat dissipation holes (16) which are connected to the packaging grooves (2).

5. A chip packaging assembly according to claim 4, characterized in that: The metal sheet (7) is provided with a plurality of slots (17), and the plurality of slots (17) are evenly distributed on the metal sheet (7).

6. A chip packaging assembly according to claim 5, characterized in that: A plurality of serpentine heat sinks (18) are fixedly connected to the side walls on the upper sides of the plurality of heat sinks (8), and the material of the serpentine heat sinks (18) is the same as that of the heat sinks (8).

7. The chip packaging assembly according to claim 6, characterized in that: A triangular alignment groove (19) is provided at the upper right corner of the packaging plate (1).

8. The chip packaging assembly according to claim 7, characterized in that: The heat conducting rod (6), the metal sheet (7), the heat sink (8) and the heat collecting block (9) are all made of copper.

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