Easy-to-clean SIP product

Abstract

The utility model provides an SIP product easy to clean. The SIP product easy to clean comprises a substrate and a functional device arranged on the substrate. The display panel is characterized in that a solder ball is connected between the functional device and the substrate, and the functional device is electrically connected with the substrate through the solder ball; and a groove is formed in the part, below the functional device, of the substrate. The SIP product easy to clean provided by the utility model can solve the problem that the solder balls in the existing SIP product easy to clean are not easy to clean.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic device packaging, and more specifically, to an easily cleanable SIP product. Background Art

[0002] In the production process of electronic devices, especially in the production process of SIP (system-in-package) products, it is necessary to use solder balls to connect functional devices to a substrate, that is: solder balls are provided at the bottom of the functional devices, and the electrical connection and fixed connection between the functional devices and the substrate are realized through the solder balls.

[0003] For some functional devices (usually small-sized devices), their packaging methods are as Figure 1 and Figure 2 shown. Based on the functional requirements of device 1’, the height of the solder balls 3’ at the bottom of this part of the devices is relatively high (the solder ball welding height is high). Therefore, the water washing space between the device and the substrate is relatively large, and the cleaning agent (liquid cleaning agent 5’) can easily enter the space between the device and the substrate, and wrap and clean the solder balls, washing off the flux 2’ on the surface of the solder balls to ensure the reliability of the packaged product.

[0004] For another part of functional devices (usually large-sized devices), their packaging methods are as Figure 3 and Figure 4 shown. Based on the functional requirements of the devices, the height of the solder balls at the bottom of this part of the devices is relatively low (the solder ball welding height is low). Therefore, the water washing space between the device and the substrate is relatively large, but the cleaning agent (liquid cleaning agent) is not easy to enter the space between the device and the substrate. Because it is impossible to wrap and clean all the solder balls between the device and the substrate, there is a problem that the flux on some of the solder balls between the device and the substrate cannot be cleaned thoroughly, which will further affect the plastic encapsulant filling (Mold process) and bring reliability risks to the product. And for such products, it is usually necessary to compress the height of the product as much as possible. To compress the height of the SIP product, ICs (functional devices) with lower welding heights are more preferred in the design. Therefore, this technical problem cannot be solved by increasing the height of the solder balls.

[0005] Based on the above technical problems, there is an urgent need for an easily cleanable SIP product that can improve the cleaning effect. Summary of the Utility Model

[0006] In view of the above problems, the purpose of the present utility model is to provide an easily cleanable SIP product to solve the problem that the solder balls in the existing easily cleanable SIP products are not easy to clean.

[0007] The easy-to-clean SIP product provided by the present utility model includes a substrate and functional devices disposed on the substrate; characterized in that, solder balls are connected between the functional devices and the substrate, and the functional devices are electrically connected to the substrate through the solder balls; and,

[0008] A groove is formed in the part of the substrate below the functional device.

[0009] In addition, a preferred structure is that the groove is on the side of the solder ball.

[0010] In addition, a preferred structure is that at least two solder balls are provided between the functional device and the substrate; and,

[0011] The groove is provided on at least one side of each solder ball.

[0012] In addition, a preferred structure is that the solder balls are distributed in a matrix between the functional device and the substrate; and,

[0013] The groove is provided between adjacent rows of the solder balls or between adjacent columns of the solder balls.

[0014] In addition, a preferred structure is that the groove is a counterbore formed on the surface of the substrate;

[0015] The upper edge of the counterbore is flush with the upper surface of the substrate.

[0016] In addition, a preferred structure is that the cross-section of the groove is a trapezoidal structure.

[0017] In addition, a preferred structure is that the lower surface of the groove is an arc structure.

[0018] In addition, a preferred structure is that a soldering flux is formed on the surface of the solder ball, and the cleaning agent is guided through the groove to the periphery of the solder ball to clean the soldering flux.

[0019] In addition, a preferred structure is that a housing covering the functional device is provided on the substrate.

[0020] In addition, a preferred structure is that the substrate is a PCB board.

[0021] Compared with the prior art, the above-mentioned easy-to-clean SIP product according to the present utility model has the following beneficial effects:

[0022] The easy-to-clean SIP product provided by the present utility model can divert the cleaning agent when cleaning the product with the cleaning agent by providing a groove on one side of the solder balls between the functional device and the substrate, and divert the cleaning agent to the vicinity of the solder balls (especially for the solder balls with relatively low height), ensuring that the positions with flux on the solder balls can be cleaned; it can improve the water washing effect and eliminate the risk of flux residue on the premise of further reducing the height dimension of the product. Description of the Drawings

[0023] By referring to the following description in conjunction with the drawings and the content of the claims, and with a more comprehensive understanding of the present utility model, other objects and results of the present utility model will become more apparent and easier to understand.

[0024] In the drawings:

[0025] Figure 1 is a side sectional view of an existing product with relatively high solder balls;

[0026] Figure 2 is a top view of an existing product with relatively high solder balls;

[0027] Figure 3 is a side sectional view of an existing product with relatively low solder balls;

[0028] Figure 4 is a top view of an existing product with relatively low solder balls;

[0029] Figure 5 is a side sectional view of the easy-to-clean SIP product provided by the present utility model;

[0030] Figure 6 is a top view of the easy-to-clean SIP product provided by the present utility model;

[0031] Figure 7 is Figure 6 a magnified side sectional view of the position indicated by the dashed circle in

[0032] Reference numerals: device 1', flux 2', solder ball 3', substrate 4', liquid cleaning agent 5', functional chip 1, solder ball 2, PCB board 4, groove 5, cleaning agent 6.

[0033] In all the drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Embodiments

[0034] In the following description, for purposes of illustration, in order to provide a thorough understanding of one or more embodiments, numerous specific details are set forth. However, it is apparent that these embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0035] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model; the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance; in addition, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0036] Figure 5 The side view sectional structure of the easy-to-clean SIP product provided by the present utility model is shown. Figure 6 The top view structure of the easy-to-clean SIP product provided by the present utility model is shown. Figure 7 Shown is Figure 6 The enlarged side view sectional structure of the position indicated by the dashed circle in

[0037] Combined with Figures 5 to 7 As commonly shown, the easy-to-clean SIP product provided by the embodiment of the present utility model includes a substrate as a carrier for carrying the functional device 1 and the functional device 1 disposed on the substrate. To reduce the height of the entire product and improve its integration, a solder ball 2 with a lower height is connected between the functional device 1 and the substrate. The functional device 1 is fixed on the substrate through the solder ball 2 with a lower height, and moreover, the functional device 1 can also achieve electrical connection with the substrate through the solder ball 2; and, to achieve the cleaning of the flux around the solder ball 2, a groove 5 is opened on the part of the substrate below the functional device 1 on one side of the solder ball 2. During the actual cleaning process, the cleaning agent 6 can flow through the groove 5 to the vicinity of the solder ball 2 to ensure that the positions on the solder ball 2 where there is flux can be cleaned.

[0038] It should be noted that, in order to further improve the integration of the entire product, the substrate can adopt a PCB board 4 printed with internal circuits (the full English name is Printed Circuit Board, and the Chinese name is printed circuit board, which is a support for electronic components).

[0039] In a specific embodiment of the present invention, in order to improve the connection stability of the functional device 1, a plurality (at least two) of solder balls 2 are provided between the functional device 1 and the substrate, and the connection stability of the functional device 1 is improved by connecting the substrate and the functional device 1 through the plurality of solder balls 2; and, in order to ensure that each solder ball 2 can be cleaned, at least one side of each solder ball 2 needs to be provided with a groove 5, and the cleaning agent 6 is guided to the vicinity of each solder ball 2 through the groove 5 to ensure that the positions with flux on each solder ball 2 can be cleaned.

[0040] Furthermore, as Figure 6 shown, usually, the solder balls 2 are arranged in a matrix between the functional device 1 and the substrate. Arranging the solder balls 2 in a matrix can not only improve the connection stability of the functional device 1, but also facilitate the setting of the groove 5. During the setting process of the groove 5, a groove 5 can be provided between two adjacent rows of solder balls 2 or between two adjacent columns of solder balls 2, so that the cleaning agent 6 can be introduced to the vicinity of each solder ball 2.

[0041] For the design of the groove 5, the groove 5 is usually designed as a sunk groove opened on the surface of the substrate, that is, the upper edge of the sunk groove is flush with the upper surface of the substrate; and, in order to improve the fluidity of the cleaning agent 6 in the groove 5, the vertical cross-section of the groove 5 can be set as a trapezoidal structure with a larger upper part and a smaller lower part. The groove 5 with this structure can effectively improve the fluidity of the cleaning agent 6; in addition, in order to avoid the adhesion of the cleaning agent 6 to the bottom of the groove 5, the lower surface of the groove 5 can be set as an arc structure, and the bottom surface of the groove 5 with the arc structure can effectively reduce the friction coefficient of the bottom surface of the groove 5 and avoid the adhesion of the cleaning agent 6 to the bottom of the groove 5.

[0042] In addition, in order to protect the functional device 1 inside the product, a housing covering the functional device 1 can be provided on the substrate, and the housing is used to prevent external objects from touching the functional device 1 and improve the protection performance of the functional device 1.

[0043] It can be seen from the above specific embodiments that the easy-to-clean SIP product provided by the present invention can guide the cleaning agent 6 during the cleaning of the product with the cleaning agent 6 by providing a groove 5 on one side of the solder ball 2 with a relatively low height between the functional device 1 and the substrate, guide the cleaning agent 6 to the vicinity of the solder ball, and ensure that the positions with flux on the solder ball 2 can be cleaned; can compress the overall product in height to achieve the goal of product miniaturization; and can improve the water washing effect and eliminate the risk of flux residue on the premise of reducing the height dimension of the product.

[0044] As described above with reference to Figures 5 to 7 The easy-to-clean SIP product according to the present utility model has been described by way of example. However, those skilled in the art should understand that various improvements can be made to the above-mentioned easy-to-clean SIP product proposed by the present utility model without departing from the content of the present utility model. Therefore, the protection scope of the present utility model should be determined by the content of the appended claims.

Claims

1. An easy-to-clean SIP product, comprising a substrate and a functional device arranged on the substrate; characterized in that: A solder ball is connected between the functional device and the substrate, and the functional device is electrically connected to the substrate through the solder ball; and, A groove is formed on a portion of the substrate below the functional device.

2. The easy-to-clean SIP product according to claim 1, characterized in that: The groove is located on the side of the solder ball.

3. The easy-to-clean SIP product according to claim 1, characterized in that: At least two solder balls are arranged between the functional device and the substrate; and At least one side of each solder ball is provided with the groove.

4. The easy-to-clean SIP product according to claim 2, characterized in that: The solder balls are distributed in a matrix between the functional device and the substrate; and The grooves are arranged between two adjacent rows of solder balls or between two adjacent columns of solder balls.

5. The easy-to-clean SIP product according to claim 2, characterized in that: The groove is a sink groove opened on the surface of the substrate; The upper edge of the sink is flush with the upper surface of the substrate.

6. The easy-to-clean SIP product according to claim 5, characterized in that: The cross section of the groove is a trapezoidal structure.

7. The easy-to-clean SIP product according to claim 5, characterized in that: The lower surface of the groove is an arc-shaped structure.

8. The easy-to-clean SIP product according to claim 5, characterized in that: A soldering flux is formed on the surface of the solder ball, and a cleaning agent is guided to the periphery of the solder ball through the groove to clean the soldering flux.

9. The easy-to-clean SIP product according to claim 1, characterized in that: A housing covering the functional device is arranged on the substrate.

10. The easy-to-clean SIP product according to claim 1, characterized in that: The substrate is a PCB board.

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