Packaging method and packaging equipment for integrated circuit board

Abstract

The invention provides a packaging method and packaging equipment of an integrated circuit board, and the packaging method comprises the steps: obtaining a circuit board, and carrying out the surface mounting of a ball mounting surface of the circuit board, so as to enable an electronic element to be welded on the ball mounting surface; carrying out surface mounting treatment on the functional surface of the circuit board so as to weld an electronic element on the functional surface; carrying out laser ball mounting treatment on the bonding pad of the ball mounting surface of the circuit board so as to implant solder balls on the welding spots; and detecting the circuit board so as to detect whether the quality of the circuit board reaches the standard or not. According to the packaging method and packaging equipment for the integrated circuit board, the structural stability of the solder balls can be guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of packaging, and particularly to a packaging method and a packaging device for an integrated circuit board. Background Art

[0002] The System in Package (SiP) manufacturing process refers to integrating multiple integrated circuits or components in one package, which can better achieve higher integration and functional complexity. In the current SiP manufacturing process of circuit boards, the Ball Grid Array (BGA) assembly is usually carried out by using the Surface Mount Technology (SMT).

[0003] For the current packaging process, the process is to paste components on the ball-planting surface first and then plant balls on the ball-planting surface. After the ball planting is completed, the solder balls will go through two reflow soldering processes, resulting in the solder joints becoming brittle and easy to crack in the subsequent SMT process, affecting the product reliability. Therefore, there is room for improvement. Summary of the Invention

[0004] The purpose of the present invention is to provide a packaging method and a packaging device for an integrated circuit board to ensure the structural stability of the solder balls.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention provides a packaging method for an integrated circuit board, including:

[0007] Obtain a circuit board, and perform a pasting process on the ball-planting surface of the circuit board to solder electronic components on the ball-planting surface;

[0008] Perform a pasting process on the functional surface of the circuit board to solder electronic components on the functional surface;

[0009] Perform a laser ball-planting process on the pads of the ball-planting surface of the circuit board to implant solder balls on the solder joints;

[0010] Detect the circuit board to detect whether the quality of the circuit board meets the standard.

[0011] In an embodiment of the present invention, the step of obtaining a circuit board and performing a pasting process on the ball-planting surface of the circuit board to solder electronic components on the ball-planting surface includes:

[0012] Obtain a circuit board, and print solder paste on the ball-planting surface of the circuit board;

[0013] Perform a pasting process on the ball-planting surface to attach electronic components to the ball-planting surface;

[0014] Perform reflow soldering on the ball-array surface to complete the soldering of electronic components;

[0015] Inspect the ball-array surface to check whether the quality of the solder joints meets the standard.

[0016] In an embodiment of the present invention, the step of performing chip mounting on the functional surface of the circuit board to solder electronic components on the functional surface includes:

[0017] Turn over the circuit board to print solder paste on its functional surface;

[0018] Perform chip mounting on the functional surface to attach electronic components to the functional surface;

[0019] Perform reflow soldering on the functional surface to complete the soldering of electronic components;

[0020] Inspect the functional surface to check whether the quality of the solder joints meets the standard.

[0021] In an embodiment of the present invention, the step of performing laser ball implantation on the pads of the ball-array surface of the circuit board to implant solder balls on the solder joints includes:

[0022] Perform preheating on the circuit board to make its temperature data reach a preset temperature range;

[0023] Adjust the intensity data of the laser energy according to the current temperature data of the circuit board;

[0024] Obtain the dotting distance between the laser unit and the solder joints of the circuit board according to the warpage of each solder joint on the ball-array surface;

[0025] Complete laser ball implantation according to the dotting distance of each solder joint.

[0026] In an embodiment of the present invention, the preset temperature range is expressed as 90°C to 150°C.

[0027] In an embodiment of the present invention, the step of inspecting the circuit board to detect whether the quality of the circuit board meets the standard includes:

[0028] Extract the characteristic data of each solder ball according to the surface image data of the circuit board;

[0029] Compare the characteristic data of each solder ball with preset standard conditions to screen out the solder balls that do not meet the standard conditions, which are expressed as defective solder balls, and perform ball implantation on the defective solder balls again;

[0030] Perform laser scanning on the surface of the circuit board to obtain the height data of each solder ball;

[0031] According to the height data of each solder ball, obtain the overall coplanarity data of the circuit board and the coplanarity data of each solder ball;

[0032] Judge whether the overall coplanarity data is within the preset standard coplanarity data range;

[0033] If the overall coplanarity data is within the standard coplanarity data range, it means that the circuit board meets the requirements;

[0034] If the overall coplanarity data is not within the standard coplanarity data range, screen out the solder balls that do not meet the requirements, denoted as problem solder balls, and re-perform the ball mounting process on the problem solder balls.

[0035] In an embodiment of the present invention, in the step of comparing the characteristic data of each solder ball with the preset standard conditions, each data in the characteristic data is sequentially compared with each data range in the standard conditions, where the characteristic data includes shape data, size data, position data, and the spacing data between two adjacent solder balls, and the standard conditions include a standard shape range, a standard size range, a standard position range, and a standard spacing range between two adjacent solder balls.

[0036] In an embodiment of the present invention, the step of screening out the solder balls that do not meet the requirements, denoted as problem solder balls, and re-performing the ball mounting process on the problem solder balls when the overall coplanarity data is not within the standard coplanarity data range includes:

[0037] Judge whether the coplanarity data of each solder ball is within the standard coplanarity data range;

[0038] If the coplanarity data of a certain solder ball is not within the standard coplanarity data range, it means that the solder ball is a problem solder ball, and record the error information of the problem solder ball;

[0039] If the coplanarity data of a certain solder ball is within the standard coplanarity data range, it means that the solder ball meets the requirements;

[0040] Obtain the problem solder balls, display them, and re-perform the ball mounting process on the problem solder balls.

[0041] In an embodiment of the present invention, in the step of recording the error information of the problem solder balls, it further includes: real-time displaying the detection results of the problem solder balls and displaying the fluctuation trend of the coplanarity data of the solder balls.

[0042] The present invention also provides a packaging device for an integrated circuit board, including:

[0043] A chip module is used to perform chip mounting on the ball grid array surface of a circuit board to solder electronic components on the ball grid array surface, and the chip module is also used to perform chip mounting on the functional surface of the circuit board to solder electronic components on the functional surface; and

[0044] A ball grid array module is used to perform laser ball grid array processing on the pads of the ball grid array surface of the circuit board to implant solder balls on the solder joints, and the ball grid array module is also used to detect the circuit board to detect whether the quality of the circuit board meets the standard.

[0045] As described above, the present invention provides a packaging method and a packaging device for an integrated circuit board. By first performing SMT chip mounting and reflow soldering, and then performing room-temperature ball grid array formation, the solder balls are thus prevented from undergoing multiple reflow soldering processes. Since the IMC layer formed by room-temperature ball grid array formation is relatively thin, the risk of solder joint brittle fracture caused by IMC embrittlement during the reflow soldering process in subsequent applications can be reduced. At the same time, since a more ductile thin IMC layer has already been formed by room-temperature ball grid array formation, the solder balls can still maintain good mechanical strength and stable connection performance when undergoing reflow soldering. Separating the SMT chip mounting process from the ball grid array formation process can reduce interference between processes and improve the efficiency and connection quality of the entire packaging manufacturing.

[0046] Of course, any product implementing the present invention does not necessarily need to achieve all of the above advantages simultaneously. Description of the Drawings

[0047] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0048] Figure 1 It is a flowchart of a packaging method for an integrated circuit board in an embodiment of the present invention;

[0049] Figure 2 For Figure 1 It is a flowchart of step S10 in

[0050] Figure 3 For Figure 1 It is a flowchart of step S20 in

[0051] Figure 4 It is a flowchart of a laser ball grid array method for an integrated circuit board in an embodiment of the present invention;

[0052] Figure 5 For Figure 4 It is a flowchart of step S32 in

[0053] Figure 6 ForFigure 4 Another flowchart of step S32 in

[0054] Figure 7 For Figure 4 The flowchart of step S33 in

[0055] Figure 8 The flowchart of the solder ball detection method for an integrated circuit board in an embodiment of the present invention

[0056] Figure 9 For Figure 8 The flowchart of step S41 in

[0057] Figure 10 For Figure 8 The flowchart of step S42 in

[0058] Figure 11 For Figure 8 The flowchart of step S47 in Detailed implementation manners

[0059] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0060] Please refer to Figure 1 , the present invention provides a packaging method for an integrated circuit board, which can be applied to the SiP manufacturing process of an integrated circuit board (Printed Circuit Board, PCB) to complete laser ball implantation on the PCB board. The packaging method may include the following steps:

[0061] Step S10: Obtain a circuit board, perform a chip mounting process on the ball-implanting surface of the circuit board to solder electronic components on the ball-implanting surface;

[0062] Step S20: Perform a chip mounting process on the functional surface of the circuit board to solder electronic components on the functional surface;

[0063] Step S30: Perform laser ball implantation on the pads of the ball-implanting surface of the circuit board to implant solder balls on the solder joints;

[0064] Step S40: Detect the circuit board to detect whether the quality of the circuit board meets the standard.

[0065] Please refer to Figure 2 , in an embodiment of the present invention, when step S10 is executed, specifically, step S10 may include the following steps:

[0066] Step S11: Obtain a circuit board and print solder paste on the ball grid array (BGA) surface of the circuit board.

[0067] Step S12: Perform chip placement on the BGA surface of the circuit board to attach electronic components to the BGA surface.

[0068] Step S13: Perform reflow soldering on the BGA surface of the circuit board to complete the soldering of the electronic components.

[0069] Step S14: Inspect the BGA surface of the circuit board to check whether the quality of the solder joints meets the standard.

[0070] In an embodiment of the present invention, when performing Step S11, specifically, before printing solder paste on the BGA surface of the circuit board, it is necessary to ensure that the solder paste printing module has completed initialization, and the solder paste should be at an applicable temperature and evenly mixed to ensure its viscosity is suitable for printing. At the same time, a matching stencil template needs to be prepared, and there are openings on the stencil template corresponding to the solder pads of the circuit board.

[0071] After that, the circuit board can be fixed on the platform of the solder paste printing module. The platform can be provided with positioning pins or other jigs to ensure that the holes on the stencil template are precisely aligned with the solder pads of the circuit board. For example, through an automated optical inspection (AOI) module, the position can be automatically corrected by using the images captured by the imaging unit and the positioning marks on the circuit board.

[0072] After aligning the circuit board, an appropriate amount of solder paste can be placed at one end of the stencil template, and a squeegee or a rubber blade can be used for scraping. During scraping, the squeegee will squeeze the solder paste into the holes of the stencil template at a constant angle and pressure, and transfer it to the solder pads of the circuit board through the holes. Among them, the pressure applied by the squeegee must be uniform to ensure that the solder paste can evenly enter the holes of the template and be transferred to the solder pads of the circuit board. The solder paste printing module can measure and adjust the pressure of the squeegee through a sensor. After completing the solder paste printing, since the separation speed between the stencil template and the circuit board also has a great impact on the printing quality, the stencil template needs to be carefully separated to ensure that the solder paste remains on the solder pads of the circuit board. In this embodiment, the stencil template can be separated from the circuit board by the solder paste printing module in a way of lifting vertically or lifting the front end first and then the rear end.

[0073] In an embodiment of the present invention, when step S12 is executed, specifically, Surface-Mount Technology (SMT) can be used to assemble electronic components on a circuit board. The electronic components can be precisely placed on the pads of the circuit board where solder paste has been printed. Before chip mounting, the printed solder paste can be verified to ensure that its shape, volume, and position meet the requirements. For example, the solder paste can be verified through the AOI module. If the shape, volume, and position of the printed solder paste meet the requirements, the next process can be carried out. If any one of the shape, volume, and position of the printed solder paste does not meet the requirements, the circuit board can be marked for subsequent reprinting.

[0074] In this embodiment, a chip mounting module can be used for chip mounting. The chip mounting module can be loaded with various electronic components to be mounted, including but not limited to chips, resistors, capacitors, and integrated circuits, etc. These electronic components can be stored in a feeder module, and the feeder module can provide electronic components to the chip mounting module for assembly according to the program.

[0075] Specifically, before chip mounting through the chip mounting module, the chip mounting module needs to be programmed to set the position, placement angle, and other required parameters of each electronic component. At the same time, the pick-and-place head on the chip mounting module is calibrated to ensure that it can accurately pick up electronic components from the feeder and correctly place them on the pads of the circuit board. Among them, the pick-and-place head of the chip mounting module can automatically pick up electronic components from the feeder module according to the pre-programmed path and coordinates and accurately place them on the designated pads printed with solder paste. The chip mounting module can use a vacuum suction pen to capture and release electronic components.

[0076] After the electronic component is placed on the solder paste, the pick-and-place head needs to adjust the pressure between the electronic component and the pad. The pressure between the two should be appropriate to ensure good contact and not scatter the solder paste. After the placement of the electronic component is completed, the AOI module can be used to verify the position of the electronic component to ensure that its position meets the requirements. For example, when verifying the position of the electronic component through the AOI module, if the positions of the electronic components after chip mounting meet the requirements, the next process can be carried out. If the position of a certain electronic component does not meet the requirements, the electronic component can be marked for subsequent fine-tuning to ensure that its position meets the requirements.

[0077] In an embodiment of the present invention, when step S13 is executed, specifically, reflow soldering refers to the process of firmly soldering electronic components to a circuit board in the packaging process. In reflow soldering, the solder paste printed on the circuit board is heated to a molten state and then cooled to form solid solder joints. When performing the reflow soldering process, the circuit board after chip mounting can be transferred to the reflow soldering module.

[0078] First, the reflow soldering module can preheat the circuit board. During the preheating stage, it can raise the temperature of the circuit board to a certain temperature range, such as 150°C to 180°C. By preheating the circuit board, the flux in the solder paste can be effectively activated, the solvent in it can be removed, and the thermal shock to the electronic components and the circuit board can be prevented.

[0079] After that, the reflow soldering module can control the temperature of the circuit board to be in the constant temperature stage. During the constant temperature stage, the temperature on the circuit board is homogenized, so that all parts of the circuit board reach the same temperature as in the preheating stage, further removing any residual solvent in the flux and the solder paste, and ensuring that the solder paste has a uniform wetting performance.

[0080] Furthermore, the reflow soldering module can control the circuit board to be in the high temperature stage. During the high temperature stage, the temperature in the reflow zone can be controlled to rise above the melting point of the solder paste. At this time, the solder paste melts, and the ends of the electronic components form a physical connection with the pads on the circuit board. The temperature data in the high temperature stage can be between 217°C and 250°C. The specific value of the temperature data in the high temperature stage can depend on the type of solder paste and the requirements of the welding components, which are not limited here. Among them, the temperature data needs to be controlled at an accurate peak for a period of time to ensure good soldering.

[0081] Finally, the reflow soldering module can control the circuit board to be in the cooling stage. During the cooling stage, the solder joints are quickly cooled below room temperature to avoid poor solder joint formation. During the cooling stage, an appropriate cooling rate plays an important role in the strength and quality of the solder joints. In this embodiment, by precisely controlling the temperature conditions in each stage, the soldering work of the electronic components on the circuit board can be completed efficiently and stably.

[0082] In an embodiment of the present invention, when step S14 is executed, specifically, the AOI module refers to a device that automatically checks the soldering quality of the circuit board using a visual method according to a preset standard. When using the AOI module to detect the ball grid array surface of the circuit board after reflow soldering to check whether the solder joint quality meets the standard, the parameters of the AOI module can be configured first to set appropriate lighting conditions, camera parameters, etc. At the same time, a test software can be preset, and the position of the electronic components to be inspected, the type of electronic components, and the type of defects can be set in the test software.

[0083] When detecting the ball grid array surface of a circuit board, first, the circuit board can be transported to the AOI module, and the position can be automatically corrected by using the images captured by the imaging unit in the AOI module and the positioning marks on the circuit board. After completing the position calibration of the circuit board, the imaging unit of the AOI module can capture images of the solder joints, electronic components, and other key areas on the circuit board from different angles. Images from different angles are beneficial to improving the accuracy of inspection, especially for those solder joints that are difficult to observe.

[0084] In this embodiment, the captured images can be transmitted to the test software, and the test software can use algorithms to inspect each solder joint and electronic component to determine whether the solder joints meet the preset standards by comparing features such as the shape, size, position, and brightness of the solder joints. For example, the test software may identify defects such as open solder joints, short circuits, offsets, insufficient soldering, polarity errors, missing components, and component errors in a certain solder joint. When a defect is detected, the AOI module can record the defect and display the position of the defect point and the corresponding defect type on the display module, and then feedback it to the staff to adjust the process and modify the equipment parameters for re-inspection and repair. The AOI module can collect test data for subsequent quality control and statistical analysis, which helps to continuously improve the production process.

[0085] Please refer to Figure 3 , in an embodiment of the present invention, when step S20 is executed, specifically, step S20 may include the following steps:

[0086] Step S21: Turn over the circuit board to print solder paste on its functional surface;

[0087] Step S22: Perform a surface mounting process on the functional surface of the circuit board to attach electronic components to the functional surface;

[0088] Step S23: Perform a reflow soldering process on the functional surface of the circuit board to complete the soldering of the electronic components;

[0089] Step S24: Inspect the functional surface of the circuit board to check whether the quality of the solder joints meets the standard.

[0090] In an embodiment of the present invention, since the chip mounting on the ball grid array surface of the circuit board is completed in the above step S10, then, the circuit board can be turned over to re-perform the chip mounting process on the functional surface of the circuit board. When performing the chip mounting process on the functional surface of the circuit board, the processing process is the same as the above chip mounting process on the ball grid array surface, and will not be elaborated here.

[0091] Please refer to Figure 4, in an embodiment of the present invention, when step S30 is executed, after the chip surface and the functional surface of the circuit board are pasted, ball planting can be performed on the ball planting surface. In this embodiment, laser ball planting on the ball planting surface can be completed by using a laser ball planting method. The laser ball planting method may include the following steps:

[0092] Step S31, preheat the circuit board to make its temperature data reach a preset temperature range;

[0093] Step S32, adjust the intensity data of the laser energy according to the current temperature data of the circuit board;

[0094] Step S33, obtain the dotting distance between the laser unit and the solder joints of the circuit board according to the warpage of each solder joint on the ball planting surface;

[0095] Step S34, complete laser ball planting according to the dotting distance of each solder joint.

[0096] In an embodiment of the present invention, when step S31 is executed, after the chip surface and the functional surface of the circuit board complete the pasting process, the circuit board can be transferred to a ball grid array (BGA) module to complete the ball planting process.

[0097] Specifically, before ball planting the circuit board, the circuit board can be preheated to a preset temperature range. Preheating the circuit board can ensure the smooth progress of the ball planting process and the soldering process, and improve the soldering quality. By preheating the circuit board, it can effectively prevent a large temperature gradient from occurring between the circuit board and electronic components due to sudden heating during the subsequent soldering process, resulting in warping or even cracking of the circuit board or electronic components. At the same time, preheating can effectively improve the wettability of the solder joints, thereby ensuring that the solder joints better adhere to the solder balls and can better fuse with the pads during the subsequent soldering stage. And preheating can effectively reduce the moisture in the circuit board and solder paste, preventing the moisture from being rapidly heated during the soldering process, forming virtual soldering or voids inside the solder joints. Furthermore, preheating can reduce thermal stress, avoid damage or warping of the circuit board caused by rapid temperature changes, and can also optimize the thermal cycle of the ball planting process to obtain ball planting quality and passing rate. Before the ball planting process, by preheating the temperature of the circuit board to be consistent with the temperature of the ball planting process, the heat loss of the ball grid array module when placing the solder balls on the solder paste can be reduced, thereby improving production efficiency.

[0098] In an embodiment of the present invention, when preheating the circuit board, the circuit board can be preheated by a heating unit in the ball grid array module. The heating unit can preheat the circuit board by using hot air heating or infrared heating.

[0099] Among them, hot air heating refers to using a hot air gun or a hot air circulation system to evenly blow hot air onto the surface of the circuit board, and the heat is transferred to the circuit board through convection. Hot air heating adopts the method of air flow, which is conducive to quickly and evenly heating the circuit board and achieving relatively sufficient heat transfer. When performing hot air heating, the temperature and flow rate of the hot air gun or the hot air circulation system can be set, and it is ensured that the hot air can evenly cover the surface of the circuit board. At the same time, the preheating time is set so that the temperature of the circuit board slowly rises to the preset temperature. During the preheating process, the temperature of the circuit board needs to be monitored in real time to ensure that it does not exceed the temperature threshold. Among them, the temperature threshold refers to the temperature at which the circuit board undergoes vitrification when it reaches this temperature.

[0100] Infrared heating refers to using an infrared emitter to generate infrared radiation and directly transfer the heat to the circuit board. Infrared heating adopts the radiation heating method, which can penetrate more deeply into the interior of the circuit board to improve the preheating efficiency of the circuit board. When performing infrared heating, the power and radiation range of the infrared emitter can be configured to ensure that the circuit board is within the radiation range of the infrared emitter. At the same time, the preheating time is set so that the temperature of the circuit board slowly rises to the preset temperature. During the preheating process, the temperature of the circuit board needs to be monitored in real time to ensure that it does not exceed the temperature threshold.

[0101] During the preheating process, it is necessary to use a temperature sensor, etc. to perform real-time temperature monitoring to prevent overheating or uneven heating. At the same time, it is necessary to ensure that the overall and local temperature distributions of the circuit board are uniform to improve the subsequent ball mounting quality. And it is necessary to control the temperature rising rate of the preheating to prevent the increase of thermal stress on the circuit board and electronic components. In this embodiment, the preset temperature can be within a preset temperature range, and the preset temperature range can be set to 90°C to 150°C. Of course, the specific numerical value of the preset temperature range can also be set according to actual needs and is not limited here.

[0102] Please refer to Figure 5 , in an embodiment of the present invention, when step S32 is executed, specifically, step S32 may include the following steps:

[0103] Step S3211: Obtain a dataset of the mutual relationship between the temperature data and the corresponding laser energy data of the circuit board. Among them, the mutual relationship dataset may include multiple temperature data, and each temperature data corresponds to a laser energy data;

[0104] Step S3212: Fit according to the functional relationship between the temperature data and the corresponding laser energy data of the circuit board to obtain the corresponding fitting function;

[0105] Step S3213: Obtain the current temperature data of the circuit board, and input the current temperature data as a parameter into the fitting function to obtain the corresponding current laser energy data;

[0106] Step S3214: Adjust the parameters of the laser unit in the ball mounting module according to the current laser energy data.

[0107] In an embodiment of the present invention, when step S3211 is executed, specifically, after preheating the circuit board, ball mounting on the circuit board needs to be started. There will be a certain period of time between the preheating stage and the ball mounting stage, which will cause a certain change in the current temperature of the circuit board. For different circuit boards, the temperature after each preheating may also be different. Before the ball mounting stage, the current temperature of each circuit board may not be the same. Therefore, for different circuit boards, it is necessary to correct the laser energy output by the laser unit, so as to ensure that the corrected laser unit can successfully complete the ball mounting process, prevent the circuit board from being damaged due to excessive laser energy output by the laser unit, or prevent the ball mounting from failing due to too small laser energy output.

[0108] Furthermore, during the ball mounting process, since the current temperature data of the circuit board and the laser energy data output by the laser unit are correlated, a mutual relationship data set of the temperature data and the corresponding laser energy data of the circuit board can be obtained in advance through experiments. For example, through experiments, it can be known that when the temperature data is 25 °C, the laser energy data can be in the range of 840 mJ to 997 mJ. When the temperature data is 100 °C, the laser energy data can be in the range of 720 mJ to 800 mJ. When the temperature data is 150 °C, the laser energy data can be in the range of 620 mJ to 765 mJ.

[0109] In an embodiment of the present invention, when step S3212 is executed, specifically, after obtaining the correlation data set, the temperature data of the circuit board can be used as the abscissa, and the laser energy data can be used as the ordinate to fit all the data to obtain the corresponding fitting function. During the fitting process, methods such as linear fitting, polynomial fitting, exponential fitting, and logarithmic fitting can be used for fitting. In this embodiment, according to the data in the correlation data set, a corresponding scatter plot can be drawn to observe the distribution of the data, so as to initially select a suitable model for fitting. For example, if the data in the scatter plot is similar to a straight line, a linear model can be selected; if it is similar to a parabola, a quadratic polynomial model can be selected. Then, the least squares method or other optimization techniques can be used to evaluate the model parameters according to the selected model. Finally, the fitting function can be verified according to a new set of temperature data of the circuit board and the corresponding laser energy data. In other embodiments, fitting can also be performed through computer software to obtain the fitting function, such as Python (using libraries such as NumPy and SciPy or specialized libraries such as statsmodels and scikit-learn), R, MATLAB, etc.

[0110] In an embodiment of the present invention, when steps S3213 and S3214 are executed, specifically, after obtaining the fitting function, the current temperature data of the circuit board can be obtained according to the temperature sensor, and the current temperature data can be used as a parameter and input into the fitting function to obtain the corresponding current laser energy data. The current laser energy data obtained at this time is a more appropriate energy and can successfully complete the ball mounting process of the current circuit board. Then, in order to enable the laser output by the laser unit in the ball mounting module to reach the current laser energy data, the parameters of the laser unit in the ball mounting module need to be adjusted. For example, the output power of the laser can be adjusted by modifying the settings in the ball mounting module or using software, or the position of the laser unit head can be adjusted or a focusing lens can be used to change the focal length of the laser to change the size and intensity of the laser spot.

[0111] Please refer to Figure 6 , in an embodiment of the present invention, step S32 may also include other steps, for example:

[0112] Step S3221: Obtain the correlation data set of the temperature data of the circuit board and the corresponding laser energy data, where the correlation data set may include multiple temperature data, and each temperature data corresponds to a laser energy data;

[0113] Step S3222: Set multiple consecutive temperature range intervals according to the temperature data of the circuit board, where at least one temperature data of the circuit board may be distributed within each temperature range interval;

[0114] Step S3223: Obtain the laser energy data corresponding to the temperature data within the temperature range interval, and take the average value of the laser energy data to obtain the corresponding average laser energy data. Each temperature range interval can correspond to an average laser energy data.

[0115] Step S3224: Obtain the temperature range interval in which the current temperature data of the circuit board is located, and obtain the corresponding average laser energy data, denoted as the current laser energy data.

[0116] Step S3225: Adjust the parameters of the laser unit in the ball mounting module according to the current laser energy data.

[0117] In an embodiment of the present invention, when step S3221 is executed, specifically, during the ball mounting process, since there is a correlation between the current temperature data of the circuit board and the laser energy data output by the laser unit, the mutual relationship data set between the temperature data of the circuit board and the corresponding laser energy data can be obtained in advance through experiments.

[0118] In an embodiment of the present invention, when step S3222 is executed, specifically, since the number of temperature data may be multiple and the magnitudes of different temperature data may also be different, multiple consecutive temperature range intervals can be preset. For example, multiple consecutive temperature range intervals can be divided into interval A, interval B, interval C, interval D, etc. The temperature x in interval A can be expressed as 10 <= X < 20 °C. The temperature X in interval B can be expressed as 20 <= X < 30 °C. The temperature X in interval C can be expressed as 30 <= X < 40 °C. The temperature X in interval D can be expressed as 40 <= X < 50 °C. And so on until multiple consecutive intervals are obtained. Of course, in other embodiments, the range of each interval can also be 5 °C, 15 °C, etc. The specific size of the range of the interval can be set according to actual needs as long as at least one temperature data of the circuit board can be distributed within each temperature range interval.

[0119] In an embodiment of the present invention, when step S3223 is executed, specifically, since at least one temperature data of the circuit board can be distributed within each temperature range interval, and each temperature data of the circuit board can correspond to a laser energy data, at least one laser energy data can correspond to each temperature range interval. In this embodiment, the average value processing can be performed on the laser energy data corresponding to each temperature range interval to obtain the corresponding average laser energy data, so that each temperature range interval can correspond to an average laser energy data, which is convenient for adjusting the parameters of the laser unit subsequently.

[0120] In an embodiment of the present invention, when steps S3224 and S3225 are executed, specifically, after the current laser energy data is obtained, the temperature range interval where it is located can be judged, and then the average laser energy data in the obtained temperature range interval can be obtained, which is expressed as the previous laser energy data. After that, in order to enable the laser output by the laser unit in the ball mounting module to reach the current laser energy data, the parameters of the laser unit in the ball mounting module need to be adjusted.

[0121] Please refer to Figure 7 , in an embodiment of the present invention, when step S33 is executed, specifically, step S33 may include the following steps:

[0122] Step S331, obtain the overall warpage data of the circuit board;

[0123] Step S332, according to the overall warpage degree, obtain the warpage data of each solder joint to generate a warpage data set, where the warpage data set includes the positions of different solder joints and the corresponding warpage data;

[0124] Step S333, according to the warpage data set, obtain the dotting distance between each solder joint and the laser unit in the vertical direction.

[0125] In an embodiment of the present invention, when step S331 is executed, specifically, before the ball mounting stage, the circuit board will be heated multiple times, which may cause it to have an overall warpage degree (warpage). The overall warpage degree refers to the unevenness of the circuit board caused by thermal stress or other factors. Warpage may have a negative impact on the ball mounting process and the functionality and reliability of the final product. Therefore, it is necessary to measure the warpage degree of the circuit board for subsequent processing. For example, the overall warpage degree of the circuit board can be calculated by the laser unit in the ball mounting module using the laser scanning method. Another example is that the overall warpage degree of the circuit board can also be calculated by the AOI module using the visual detection algorithm.

[0126] When calculating the overall warpage degree of the circuit board using the laser scanning method, the laser unit can emit a laser beam and irradiate it on the surface of the circuit board. After that, the laser unit can move along a preset path (horizontal or vertical) to evenly scan the entire surface of the circuit board. The sensor inside the laser unit receives the reflected laser and records the position and reflection time of each scanning point, and then the distance between each scanning point and the sensor can be calculated. Finally, according to each scanning point and the corresponding distance, the highest point and the lowest point of the circuit board warpage, and the distance between the highest point and the lowest point in the vertical direction can be determined, and this distance can represent the overall warpage degree of the circuit board.

[0127] When calculating the overall warpage of a circuit board using a vision detection algorithm, the AOI module can use a camera unit to capture images of the circuit board from different angles to capture the complete shape of the warpage. Subsequently, the vision detection algorithm in the AOI module can convert the captured color image into a grayscale image to simplify subsequent processing. At the same time, various filtering algorithms, such as median filtering, Gaussian filtering, etc., are used to remove image noise, and edge detection algorithms, such as Canny or Sobel algorithms, are applied to identify the contour of the circuit board. If the image is distorted, an image correction algorithm can also be used to correct perspective distortion. After a series of processing, the features of the circuit board can be extracted. For example, a stereo vision algorithm can be used to reconstruct the three-dimensional surface model of the circuit board first, and then the depth information of each pixel can be calculated through a matching algorithm. According to the depth information or the stereo vision algorithm, a three-dimensional model of the circuit board surface can be constructed. When the three-dimensional model is obtained, the measured data points of the circuit board can be compared with the expected ideal plane or the data of the reference board, and the height deviation of the circuit board in different regions can be calculated. By identifying the lowest point and the highest point, as well as the distance between the highest point and the lowest point in the vertical direction, this distance can represent the overall warpage of the circuit board.

[0128] In an embodiment of the present invention, when steps S332 and S333 are executed, specifically, after obtaining the overall warpage of the circuit board, the warpage data of each solder joint on the circuit board can be obtained, and the position of each solder joint can correspond to a warpage data. A warpage data set can be generated according to the warpage data of different solder joints. According to the warpage data set, the ball placement module can adjust the laser unit to ensure that the distance between each solder joint and the laser unit is the same in the vertical direction, and then obtain the corresponding dotting distance, so that the heights of all solder balls are the same after subsequent ball placement.

[0129] In an embodiment of the present invention, when step S34 is executed, specifically, for the circuit board of the present application, during the ball placement process, hundreds or thousands of solder balls need to be implanted at high speed on different solder joints. Therefore, precise positioning of the solder joints on the circuit board is required. For example, the circuit board can be positioned first to calibrate the position of the circuit board and the laser unit of the ball placement module to ensure that the solder balls are accurately implanted at the predetermined positions, that is, on the solder joints. During the positioning process, the camera unit of the ball placement module can scan the marking points on the circuit board to identify the specific position of the circuit board. The camera unit can calibrate the X-Y coordinate system of the ball placement module according to the position information of the marking points to ensure that the laser unit is completely aligned with the predetermined pad positions on the circuit board.

[0130] Further, after calibration, the ball placement module can send solder balls to the correct position of the placer through a vibrating bowl, and the vibrating bowl can ensure that the solder balls move in the correct direction and at the correct speed. The laser unit can pick up the solder balls in the placer for the ball placement process. The laser unit can use vacuum adsorption or other mechanical methods to pick up the solder balls and accurately place them on the pads printed with an appropriate amount of solder paste, that is, the solder joints. In this embodiment, the solder balls can be placed on the corresponding solder joints according to the dotting distances of different solder joints.

[0131] After placing the solder balls on the solder joints, the laser unit gently presses the solder balls into the solder paste to ensure that the solder balls can be firmly soldered to the solder joints during subsequent soldering. Since hundreds or thousands of solder balls need to be implanted on a circuit board, it is necessary to accurately position the positions of each solder joint. At the same time, the laser unit needs to place the solder balls stably at high speed to improve production efficiency.

[0132] Please refer to Figure 8 , in an embodiment of the present invention, when performing step S40, after the laser ball placement on the ball placement surface is completed by using the laser ball placement method, the solder balls on the ball placement surface can be detected to determine whether the quality of the solder balls meets the requirements. In this embodiment, the solder ball detection method can be used to complete the detection of the solder balls on the circuit board. The solder ball detection method can include the following steps:

[0133] Step S41: Extract the characteristic data of each solder ball according to the surface image data of the circuit board;

[0134] Step S42: Compare the characteristic data of each solder ball with the preset standard conditions to screen out the solder balls that do not meet the standard conditions, which are expressed as defective solder balls, and re-perform the ball placement process on the defective solder balls;

[0135] Step S43: Perform laser scanning processing on the solder balls on the surface of the circuit board to obtain the height data of each solder ball;

[0136] Step S44: Obtain the overall coplanarity data of the solder balls on the circuit board and the coplanarity data of each solder ball according to the height data of each solder ball;

[0137] Step S45: Determine whether the overall coplanarity data is within the preset standard coplanarity data range;

[0138] Step S46: If the overall coplanarity data is within the standard coplanarity data range, it means that the quality of the circuit board meets the requirements;

[0139] Step S47: If the overall coplanarity data is not within the standard coplanarity data range, screen out the solder balls that do not meet the requirements, which are expressed as problem solder balls, and re-perform the ball placement process on the problem solder balls.

[0140] Please refer to Figure 9 In an embodiment of the present invention, when step S41 is executed, specifically, step S41 may include the following steps:

[0141] Step S411: Obtain the surface image data of the circuit board;

[0142] Step S412: Extract the characteristic data of each solder ball according to the surface image data, where the characteristic data includes shape data, size data, position data, and the spacing data between two adjacent solder balls.

[0143] In an embodiment of the present invention, when step S411 is executed, specifically, when it is necessary to detect the solder balls on the circuit board after ball placement, the circuit board can be transferred to the AOI module, and the solder balls are detected by the AOI module. Specifically, the circuit board can be fixed on the platform of the AOI module first. Then, appropriate light source illumination can be set on the AOI module to ensure that each solder ball can be clearly captured, and at the same time, the parameters of the camera unit of the AOI module, including focal length and exposure time, etc., are adjusted to obtain the best image.

[0144] During the process of obtaining the surface image data of the circuit board, the camera unit of the AOI module can move on the circuit board and capture the images of the solder balls one by one or in groups according to a predetermined moving path. Among them, the camera unit can include cameras at multiple angles to ensure that the captured images can contain sufficient three-dimensional information to determine the shape and position of each solder ball. Through the images at different angles, the surface image data of the circuit board can be obtained.

[0145] In an embodiment of the present invention, when step S412 is executed, specifically, after obtaining the surface image data of the circuit board, since the surface image data contains the information of each solder ball, therefore, it is necessary to process the surface image data to extract the characteristic information of each solder ball. The steps of processing the surface image data can include grayscale conversion, binarization, edge detection, morphological operations, etc., so as to obtain the characteristic information of each solder ball. Among them, the characteristic information can include shape data, size data, position data, height data, the spacing data between two adjacent solder balls, and so on.

[0146] Please refer to Figure 10 In an embodiment of the present invention, when step S42 is executed, specifically, step S42 may include the following steps:

[0147] Step S421: Compare the characteristic data of each solder ball with the preset standard conditions to determine whether there are solder balls that do not meet the requirements, where the standard conditions include the standard shape range, the standard size range, the standard position range, and the standard spacing range between two adjacent solder balls;

[0148] Step S422: If the characteristic data of a certain solder ball meets the standard conditions, it indicates that the solder ball meets the requirements.

[0149] Step S423: If the characteristic data of a certain solder ball does not meet the standard conditions, it indicates that the solder ball is a defective solder ball, and record the corresponding defect type.

[0150] Step S424: Obtain the defective solder balls, display them, and re-ball the defective solder balls.

[0151] In an embodiment of the present invention, when performing step S421, specifically, after extracting the characteristic data of each solder ball, each item of data in the characteristic data of each solder ball can be compared with the preset standard conditions to determine whether there are solder balls that do not meet the requirements. Among them, the standard conditions include the standard shape range, the standard size range, the standard position range, the standard spacing range between adjacent two solder balls, etc. Each data range in the standard conditions can be obtained through experiments or by measuring a defect-free circuit board of a certain standard to obtain the data range of each parameter. The specific size of each data range in the standard conditions can be set according to actual needs.

[0152] In an embodiment of the present invention, when performing step S422 and step S423, specifically, when comparing the characteristic data of the solder ball with the standard conditions, the shape data can be compared with the standard shape range first. If the shape data is within the standard shape range, it indicates that the shape of the solder ball meets the requirements. If the shape data is not within the standard shape range, it indicates that the shape of the solder ball does not meet the requirements. At this time, the solder ball can be marked and marked as a shape defect. Then, the size data can be compared with the standard size range. If the size data is within the standard size range, it indicates that the size of the solder ball meets the requirements. If the size data is not within the standard size range, it indicates that the size of the solder ball does not meet the requirements. At this time, the solder ball can be marked and marked as a size defect. And so on, until the position data is compared with the standard position range and the spacing data between adjacent two solder balls is compared with the standard spacing range between adjacent two solder balls. After the inspection of the solder ball is completed, the solder ball may have multiple defects at the same time, such as shape defects, size defects, position defects, spacing defects, etc. If the characteristic data of a certain solder ball does not meet the standard conditions, the solder ball can be marked as a defective solder ball and the corresponding defect type can be recorded. If the characteristic data of a certain solder ball all meet the standard conditions, the solder ball can be marked as a normal solder ball.

[0153] In an embodiment of the present invention, when step S424 is executed, specifically during the detection of solder balls, when defective solder balls appear, the defect information of the defective solder balls can be displayed on the UI interface of the display module. The defect information may include the position information and defect type of the defective solder balls. For example, the defect information of each defective solder ball can be displayed in the form of a table on the UI interface, or in the shape of a chart. Specifically, the display method can be set according to actual requirements and is not limited here.

[0154] Further, after obtaining the defect information of each defective solder ball, the ball planting process can be performed on each defective solder ball in sequence. Specifically, the defect information of the defective solder ball can be obtained first, and the defective solder ball can be removed. The de-ball module can be used to remove the defective solder balls. The de-ball module can use methods such as high-temperature hot air, de-ball cutter, or laser de-ball to remove the balls. During the de-ball process, the temperature and time need to be controlled to avoid damaging adjacent good solder balls or the circuit board. At the same time, the residual solder needs to be removed and the solder pads need to be cleaned. After that, solder paste can be reapplied on the solder pads to help the new solder balls adhere well. After applying the solder paste on the solder pads, it can be transferred to the ball planting module for re-ball planting. Finally, the circuit board after ball planting can be sent to the AOI module for detection again until all the solder balls on the circuit board meet the requirements. During the testing and re-ball planting process, the repair process and test results can be recorded to provide data for subsequent quality improvement and process optimization.

[0155] In an embodiment of the present invention, when step S43 is executed, specifically, after the AOI module detects all the solder balls, there may be some solder balls with inconsistent heights at this time. Therefore, the circuit board needs to be detected again to ensure that the solder balls on the circuit board meet the standards.

[0156] First, the circuit board can be transferred to the workbench of the ball planting module and fixed to ensure that the circuit board is stable and will not shift during the scanning process. After that, the position of the laser unit can be adjusted to align it with the solder ball area to be scanned on the circuit board. At the same time, the parameters of the laser unit can be configured, such as configuring appropriate scanning speed, laser intensity, resolution, focal length, etc., to adapt to different types of circuit boards and solder balls. After completing the parameter configuration of the laser unit, the laser unit can be started to emit a laser beam towards the solder ball area of the circuit board. The laser beam irradiates the surface of the solder ball and is reflected back. The sensor of the laser unit can capture the reflected laser and record the time or phase change of the laser return, and then calculate the height data of the solder ball. Finally, after scanning all the solder balls, the height data of all the solder balls can be saved for subsequent analysis.

[0157] In an embodiment of the present invention, when step S44 is executed, specifically, a standard defect-free circuit board can be scanned first to preset a reference plane, which can then be used as the reference plane for subsequently measuring the coplanarity data of each solder ball. Alternatively, after obtaining the height data of each solder ball, a plane that minimizes the sum of the squared deviations of all solder balls can be calculated according to the least squares method, that is, the reference plane. In this embodiment, the specific method for setting the reference plane is not limited as long as it can satisfy the calculation of the coplanarity data of all solder balls. Among them, the coplanarity data refers to the degree of all solder balls on the circuit board relative to the reference plane.

[0158] Furthermore, when calculating the overall coplanarity data of the solder balls on the circuit board, the processing unit in the ball mounting module can first poll the height data of all solder balls, and then obtain the height difference between the highest-positioned solder ball and the lowest-positioned solder ball. This height difference can be expressed as the overall coplanarity data. When calculating the coplanarity data of each solder ball on the circuit board, according to the height data of each solder ball, the height difference between each solder ball and the reference plane is obtained, and this height difference can be expressed as the coplanarity data of the solder ball.

[0159] After obtaining the overall coplanarity data and the coplanarity data of each solder ball, it can be displayed in the form of a table or in the form of a normal distribution on the UI interface of the display module. The display method is not limited as long as it can satisfy the intuitive display of the current status of the solder balls for further analysis or quality control.

[0160] In an embodiment of the present invention, when steps S45 and S46 are executed, specifically, the standard coplanarity data range can be obtained by scanning multiple standard defect-free circuit boards to obtain the corresponding standard coplanarity data, and then statistics are performed on multiple standard coplanarity data to obtain a standard coplanarity data range. Or, the standard coplanarity data range can also be an empirical numerical range preset according to the parameters of the circuit board.

[0161] After setting the standard coplanarity data range, the processing unit in the ball mounting module can first compare the overall coplanarity data of the circuit board with the standard coplanarity data range to preliminarily determine whether the solder balls on the circuit board meet the requirements. If the overall coplanarity data of the circuit board is within the standard coplanarity data range, it means that the solder balls on the circuit board meet the requirements and the quality of the solder balls on the circuit board is good. If the overall coplanarity data of the circuit board is not within the standard coplanarity data range, it means that some of the solder balls on the circuit board do not meet the requirements, and the solder balls on the circuit board that do not meet the requirements need to be screened out.

[0162] Please refer to Figure 11, in an embodiment of the present invention, when step S47 is executed, specifically, step S47 may include the following steps:

[0163] Step S471, determine whether the coplanarity data of each solder ball is within the standard coplanarity data range;

[0164] Step S472, if the coplanarity data of a certain solder ball is within the standard coplanarity data range, it means that the solder ball meets the requirements;

[0165] Step S473, if the coplanarity data of a certain solder ball is not within the standard coplanarity data range, it means that the solder ball is a defective solder ball, and record the error information of the defective solder ball, where the error information includes the position information and the coplanarity data;

[0166] Step S474, obtain the defective solder ball, display it, and re-ball the defective solder ball.

[0167] In an embodiment of the present invention, when steps S471, S472, and S473 are executed, specifically, when the processing unit in the ball mounting module screens the solder balls, it can poll each solder ball in turn, and compare the coplanarity data of each solder ball with the standard coplanarity data range in turn.

[0168] When the coplanarity data of a certain solder ball is within the standard coplanarity data range, it means that the solder ball meets the requirements, and the solder ball can be marked as a normal solder ball.

[0169] When the coplanarity data of a certain solder ball is not within the standard coplanarity data range, it means that the solder ball is a defective solder ball. At this time, the error information of the defective solder ball can be recorded, where the error information includes the position information and the coplanarity data.

[0170] During the process of polling and judging the solder balls, the detection results can be displayed on the UI interface of the display module in real time. The specific display method is not limited, as long as it can meet the real-time monitoring of the fluctuation trend of the coplanarity data of the solder balls. For example, the error information of the defective solder balls can be displayed in the form of a normal distribution graph.

[0171] In an embodiment of the present invention, when step S474 is executed, specifically, when the processing unit in the ball mounting module obtains the error information of all the defective solder balls, it is necessary to re-ball these defective solder balls. Specifically, the error information of the defective solder balls can be obtained first, and the defective solder balls and the residual solder are removed, and the pads are cleaned. Then, solder paste can be reapplied and balls can be mounted at the positions of the original defective solder balls. Finally, the circuit board after ball mounting can be sent to the ball mounting module for detection again until all the solder balls on the circuit board meet the requirements.

[0172] Furthermore, during the testing and re - balling process, the ball - planting module can record the repair process and test results, providing data for subsequent quality improvement and process optimization. At the same time, it is necessary to determine whether the number of defective solder balls reaches a threshold. If the number of defective solder balls on a certain circuit board reaches the threshold, remedial measures need to be taken, such as adjusting the soldering process parameters, re - balling, replacing the defective circuit board, etc., to make timely adjustments and improve the subsequent product yield. Among them, the threshold is a pre - set value, and the specific size of the threshold can be set according to actual needs.

[0173] In an embodiment of the present invention, the present invention also provides a packaging device for an integrated circuit board. The modules required in the above - mentioned packaging method can be integrated into the same packaging device, and this packaging device can package the circuit board by using the above - mentioned packaging method and ball - planting method. The packaging device can include a solder paste printing module, an automatic optical inspection module, a chip - mounting module, a feeding module, a reflow soldering module, a display module, a ball - planting module and other modules. The functions of each module in the packaging device are the same as those of the modules in the above - mentioned packaging method and ball - planting method, and at the same time, the process flow is also the same, which will not be elaborated here.

[0174] It can be seen that in the above - mentioned solution, SMT chip - mounting reflow is carried out first, and then ball - planting is carried out at room temperature, thus avoiding the solder balls from experiencing multiple reflow soldering processes. Since the IMC layer formed by ball - planting at room temperature is thinner, it can reduce the risk of solder joint brittle fracture caused by IMC embrittlement during the reflow soldering process in subsequent applications. At the same time, because a more ductile thin IMC layer has been formed through ball - planting at room temperature, the solder balls can still maintain good mechanical strength and stable connection performance when experiencing reflow soldering. Separating the SMT chip - mounting process from the ball - planting process can reduce process interference and improve the efficiency and connection quality of the entire packaging manufacturing.

[0175] The embodiments of the present invention disclosed above are only used to help illustrate the present invention. The embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the art in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging method for an integrated circuit board, characterized in that, Including: Obtain a circuit board, perform chip mounting on the ball grid array surface of the circuit board to solder electronic components on the ball grid array surface; Perform chip mounting on the functional surface of the circuit board to solder electronic components on the functional surface; Perform laser ball grid array processing on the pads of the ball grid array surface of the circuit board to implant solder balls at the solder joints; Inspect the circuit board to check whether the quality of the circuit board meets the standard.

2. The encapsulation method of the integrated circuit board according to claim 1, characterized in that, The step of obtaining a circuit board and performing chip mounting on the ball grid array surface of the circuit board to solder electronic components on the ball grid array surface includes: Obtain a circuit board and print solder paste on the ball grid array surface of the circuit board; Perform chip mounting on the ball grid array surface to attach electronic components to the ball grid array surface; Perform reflow soldering on the ball grid array surface to complete the soldering of the electronic components; Inspect the ball grid array surface to check whether the quality of the solder joints meets the standard.

3. The encapsulation method of the integrated circuit board according to claim 1, characterized in that, The step of performing chip mounting on the functional surface of the circuit board to solder electronic components on the functional surface includes: Turn over the circuit board to print solder paste on its functional surface; Perform surface mounting on the functional surface to attach electronic components to the functional surface; Perform reflow soldering on the functional surface to complete the soldering of the electronic components; Inspect the functional surface to check whether the quality of the solder joints meets the standard.

4. The encapsulation method of the integrated circuit board according to claim 1, wherein, The step of performing laser ball grid array processing on the pads of the ball grid array surface of the circuit board to implant solder balls at the solder joints includes: Perform preheating treatment on the circuit board to make its temperature data reach the preset temperature range; Adjust the intensity data of the laser energy according to the current temperature data of the circuit board; Obtain the dotting distance between the laser unit and the solder joints of the circuit board according to the warpage of each solder joint on the ball grid array surface; Complete laser ball grid array according to the dotting distance of each solder joint.

5. The encapsulation method of the integrated circuit board according to claim 4, wherein, The preset temperature range is expressed as 90°C to 150°C.

6. The encapsulation method of the integrated circuit board according to claim 1, wherein The step of inspecting the circuit board to check whether the quality of the circuit board meets the standard includes: Extract the characteristic data of each solder ball according to the surface image data of the circuit board; Compare the characteristic data of each solder ball with the preset standard conditions to screen out the solder balls that do not meet the standard conditions, which are expressed as defective solder balls, and perform re-ball grid array processing on the defective solder balls; Perform laser scanning processing on the surface of the circuit board to obtain the height data of each solder ball; Obtain the overall coplanarity data of the circuit board and the coplanarity data of each solder ball according to the height data of each solder ball; Judge whether the overall coplanarity data is within the preset standard coplanarity data range; If the overall coplanarity data is within the standard coplanarity data range, it means that the circuit board meets the requirements; If the overall coplanarity data is not within the standard coplanarity data range, screen out the solder balls that do not meet the requirements, which are expressed as problem solder balls, and perform re-ball grid array processing on the problem solder balls.

7. The encapsulation method of the integrated circuit board according to claim 6, characterized in that, In the step of comparing the characteristic data of each solder ball with the preset standard conditions, each data in the characteristic data is sequentially compared with each data range in the standard conditions. Among them, the characteristic data includes shape data, dimension data, position data, and the spacing data between two adjacent solder balls, and the standard conditions include a standard shape range, a standard dimension range, a standard position range, and a standard spacing range between two adjacent solder balls.

8. The packaging method of the integrated circuit board according to claim 6, characterized in that, The step of, if the overall coplanarity data is not within the standard coplanarity data range, screening out the solder balls that do not meet the requirements, denoted as problem solder balls, and re-performing the ball mounting process on the problem solder balls includes: Judging whether the coplanarity data of each solder ball is within the standard coplanarity data range; If the coplanarity data of a certain solder ball is not within the standard coplanarity data range, it means that the solder ball is a problem solder ball, and the error information of the problem solder ball is recorded; If the coplanarity data of a certain solder ball is within the standard coplanarity data range, it means that the solder ball meets the requirements; Obtaining the problem solder balls, displaying them, and re-performing the ball mounting process on the problem solder balls.

9. The encapsulation method of the integrated circuit board according to claim 8, wherein In the step of recording the error information of the problem solder balls, it further includes: real-time displaying the detection results of the problem solder balls and displaying the fluctuation trend of the coplanarity data of the solder balls.

10. An encapsulation device for an integrated circuit board, characterized in that, Includes: A chip mounting module for performing chip mounting on the ball mounting surface of the circuit board to solder electronic components on the ball mounting surface, and the chip mounting module is also used to perform chip mounting on the functional surface of the circuit board to solder electronic components on the functional surface; And A ball mounting module for performing laser ball mounting on the pads of the ball mounting surface of the circuit board to implant solder balls on the solder joints, and the ball mounting module is also used to detect the circuit board to detect whether the quality of the circuit board meets the standard.

Images