Integrated circuit board with good antistatic and pressure-resistant performance
By designing an anti-static mechanism on the integrated circuit board, and using ion fans and vacuum cleaners to eliminate static electricity, the threat of electrostatic discharge to the reliability of the integrated circuit is solved, and the anti-static voltage resistance is significantly improved.
Patent Information
- Application Number
- CN202421624792.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-10
AI Technical Summary
The electrostatic discharge phenomenon in nature poses a serious threat to the reliability of integrated circuits, and 30% of the failure of integrated circuit products is caused by electrostatic discharge phenomenon.
An integrated circuit board with good anti-static voltage resistance is designed, using an outer shell with bonded aluminum leather board and reinforcement board, and a built-in anti-static mechanism, including an ion fan and a vacuum cleaner, neutralize the charge by generating positive and negative charge airflow, and remove dust through the vacuum cleaner, thereby eliminating static electricity.
Effectively neutralize the positive and negative charges on the surface of the integrated circuit board, remove dust, significantly improve the anti-static voltage resistance of the integrated circuit board, and reduce the failure efficiency caused by electrostatic discharge.
Smart Images

Figure CN223040219U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of integrated circuit boards with good antistatic and high voltage resistance. Specifically, an integrated circuit board is wrapped by a shell on the periphery. The shell is made of two plates, an aluminum skin plate and a reinforcing plate, which are bonded together with a polyethylene anti-corrosion glue as the bonding glue. Through pipes are fixedly installed at both the left and right ends of the shell. An antistatic mechanism is correspondingly installed at the upper end of the integrated circuit board body. The integrated circuit board body is installed inside an electrostatic isolation box, and two wire passing openings are provided on one side of the electrostatic isolation box. An ion blower is fixedly installed on the inner wall of the antistatic mechanism. Through a large amount of airflows with positive and negative charges generated inside the three ion blowers themselves, the excess positive and negative charges generated on the surface of the integrated circuit board body can be neutralized. Then, a dust collector is used to adsorb the dust generated on the surface of the integrated circuit board body, and the dust is collected in a dust collection box. There are two dust collection boxes and dust collectors respectively on the left and right sides to eliminate the static electricity phenomenon inside the integrated circuit. Background Art
[0002] The static discharge phenomenon in nature poses a serious threat to the reliability of integrated circuits. 30% of the failures of integrated circuit products are caused by suffering from static discharge phenomena. Improving the reliability of integrated circuit static discharge protection plays an important role in improving the yield of products. For this reason, we propose an integrated circuit board with good antistatic and high voltage resistance. Content of the Utility Model
[0003] Aiming at the deficiencies of the prior art, the utility model provides an integrated circuit board with good antistatic and high voltage resistance, and solves the above problems.
[0004] To achieve the above object, the utility model provides the following technical solution: An integrated circuit board with good antistatic and high voltage resistance is wrapped by a shell on the periphery. The shell is made of two plates, an aluminum skin plate and a reinforcing plate, which are bonded together with a polyethylene anti-corrosion glue as the bonding glue. Through pipes are fixedly installed at both the left and right ends of the shell. An antistatic mechanism is correspondingly installed at the upper end of the integrated circuit board body. The integrated circuit board body is installed inside an electrostatic isolation box, and two wire passing openings are provided on one side of the electrostatic isolation box. Cover plate slots are installed on one side of the inner wall of the wire hole cover without wire passing openings, and are installed on both the left and right sides.
[0005] Preferably, the antistatic and pressure-resistant box plate is made of two plates, an aluminum skin plate and a reinforcing plate, which are bonded together with a polyethylene anti-corrosion glue, achieving a good antistatic effect and having sufficient pressure resistance.
[0006] Preferably, the electrostatic isolation box and the electrostatic isolation box cover plate adopt a slot-drawing form. Slots are provided at the top of both sides of the electrostatic isolation box, and both sides of the electrostatic isolation box cover plate are stuck in the cover plate slots for sliding connection, which is convenient for observation and wiring, and can also dissipate heat to a certain extent.
[0007] Preferably, the wiring port of the static electricity isolation box and the wire hole cover of the wire routing port are made of anti-static insulating gasket material. It is a circular hole cover composed of four fan-shaped shapes, which is convenient for wire routing and dust-proof. The opening size and number of the wire routing port are determined according to the actual wiring situation. The wire hole cover of the wire routing port is installed at the groove of the wire routing port. The groove of the wire routing port is opened at the position of the wire routing port, and it is grooved for one week. The wiring required by the integrated circuit board body enters and exits from the position of the wire routing port. Two holes are opened to shorten the wiring length and facilitate wire management.
[0008] Preferably, the anti-static mechanism is that the cover plate slot is installed on both sides of the inner wall of the static electricity isolation box and is fixed to the static electricity isolation box by bonding or welding.
[0009] Preferably, the cover plate slot is installed on both sides of the inner wall of the static electricity isolation box and is fixed to the static electricity isolation box by bonding or welding. Three ion fan reserved ports are installed and fixed on the inner wall of the cover plate slot. An ion fan is installed and fixed on the ion fan reserved port. Dust collection boxes are installed at both the left and right ends of the bottom of the cover plate slot, and a vacuum cleaner is installed at the bottom of the dust collection box.
[0010] Compared with the prior art, the present utility model provides an integrated circuit board with good anti-static and voltage resistance, and has the following beneficial effects:
[0011] 1. For the integrated circuit board with good anti-static and voltage resistance, the ion fan is installed and fixed on the inner wall of the anti-static mechanism. A large amount of positive and negative charge airflows are generated inside the three ion fans themselves, which can neutralize the excess positive and negative charges generated on the surface of the integrated circuit board body. Then, the vacuum cleaner adsorbs the dust generated on the surface of the integrated circuit board body, and the dust is collected in the dust collection box. There are two dust collection boxes and vacuum cleaners respectively on the left and right sides, eliminating the static electricity phenomenon inside the integrated circuit.
[0012] 2. For the integrated circuit board with good anti-static and voltage resistance, through the cooperation of the driving motor, the lead screw rotating shaft and the nut slider, the ion fan can be driven to move reciprocally. Using the static electricity rod arranged at the bottom of the ion fan, and then a large amount of positive and negative charge airflows are generated inside the ion fan itself, which can neutralize the excess positive and negative charges generated on the surface of the circuit board. Then, the vacuum cleaner adsorbs the dust generated on the surface of the circuit board, eliminating the static electricity phenomenon inside the integrated circuit.
[0013] 3. For the integrated circuit board with good anti-static and voltage resistance, this anti-static mechanism involves mechanical movement, motor use, and vacuum cleaner use, which will generate heat. Heat accumulates in the semi-closed anti-static box, and heat dissipation is required to ensure the normal progress of the movement process. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic structural diagram of the integrated circuit board with good anti-static and voltage resistance of the present utility model;
[0015] Figure 2Schematic cross-sectional view of an integrated circuit board with good antistatic and voltage resistance for this utility model;
[0016] Figure 3 Schematic diagram of the material composition of the antistatic and pressure-resistant box for this utility model;
[0017] Figure 4 Schematic diagram of the structure of the static electricity isolation box for this utility model;
[0018] Figure 5 Cross-sectional view of the wiring port of the static electricity isolation box for this utility model;
[0019] Figure 6 Schematic diagram of the installation position of the antistatic mechanism for this utility model;
[0020] Figure 7 Schematic diagram of the position of the heat dissipation fins of the antistatic mechanism for this utility model;
[0021] Figure 8 Schematic diagram of the structure of the antistatic mechanism for this utility model.
[0022] In the figure: 1 - integrated circuit board body; 2 - static electricity isolation box; 3 - static electricity isolation box cover plate; 4 - cover plate card slot; 5 - antistatic mechanism; 6 - heat dissipation fins of the antistatic mechanism; 7 - wire hole cover of the wire routing port; 8 - wire routing port; 9 - aluminum sheet; 10 - polyethylene anticorrosive glue; 11 - reinforcement plate; 12 - groove of the wire routing port; 41 - ion blower; 42 - dust collection box; 43 - vacuum cleaner; 44 - reserved port for ion blower. Specific implementation manners
[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0024] Please refer to Figure 1-8 , an integrated circuit board with good antistatic and voltage resistance, the periphery is wrapped by a housing 11, the material of the housing is bonded by two plates, namely an aluminum sheet and a reinforcement plate, the bonding glue is polyethylene anticorrosive glue, through tubes 12 are fixedly installed at both left and right ends of the housing 11, and an antistatic mechanism 2 is correspondingly installed above the integrated circuit board body 1.
[0025] The integrated circuit board body 1 is installed inside the static electricity isolation box 2. Two wire routing ports 8 are opened on one side of the static electricity isolation box 2. The cover plate card slots 4 are installed on one side of the inner wall without the wire hole cover 7 of the wire routing port, and are installed on both the left and right sides.
[0026] The antistatic and pressure-resistant box plate material is an aluminum sheet 9 and a reinforcing plate 11 bonded together, and the bonding glue is a polyethylene anticorrosive glue 10, which has a good antistatic effect and has sufficient pressure resistance.
[0027] The electrostatic isolation box is composed of an electrostatic isolation box 2 and an electrostatic isolation box cover 3 in a slot-pull-out form. Slots are provided on the tops of both sides of the electrostatic isolation box 2. Both sides of the electrostatic isolation box cover 3 are stuck in the cover slots 4 and are slidably connected, which is convenient for observation and wiring, and can also perform certain heat dissipation.
[0028] The wiring port of the static isolation box, the wiring port wire hole cover 7 is made of anti-static insulating rubber pad material, and is a circular hole cover composed of four fan-shaped shapes, which is convenient for wiring and dustproof. The wiring port 8 determines the number of openings according to the actual wiring situation. The wiring port wire hole cover 7 is installed at the wiring port groove 12. The wiring port groove is opened at the wiring port 8 position, and the groove is opened for a circle. The wiring required by the integrated circuit board body 1 enters and exits from the wiring port 8 position. Two holes are opened to shorten the wiring length and facilitate wiring.
[0029] The anti-static mechanism is a cover plate slot 4 installed on both sides of the inner wall of the static isolation box 2, and fixed on the static isolation box 2 by bonding or welding.
[0030] The ion blower 41 is installed and fixed on the inner wall of the cover plate slot 4. A large amount of positive and negative charged airflow is generated inside the three ion blowers 41, which can neutralize the excess positive and negative charges generated on the surface of the integrated circuit board body 1. The dust generated on the surface of the integrated circuit board body 1 is then adsorbed by the vacuum cleaner 43 and collected in the dust box 42. Two dust boxes 42 and vacuum cleaners 43 are respectively provided on the left and right sides to eliminate static electricity inside the integrated circuit.
[0031] Working principle: The ion fan 41 is installed and fixed on the inner wall of the anti-static mechanism 4. A large amount of positive and negative charge airflow is generated inside the three ion fans 41, which can neutralize the excess positive and negative charge generated on the surface of the integrated circuit board body 1. The dust generated on the surface of the integrated circuit board body 1 is then adsorbed by the vacuum cleaner 43, and the dust is collected in the dust box 42. Two dust boxes 42 and vacuum cleaners 43 are respectively provided on the left and right sides to eliminate the static electricity inside the integrated circuit; through the cooperation of the driving motor, the lead screw shaft and the nut slider, the ion fan can be driven to move back and forth, and the static electricity rod set at the bottom of the ion fan is used. A large amount of positive and negative charge airflow is generated inside the ion fan itself, which can neutralize the excess positive and negative charge generated on the circuit board surface, and then the dust generated on the circuit board surface is adsorbed by the vacuum cleaner to eliminate the static electricity inside the integrated circuit; this anti-static mechanism involves mechanical movement, the use of the motor and the vacuum cleaner will generate heat, and the heat accumulates in the semi-enclosed anti-static box, which needs to be dissipated to ensure the normal movement process.
[0032] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. An integrated circuit board with good antistatic and pressure resistance, comprising an integrated circuit board body (1) and an electrostatic isolation box (2), characterized in that: The integrated circuit board body (1) is arranged inside the static isolation box (2), and antistatic mechanisms (5) are respectively arranged on two sides of the static isolation box (2) corresponding to the integrated circuit board body (1), and antistatic mechanism heat dissipation fins (6) are arranged on the antistatic mechanisms (5).
2. The integrated circuit board with good antistatic and pressure resistance according to claim 1, characterized in that: The electrostatic isolation box (2) comprises a concave-shaped box body and an electrostatic isolation box cover plate (3). A wiring opening (8) is provided on the right end surface of the electrostatic isolation box (2). Cover plate slots (4) are installed on the inner walls on both sides of the electrostatic isolation box (2). The electrostatic isolation box cover plate (3) and the cover plate slots (4) are movably connected together.
3. The integrated circuit board with good antistatic and pressure resistance according to claim 2, characterized in that: A wiring opening groove (12) is provided inside the wiring opening (8), and four sets of wiring opening wire hole covers (7) are clamped in the wiring opening groove (12), and the four sets of wiring opening wire hole covers (7) are all fan-shaped.
4. The integrated circuit board with good antistatic and pressure resistance according to claim 2, characterized in that: The anti-static mechanism (5) comprises a mounting shell, three groups of ion fans (41), a dust collection box (42) and a dust collector (43); three groups of ion fan reserved openings (44) are provided on the cover plate slot (4); the positions of the ion fans (41) correspond to the positions of the ion fan reserved openings (44); the interior of the mounting shell is provided with a dust collection box (42) and a dust collector (43); the air suction inlet of the dust collector (43) extends to the outside of the cover plate slot (4); and the dust collector (43) is connected to the dust collection box (42).
5. The integrated circuit board with good antistatic and pressure resistance according to claim 1, characterized in that: The electrostatic isolation boxes (2) and 3 are both made of an aluminum sheet (9) and a reinforcing sheet (11) bonded together, and the bonding glue is a polyethylene anti-corrosion glue (10).