Special quick cooling device for sole mold

By designing a special fast cooling device for sole molds, the circulating cooling of coolant is achieved by using a pressure pump and a semiconductor refrigeration sheet, the problem of low cooling efficiency in the prior art is solved and the rapid cooling of sole molds is achieved.

CN223045108UActive Publication Date: 2025-07-01PUTIAN CHENGXIANG HENGXIN SHOES MATERIAL CO LTD
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Patent Information

Application Number
CN202422205019.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2025-07-01
Estimated Expiration
2034-09-09

AI Technical Summary

Technical Problem

The existing sole mold cooling device has low cooling efficiency and cannot quickly cool down, resulting in inconvenience in use.

Method used

A special fast cooling device for sole molds is designed. The coolant is driven around the upper and lower mold surfaces through a pressure pump to form a large temperature difference, accelerate the heat flow to the coolant, and cool the refluxed coolant through a semiconductor refrigeration sheet to achieve rapid cooling.

Benefits of technology

It realizes rapid cooling of sole molds, improves cooling efficiency, and facilitates the use process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223045108U_ABST
Patent Text Reader

Abstract

The utility model discloses a special quick cooling device for a sole mold, which comprises a bottom plate, the left side of the top of the bottom plate is fixedly connected with a vertical plate, the top of the right side of the vertical plate is fixedly connected with a transverse plate, the bottom of the transverse plate is fixedly connected with an air cylinder, and the bottom of the air cylinder is fixedly connected with an upper mold body. A lower die body is arranged at the bottom of the upper die body, the lower die body is fixedly connected with the bottom plate, and the surface of the upper die body and the surface of the lower die body are both sleeved with cooling shells. The pressure pump is driven to work, cooling liquid enters the cooling shell and surrounds the surfaces of the upper die body and the lower die body, a large temperature difference is formed between the cooling liquid and the interior of the upper die body and the interior of the lower die body, heat is accelerated to flow to the cooling liquid, the cooling liquid flows back through the transverse pipe, the semiconductor chilling plate is used for cooling the backflow cooling liquid, and the cooling liquid is reused. In this way, the upper die body and the lower die body are rapidly cooled, and use by people is facilitated.
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Description

Technical Field

[0001] The utility model relates to the technical field of sole molds, in particular to a special rapid cooling device for sole molds. Background Technique

[0002] Shoe molds generally refer to molds for shoes such as sports shoes, beach shoes, slippers, and rubber shoes, mainly sports shoes. A mold refers to various molds and tools used in industrial production to obtain the required products through methods such as injection molding, blow molding, extrusion, die casting, or forging, smelting, stamping, and stretching. A corresponding cooling device will be equipped when the sole mold is used for injection molding of the sole.

[0003] When the existing cooling device cools the sole mold, it often cools down by natural heat dissipation or air cooling. The temperature difference between it and the inside of the mold is small, resulting in low cooling efficiency and inability to quickly cool the mold, which brings inconvenience to people's use. Therefore, a special rapid cooling device for sole molds is specifically proposed. Content of the Utility Model

[0004] The purpose of the utility model is to provide a special rapid cooling device for sole molds, which has the advantage of rapid cooling.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A special rapid cooling device for sole molds, including a bottom plate. A vertical plate is fixedly connected to the left side of the top of the bottom plate. The top of the right side of the vertical plate is fixedly connected to a horizontal plate. A cylinder is fixedly connected to the bottom of the horizontal plate. The bottom of the cylinder is fixedly connected to an upper mold body. A lower mold body is arranged at the bottom of the upper mold body. The lower mold body is fixedly connected to the bottom plate. Cooling shells are sleeved on the surfaces of both the upper mold body and the lower mold body. An injection pipe is communicated with the top of the upper mold body. A pipe cap is threadedly connected to the top of the injection pipe. Hoses are arranged on the front side and the rear side of the right side of the upper mold body. Pipes are arranged on the front side and the rear side of the right side of the lower mold body. Flow dividing plates are fixedly connected to the front side and the rear side of the center of the top of the bottom plate. The cooling shells and the flow dividing plates are communicated with the pipes. The cooling shells and the flow dividing plates are communicated with the hoses. A liquid storage tank is fixedly connected to the right side of the top of the bottom plate. A pressure pump is communicated with the front side of the bottom left of the liquid storage tank. A through pipe is communicated with the left side of the pressure pump. The through pipe is communicated with the flow dividing plate. A horizontal pipe is communicated with the rear side of the top left of the liquid storage tank. The horizontal pipe is communicated with the flow dividing plate. A semiconductor refrigeration sheet is fixedly connected to the top of the right side of the liquid storage tank. An endothermic end is fixedly connected to the left side of the semiconductor refrigeration sheet. The left side of the endothermic end penetrates into the inner cavity of the liquid storage tank. A heat dissipation end is fixedly connected to the right side of the semiconductor refrigeration sheet.

[0006] As a preferred solution, support plates are fixedly connected to both sides of the top of the liquid storage tank. A box body is fixedly connected to the top of the support plates. A motor is fixedly connected to the left side of the inner cavity top of the box body. The output end of the motor is fixedly connected to a first rotating rod. The right side of the inner cavity top of the box body is movably connected to a second rotating rod through a bearing. Heat dissipation fans are fixedly connected to the bottoms of the first rotating rod and the second rotating rod. Driving wheels are sleeved on the surfaces of the first rotating rod and the second rotating rod. The two driving wheels are connected by a belt drive. Openings are formed in the top and bottom of the box body. Dust-proof nets are fixedly connected to the top and bottom of the box body.

[0007] As a preferred solution, a liquid inlet pipe is communicated with the right side of the top of the liquid storage tank. A sealing cover is threadedly connected to the top of the surface of the liquid inlet pipe.

[0008] As a preferred solution, a temperature detection sensor is fixedly connected to the right side of the liquid storage tank. A detection probe is fixedly connected to the left side of the temperature detection sensor. The left side of the detection probe penetrates through to the inner cavity of the liquid storage tank.

[0009] As a preferred solution, a liquid discharge pipe is communicated with the bottom of the right side of the liquid storage tank. A valve is fixedly connected to the right side of the liquid discharge pipe. An observation window is fixedly connected to the front of the liquid storage tank.

[0010] As a preferred solution, a fixing plate is fixedly connected to the top of the left side of the upper die body. A slider is fixedly connected to the left side of the fixing plate. A chute adapted to the slider is formed in the top of the right side of the vertical plate.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] 1. By driving the pressure pump to work, the coolant enters the cooling shell and surrounds the surfaces of the upper die body and the lower die body, forming a large temperature difference inside the upper die body and the lower die body, accelerating the heat flow to the coolant, and flowing back through the horizontal pipe. The coolant flowing back is cooled by the semiconductor refrigeration sheet for reuse, so as to quickly cool the upper die body and the lower die body, which is convenient for people to use.

[0013] 2. By arranging a motor, a first rotating rod, a second rotating rod, driving wheels, a belt and a heat dissipation fan, the liquid storage tank can be assisted in heat dissipation to accelerate the cooling of the coolant. By arranging a liquid inlet pipe and a sealing cover, it is convenient for the user to add coolant to the liquid storage tank. By arranging a temperature sensor and a detection probe, the temperature inside the liquid storage tank can be detected. By arranging a liquid discharge pipe and a valve, the coolant in the liquid storage tank can be discharged. By arranging a fixing plate, a slider and a chute, the movement of the upper die body in the vertical direction can be made more stable. Description of the Drawings

[0014] Figure 1 It is the first three-dimensional view of the structure of the present utility model;

[0015] Figure 2 This is a schematic structural diagram of the present utility model;

[0016] Figure 3 This is the second three-dimensional view of the structure of the present utility model.

[0017] In the figure: 1, bottom plate; 2, vertical plate; 3, horizontal plate; 4, cylinder; 5, upper die body; 6, lower die body; 7, cooling shell; 8, injection molding pipe; 9, pipe cap; 10, hose; 11, conduit; 12, flow distribution plate; 13, liquid storage tank; 14, pressure pump; 15, through pipe; 16, horizontal pipe; 17, semiconductor refrigeration sheet; 18, heat absorption end; 19, heat dissipation end. Specific embodiments

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure or characteristic that can be included in at least one implementation manner of the present utility model. The "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that excludes other embodiments.

[0020] Embodiment 1:

[0021] Please refer to Figures 1-3As shown in the figure, the utility model provides a special rapid cooling device for a sole mold, which includes a bottom plate 1. A vertical plate 2 is fixedly connected to the left side of the top of the bottom plate 1. A horizontal plate 3 is fixedly connected to the top of the right side of the vertical plate 2. A cylinder 4 is fixedly connected to the bottom of the horizontal plate 3. A top mold body 5 is fixedly connected to the bottom of the cylinder 4. A bottom mold body 6 is arranged at the bottom of the top mold body 5. The bottom mold body 6 is fixedly connected to the bottom plate 1. Cooling shells 7 are sleeved on the surfaces of both the top mold body 5 and the bottom mold body 6. An injection pipe 8 is communicated with the top of the top mold body 5. A pipe cap 9 is threadedly connected to the top of the surface of the injection pipe 8. Hoses 10 are arranged on the front side and the rear side of the right side of the top mold body 5. Pipes 11 are arranged on the front side and the rear side of the right side of the bottom mold body 6. Flow dividing plates 12 are fixedly connected to the front side and the rear side of the center of the top of the bottom plate 1. The cooling shells 7 and the flow dividing plates 12 are communicated with the pipes 11. The cooling shells 7 and the flow dividing plates 12 are communicated with the hoses 10. A liquid storage tank 13 is fixedly connected to the right side of the top of the bottom plate 1. A pressure pump 14 is communicated with the front side of the left bottom of the liquid storage tank 13. A through pipe 15 is communicated with the left side of the pressure pump 14. The through pipe 15 is communicated with the flow dividing plate 12. A horizontal pipe 16 is communicated with the rear side of the left top of the liquid storage tank 13. The horizontal pipe 16 is communicated with the flow dividing plate 12. A semiconductor refrigeration sheet 17 is fixedly connected to the top of the right side of the liquid storage tank 13. An endothermic end 18 is fixedly connected to the left side of the semiconductor refrigeration sheet 17. The left side of the endothermic end 18 penetrates into the inner cavity of the liquid storage tank 13. A heat dissipation end 19 is fixedly connected to the right side of the semiconductor refrigeration sheet 17.

[0022] In this technical solution, the pressure pump 14 and the cooling shell 7 are applied. By driving the pressure pump 14 to work, the coolant enters the cooling shell 7, surrounds the surfaces of the top mold body 5 and the bottom mold body 6, forms a large temperature difference with the inside of the top mold body 5 and the bottom mold body 6, accelerates the heat flow to the coolant, and returns through the horizontal pipe 16. The semiconductor refrigeration sheet 17 cools the returned coolant for reuse, so as to quickly cool the top mold body 5 and the bottom mold body 6, which is convenient for people to use.

[0023] Embodiment Two:

[0024] On the basis of Embodiment One, the utility model is as Figure 1 and Figure 2As shown in the figure, both sides of the top of the liquid storage tank 13 are fixedly connected with support plates. The top of the support plates is fixedly connected with a box body. On the left side of the inner cavity top of the box body, a motor is fixedly connected. The output end of the motor is fixedly connected with a first rotating rod. On the right side of the inner cavity top of the box body, a second rotating rod is movably connected through a bearing. At the bottom of both the first rotating rod and the second rotating rod, a heat dissipation fan is fixedly connected. On the surfaces of both the first rotating rod and the second rotating rod, a driving wheel is sleeved. Between the two driving wheels, a belt is used for transmission connection. Openings are provided at both the top and the bottom of the box body. Dust-proof nets are fixedly connected to both the top and the bottom of the box body. On the right side of the top of the liquid storage tank 13, a liquid inlet pipe is communicated. At the top of the surface of the liquid inlet pipe, a sealing cover is threadedly connected. On the right side of the liquid storage tank 13, a temperature detection sensor is fixedly connected. On the left side of the temperature detection sensor, a detection probe is fixedly connected. The left side of the detection probe penetrates into the inner cavity of the liquid storage tank 13.

[0025] By adopting the above technical solution, through the motor, the first rotating rod, the second rotating rod, the driving wheels, the belt and the heat dissipation fan, the liquid storage tank 13 can be assisted in heat dissipation to accelerate the cooling of the coolant. Through the liquid inlet pipe and the sealing cover, it is convenient for the user to add coolant to the liquid storage tank 13. Through the temperature sensor and the detection probe, the temperature inside the liquid storage tank 13 can be detected.

[0026] Embodiment 3:

[0027] The present utility model is as Figure 1 and Figure 2 As shown in the figure, at the bottom of the right side of the liquid storage tank 13, a liquid discharge pipe is communicated. On the right side of the liquid discharge pipe, a valve is fixedly connected. On the front surface of the liquid storage tank 13, an observation window is fixedly connected. On the top of the left side of the upper die body 5, a fixing plate is fixedly connected. On the left side of the fixing plate, a sliding block is fixedly connected. On the top of the right side of the vertical plate 2, a sliding groove adapted to the sliding block is provided.

[0028] By adopting the above technical solution, through the liquid discharge pipe and the valve, the coolant in the liquid storage tank 13 can be discharged. Through the fixing plate, the sliding block and the sliding groove, the movement of the upper die body 5 in the vertical direction can be made more stable.

[0029] The working principle of the present utility model is as follows: The pressure pump 14 operates, and the coolant in the liquid storage tank 13 enters the cooling shell 7 through the through pipe 15, the flow dividing plate 12, the hose 10 and the conduit 11 to cool down the upper die body 5 and the lower die body 6. After absorbing heat, the coolant flows back to the liquid storage tank 13 through the conduit 11, the hose 10, the flow dividing plate 12 and the cross pipe 16. The semiconductor refrigeration sheet 17 operates to cool down the coolant. The temperature in the liquid storage tank 13 is detected by the temperature detection sensor. The motor operates to drive the first rotating rod to rotate, and the second rotating rod is driven to rotate through the driving wheel and the belt. The first rotating rod and the second rotating rod drive the two cooling fans to rotate to assist in dissipating heat from the liquid storage tank 13 and accelerate the cooling of the coolant, so as to form a large temperature difference between the coolant and the upper die body 5 and the lower die body 6, achieving the purpose of rapid cooling and facilitating people's use.

[0030] Importantly, it should be noted that the construction and arrangement of the present application shown in multiple different exemplary embodiments are only illustrative. Although only a few embodiments are described in detail in this disclosure, those who refer to this disclosure should easily understand that many modifications are possible without substantially departing from the novel teachings and advantages of the subject matter described in this application (for example, the dimensions, scales, structures, shapes and proportions of various components, as well as parameter values (such as temperature, pressure, etc.), installation arrangements, use of materials, color, orientation changes, etc.). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature, number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the present utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means-plus-function" clause is intended to cover the structure that performs the recited function herein, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present utility model. Therefore, the present utility model is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0031] In addition, in order to provide a concise description of the exemplary embodiments, not all features of the actual embodiments may be described (i.e., those features that are not relevant to the currently considered best mode of implementing the present utility model, or those features that are not relevant to the implementation of the present utility model).

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the present utility model. Although the present utility model has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present utility model.

Claims

1. A rapid cooling device for a sole mold, comprising a bottom plate (1), characterized in that: The left side of the top of the bottom plate (1) is fixedly connected to a vertical plate (2), the top of the right side of the vertical plate (2) is fixedly connected to a horizontal plate (3), the bottom of the horizontal plate (3) is fixedly connected to a cylinder (4), the bottom of the cylinder (4) is fixedly connected to an upper mold body (5), the bottom of the upper mold body (5) is provided with a lower mold body (6), the lower mold body (6) and the bottom plate (1) are fixedly connected, the surfaces of the upper mold body (5) and the lower mold body (6) are both sleeved with a cooling shell (7), the top of the upper mold body (5) is connected to an injection molding pipe (8), the top of the surface of the injection molding pipe (8) is threadedly connected to a pipe cover (9), the front and rear sides of the right side of the upper mold body (5) are both provided with a hose (10), the front and rear sides of the right side of the lower mold body (6) are both provided with a conduit (11), the front and rear sides of the top axis of the bottom plate (1) are fixedly connected to a diverter plate (12), the cooling shell (7) and the diverter plate (12) and the conduit (11) are all connected, the cooling shell (7) and the diverter plate (12) are all connected with the hose (10), the right side of the top of the bottom plate (1) is fixedly connected with a liquid storage tank (13), the front side of the left bottom of the liquid storage tank (13) is connected with a pressure pump (14), the left side of the pressure pump (14) is connected with a through pipe (15), the through pipe (15) and the diverter plate (12) are connected, the rear side of the left top of the liquid storage tank (13) is connected with a transverse pipe (16), the transverse pipe (16) and the diverter plate (12) are connected, the top of the right side of the liquid storage tank (13) is fixedly connected with a semiconductor cooling plate (17), the left side of the semiconductor cooling plate (17) is fixedly connected with a heat absorbing end (18), the left side of the heat absorbing end (18) penetrates into the inner cavity of the liquid storage tank (13), and the right side of the semiconductor cooling plate (17) is fixedly connected with a heat dissipation end (19).

2. A rapid cooling device for sole mold according to claim 1, characterized in that: Both sides of the top of the liquid storage box (13) are fixedly connected to support plates, the top of the support plates is fixedly connected to the box body, the left side of the top of the box inner cavity is fixedly connected to a motor, the output end of the motor is fixedly connected to a first rotating rod, the right side of the top of the box inner cavity is movably connected to a second rotating rod via a bearing, the bottoms of the first rotating rod and the second rotating rod are fixedly connected to a cooling fan, the surfaces of the first rotating rod and the second rotating rod are both sleeved with driving wheels, the two driving wheels are connected via a belt drive, the top and bottom of the box body are both opened, and the top and bottom of the box body are fixedly connected to a dustproof net.

3. The rapid cooling device for sole mold according to claim 1, characterized in that: The right side of the top of the liquid storage box (13) is connected to a liquid inlet pipe, and the top of the surface of the liquid inlet pipe is threadedly connected to a sealing cover.

4. A rapid cooling device for sole mold according to claim 1, characterized in that: A temperature detection sensor is fixedly connected to the right side of the liquid storage tank (13), a detection probe is fixedly connected to the left side of the temperature detection sensor, and the left side of the detection probe penetrates into the inner cavity of the liquid storage tank (13).

5. The rapid cooling device for sole mold according to claim 1, characterized in that: The bottom of the right side of the liquid storage box (13) is connected to a liquid discharge pipe, a valve is fixedly connected to the right side of the liquid discharge pipe, and an observation window is fixedly connected to the front side of the liquid storage box (13).

6. The rapid cooling device for sole mold according to claim 1, characterized in that: A fixed plate is fixedly connected to the top of the left side of the upper mold body (5), a sliding block is fixedly connected to the left side of the fixed plate, and a sliding groove matching the sliding block is provided at the top of the right side of the vertical plate (2).