Blind hole offset detection structure and circuit board drilling offset test module

Abstract

The utility model relates to a blind hole offset detection structure and a circuit board drilling offset test module, the blind hole offset detection structure comprises a base body, a first input gasket, a first output gasket and a plurality of first contact gaskets, and the first input gasket, the first output gasket and the first contact gaskets are all arranged on the surface of the base body and can conduct electricity. The first input gasket and the first output gasket are electrically connected with the first contact gaskets respectively, the first contact gaskets are arranged at intervals, and the interval distance is within the deviation range of the first blind hole. The first input gasket and the first output gasket are electrically connected with a first contact gasket, during testing, conduction of the first input gasket and the first output gasket can be used for detecting whether the first contact gaskets are conducted or not, the first contact gaskets are arranged at intervals, and the interval distance is within the deviation range of the first blind hole; whether the first blind hole deviates from the preset position can be detected, the structure is simple, the alignment of the blind holes can be detected, and the detection efficiency of the alignment of the blind holes is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection, in particular to a blind hole offset detection structure and a circuit board drilling offset test module. Background Art

[0002] In the technical field of blind hole quality detection, during the process of manufacturing blind holes on a circuit board, blind hole quality problems often occur. For example, abnormal blind holes or misaligned blind holes are generated. Abnormal blind holes usually result in micro-break or micro-open circuit states, and misaligned blind holes usually result in short circuit states, leading to market problems for batch circuit boards. Therefore, in the production of circuit boards, it is usually necessary to detect the blind holes provided on the circuit board to improve the quality of the circuit board. The existing blind hole detection structures for detecting blind holes on circuit boards are complex in structure, occupy a large area of the substrate, and have low detection efficiency. Therefore, it is necessary to provide a blind hole offset detection structure and a circuit board drilling offset test module with a simple structure and high detection efficiency to solve the above technical problems. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a blind hole offset detection structure and a circuit board drilling offset test module, which have a simple structure, can detect the alignment of blind holes, and improve the detection efficiency of blind hole alignment.

[0004] A blind hole offset detection structure includes a base body, a first input gasket, a first output gasket, and a plurality of first contact gaskets. The first input gasket, the first output gasket, and the first contact gaskets are all arranged on the surface of the base body and can conduct electricity. The first input gasket and the first output gasket are respectively electrically connected to one of the first contact gaskets. The first contact gaskets are arranged at intervals, and the interval distance is within the range of the first blind hole offset.

[0005] In the blind hole offset detection structure provided in this application, the first input gasket, the first output gasket, and the first contact gaskets are all arranged on the surface of the base body and can conduct electricity. The first input gasket and the first output gasket are electrically connected to one of the first contact gaskets. During testing, conducting the first input gasket and the first output gasket can be used to detect whether the first contact gaskets are conducting. The first contact gaskets are arranged at intervals, and the interval distance is within the range of the first blind hole offset, so as to detect whether the first blind hole deviates from the preset position. The structure is simple, can detect the alignment of blind holes, and improves the detection efficiency of blind hole alignment.

[0006] In one embodiment, the first contact gasket is in a long strip shape, and the first contact gaskets are arranged in a staggered manner in the length direction.

[0007] In one embodiment, the first contact pad includes a first outer ring pad and a first inner ring pad that are strip-shaped. The first outer ring pad and the first inner ring pad are arranged with a dislocation in the length direction. The first outer ring pad and the first inner ring pad are spaced apart in the width direction, and the spacing distance is within the offset range of the first blind hole. At least a part of the first inner ring pad is opposite to the first outer ring pad in the width direction.

[0008] In one embodiment, adjacent first inner ring pads are spaced opposite to each other in the length direction, and adjacent first outer ring pads are spaced opposite to each other in the length direction.

[0009] In one embodiment, both the first outer ring pad and the first inner ring pad are arc-shaped. The first outer ring pads are arranged in a ring, and the first inner ring pads are arranged in a ring.

[0010] In one embodiment, it further includes a second input pad, a second output pad, and a second contact pad that are provided on the surface of the substrate and can conduct electricity. The second input pad and the second output pad are respectively electrically connected to one of the second contact pads; the second contact pads are spaced apart from each other, and the spacing distance is within the offset range of the second blind hole.

[0011] In one embodiment, the second contact pad includes a second outer ring pad and a second inner ring pad that are strip-shaped. The second outer ring pad and the second inner ring pad are arranged with a dislocation in the length direction. The second outer ring pad and the second inner ring pad are spaced apart in the width direction, and the spacing distance is within the offset range of the second blind hole. At least a part of the second inner ring pad is opposite to the second outer ring pad in the width direction.

[0012] In one embodiment, adjacent second inner ring pads are spaced opposite to each other in the length direction, and adjacent second outer ring pads are spaced opposite to each other in the length direction. The second outer ring pad and the second inner ring pad are both arc-shaped. The second outer ring pads are arranged in a ring, and the second inner ring pads are arranged in a ring.

[0013] In one embodiment, the first contact pads are arranged in a ring around the periphery of the second contact pad, and the second contact pads are arranged in a ring around the second input pad and the second output pad.

[0014] A circuit board drilling offset test module, characterized in that it includes a circuit board and a blind hole offset detection structure. The first surface of the circuit board is provided with the first blind hole and the second blind hole. The blind hole offset detection structure is provided on the first surface, and the first blind hole is located between two adjacent first contact pads, and the second blind hole is located between two adjacent second contact pads.

[0015] In the circuit board drilling offset test module provided by the present application, the blind hole offset detection structure is arranged on the first surface of the circuit board. The first surface of the circuit board is provided with a first blind hole and a second blind hole. By arranging the blind hole offset detection structure above the circuit board, aligning the first blind hole between two adjacent first contact pads, and placing the second blind hole between two adjacent second contact pads, it is possible to detect whether the first blind hole and the second blind hole deviate from the preset positions, so as to quantify the offset value. The above-mentioned blind hole circuit board drilling offset test module is easy to operate, can be provided with multiple first blind holes and multiple second blind holes, and can test multiple first blind holes and multiple second blind holes simultaneously, which can improve the detection efficiency of the circuit board drilling offset test module. Description of the Drawings

[0016] The following further describes the present invention in conjunction with the drawings and embodiments, where:

[0017] Figure 1 It is a schematic structural diagram of the blind hole offset detection structure provided by an embodiment of the present application;

[0018] Figure 2 It is a schematic diagram during the test of the blind hole offset detection structure provided by an embodiment of the present application.

[0019] Reference numerals: blind hole offset detection structure 10; substrate 20; first input pad 30; first output pad 40; first contact pad 50; first outer ring pad 51; first inner ring pad 52; second input pad 60; second output pad 70; second contact pad 80; second outer ring pad 81; second inner ring pad 82; first blind hole 91; second blind hole 92 Detailed Embodiments

[0020] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given in conjunction with the drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0021] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0022] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0023] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0024] In the process of circuit board production, blind vias are usually made by laser drilling. During the process of making blind vias on the circuit board, blind via quality problems often occur. It may cause the inner layer of the circuit board to shift due to laser deviation. During the production process, the inner layer shift cannot be confirmed in time and can only be discovered after the electrical test is completed, resulting in waste of production costs. For example, abnormal blind vias or misaligned blind vias occur. Abnormal blind vias usually lead to micro-break or micro-open circuit states, and misaligned blind vias usually lead to short circuit states, resulting in market problems for batch circuit boards. Therefore, in the production of circuit boards, it is usually necessary to detect the blind vias provided on the circuit board to improve the quality of the circuit board. The existing blind via detection structures for detecting blind vias on circuit boards are complex in structure, occupy a large area of the substrate, and have low detection efficiency. Therefore, it is necessary to provide a blind via offset detection structure 10 with a simple structure and high detection efficiency to solve the above technical problems.

[0025] Reference Figure 1 and Figure 2 To solve the above problems, an embodiment of the present application provides a blind hole offset detection structure 10, which includes a substrate 20, a first input gasket 30, a first output gasket 40, and a plurality of first contact gaskets 50. The first input gasket 30, the first output gasket 40, and the first contact gaskets 50 are all disposed on the surface of the substrate 20 and can conduct electricity. The first input gasket 30 and the first output gasket 40 are respectively electrically connected to a first contact gasket 50. The first contact gaskets 50 are spaced apart from each other, and the spacing distance is within the offset range of the first blind hole 91.

[0026] In the blind hole offset detection structure 10, the blind hole offset detection structure 10 includes a substrate 20, a first input gasket 30, a first output gasket 40, and a plurality of first contact gaskets 50. The blind hole offset detection structure 10 provided in this embodiment is disposed in a circuit board and is used to detect whether the alignment of the blind holes in the circuit board is qualified. The "alignment" refers to the alignment accuracy of the blind holes with respect to the pattern. In this embodiment, the circuit board is a multi-layer board, including an outer layer and a plurality of inner layers. A blind hole refers to a via hole that connects an outer layer of the multi-layer board and a part of the inner layers.

[0027] In some embodiments, the substrate 20 can be a base plate, and the plate-like structure is relatively thin for easy testing. The first input gasket 30, the first output gasket 40, and the first contact gasket 50 are all disposed on the surface of the substrate 20 and can conduct electricity. The first output gasket 40 is electrically connected to a first contact gasket 50. During testing, conducting the first input gasket 30 and the first output gasket 40 can be used to detect whether the first contact gaskets 50 are conducting. The first contact gaskets 50 are spaced apart and the spacing distance is within the offset range of the first blind hole 91, thereby detecting whether the first blind hole 91 deviates from the preset position to achieve quantification of the offset value. The above blind hole offset detection structure 10 is simple and has high detection efficiency. Specifically, the first input gasket 30 can be circular or annular, and the first output gasket 40 can be circular or annular. The first contact gasket 50 can be strip-shaped, and the first contact gaskets 50 are arranged in a staggered manner in the length direction. In some embodiments, there is a gap between the first input gasket 30 and the first contact gasket 50, and there is a gap between the first output gasket 40 and the first contact gasket 50. In some embodiments, the first input gasket 30 is electrically connected to a first contact gasket 50. Specifically, a first lead wire can be provided, and the first lead wire is used to connect the first input gasket 30 and a first contact gasket 50 to achieve electrical connection between the two. Correspondingly, the first output gasket 40 is electrically connected to a first contact gasket 50. Specifically, a second lead wire can be provided, and the second lead wire is used to connect the first output gasket 40 and a first contact gasket 50 to achieve electrical connection between the two. The first contact gaskets 50 are spaced apart, and the spacing distance is within the offset range of the first blind hole 91. A plurality of first contact gaskets 50 can form an approximately annular structure, that is, a plurality of strip-shaped first contact gaskets 50 surround one or more annular structures, and the annular structures are concentrically arranged. The spacing between the first contact gaskets 50 is a first preset spacing, and the first preset spacing is within the offset range of the first blind hole 91.

[0028] Refer to Figure 1 and Figure 2, during detection, the alignment of multiple first blind holes 91 can be detected by the electrical connection state between the first input gasket 30 and the first output gasket 40. Specifically, if a closed-loop conduction is formed among the first input gasket 30, the first contact gasket 50, and the first output gasket 40, resulting in a short circuit, it is determined that the alignment of the first blind holes 91 is qualified. On the contrary, if there is no conduction among the first input gasket 30, the first contact gasket 50, and the first output gasket 40, it is determined that the alignment of the first blind holes 91 is unqualified, that is, the first blind holes 91 are offset, and the offset distance of the first blind holes 91 exceeds the first preset spacing. Therefore, by detecting the electrical conduction state of the first input gasket 30, the first contact gasket 50, and the first output gasket 40, the alignment accuracy of multiple first blind holes 91 can be detected simultaneously. The structure is simple, capable of detecting the alignment of blind holes, and improving the detection efficiency of the alignment of blind holes.

[0029] Continue to refer to Figure 1 and Figure 2 , in some embodiments, the first contact gasket 50 includes a first outer ring gasket 51 and a first inner ring gasket 52 in a strip shape. During inspection, when the first input gasket 30 and the first output gasket 40 are connected to electricity, the current can sequentially pass through the first input gasket 30, the first inner ring gasket 52, the first outer ring gasket 51, and the first output gasket 40. In some embodiments, both the first outer ring gasket 51 and the first inner ring gasket 52 are arc-shaped, and the first outer ring gaskets 51 are arranged in a ring, that is, multiple first outer ring gaskets 51 are located on one ring, and the first inner ring gaskets 52 are arranged in a ring, that is, multiple first inner ring gaskets 52 are located on another ring. For example, the trajectories of the arrangement of the first inner ring gasket 52 and the first outer ring gasket 51 can be two concentric circles. The first inner ring gasket 52 is located on the circumference of the smaller circle, and the first outer ring gasket 51 is located on the circumference of the larger circle. There is a certain interval between the first inner ring gasket 52 and the corresponding first outer ring gasket 51, and the interval can be set as the preset spacing. The first outer ring gasket 51 and the first inner ring gasket 52 are arranged with a dislocation in the length direction, and are spaced in the width direction, and the spacing distance is within the offset range of the first blind holes 91. At least part of the area of the first inner ring gasket 52 is opposite to the first outer ring gasket 51 in the width direction. Multiple first blind holes 91 are arranged between the first inner ring gasket 52 and the first outer ring gasket 51, which is convenient for the production of etching, realizes the detection of small-distance offsets, and further improves the detection accuracy. Detecting the alignment of multiple first blind holes 91 simultaneously can improve the detection efficiency of the alignment of blind holes. By detecting whether the structure is in a short-circuit state to detect the alignment of the first blind holes 91, there is no need to test the blind holes one by one through the combination of multiple modules in the prior art. The structure is simple and can improve the detection efficiency.

[0030] Refer to Figure 2, is a schematic diagram during the test of the blind hole offset detection structure 10. During the test, the width of the first contact pad 50 of the blind hole offset detection structure 10 is 0.2 mm, and the interval between the first outer ring pad 51 and the first inner ring pad 52 is 30 μm. In one embodiment, the blind hole offset detection structure 10 includes five first inner ring pads 52 and four first outer ring pads 51, where the five first inner ring pads 52 are sequentially located on the circumference of a circle, and the four outer ring pads are sequentially located on the circumference of another circle, and the above two circles are concentric circles. Further, 8 blind holes can be tested in the interval between the first inner ring pad 52 and the first outer ring pad 51. Testing multiple blind holes simultaneously can improve the detection efficiency of the blind hole offset detection structure 10.

[0031] Reference Figure 1 , the blind hole offset detection structure 10 further includes a second input pad 60, a second output pad 70, and a second contact pad 80 that are provided on the surface of the substrate 20 and can conduct electricity. The second input pad 60 and the second output pad 70 are respectively electrically connected to a second contact pad 80, and the second contact pads 80 are arranged at intervals, and the interval distance is within the offset range of the second blind hole 92. The second input pad 60 can be circular or annular, and the second output pad 70 can be circular or annular. The second contact pad 80 can be in a strip shape, and the second contact pads 80 are arranged in a staggered manner in the length direction. In some embodiments, there is an interval between the second input pad 60 and the second contact pad 80, and there is an interval between the second output pad 70 and the second contact pad 80. In some embodiments, the second input pad 60 is electrically connected to a second contact pad 80. Specifically, a third lead can be provided, and the third lead is used to connect the second input pad 60 and a second contact pad 80 to achieve electrical connection between the two. Correspondingly, the second output pad 70 is electrically connected to a second contact pad 80. Specifically, a fourth lead can be provided, and the fourth lead is used to connect the second output pad 70 and a second contact pad 80 to achieve electrical connection between the two. The second contact pads 80 are arranged at intervals, and the interval distance is within the offset range of the second blind hole 92. Multiple second contact pads 80 can form an approximately annular structure, that is, multiple strip-shaped second contact pads 80 surround one or more annular structures, and the annular structures are concentrically arranged. The interval between the second contact pads 80 is a second preset interval, and the second preset interval is within the offset range of the second blind hole 92.

[0032] In some embodiments, the second contact gasket 80 includes a second outer ring gasket 81 and a second inner ring gasket 82 in the shape of a long strip. During inspection, when the second input gasket 60 and the second output gasket 70 are energized, the current can sequentially pass through the second input gasket 60, the second inner ring gasket 82, the second outer ring gasket 81, and the second output gasket 70. In some embodiments, both the second outer ring gasket 81 and the second inner ring gasket 82 are arc-shaped, and the second outer ring gaskets 81 are arranged in a ring, that is, a plurality of second outer ring gaskets 81 are located on one ring, and the second inner ring gaskets 82 are arranged in a ring, that is, a plurality of second inner ring gaskets 82 are located on another ring. For example, the trajectories of the second inner ring gasket 82 and the second outer ring gasket 81 can be two concentric circles, the second inner ring gasket 82 is located on the circumference of the smaller circle, and the second outer ring gasket 81 is located on the circumference of the larger circle. There is a certain interval between the second inner ring gasket 82 and the corresponding second outer ring gasket 81, and the interval can be set to a preset distance. The second outer ring gasket 81 and the second inner ring gasket 82 are arranged with a dislocation in the length direction, and the second outer ring gasket 81 and the second inner ring gasket 82 are spaced in the width direction, and the spacing distance is within the offset range of the second blind hole 92. At least a part of the second inner ring gasket 82 is opposite to the second outer ring gasket 81 in the width direction. A plurality of second blind holes 92 are arranged between the second inner ring gasket 82 and the second outer ring gasket 81, which is convenient for the production of etching, realizes the detection of small-distance offset, and further improves the detection accuracy. During detection, the specific operation and the method of judging whether there is an offset are the same as those of the first contact gasket 50, and will not be elaborated here. The first contact gaskets 50 are arranged in a ring around the periphery of the second contact gasket 80, and the second contact gaskets 80 are arranged in a ring around the second input gasket 60 and the second output gasket 70. During testing, the conduction tests of the first contact gasket 50 and the second contact gasket 80 can be carried out simultaneously, and the tests between the two do not affect each other, which can effectively improve the testing efficiency.

[0033] Refer to Figure 1 , when setting the blind hole offset detection structure 10, the spacing of the blind hole offset can be preset in the engineering data first, that is, the preset spacing. Further, laser holes are drilled on the substrate 20. Further, exposure and development are carried out on the circuit layer. Finally, the laser holes and the first input gasket 30, the first output gasket 40, a plurality of first contact gaskets 50, the second input gasket 60, the second output gasket 70, and the second contact gasket 80 for detecting the offset degree are plated with copper. In some embodiments, the above-mentioned gaskets can be set as copper sheets.

[0034] The circuit board drilling offset test module according to the second aspect of the present utility model includes a circuit board and the blind hole offset detection structure 10 of the first aspect embodiment. A first blind hole 91 and a second blind hole 92 are formed on the first surface of the circuit board, and the first blind hole 91 and the second blind hole 92 are blind holes to be detected. The blind hole offset detection structure 10 is arranged on the first surface of the circuit board. By setting the blind hole offset detection structure 10 above the circuit board, aligning the first blind hole 91 between two adjacent first contact pads 50, and placing the second blind hole 92 between two adjacent second contact pads 80, it can be detected whether the first blind hole 91 and the second blind hole 92 deviate from the preset positions, and the alignment degree of the blind holes can be detected, improving the detection efficiency of the blind hole alignment degree. The above-mentioned blind hole circuit board drilling offset test module is simple to operate. Multiple first blind holes 91 and multiple second blind holes 92 can be set to test multiple first blind holes 91 and multiple second blind holes 92 simultaneously, improving the detection efficiency of the circuit board drilling offset test module. Since this embodiment adopts the technical features of the angle adjustment bracket of the first aspect embodiment, this embodiment has the beneficial effects brought by the first aspect embodiment, which will not be elaborated here.

[0035] The above embodiments only represent several implementation manners of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A blind hole offset detection structure, characterized in that: It includes a substrate, a first input pad, a first output pad and multiple first contact pads. The first input pad, the first output pad and the first contact pad are all arranged on the surface of the substrate and are capable of conducting electricity. The first input pad and the first output pad are respectively electrically connected to one of the first contact pads. The first contact pads are spaced apart and the spacing distance is within the first blind hole offset range.

2. The blind hole offset detection structure according to claim 1, characterized in that: The first contact pad is in the shape of a long strip and is staggered in the length direction.

3. The blind hole offset detection structure according to claim 2, characterized in that: The first contact gasket includes a first outer ring gasket and a first inner ring gasket in the form of long strips. The first outer ring gasket and the first inner ring gasket are staggered in the length direction, and the first outer ring gasket and the first inner ring gasket are spaced apart in the width direction. The spacing distance is within the offset range of the first blind hole, and at least a partial area of ​​the first inner ring gasket is opposite to the first outer ring gasket in the width direction.

4. The blind hole offset detection structure according to claim 3, characterized in that: The adjacent first inner ring gaskets are spaced apart from each other in the length direction, and the adjacent first outer ring gaskets are spaced apart from each other in the length direction.

5. The blind hole offset detection structure according to claim 3, characterized in that: The first outer ring gasket and the first inner ring gasket are both arc-shaped, and the first outer ring gaskets are arranged in a ring shape, and the first inner ring gaskets are arranged in a ring shape.

6. The blind hole offset detection structure according to claim 1, characterized in that: It also includes a second input pad, a second output pad and a second contact pad which are arranged on the surface of the substrate and are capable of conducting electricity. The second input pad and the second output pad are electrically connected to a second contact pad respectively. The second contact pads are arranged at intervals, and the interval distance is within the second blind hole offset range.

7. The blind hole offset detection structure according to claim 6, characterized in that: The second contact gasket includes a second outer ring gasket and a second inner ring gasket in the form of long strips. The second outer ring gasket and the second inner ring gasket are staggered in the length direction, and the second outer ring gasket and the second inner ring gasket are spaced apart in the width direction. The spacing distance is within the second blind hole offset range, and at least a partial area of ​​the second inner ring gasket is opposite to the second outer ring gasket in the width direction.

8. The blind hole offset detection structure according to claim 7, characterized in that: Adjacent second inner ring gaskets are spaced opposite to each other in the length direction, adjacent second outer ring gaskets are spaced opposite to each other in the length direction, the second outer ring gaskets and the second inner ring gaskets are both arc-shaped, the second outer ring gaskets are arranged in a ring shape, and the second inner ring gaskets are arranged in a ring shape.

9. The blind hole offset detection structure according to claim 6, characterized in that: Each of the first contact pads is arranged in a ring around the periphery of the second contact pad, and each of the second contact pads is arranged in a ring around the second input pad and the second output pad.

10. A circuit board drilling deviation test module, characterized in that: The invention comprises a circuit board and the blind hole offset detection structure of claim 6, wherein the first blind hole and the second blind hole are formed on the first surface of the circuit board, the blind hole offset detection structure is arranged on the first surface, and the first blind hole is located between two adjacent first contact pads, and the second blind hole is located between two adjacent second contact pads.

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