Infrared sensor and detection assembly
By adopting a layered structure design in infrared sensors, the induction chip is avoided from being heated for a long time, the problem of degradation in induction chip performance is solved and the service life of the induction chip is extended.
Patent Information
- Application Number
- CN202422277960.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-18
AI Technical Summary
In existing infrared sensors, the performance of the induction chip is degraded due to long-term heat, which in severe cases causes failure of internal electrical components of the chip and shortens the chip life.
The layered structure design is adopted, and the induction chip, conductive bracket and signal acquisition chip are laminated in the first direction. The outer shell has a cavity and a photosensitive hole. The conductive bracket is electrically connected to the induction chip and signal acquisition chip. The outer shell serves as a thermal insulation function to avoid heat conduction to the induction chip.
Effectively prevent the heat generated by the circuit board and signal acquisition chip from being transmitted to the induction chip, reduce the impact of heat on the induction chip, and extend the service life of the induction chip.
Smart Images
Figure CN223050668U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and particularly relates to an infrared sensor and a detection component. Background Art
[0002] Existing infrared sensors generally include an induction chip and a signal acquisition chip. The induction chip is disposed on the signal acquisition chip. In this way, the heat generated by the signal acquisition chip during operation is directly conducted to the induction chip, and the induction chip being heated for a long time will cause the performance of the chip to decline. Seriously, it will cause the internal electrical components of the chip to fail, thereby shortening the lifespan of the chip. Summary of the Utility Model
[0003] The main purpose of the utility model is to propose an infrared sensor and a detection component, aiming to avoid the induction chip being heated for a long time, reduce the influence of heat on the chip performance, and extend the service life of the induction chip.
[0004] To achieve the above object, the infrared sensor proposed by the utility model includes:
[0005] A housing having a cavity and a photosensitive hole communicating with the cavity;
[0006] An induction chip disposed in the cavity, the induction chip being arranged facing the photosensitive hole, and the induction chip being used for outputting an induction signal representing an infrared signal being sensed;
[0007] A signal acquisition chip disposed in the cavity, the signal acquisition chip having a signal output pin for electrically connecting to an external circuit board, and the signal acquisition chip being used for acquiring the induction signal output by the induction chip;
[0008] A conductive bracket disposed in the cavity, the conductive bracket being electrically connected to the induction chip and the signal acquisition chip respectively, and the induction chip, the conductive bracket and the signal acquisition chip are stacked along a first direction.
[0009] In one embodiment, the conductive bracket has opposite first and second ends along the first direction, the first end is electrically connected to the induction chip, and the second end is electrically connected to the signal acquisition chip.
[0010] In one embodiment, the contact surface of the conductive bracket and the induction chip is a plane;
[0011] And / or, the contact surface of the conductive bracket and the signal acquisition chip is a plane.
[0012] In one embodiment, the conductive bracket includes a first conductive part and a second conductive part, the first conductive part and the second conductive part are arranged at intervals along a second direction, the first conductive part, the sensing chip, the second conductive part and the signal acquisition chip enclose a heat dissipation space, and the first direction intersects with the second direction.
[0013] In one embodiment, the signal acquisition chip includes a wafer, a package and a pad, and the package is coated on the wafer;
[0014] Part of the pad is arranged in the package body, and another part of the pad is exposed on a side of the package body facing the conductive support and is electrically connected to the conductive support.
[0015] In one embodiment, the outer shell includes a base and a shell body connected with the base to enclose the cavity.
[0016] In one embodiment, the base is provided with a limiting groove, the bottom of the package body is arranged in the limiting groove, the package body partially extends out of the limiting groove, and the pad is arranged on a side of the package body away from the limiting groove.
[0017] In one embodiment, the infrared sensor further includes a filter, which is disposed at the photosensitive hole and is used to filter light other than infrared light.
[0018] The utility model also provides a detection component, including a circuit board; and / or the infrared sensor as described above.
[0019] The technical solution of the utility model is to define a shell with a cavity and a photosensitive hole connected to the cavity, a sensing chip is arranged in the cavity, the sensing chip is arranged toward the photosensitive hole, a signal acquisition chip is arranged in the cavity for being electrically connected to a circuit board, and a conductive bracket is arranged in the cavity, and the conductive bracket is electrically connected to the sensing chip and the signal acquisition chip respectively; in this way, in actual application, the signal acquisition chip collects the sensing signal output by the sensing chip through the conductive bracket, and outputs the collected sensing signal to the circuit board to realize signal transmission, and the shell plays a heat insulation role to prevent the heat of the circuit board from being transferred to the sensing chip through the air to form interference, causing signal fluctuations. Since the sensing chip, the conductive bracket and the signal acquisition chip are stacked along the first direction, the layered structure can also prevent the heat generated by the circuit board and the heat generated by the signal acquisition chip from being transferred to the sensing chip to form interference, causing signal fluctuations, thereby avoiding the sensing chip from being heated for a long time, reducing the influence of heat on the performance of the sensing chip, and extending the service life of the sensing chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings here are incorporated into the specification and form a part of this specification, showing embodiments in line with the present utility model, and are used together with the specification to explain the principles of the present utility model.
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.
[0022] Figure 1 Structural schematic diagram of the infrared sensor provided by the present utility model;
[0023] Figure 2 is Figure 1 front view of
[0024] Figure 3 is Figure 1 structural schematic diagram of removing the housing body in
[0025] Figure 4 is Figure 1 exploded view of
[0026] Explanation of the reference numerals in the drawings:
[0027] 100, infrared sensor; 1, housing; 11, base; 111, photosensitive hole; 113, limiting groove; 12, housing body; 13, cavity; 2, induction chip; 3, signal acquisition chip; 31, wafer; 32, encapsulation body; 33, pad; 4, conductive bracket; 41, first end; 42, second end; 43, first conductive part; 44, second conductive part; 5, heat dissipation space; 6, light filtering element.
[0028] The realization of the objectives, functional features, and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners
[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.
[0030] Existing infrared sensors generally include a sensing chip and a signal acquisition chip. The sensing chip is disposed on the signal acquisition chip. In this way, the heat generated by the signal acquisition chip during operation is directly conducted to the sensing chip. However, long-term heating of the sensing chip will cause the sensing performance of the chip to decline, and in severe cases, it will cause the internal electrical components of the chip to fail, resulting in a shortened chip lifespan.
[0031] Therefore, the present utility model proposes an infrared sensor 100, aiming to avoid the long-term heating of the sensing chip 2, reduce the influence of heating on the chip performance, and extend the service life of the sensing chip 2.
[0032] Refer to Figures 1 to 4 , in an embodiment of the present utility model, the infrared sensor 100 includes:
[0033] A housing 1, having a cavity 13 and a light-sensitive hole 111 communicating with the cavity 13;
[0034] A sensing chip 2, disposed in the cavity 13, the sensing chip 2 is arranged facing the light-sensitive hole 111, and the sensing chip 2 is used to output a sensing signal representing the sensed infrared signal;
[0035] A signal acquisition chip 3, disposed in the cavity 13, used for electrical connection to a circuit board, the signal acquisition chip 3 is used to collect the sensing signal output by the sensing chip 2 and output it to the circuit board;
[0036] A conductive bracket 4, disposed in the cavity 13, the conductive bracket 4 is electrically connected to the sensing chip 2 and the signal acquisition chip 3 respectively, and the sensing chip 2, the conductive bracket 4 and the signal acquisition chip 3 are stacked in a first direction.
[0037] In this embodiment, the housing 1 can be set according to the installation requirements of the sensing chip 2, the signal acquisition chip 3 and the conductive bracket 4. Specifically, refer to Figure 1 , the housing 1 is an overall cylindrical structure. The housing 1 has a cavity 13 and a light-sensitive hole 111 communicating with the cavity 13, and the light-sensitive hole 111 is provided at the top of the housing 1. The housing 1 plays a heat insulation role, avoiding the heat of the circuit board being transmitted to the sensing chip 2 through the air to form interference and causing signal fluctuations.
[0038] The sensing chip 2 can be implemented by a ceramic sensing chip 2. The ceramic sensing chip 2 is disposed in the cavity 13 of the housing 1 and is arranged facing the light-sensitive hole 111. In this way, the visible light and infrared signals in the external environment can be irradiated to the ceramic sensing chip 2 through the light-sensitive hole 111. When the ceramic sensing chip 2 senses an infrared signal, it generates a sensing signal and outputs it to the signal acquisition chip 3.
[0039] The signal acquisition chip 3 can be implemented using an SOP8 chip. The SOP8 chip has characteristics such as small size, low power consumption, excellent performance, and easy integration, which can effectively reduce the volume of the infrared sensor 100 and lower its power consumption. The SOP8 chip is installed in the cavity 13 to reduce the influence of factors in the external environment on it and extend the service life of the SOP8 chip. The input end of the signal acquisition chip 3 is electrically connected to the output end of the induction chip 2, and the output end of the signal acquisition chip 3 is used to be electrically connected to the circuit board of the product. For ease of understanding, in actual application, the output end of the signal acquisition chip 3 can be electrically connected to the circuit board of the product, so that the signal acquisition chip 3 can collect the induction signal output by the induction chip 2 and output the collected induction signal to the circuit board, thereby realizing the transmission of the signal.
[0040] The conductive support 4 is arranged in the cavity 13. The conductive support 4 is electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. That is, the conductive support 4 serves as an electrical connection medium between the induction chip 2 and the signal acquisition chip 3, which can effectively shorten the length of the electrical connection line between the induction chip 2 and the signal acquisition chip 3 and reduce the volume of the infrared sensor 100. Moreover, the induction chip 2, the conductive support 4, and the signal acquisition chip 3 are stacked in the first direction, and the first direction is the height direction of the signal acquisition chip 3. In this way, the heat generated by the induction chip 2 and the signal acquisition chip 3 during operation can be conducted through the conductive support 4 to the inside of the cavity 13, then through the cavity 13 to the photosensitive hole 111, and finally through the photosensitive hole 111 to the external environment, reducing the heat conduction to the induction chip 2, avoiding the induction chip 2 from being heated for a long time, reducing the influence of heat on the chip performance, ensuring that the chip can normally sense infrared signals, and extending the service life of the induction chip 2.
[0041] The technical solution of the present utility model is defined in that the housing 1 has a cavity 13 and a photosensitive hole 111 communicating with the cavity 13. The induction chip 2 is arranged in the cavity 13, the induction chip 2 is arranged facing the photosensitive hole 111, the signal acquisition chip 3 is arranged in the cavity 13 and is used to be electrically connected to the circuit board, and the conductive support 4 is arranged in the cavity 13. The conductive support 4 is electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. In this way, in actual application, the signal acquisition chip 3 collects the induction signal output by the induction chip 2 through the conductive support 4 and outputs the collected induction signal to the circuit board to realize the transmission of the signal. Moreover, since the induction chip 2, the conductive support 4, and the signal acquisition chip 3 are stacked in the first direction, the layered structure setting can prevent the heat generated by the circuit board and the signal acquisition chip 3 from being conducted to the induction chip 2 to form interference, resulting in signal fluctuations, thereby avoiding the induction chip 2 from being heated for a long time, reducing the influence of heat on the performance of the induction chip 2, and extending the service life of the induction chip 2.
[0042] Refer to Figure 3, in an embodiment of the present utility model, the conductive bracket 4 has opposite first end 41 and second end 42 along a first direction, the first end 41 is electrically connected to the induction chip 2, and the second end 42 is electrically connected to the signal acquisition chip 3.
[0043] In this embodiment, the conductive bracket 4 has opposite first end 41 and second end 42 along a first direction, and the first direction is the height direction of the signal acquisition chip 3. The first end 41 faces and is electrically connected to the induction chip 2, and the second end 42 faces and is electrically connected to the signal acquisition chip 3, thereby completing the electrical connection between the conductive bracket 4, the induction chip 2, and the signal acquisition chip 3, which is convenient and fast.
[0044] Optionally, the electrical connection method between the first end 41 and the induction chip 2 is generally not limited. For example, the first end 41 is provided with a first copper sheet, and the induction chip 2 is provided with a second copper sheet. When the first copper sheet contacts the second copper sheet, the electrical connection between the first end 41 and the induction chip 2 can be realized. It can be inferred from this that the electrical connection method between the second end 42 and the signal acquisition chip 3 is similar, and no repeated description will be given here.
[0045] Refer to Figure 3 , in an embodiment of the present utility model, the contact surface between the conductive bracket 4 and the induction chip 2 is a plane;
[0046] And / or, the contact surface between the conductive bracket 4 and the signal acquisition chip 3 is a plane.
[0047] To enhance the heat dissipation performance of the induction chip 2, in this embodiment, the contact surface between the conductive bracket 4 and the induction chip 2 is a plane. The plane can increase the contact area between the conductive bracket 4 and the induction chip 2, so that the heat generated by the induction chip 2 can be more conducted to the conductive bracket 4 and discharged to the external environment through the conductive bracket 4, avoiding the accumulation of heat on the induction chip 2 and reducing the situation of electrical components inside the chip failing. Similarly, to enhance the heat dissipation performance of the signal acquisition chip 3, in another embodiment, the contact surface between the conductive bracket 4 and the signal acquisition chip 3 can also be a plane.
[0048] There are many implementation forms of the conductive bracket 4. Refer to Figure 4 , in an embodiment of the present utility model, the conductive bracket 4 includes a first conductive part 43 and a second conductive part 44. The first conductive part 43 and the second conductive part 44 are spaced apart along a second direction. The first conductive part 43, the induction chip 2, the second conductive part 44, and the signal acquisition chip 3 enclose a heat dissipation space 5, and the first direction intersects with the second direction.
[0049] In this embodiment, the conductive bracket 4 includes a first conductive part 43 and a second conductive part 44. The first conductive part 43 and the second conductive part 44 are arranged on the signal acquisition chip 3 at intervals in the second direction, and the second direction is the length direction of the signal acquisition chip 3. The two opposite ends of the first conductive part 43 in the first direction are electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively, and the two opposite ends of the second conductive part 44 in the first direction are also electrically connected to the induction chip 2 and the signal acquisition chip 3 respectively. That is to say, the first conductive part 43 and the second conductive part 44 are arranged in parallel in the first direction.
[0050] There are also many implementation forms of the signal acquisition chip 3. Refer to Figure 4 , in an embodiment of the present utility model, the signal acquisition chip 3 includes a wafer 31, a package 32 and pads 33, and the package 32 covers the wafer 31. Part of the pads 33 is arranged inside the package 32, and the other part of the pads 33 is exposed on the side of the package 32 facing the conductive bracket 4 and is electrically connected to the conductive bracket 4.
[0051] In this embodiment, the wafer 31 is installed inside the package 32 to reduce the influence of factors in the external environment on it and extend the service life of the wafer 31.
[0052] There are also many implementation forms of the housing 1. Refer to Figure 4 , in an embodiment of the present utility model, the housing 1 includes a base 11 and a housing body 12 connected to the base 11 to enclose the cavity 13.
[0053] In this embodiment, by setting the housing 1 into a split structure of the base 11 and the housing body 12, it is convenient to arrange the induction chip 2, the signal acquisition chip 3 and the conductive bracket 4 in the housing 1, and the assembly convenience of the infrared sensor 100 is improved. Optionally, the connection between the base 11 and the housing body 12 can be a fixed connection, such as welding, etc., or a detachable connection, such as magnetic attraction connection, plug connection, snap connection, etc. If the base 11 and the housing body 12 are fixedly connected, the fixed method can improve the structural stability of the housing 1; if the base 11 and the housing body 12 are detachably connected, when at least one of the induction chip 2, the signal acquisition chip 3, and the conductive bracket 4 is damaged, the damaged component can be repaired or replaced by disassembling the housing 1, improving the convenience of repair or replacement.
[0054] According to the above content, to strengthen the installation of the package 32, refer to Figure 4 , in an embodiment of the present utility model, the base 11 is provided with a limiting groove 113, the bottom of the package 32 is arranged in the limiting groove 113, a part of the package 32 extends out of the limiting groove 113, and the pads 33 are arranged on the side of the package 32 facing away from the limiting groove 113.
[0055] In this embodiment, a limiting groove 113 is provided on one side of the base 11 located inside the cavity 13. The bottom of the encapsulation body 32 is adaptively installed in the limiting groove 113 to fix the encapsulation body 32. A part of the encapsulation body 32 extends out of the limiting groove 113, which is convenient for arranging the pad 33 and the conductive support 4. Among them, the conductive support 4 is arranged on the top surface of the top of the pad 33, which is convenient for electrically connecting the induction chip 2.
[0056] Referring to Figure 4 , in an embodiment of the present invention, the infrared sensor 100 further includes a light filtering member 6, and the light filtering member 6 is arranged at the light sensing hole 111 for filtering light other than infrared light.
[0057] In this embodiment, the light filtering member 6 can be implemented by a light filtering film, and the light filtering film is installed at the light sensing hole 111. The light filtering film is used to filter light other than infrared light, so that the induction chip 2 can quickly and accurately sense the infrared signal and output the induction signal to the signal acquisition chip 3, and the signal acquisition chip 3 outputs it to the circuit board, thereby improving the efficiency of signal transmission.
[0058] The present invention also proposes a detection component, which includes a circuit board; and / or, an infrared sensor 100. The specific structure of the infrared sensor 100 refers to the above embodiment. Since this detection component adopts all the technical solutions of the above all embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated here one by one.
[0059] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. An infrared sensor, characterized in that: include: A housing having a cavity and a photosensitive hole connected to the cavity; A sensing chip is disposed in the cavity, the sensing chip is disposed toward the photosensitive hole, and the sensing chip is used to output a sensing signal representing the sensed infrared signal; A signal acquisition chip is disposed in the cavity, the signal acquisition chip has a signal output pin, the signal output pin is used to be electrically connected to an external circuit board, and the signal acquisition chip is used to collect the sensing signal output by the sensing chip; A conductive bracket is disposed in the cavity, the conductive bracket is electrically connected to the sensing chip and the signal acquisition chip respectively, and the sensing chip, the conductive bracket and the signal acquisition chip are stacked along a first direction.
2. The infrared sensor according to claim 1, characterized in that: The conductive bracket has a first end and a second end opposite to each other along a first direction, the first end is electrically connected to the sensing chip, and the second end is electrically connected to the signal acquisition chip.
3. The infrared sensor according to claim 1, characterized in that: The contact surface between the conductive bracket and the sensing chip is a plane; And / or, the contact surface between the conductive bracket and the signal acquisition chip is a plane.
4. The infrared sensor according to claim 1, characterized in that: The conductive bracket includes a first conductive part and a second conductive part, the first conductive part and the second conductive part are arranged at intervals along a second direction, the first conductive part, the sensing chip, the second conductive part and the signal acquisition chip enclose a heat dissipation space, and the first direction intersects with the second direction.
5. The infrared sensor according to claim 1, characterized in that: The signal acquisition chip comprises a wafer, a package and a pad, wherein the package is coated on the wafer; Part of the pad is arranged in the package body, and another part of the pad is exposed on a side of the package body facing the conductive support and is electrically connected to the conductive support.
6. The infrared sensor according to claim 5, characterized in that: The outer shell comprises a base and a shell body connected with the base to enclose the cavity.
7. The infrared sensor according to claim 6, characterized in that: The base is provided with a limiting groove, the bottom of the package body is arranged in the limiting groove, the package body partially extends out of the limiting groove, and the pad is arranged on a side of the package body away from the limiting groove.
8. The infrared sensor according to claim 1, characterized in that: The infrared sensor further comprises a filter element, which is arranged at the photosensitive hole and is used for filtering light except infrared light.
9. A detection component, characterized in that: comprising a circuit board; and / or, an infrared sensor as claimed in any one of claims 1 to 8.