Test bench assembly with frame wafer assembly and probe bench

Abstract

The utility model provides a test bench assembly with a frame wafer assembly and a probe bench. The testboard assembly comprises a testboard body, the testboard body is provided with a bearing surface, and the bearing surface is used for bearing a wafer assembly; the adsorption assembly is arranged on the peripheral side of the test board body in a surrounding manner; the ejector rod assembly is arranged on the peripheral side of the test board body in a surrounding mode and can move in the first direction, so that the ejector rod assembly has a first state in which the ejector rod assembly protrudes relative to the adsorption assembly and a second state in which the ejector rod assembly is sunken relative to the adsorption assembly, and when the ejector rod assembly is in the first state, the ejector rod assembly can move in the first direction. The ejector rod assembly is used for bearing a frame of the wafer assembly and transporting the wafer assembly; and after the ejector rod assembly bears the wafer assembly and the ejector rod assembly is in the second state, the adsorption assembly is used for adsorbing a frame of the wafer assembly so as to effectively bear and fix the ultrathin wafer.

Description

Technical Field

[0001] The present application relates to the technical field of wafer detection, and in particular to a test bench assembly with a frame wafer assembly and a probe station. Background Art

[0002] As a high-precision electronic testing equipment, the core function of the probe station is to perform electrical tests on semiconductor chips, integrated circuits and other microelectronic devices. The probe station usually includes a test bench, a manipulator, probes and other components. Among them, in the operation process of the probe station, the main function of the test bench is to fix the wafer to ensure that the wafer can maintain a stable and accurate position during the test.

[0003] When testing ultra-thin wafers, due to the fragility of the wafers themselves, frames are usually installed around the wafers to improve their stability and safety during manufacturing, testing and handling. However, for wafers with frames, traditional test bench components cannot effectively receive and fix the wafers. Utility Model Content

[0004] In view of this, the present application provides a test bench assembly and a probe station with a frame wafer assembly to effectively carry an ultra-thin wafer.

[0005] In a first aspect, the present application provides a test bench assembly with a frame wafer assembly, the test bench assembly comprising:

[0006] A test bench body, wherein the test bench body has a bearing surface, and the bearing surface is used to bear the wafer assembly;

[0007] An adsorption component, the adsorption component is disposed around the periphery of the test bench body; and

[0008] A push rod assembly, wherein the push rod assembly is arranged around the circumference of the test bench body, and the push rod assembly can move along a first direction so that the push rod assembly has a first state in which it is protruding compared to the adsorption assembly, and a second state in which it is recessed compared to the adsorption assembly. When the push rod assembly is in the first state, the push rod assembly is used to receive the frame of the wafer assembly and transport the wafer assembly; after the push rod assembly receives the wafer assembly and the push rod assembly is in the second state, the adsorption assembly is used to adsorb the frame of the wafer assembly.

[0009] Among them, the adsorption assembly includes a support member and a plurality of suction cups, the support member is arranged around the periphery of the test bench body, the plurality of suction cups are supported on a side of the support member adjacent to the supporting surface, and the plurality of suction cups are used to adsorb the frame of the wafer assembly.

[0010] Wherein, the adsorption assembly further includes a limiting member, which is carried on a side of the support member adjacent to the plurality of suction cups and is used to limit the position of the wafer assembly;

[0011] The suction cup has an extended state and a contracted state. When the suction cup does not adsorb the wafer component, the suction cup is in an extended state, and along the first direction, the suction cup protrudes from the limiting member; when the suction cup adsorbs the wafer component, the suction cup is in a contracted state, and the limiting member abuts against the frame of the wafer component.

[0012] Among them, the push rod assembly includes a connecting ring and a plurality of push rods, the connecting ring is arranged around the periphery of the test bench body, the plurality of push rods are fixed to a side of the connecting ring adjacent to the test bench body, the plurality of push rods are arranged at intervals from each other, and the plurality of push rods are arranged around the periphery of the test bench body.

[0013] Wherein, the test bench assembly further comprises a driving assembly, wherein the driving assembly is arranged on a side of the connecting ring away from the plurality of ejector rods, and the driving assembly is used to drive the ejector rod assembly to reciprocate along a first direction.

[0014] Wherein, the test bench assembly further comprises a bearing member, the bearing member is arranged on a side of the test bench body away from the bearing surface, and the bearing member is used to bear the test bench body;

[0015] The driving assembly includes a connecting member, a driving member and a guiding member, one side of the connecting member is fixed to the driving member, and the other side of the connecting member is fixed to the connecting ring. The driving member is fixed to the supporting member, and the driving member can drive the connecting member and the push rod assembly to reciprocate along a first direction. The guiding member is arranged on a side of the connecting member away from the connecting ring, and is used to guide the movement of the push rod assembly along the first direction.

[0016] Wherein, the support member includes a first support part and a second support part which are connected to each other, the suction cup is arranged on the first support part, the second support part is arranged adjacent to the push rod assembly, and the second support part has an avoidance groove on a side adjacent to the push rod assembly, and the avoidance groove is used to pass the push rod of the push rod assembly.

[0017] Among them, a vacuum groove is arranged inside the support member, and the suction cup has a vacuum channel. The vacuum channel of the suction cup is connected to the vacuum groove, and the vacuum channel is used to circulate negative pressure gas. The suction cup can use the negative pressure gas to adsorb the wafer assembly.

[0018] Wherein, the adsorption component further includes an air pipe and an air pipe clamp. The air pipe is disposed around the circumference of the support member, and the air pipe is communicated with the vacuum tank and is used to convey negative pressure gas to the vacuum tank. The air pipe clamp is fixed on one side of the support member adjacent to the air pipe, and the air pipe clamp is used to fix the air pipe.

[0019] In a second aspect, the present application further provides a probe station, and the probe station includes the test station component. The test station component provided in this embodiment includes a test station body, an adsorption component, and a thimble component. The thimble component and the adsorption component are disposed around the circumference of the test station body. The thimble component can move along a first direction and is used to support the frame of the wafer component, thereby avoiding the situation where the thimble component directly contacts the wafer and causes the wafer to break, and can also avoid the problem that the wafer is deformed and cannot be effectively adsorbed by the test station body. In addition, the adsorption component is used to adsorb the frame of the wafer component, so as to achieve good fixation of the wafer component, so that the wafer component can maintain good stability and position accuracy during the test process, and further ensure the high precision of the test station component and the probe station. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a schematic diagram of the working principle of the test station component of the embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the structure of the wafer component of the embodiment of the present application;

[0023] Figure 3 It is a schematic diagram of the structure of the test station component of the embodiment of the present application;

[0024] Figure 4 It is a schematic diagram of the structure of the adsorption component of the embodiment of the present application;

[0025] Figure 5 It is a schematic diagram of the structure of the test station component of another embodiment of the present application;

[0026] Figure 6 It is a schematic diagram of the structure of the thimble component of the embodiment of the present application;

[0027] Figure 7 It is a schematic diagram of the structure of the test station component of still another embodiment of the present application;

[0028] Figure 8 It is a schematic diagram of the working principle of the test bench assembly according to another embodiment of the present application;

[0029] Figure 9 It is a schematic structural diagram of the adsorption assembly according to another embodiment of the present application;

[0030] Figure 10 It is a schematic structural diagram of the probe station according to an embodiment of the present application.

[0031] Explanation of reference numerals:

[0032] 1 - Probe station, 10 - Test bench assembly, 20 - Wafer assembly, 11 - Test bench body, 12 - Adsorption assembly, 13 - Ejector rod assembly, 14 - Driving assembly, 15 - Carrier, 21 - Wafer, 22 - Film, 23 - Frame, 111 - Carrying surface, 121 - Support member, 122 - Suction cup, 123 - Limiting member, 124 - Air pipe, 125 - Air pipe clamp, 131 - Connecting ring, 132 - Ejector rod, 141 - Connecting member, 142 - Driving member, 143 - Guide member, 1211 - First support portion, 1212 - Second support portion, 1213 - Vacuum groove, 1221 - Vacuum channel, 121a - Avoidance groove. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0034] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0035] References to "embodiments" or "implementations" in this document mean that the specific features, structures, or characteristics described in connection with the embodiments or implementations can be included in at least one embodiment of the present application. The phrase appears at various positions in the specification and does not necessarily refer to the same embodiment each time, nor are they independent or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0036] Before introducing the technical solution of the present application, the technical problems in the related art will be introduced in detail.

[0037] When detecting an ultra-thin wafer, due to the fragility of the wafer itself, a frame is usually installed around the wafer to improve its stability and safety during manufacturing, testing, and processing. However, for a wafer with a frame (Wafer with Frame), traditional test bench components cannot effectively receive and fix the wafer.

[0038] Among them, the wafer with a frame is composed of a wafer, a frame, and a film. The wafer is pasted on the film, and the film is fixed to the frame to achieve the fixation and support of the ultra-thin wafer.

[0039] The test bench in the probe station can receive the wafer by setting up a thimble structure. However, for an ultra-thin wafer with a frame, if the thimble directly abuts against the wafer to receive it, it is likely to cause the wafer to break.

[0040] In view of this, to solve the above problems, the present application provides a test bench component 10 for a wafer component 20 with a frame. Please refer to Figure 1 、 Figure 2 and Figure 3 . The test bench component 10 of this implementation includes a test bench body 11, a suction component 12, and a thimble component 13. The test bench body 11 has a bearing surface 111, and the bearing surface 111 is used to bear the wafer component 20. The suction component 12 is disposed around the periphery of the test bench body 11. The thimble component 13 is disposed around the periphery of the test bench body 11, and the thimble component 13 can move along the first direction Z, so that the thimble component 13 has a first state protruding relative to the suction component 12 and a second state recessed relative to the suction component 12. When the thimble component 13 is in the first state, the thimble component 13 is used to receive the frame 23 of the wafer component 20 and transport the wafer component 20. When the thimble component 13 receives the wafer component 20 and the thimble component 13 is in the second state, the suction component 12 is used to adsorb the frame 23 of the wafer component 20.

[0041] Optionally, the test bench assembly 10 is applied to the probe station 1 and is used to carry and fix the wafer assembly 20 to be detected, ensuring that the wafer assembly 20 can maintain a stable posture and an accurate position during the test.

[0042] Optionally, the wafer assembly 20 is composed of a wafer 21, a frame 23, and a film 22. The wafer 21 is pasted on the film 22, and the film 22 is fixed to the frame 23 to realize the fixation and support of the ultra-thin wafer 21.

[0043] Preferably, the wafer 21 is an ultra-thin wafer 21, the film 22 is a blue film, and the frame 23 is an iron frame.

[0044] Optionally, the test bench body 11 is a vacuum test bench. The test bench body 11 is provided with a vacuum groove or a plurality of vacuum suction holes on the bearing surface 111. The vacuum groove or the vacuum suction holes are both used for circulating negative pressure gas, so as to realize the effective adsorption and fixation of the wafer assembly 20.

[0045] Optionally, the adsorption assembly 12 is disposed around the periphery of the test bench body 11, and the adsorption assembly 12 is spaced apart from the test bench body 11. The adsorption assembly 12 can adsorb the wafer assembly 20 through vacuum to assist in fixing the wafer assembly 20.

[0046] Optionally, the ejector rod assembly 13 is disposed around the periphery of the test bench body 11, and the ejector rod assembly 13 is spaced apart from the test bench body 11.

[0047] Optionally, the ejector rod assembly 13 can reciprocally move along the first direction Z, so that the ejector rod assembly 13 has a first state protruding relative to the adsorption assembly 12 and a second state recessed relative to the adsorption assembly 12. Further optionally, when the ejector rod assembly 13 is in the first state, the ejector rod assembly 13 protrudes from the bearing surface 111 of the test bench body 11. When the ejector rod assembly 13 is in the second state, the ejector rod assembly 13 is recessed from the bearing surface 111 of the test bench body 11.

[0048] In an alternative embodiment of the present application, during the operation of the probe station 1, when the test bench assembly 10 needs to carry the wafer assembly 20 to be detected, the ejector rod assembly 13 can rise along the first direction Z and abut against the frame 23 of the wafer assembly 20 to carry the wafer assembly 20. After the ejector rod assembly 13 carries the wafer assembly 20, the ejector rod assembly 13 descends in the opposite direction of the first direction Z and transports the wafer assembly 20 to a position adjacent to the adsorption assembly 12 and the test bench body 11. The adsorption assembly 12 turns on the vacuum adsorption state and adsorbs the frame 23 of the wafer assembly 20, and the test bench body 11 turns on the vacuum adsorption state and adsorbs the wafer 21 of the wafer assembly 20, thereby realizing the effective carrying and fixing of the wafer assembly 20. It can be understood that compared with the comparative embodiment in which the ejector rod assembly 13 is arranged in the bearing surface 111 of the test bench body 11, the situation that the ejector rod assembly 13 abuts against the ultra-thin wafer 21 and causes damage or fragmentation of the wafer 21 can be avoided, and the problem of causing deformation of the wafer 21 can be avoided.

[0049] In summary, the test bench assembly 10 provided in this embodiment includes a test bench body 11, an adsorption assembly 12 and an ejector rod assembly 13. The ejector rod assembly 13 and the adsorption assembly 12 are arranged around the periphery of the test bench body 11. The ejector rod assembly 13 can move along the first direction Z and is used to carry the frame 23 of the wafer assembly 20, thereby avoiding the situation that the ejector rod assembly 13 directly contacts the wafer 21 and causes fragmentation of the wafer 21, and can avoid the problem that the wafer 21 is deformed and cannot be effectively adsorbed by the test bench body 11. In addition, the adsorption assembly 12 is used to adsorb the frame 23 of the wafer assembly 20, thereby realizing good fixation of the wafer assembly 20, so that the wafer assembly 20 can maintain good stability and position accuracy during the test, and further ensuring the high precision of the test bench assembly 10 and the probe station 1.

[0050] Please refer to Figure 3 and Figure 4 . The adsorption assembly 12 includes a support member 121 and a plurality of suction cups 122. The support member 121 is arranged around the periphery of the test bench body 11. The plurality of suction cups 122 are carried on one side of the support member 121 adjacent to the bearing surface 111. The plurality of suction cups 122 are used to adsorb the frame 23 of the wafer assembly 20.

[0051] Optionally, the support member 121 is annular. The support member 121 is arranged around the periphery of the test bench body 11 and is spaced apart from the test bench body 11.

[0052] Optionally, the number of the suction cups 122 may be, but is not limited to, two, three, four, five, or other numbers. It can be understood that the number of the suction cups 122 should not be a limitation to the test bench assembly 10 provided by this embodiment.

[0053] Optionally, the adsorption assembly 12 includes a plurality of suction cup groups, and each suction cup group includes a plurality of suction cups 122. The plurality of suction cup groups are arranged at intervals from each other. Preferably, the plurality of suction cup groups are symmetrically arranged on the periphery of the test bench body 11.

[0054] In this embodiment, the adsorption assembly 12 adsorbs the frame 23 of the wafer assembly 20 through a plurality of suction cups 122, so as to achieve good fixation of the wafer assembly 20, so that the wafer assembly 20 can maintain good stability and position accuracy during the test process.

[0055] Please refer to Figure 4 and Figure 5 . The adsorption assembly 12 further includes a limiting member 123. The limiting member 123 is carried on one side of the support member 121 adjacent to the plurality of suction cups 122 and is used to limit the wafer assembly 20. The suction cup 122 has an extended state and a contracted state. When the suction cup 122 does not adsorb the wafer assembly 20, the suction cup 122 is in the extended state, and along the first direction Z, the suction cup 122 protrudes from the limiting member 123. When the suction cup 122 adsorbs the wafer assembly 20, the suction cup 122 is in the contracted state, and the limiting member 123 abuts against the frame 23 of the wafer assembly 20.

[0056] Optionally, the limiting member 123 is a limiting bolt, and the limiting member 123 is carried and fixed on one side of the support member 121 where the suction cup 122 is provided. The limiting member 123 is adjacent to the suction cup 122 and is used to limit the wafer assembly 20.

[0057] Optionally, the suction cup 122 is made of a flexible material, and the suction cup 122 is a corrugated suction cup 122. When the suction cup 122 does not adsorb the wafer assembly 20, the suction cup 122 is in the extended state. When the suction cup 122 adsorbs the wafer assembly 20, the suction cup 122 is in the contracted state. Wherein, along the first direction Z, when the suction cup 122 is in the extended state, the suction cup 122 has a first height, and when the suction cup 122 is in the contracted state, the suction cup 122 has a second height, and the second height is less than the first height.

[0058] In an alternative embodiment of the present application, when the suction cup 122 is in the extended state, along the first direction Z, the suction cup 122 protrudes from the limiting member 123 and is used to adsorb the frame 23 of the wafer assembly 20. After the suction cup 122 adsorbs the frame 23 of the wafer assembly 20, the suction cup 122 is in the contracted state, and along the first direction Z, the suction cup 122 is flush with or recessed from the limiting member 123, so that the frame 23 of the wafer assembly 20 abuts against the limiting member 123, and the limiting member 123 can limit the wafer assembly 20, thereby preventing the suction cup 122 from shaking and causing the position of the wafer assembly 20 to be unstable.

[0059] Preferably, along the first direction Z, the limiting member 123 is recessed from the bearing surface 111 of the test bench body 11, that is, the limiting member 123 is arranged lower than the bearing surface 111 of the test bench body 11. When the suction cup 122 is in the contracted state, the test bench body 11 is used to adsorb the film 22 and the wafer 21 of the wafer assembly 20, the suction cup 122 is used to adsorb the frame 23 of the wafer assembly 20, and the frame 23 of the wafer assembly 20 abuts against the limiting member 123, and the limiting member 123 is recessed from the bearing surface 111, so that the film 22 and the wafer 21 of the wafer assembly 20 can be tightened on the bearing surface 111 of the test bench body 11, so that the wafer 21 and the bearing surface 111 of the test bench body 11 can maintain good contact, and further the test bench body 11 can effectively adsorb and fix the wafer 21 through vacuum.

[0060] Please refer to Figure 3 and Figure 6 The ejector rod assembly 13 includes a connecting ring 131 and a plurality of ejector rods 132. The connecting ring 131 surrounds the circumference of the test bench body 11. The plurality of ejector rods 132 are fixed to the side of the connecting ring 131 adjacent to the test bench body 11. The plurality of ejector rods 132 are spaced apart from each other, and the plurality of ejector rods 132 surround the circumference of the test bench body 11.

[0061] Optionally, the connecting ring 131 surrounds the circumference of the test bench body 11 and is spaced apart from the test bench body 11.

[0062] Optionally, the ejector rod 132 extends along the first direction Z. The number of the ejector rods 132 can be but not limited to two, or three, or four, or five, or other numbers, etc. The plurality of ejector rods 132 are carried and fixed to the side of the connecting ring 131 adjacent to the bearing surface 111 of the test bench body 11.

[0063] In a preferred embodiment of the present application, the plurality of ejector rods 132 are spaced apart from each other, and the plurality of ejector rods 132 are symmetrically arranged about the central axis of the test bench body 11, and the central axis extends along the first direction Z. The plurality of ejector rods 132 can stably support the wafer assembly 20, avoiding the situation that the wafer assembly 20 is displaced due to unstable support, thereby improving the reliability of the test bench assembly 10.

[0064] Please refer to Figure 7 . The test bench assembly 10 further includes a driving assembly 14. The driving assembly 14 is disposed on a side of the connecting ring 131 away from the plurality of ejector rods 132. The driving assembly 14 is used to drive the ejector rod assembly 13 to reciprocate along the first direction Z.

[0065] In this embodiment, the driving assembly 14 is connected to the connecting ring 131, and the driving assembly 14 is disposed on a side of the connecting ring 131 away from the plurality of ejector rods 132. The driving assembly 14 can drive the connecting ring 131 to move up and down along the first direction Z, so that the plurality of ejector rods 132 can move up and down along the first direction Z and complete the support of the wafer assembly 20. After the wafer assembly 20 is tested, the ejector rod assembly 13 can also eject the wafer assembly 20, thereby facilitating the test bench assembly 10 to support the wafer assembly 20 to be tested, and facilitating the manipulator of the probe station 1 to pick up the tested wafer assembly 20, improving the flexibility of the test bench assembly 10.

[0066] Please refer to Figure 7 and Figure 8 . The test bench assembly 10 further includes a carrier 15. The carrier 15 is disposed on a side of the test bench body 11 away from the bearing surface 111, and the carrier 15 is used to carry the test bench body 11. The driving assembly 14 includes a connecting member 141, a driving member 142 and a guiding member 143. One side of the connecting member 141 is fixed to the driving member 142, and the other side of the connecting member 141 is fixed to the connecting ring 131. The driving member 142 is fixed to the carrier 15, and the driving member 142 can drive the connecting member 141 and the ejector rod assembly 13 to reciprocate along the first direction Z. The guiding member 143 is disposed on a side of the connecting member 141 away from the connecting ring 131 and is used to guide the movement of the ejector rod assembly 13 along the first direction Z.

[0067] Optionally, the driving member 142 is a cylinder, a motor, or other components with a driving function, etc. The driving member 142 is connected to the ejector rod assembly 13 through the connecting member 141 and is used to drive the ejector rod assembly 13 to reciprocate along the first direction Z. And the driving member 142 is fixed to the carrier 15, so that the driving member 142 can maintain a stable position.

[0068] Optionally, one side of the connecting member 141 is fixed to the driving member 142, and the other side of the connecting member 141 is fixed to the connecting ring 131, so that a firm connection relationship can be maintained between the driving member 142 and the connecting ring 131.

[0069] Optionally, the guiding member 143 includes a guide rail and a slider. The guide rail is fixed to the carrier 15, and the guide rail extends along the first direction Z. One side of the slider is slidably connected to the guide rail, and the other side of the slider is fixedly connected to the connecting member 141, so as to guide the ejector rod assembly 13 when the ejector rod assembly 13 moves along the first direction Z, and ensure the stability and position accuracy of the ejector rod assembly 13 during the movement.

[0070] Please refer to Figure 3 and Figure 9 . The support member 121 includes a connected first support portion 1211 and a second support portion 1212. The suction cup 122 is disposed on the first support portion 1211. The second support portion 1212 is disposed adjacent to the ejector rod assembly 13, and the second support portion 1212 has an avoidance groove 121a on the side adjacent to the ejector rod assembly 13. The avoidance groove 121a is used for passing through the ejector rod 132 of the ejector rod assembly 13.

[0071] Optionally, the first support portion 1211 and the second support portion 1212 are integrally formed.

[0072] Optionally, the suction cup 122 is fixed and carried on the first support portion 1211.

[0073] Optionally, the second support portion 1212 is provided with an avoidance groove 121a at a position adjacent to the ejector rod assembly 13. The avoidance groove 121a penetrates through the second support portion 1212 along the first direction Z, and the avoidance groove 121a is exposed on the surface of the second support portion 1212 adjacent to the ejector rod assembly 13. In this embodiment, the avoidance groove 121a is used for passing through the ejector rod 132, that is, the ejector rod 132 can lift and lower along the first direction Z in the avoidance groove 121a, thereby improving the space utilization efficiency of the test bench assembly 10 and effectively saving the occupied space of the test bench assembly 10 in the probe station 1.

[0074] Please refer again Figure 9 The support member 121 is provided with a vacuum groove inside, and the suction cup 122 has a vacuum channel 1221 . The vacuum channel 1221 of the suction cup 122 is connected to the vacuum groove, and the vacuum channel 1221 is used to circulate negative pressure gas. The suction cup 122 can absorb the wafer assembly 20 by using the negative pressure gas.

[0075] In this embodiment, the plurality of suction cups 122 are all supported and fixed on one side of the support member 121 adjacent to the support surface 111 of the test bench body 11. A vacuum groove is provided in the support member 121, and the vacuum groove of the support member 121 is connected to the suction cups 122 and is used to circulate negative pressure gas to the suction cups 122, so that the suction cups 122 can absorb the frame 23 of the wafer assembly 20 through vacuum.

[0076] Please refer again Figure 9 The adsorption assembly 12 further includes an air pipe 124 and an air pipe clamp 125. The air pipe 124 is arranged around the support member 121, and the air pipe 124 is connected to the vacuum tank and used to transport negative pressure gas to the vacuum tank. The air pipe clamp 125 is fixed to a side of the support member 121 adjacent to the air pipe 124, and the air pipe clamp 125 is used to fix the air pipe 124.

[0077] Optionally, the air pipe 124 is used to transmit negative pressure gas to the vacuum groove of the support member 121, and the vacuum groove is connected to the suction cup 122, so that the suction cup 122 can absorb and fix the wafer assembly 20 through vacuum.

[0078] Optionally, the adsorption assembly 12 is further provided with a plurality of air pipe clamps 125, and the air pipe clamps 125 are fixed to one side of the support member 121 adjacent to the air pipe 124. The air pipe clamps 125 are used to fix the air pipe 124, thereby preventing the air pipe 124 from shaking when transmitting negative pressure gas, thereby improving the position stability of the test bench assembly 10.

[0079] See also Figure 10 The present application also provides a probe station 1 , and the probe station 1 includes the test station assembly 10 .

[0080] The probe station 1 may be, but is not limited to, suitable for detecting a wafer 21, or a micro-electro-mechanical system (MEMS), or a biological structure, or an optoelectronic device, or a light emitting diode (LED), or a liquid crystal display (LCD), or a solar cell.

[0081] The probe station 1 can be, but is not limited to, a semi-automatic probe station or a full-automatic probe station.

[0082] Optionally, the probe station 1 includes a test bench assembly 10, a probe card, a manipulator, and other components. The test bench assembly 10 is used to carry the wafer assembly 20 to be detected. The probe card can contact the wafer assembly 20 carried by the test bench assembly 10 and detect the chips on the wafer 21. The manipulator is used to transport the wafer assembly 20.

[0083] In this embodiment, the test bench assembly 10 includes a test bench body 11, a suction assembly 12, and a push rod assembly 13. The push rod assembly 13 and the suction assembly 12 are disposed around the periphery of the test bench body 11. The push rod assembly 13 can move along the first direction Z and is used to support the frame 23 of the wafer assembly 20, thereby avoiding the situation where the push rod assembly 13 directly contacts the wafer 21 and causes the wafer 21 to break, and can also avoid the problem that the wafer 21 is deformed and cannot be effectively adsorbed by the test bench body 11. In addition, the suction assembly 12 is used to adsorb the frame 23 of the wafer assembly 20, so as to achieve good fixation of the wafer assembly 20, so that the wafer assembly 20 can maintain good stability and position accuracy during the test, and further ensure the high precision of the test bench assembly 10 and the probe station 1.

[0084] The mention of "embodiment" or "implementation manner" in this application means that the specific features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The appearance of the phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of this application can be combined arbitrarily without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of this application.

[0085] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solutions of this application and are not restrictive. Although the technical solutions of this application have been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that the technical solutions of this application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A test bench assembly with a frame wafer assembly, characterized in that: The test bench assembly comprises: A test bench body, wherein the test bench body has a bearing surface, and the bearing surface is used to bear the wafer assembly; An adsorption component, the adsorption component is disposed around the periphery of the test bench body; and A push rod assembly, wherein the push rod assembly is arranged around the circumference of the test bench body, and the push rod assembly can move along a first direction so that the push rod assembly has a first state in which it is protruding compared to the adsorption assembly, and a second state in which it is recessed compared to the adsorption assembly. When the push rod assembly is in the first state, the push rod assembly is used to receive the frame of the wafer assembly and transport the wafer assembly; after the push rod assembly receives the wafer assembly and the push rod assembly is in the second state, the adsorption assembly is used to adsorb the frame of the wafer assembly.

2. The test bench assembly according to claim 1, characterized in that The adsorption assembly includes a support member and a plurality of suction cups. The support member is arranged around the periphery of the test bench body. The plurality of suction cups are carried on a side of the support member adjacent to the carrying surface. The plurality of suction cups are used to adsorb the frame of the wafer assembly.

3. The test bench assembly according to claim 2, characterized in that The adsorption assembly further includes a limiting member, which is carried on a side of the support member adjacent to the plurality of suction cups and is used to limit the position of the wafer assembly; The suction cup has an extended state and a contracted state. When the suction cup does not adsorb the wafer component, the suction cup is in an extended state, and along the first direction, the suction cup protrudes from the limiting member; when the suction cup adsorbs the wafer component, the suction cup is in a contracted state, and the limiting member abuts against the frame of the wafer component.

4. The test bench assembly according to claim 1, characterized in that: The ejector assembly includes a connecting ring and a plurality of ejector rods, wherein the connecting ring is arranged around the periphery of the test bench body, the plurality of ejector rods are fixed to a side of the connecting ring adjacent to the test bench body, the plurality of ejector rods are arranged at intervals from each other, and the plurality of ejector rods are arranged around the periphery of the test bench body.

5. The test bench assembly according to claim 4, characterized in that The test bench assembly further comprises a driving assembly, wherein the driving assembly is arranged on a side of the connecting ring away from the plurality of ejector rods, and the driving assembly is used for driving the ejector rod assembly to reciprocate along a first direction.

6. The test bench assembly according to claim 5, characterized in that The test bench assembly further includes a bearing member, which is disposed on a side of the test bench body away from the bearing surface, and is used to bear the test bench body; The driving assembly includes a connecting member, a driving member and a guiding member, one side of the connecting member is fixed to the driving member, and the other side of the connecting member is fixed to the connecting ring. The driving member is fixed to the supporting member, and the driving member can drive the connecting member and the push rod assembly to reciprocate along a first direction. The guiding member is arranged on a side of the connecting member away from the connecting ring, and is used to guide the movement of the push rod assembly along the first direction.

7. The test bench assembly according to claim 2, characterized in that: The support member includes a first support portion and a second support portion which are connected to each other. The suction cup is arranged on the first support portion. The second support portion is arranged adjacent to the push rod assembly. The second support portion has an avoidance groove on a side adjacent to the push rod assembly. The avoidance groove is used to pass the push rod of the push rod assembly.

8. The test bench assembly according to claim 2, characterized in that: A vacuum groove is arranged inside the support member, and the suction cup has a vacuum channel. The vacuum channel of the suction cup is connected to the vacuum groove, and the vacuum channel is used to circulate negative pressure gas. The suction cup can use the negative pressure gas to adsorb the wafer assembly.

9. The test bench assembly according to claim 8, characterized in that The adsorption assembly also includes an air pipe and an air pipe clamp. The air pipe is arranged around the peripheral side of the support member, and the air pipe is connected to the vacuum tank and is used to transport negative pressure gas to the vacuum tank. The air pipe clamp is fixed to a side of the support member adjacent to the air pipe, and the air pipe clamp is used to fix the air pipe.

10. A probe station, characterized in that: The probe station comprises the test station assembly according to any one of claims 1 to 9.

Images